CN104078054A - Long bar processing method and processing device - Google Patents
Long bar processing method and processing device Download PDFInfo
- Publication number
- CN104078054A CN104078054A CN201310103626.0A CN201310103626A CN104078054A CN 104078054 A CN104078054 A CN 104078054A CN 201310103626 A CN201310103626 A CN 201310103626A CN 104078054 A CN104078054 A CN 104078054A
- Authority
- CN
- China
- Prior art keywords
- long strips
- fixture
- heat conduction
- photoresistance
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a long bar processing method, which comprises the following steps: (1) providing a fixture, wherein the fixture is provided with an upper surface matched with the long bar; (2) forming a heat conduction layer on the upper surface; (3) forming a dry film layer on the heat conduction layer; (4) splicing the long bar to the fixture, and causing one surface of the long bar to be fit with the dry film layer; and (5) etching the long bar. The method has the advantage of high heat conduction efficiency, the long bar can be prevented from being burnt in an etching process. The invention also discloses a long bar processing device.
Description
Technical field
The present invention relates to information recording disk field of drivers, relate in particular to a kind of long strips job operation and processing unit (plant) in magnetic head producing process.
Background technology
Disc driver is conventional information-storing device, conventionally comprise multiple be installed on Spindle Motor for storing the spinning disk of data and reading or to the magnetic head of disk data writing from disk.People are more and more higher to the capacity requirement of disc driver, can increase the capacity of disc driver although increase the track recording density of disk, correspondingly need to improve magnetic head performance so that its be positioned more accurately on track.Magnetic head is as the core component of disc driver, and its flight characteristic has determined the readwrite performance of magnetic head to a great extent, and then has affected the capacity of disc driver.
It is rectangular-shaped that magnetic head is substantially, and its former and later two sides are called above and trail face, connects before this and trail face and form air bearing face (air bearing surface, ABS) towards the face of magnetic disk surface on magnetic head.ABS is recess injustice, has mattress, some shallow etch region and the dark etching area of multiple protrusions.When the alternate ABS structure of these height is rotated magnetic disc high speed, air can enter between disk and ABS, thereby allows magnetic head can be suspended in disk top.Therefore, the concavo-convex pattern on ABS has directly determined the flight characteristic of magnetic head, and then has affected the readwrite performance of magnetic head.The concavo-convex pattern of ABS can obtain by photoetching process.
The forming process of ABS on magnetic head will be introduced below.Conventionally, on a wafer, be arranged with multiple magnetic head elements, first this wafer will be cut into independent long strips, comprises multiple independently magnetic heads on each long strips, these long strips finally can be sawn into single magnetic head element, and these magnetic head elements are installed in disc driver.In order to improve the working (machining) efficiency of magnetic head, the photoetching process that forms ABS is in the time of long strips form, to form instead of form in the time of independent magnetic head form.Long strips was conventionally fixed on a fixture before etched, and the surface that long strips does not contact with fixture is the surface that is used to form magnetic head ABS.And then the long strips being mounted on fixture is carried out to photoetching.
Photoetching process generally comprises the steps such as photoresistance, exposure, development, etching and removing photoresistance.Upper photoresistance is exactly to be that photoresistance is ejected on the work surface (being used to form the surface of air bearing face) of long strips by photoresistance spraying equipment by photoactive substance.Then, correct exposure light source (such as deep UV, laser, electron beam or X ray) is irradiated on photoresistance through the hollow pattern on light shield, photoresistance is optionally exposed, thereby form the region being exposed on photoresistance.Next, clean photoresistance with developer solution, make the region being exposed by being removed with the chemical reaction of developer solution, thereby the part surface of long strips is come out, form photoresistance pattern.Then, before etching, the fixture that long strips has been installed is positioned on the etching machine of etching machine, below etching machine, is provided with a liquid nitrogen cooling system.Next step, etch exposed is in the long strips surface that is exposed region, thus the geometry adapting at this surface formation and photoresistance pattern.Finally, the remaining photoresistance in long strips surface is removed, thereby complete photoetching process, form ABS.
But, in etching process, on long strips, can produce a large amount of heat, heat conducts to by fixture and etching machine the liquid nitrogen cooling system of being located under etching machine.Heat conduction efficiency can make well the temperature of long strips be controlled at reduced levels, can burn out long strips otherwise assemble too much heat on long strips, or reduces the various performances of long strips.And heat conduction efficiency is mainly heated from long strips and is conducted to this link control of fixture, in order to improve heat conduction efficiency, on the face contacting with long strips at fixture, form a photopolymer layer, the setting of photopolymer layer has improved heat conduction efficiency to a great extent, but can not avoid long strips situation overheated and that burn out to occur completely.
The adhesion property of photopolymer layer and fixture is better, and heat conduction efficiency is higher, and adhesion property depends on the type of photopolymer layer and the surface nature of fixture.Photopolymer layer can not reuse, and after photoetching process completes, long strips unloads from fixture, and the photopolymer layer sticking on fixture generally need clean with chemical solvent, then again forms a photopolymer layer on the surface of fixture to clamp next group long strips.But etching process and use chemical solvent cleaning clamp all can damage the adhesion property of chucking surface, thereby reduce the adhesion strength of photopolymer layer at chucking surface, and then reduced its heat conduction efficiency.Therefore, the low-adhesiveness between photopolymer layer and fixture and low heat conductivity efficiency all can cause long strips to be burned in etched process, thereby damage long strips, reduce its yields.
Therefore, urgently a kind of job operation of long strips and processing unit (plant), to overcome above-mentioned defect.
Summary of the invention
One object of the present invention is to provide a kind of heat conduction efficiency high and can prevent the job operation of the long strips that long strips is burned in etching process.
Another object of the present invention is to provide a kind of processing unit (plant) of long strips, the heat conduction efficiency of described processing unit (plant) is high and can prevent that long strips is burned in etching process.
For reaching above object, the invention provides a kind of job operation of long strips, comprising: (1) provides a fixture, described fixture has the upper surface matching with long strips; (2) on described upper surface, form a heat conduction layer; (3) on described heat conduction layer, form a photopolymer layer; (4) bonding described long strips is on described fixture, and the one side of described long strips fits with described photopolymer layer; (5) long strips described in etching.
Concrete, described heat conduction layer is made by diamond-like-carbon.Described diamond like carbon carbon-coating can be strengthened the adhesion property between photopolymer layer and fixture upper surface.
Preferably, described job operation is cured described fixture after being also included in and forming described photopolymer layer at the temperature of 100 DEG C～140 DEG C, makes described heat conduction layer and photopolymer layer more firmly stick to fixture upper surface and can not peel off.
Preferably, described step (5) is also included in and on described long strips, forms photoresistance pattern.
Particularly, the step that forms described photoresistance pattern comprises photoresistance, exposure and development.
The processing unit (plant) of long strips of the present invention, comprise a fixture, film-forming apparatus and etching machine, described fixture is for clamping described long strips and having the upper surface matching with described long strips, described film-forming apparatus is for forming a heat conduction layer and form a photopolymer layer on described heat conduction layer at the upper surface of described fixture, and described etching machine is for long strips described in etching.
Concrete, described heat conduction layer is made by diamond-like-carbon.Described diamond like carbon carbon-coating can be strengthened the adhesion property between photopolymer layer and fixture upper surface.
Preferably, described processing unit (plant) also comprises baking device, for cure described fixture at the temperature of 100 DEG C～140 DEG C after the described photopolymer layer of formation, makes described heat conduction layer and photopolymer layer more firmly stick to fixture upper surface and can not peel off.
Preferably, described processing unit (plant) also comprises photoresistance forming device, for formed photoresistance pattern on described long strips before long strips described in etching.
Preferably, described photoresistance forming device comprises photoresistance Spray painting tool, exposure tool and developer tool.
Compared with prior art, fixture upper surface is formed with heat conduction layer and photopolymer layer, and heat conduction layer layer is sandwiched between fixture upper surface and photopolymer layer.Heat conduction layer can be strengthened the adhesion property between photopolymer layer and fixture, thereby improves its heat conduction efficiency, and then can prevent that long strips is burned in etching process, has improved the yields of long strips.And heat conduction layer has improved the surface nature of fixture upper surface, and higher heat conduction efficiency can reduce the infringement of etching to fixture, thereby the life cycle of fixture is extended, and has reduced production cost.In addition, because making the temperature of long strips, high heat conduction efficiency in etching process, remains reduced levels, generally can be lower than 60 DEG C, therefore the photoresistance pattern on ABS can not be out of shape, and pattern resolution is higher, adds that high heat conduction efficiency also improved the adhesion property of photoresistance pattern, extend etching period, make the upper concavo-convex pattern forming of ABS more accurate, thereby improved the flight characteristic of magnetic head, and then improved readwrite performance.
By following description also by reference to the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used for explaining embodiments of the invention.
Brief description of the drawings
Fig. 1 is the schematic diagram of long strips processing unit (plant) of the present invention.
Fig. 2 is the cut-open view of the etching machine of long strips processing unit (plant) of the present invention while matching with its fixture.
Fig. 3 is the schematic diagram of the photoresistance forming device of long strips processing unit (plant) of the present invention.
Fig. 4 is the process flow diagram of long strips job operation of the present invention.
Embodiment
Set forth below with reference to the accompanying drawings the several different most preferred embodiments of the present invention, wherein in different figure, identical label represents identical parts.The invention provides a kind of job operation and processing unit (plant) of long strips, the heat conduction efficiency of this job operation and device is high and can prevent that long strips is burned in etching process, not only improve the yields of long strips, extend the serviceable life of fixture, also make the upper concavo-convex pattern forming of ABS more accurate, thereby improve the flight characteristic of magnetic head, and then improved readwrite performance.
As shown in Figure 1, processing unit (plant) 1 of the present invention comprises a fixture 10, film-forming apparatus 20, photoresistance forming device 30 and etching machine 40, fixture 10 is for clamping long strips and having the upper surface matching with long strips, film-forming apparatus 20 is for forming a heat conduction layer and form a photopolymer layer on heat conduction layer at the upper surface of fixture 10, photoresistance forming device 30 for forming photoresistance pattern on long strips, and etching machine 40 has the long strips of photoresistance pattern for etching.Particularly, as shown in Figure 2, this etching machine 40 has an etching machine 44, is located at the pallet 42 on etching machine 44 and is located at the cooling system 46 of etching machine 44 belows.Be placed on pallet 42 in order to the fixture 10 that clamps long strips.Preferably, cooling system 46 is liquid nitrogen cooling system, and its cooldown rate is fast and be convenient to control.More specifically, photopolymer layer is made by Instant cement, and heat conduction layer is made by diamond-like-carbon.Diamond-like-carbon can be strengthened the adhesion property between photopolymer layer and fixture 10 upper surfaces, improves its heat conduction efficiency.
In the time that need use processing unit (plant) 1 to be etched with formation ABS on long strips, first use film-forming apparatus 20 to form a heat conduction layer and on heat conduction layer, form a photopolymer layer at the upper surface of fixture 10, then use baking device to cure fixture 10 at the temperature of 100 DEG C～140 DEG C, optimum temperature is 120 DEG C, makes heat conduction layer and photopolymer layer more firmly stick to fixture 10 upper surfaces and can not peel off.Then, one group of long strips is bonded on the above-mentioned fixture 10 of etching machine 40, the surface that long strips does not contact with fixture 10 is the surface that is used to form magnetic head ABS.Next step, re-use photoresistance forming device 30 and will on the surface of formation ABS, form photoresistance pattern at long strips.Concrete, as shown in Figure 3, photoresistance forming device 30 comprises photoresistance Spray painting tool 32, exposure tool 34 and developer tool 36.Use photoresistance Spray painting tool 32 that photoresistance is sprayed into long strips by forming on the surface of ABS, re-use exposure tool 34, photoresistance as above-mentioned in the exposure of ultraviolet selective, finally uses developer tool 36, as developer solution is removed the photoresistance being exposed and formed photoresistance pattern.Next step, the long strips that is formed with photoresistance pattern is placed on above-mentioned etching machine 40, and etching is not by the long strips surface of photoresistance pattern covers, thus the geometry adapting at this surface formation and photoresistance pattern.Finally, the remaining photoresistance in long strips surface is removed, thereby complete photoetching process, form ABS.After photoetching process completes, long strips unloads from fixture 10, the heat conduction layer and the photopolymer layer that stick on fixture 10 can clean with chemical solvent, then reuse film-forming apparatus 20 at the upper surface of fixture 10 and form a heat conduction layer and be positioned at photopolymer layer on this heat conduction layer to clamp next group long strips.
Long strips can produce a large amount of heat in etching process, and the heat on long strips conducts to the cooling system 46 of being located under etching machine 44 by photopolymer layer, heat conduction layer, fixture 10, pallet 42 and etching machine 44.Heat conduction layer the adhesion property that can strengthen between photopolymer layer and fixture 10 upper surfaces is set, improve its heat conduction efficiency, and then can prevent that long strips is burned in etching process, improved the yields of long strips.And heat conduction layer has improved the surface nature of fixture 10 upper surfaces, and higher heat conduction efficiency can reduce the infringement of etching to fixture 10, thereby the life cycle of fixture 10 is extended, and has reduced production cost.In addition, because making the temperature of long strips, high heat conduction efficiency in etching process, remains reduced levels, therefore the photoresistance pattern on the ABS of long strips can not be out of shape, pattern resolution is higher, add that high heat conduction efficiency also improved the adhesion property of photoresistance pattern, extended etching period, make the upper concavo-convex pattern forming of ABS more accurate, thereby improve the flight characteristic of the magnetic head of long strips, and then improved its readwrite performance.
As shown in Figure 4, the job operation of long strips of the present invention comprises the steps:
S401 a: fixture is provided, and this fixture has the upper surface matching with long strips;
S402: form a heat conduction layer on this upper surface;
S403: form a photopolymer layer on this heat conduction layer;
S404: bonding long strips is to fixture, and the one side of long strips fits with photopolymer layer;
S405: the above-mentioned long strips of etching.
Concrete, heat conduction layer is made by diamond-like-carbon.Diamond-like-carbon has good etch resistant properties, is often used to protect the pole tip on magnetic head, and can strengthen the adhesion property between photopolymer layer and fixture upper surface.
Preferably, job operation is cured fixture after being also included in and forming photopolymer layer at the temperature of 100 DEG C～140 DEG C, makes heat conduction layer and photopolymer layer more firmly stick to fixture upper surface and can not peel off.
Preferably, step (5) is included in and on long strips, forms photoresistance pattern.
Particularly, the step of formation photoresistance pattern comprises photoresistance, exposure and development.
The job operation of above-mentioned long strips forms a heat conduction layer and photopolymer layer at the upper surface of fixture, and heat conduction layer layer is sandwiched between fixture and photopolymer layer.Heat conduction layer can be strengthened the adhesion property between photopolymer layer and fixture, thereby improves its heat conduction efficiency, and then can prevent that long strips is burned in etching process, has improved the yields of long strips.And heat conduction layer has improved the surface nature of fixture upper surface, and higher heat conduction efficiency can reduce the infringement of etching to fixture, thereby the life cycle of fixture is extended, and has reduced production cost.In addition, because making the temperature of long strips, high heat conduction efficiency in etching process, remains reduced levels, therefore the photoresistance pattern on ABS can not be out of shape, pattern resolution is higher, add that high heat conduction efficiency also improved the adhesion property of photoresistance pattern, extended etching period, make the upper concavo-convex pattern forming of ABS more accurate, thereby improve the flight characteristic of magnetic head, and then improved its readwrite performance.
Above disclosed is only preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the present patent application the scope of the claims, still belongs to the scope that the present invention is contained.
Claims (10)
1. a job operation for long strips, comprises the following steps:
(1) provide a fixture, described fixture has the upper surface matching with long strips;
(2) on described upper surface, form a heat conduction layer;
(3) on described heat conduction layer, form a photopolymer layer;
(4) bonding described long strips is on described fixture, and the one side of described long strips fits with described photopolymer layer; And
(5) long strips described in etching.
2. job operation as claimed in claim 1, is characterized in that: described heat conduction layer is made by diamond-like-carbon.
3. job operation as claimed in claim 1, is characterized in that: after being also included in the described photopolymer layer of formation, at the temperature of 100 DEG C～140 DEG C, cure described fixture.
4. job operation as claimed in claim 1, is characterized in that: described step (5) is also included in and on described long strips, forms photoresistance pattern.
5. job operation as claimed in claim 4, is characterized in that: the step that forms described photoresistance pattern comprises photoresistance, exposure and development.
6. a processing unit (plant) for long strips, comprising:
One fixture, for clamping long strips, described fixture has the upper surface matching with described long strips;
Film-forming apparatus, for forming a heat conduction layer and form a photopolymer layer on described heat conduction layer at the upper surface of described fixture; And
Etching machine, for long strips described in etching.
7. processing unit (plant) as claimed in claim 6, is characterized in that: described heat conduction layer is made by diamond-like-carbon.
8. processing unit (plant) as claimed in claim 6, is characterized in that: also comprise baking device, for cure described fixture at the temperature of 100 DEG C～140 DEG C after the described photopolymer layer of formation.
9. processing unit (plant) as claimed in claim 6, is characterized in that: also comprise photoresistance forming device, for formed photoresistance pattern on described long strips before long strips described in etching.
10. processing unit (plant) as claimed in claim 9, is characterized in that: described photoresistance forming device comprises photoresistance Spray painting tool, exposure tool and developer tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310103626.0A CN104078054A (en) | 2013-03-27 | 2013-03-27 | Long bar processing method and processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310103626.0A CN104078054A (en) | 2013-03-27 | 2013-03-27 | Long bar processing method and processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104078054A true CN104078054A (en) | 2014-10-01 |
Family
ID=51599275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310103626.0A Pending CN104078054A (en) | 2013-03-27 | 2013-03-27 | Long bar processing method and processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104078054A (en) |
-
2013
- 2013-03-27 CN CN201310103626.0A patent/CN104078054A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7927973B2 (en) | Method for dividing semiconductor wafer and manufacturing method for semiconductor devices | |
| JP4018088B2 (en) | Semiconductor wafer dividing method and semiconductor element manufacturing method | |
| KR102629529B1 (en) | Processing system and processing method | |
| CN107026122A (en) | The processing method of chip | |
| JP2012056178A5 (en) | ||
| CN1201548A (en) | Toll for processing magnetic read/write heads and associated method | |
| CN1119806C (en) | Method for mfg. magnetic head slider | |
| US6865798B2 (en) | Method for shaping air bearing surface of magnetic head slider | |
| CN104078054A (en) | Long bar processing method and processing device | |
| CN104216216A (en) | Edge-washing chamber of coating device and edge-washing method | |
| JP2010192616A (en) | Method of forming protective film and method of processing wafer | |
| US8453311B2 (en) | Sheet-stack cutting | |
| KR101471510B1 (en) | Concave portion forming method, concave-convex product manufacturing method, light-emitting element manufacturing method, and optical element manufacturing method | |
| JP2015500547A (en) | Optical calibration disc | |
| CN1822109B (en) | Method and apparatus for forming surface shape, method and apparatus for forming flying surface shape of magnetic head | |
| CN1825436A (en) | Method and apparatus for forming surface shape, method and apparatus for forming flying surface shape of magnetic head | |
| JP2007268557A (en) | Laser beam machine and window cell | |
| US7166334B2 (en) | Method of manufacturing disc-shaped recording medium | |
| US20060255021A1 (en) | Manufacturing method of slider | |
| JP3015546B2 (en) | Resist coating method | |
| JPH01264644A (en) | Production of optical disk substrate | |
| JP2005310889A (en) | Semiconductor device, method for manufacturing the same and wafer with identification information | |
| US20080024772A1 (en) | Particle removal tool with integrated defect detection/analysis capability | |
| JPH10124808A (en) | Production of magnetic head | |
| CN114055322A (en) | KDP surface microdefect profiling deliquescence repair device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141001 |