CN104077376A - Press-welding target identifying and positioning method and system of full-automatic aluminum wire press welder - Google Patents
Press-welding target identifying and positioning method and system of full-automatic aluminum wire press welder Download PDFInfo
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- CN104077376A CN104077376A CN201410289736.5A CN201410289736A CN104077376A CN 104077376 A CN104077376 A CN 104077376A CN 201410289736 A CN201410289736 A CN 201410289736A CN 104077376 A CN104077376 A CN 104077376A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention relates to a press-welding target identifying and positioning method and a press-welding target identifying and positioning system of a full-automatic aluminum wire press welder. The method comprises: firstly defining a frame unit and chips thereon in a layered grading manner, then adjusting the position of a camera to enable a substrate layer and the chips in each layer to be clearly imaged in a field of view and storing the corresponding camera position data into a database corresponding to each layer; when the chips on the certain layer are clearly imaged in the field of view, identifying and positioning the identification features of the chips in the layer, and endowing the corresponding chip in the database of the chip layer with obtained position and angle data. The method and system are not limited in the identification and positioning of the single-layer chips or the chips with single type, and flexibility and adaptability of the system are both greatly improved. Meanwhile, since the layers are processed layer by layer, the background management database of the identification system is distinct and clear; when needing to change, add or delete the chip layer or a lead frame rank, the whole identification system does not need to be set or defined again, thus being simple and rapid in operation process.
Description
Technical field
The present invention relates to a kind of Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method and system.
Background technology
The identification and positioning system of aluminium wire pressure welding device is aimed at soldering appliance in welding region position for automatically determining before bonding wire with solder joint.At present, the recognition system of pressure welding device is by the one single chip target for single model mostly, chip unit is transferred to field of view, utilize stationary installation that chi frame is fixed on to current location, after fixedly completing, by computer generated image system, obtain the position of chip and framework and finally complete chip positioning and process.This kind of mode is applicable to the welding of same chip model, single lead frame, one single chip unit.But along with the variation of pressure welding object form, occurred that single frame unit comprises different model, multi-form chip, and arranged multilayer chiop more, this just has higher requirement to the identification location of chip.Along with on market to enhancing productivity, the demand saving production cost increases day by day, original identification and positioning system cannot be met the need of market.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method and system, can be for comprising different model on single frame unit, multi-form chip is identified, and realizes the identification location of the multi-level chip of many rows.
In order to solve the problems of the technologies described above, Full-automatic aluminum thread pressure welding machine pressure welding target identification and positioning system of the present invention comprises following module:
Hierarchical definition module successively: the mode that adopts successively classification to frame unit with and on chip define, lead frame unit is defined as to Base layer, directly the chip layer of paster on lead frame is defined as Bondlayer1 layer, each chip of Bondlayer1 layer is defined as respectively Bondlayer1.1, Bondlayer1.2,, Bondlayer1.N
1; The chip layer of paster on Bondlayer1 layer is defined as Bondlayer2 layer, and each chip of Bondlayer2 layer is defined as respectively Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N
2; The rest may be inferred, and each chip of BondlayerM layer is defined as respectively BondlayerM.1, BondlayerM.2 ... BondlayerM.N
m;
Base layer locating module: adjust camera position, whether what judge blur-free imaging in visual field is Base layer, adjustment camera position, whether what judge blur-free imaging in visual field is Base layer, is the recognition feature of lead frame unit to be identified to location; If Base layer welding position is lead frame pin, without identification, by pin position and angle be made as definite value;
First camera adjusting module: adjust camera position and make Bondlayer1 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer1 layer correspondence;
Bondlayer1 layer chip identification locating module: from Bondlayer1 layer, analyze Bondlayer1 layer each chip identification feature and position relationship; If there are a plurality of separate chips to identify respectively location, and by the position data assignment of each chip to chip corresponding in Bondlayer1 layer data storehouse; If Base layer only has one to follow chip, lead frame unit and this are followed to relative position between chip and angle-data assignment to this chip corresponding in Bondlayer1 layer data storehouse, or separately this is followed that chip identification feature identify location and this chip to correspondence in Bondlayer1 layer data storehouse by its position and angle-data assignment;
I camera adjusting module: adjust camera position and make successively each chip layer blur-free imaging in visual field, corresponding camera position data are deposited in the database of each Bondlayer layer correspondence;
BondlayerI layer chip identification locating module: for arbitrary chip BondlayerI, J, I is the level number at chip place, J is that chip is in the sequence number of I floor, if this chip BondlayerI, on J, only have one to follow chip, calculate this position of following chip identification feature and angle and by its assignment to this corresponding chip of following of Bondlayer (I+1) layer, or calculate this and follow chip identification feature and this chip BondlayerI, the relative position between J recognition feature and angle the chip of following to this correspondence of Bondlayer (I+1) layer by its assignment; If this chip BondlayerI, has at least two separate chips on J, these chips are identified respectively to location, and by the elements of a fix assignment of these chip identification features to chip corresponding to Bondlayer (I+1) layer; Travel through each chip of each chip layer, until complete the identification location of all chips, the elements of a fix assignment of all chip identification features is given to the corresponding chip of corresponding chip layer.
Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method of the present invention comprises the steps:
Step 1: the mode that adopts successively classification to frame unit with and on chip define, lead frame unit is defined as to Base layer, directly the chip layer of paster on lead frame is defined as Bondlayer1 layer, each chip of Bondlayer1 layer is defined as respectively Bondlayer1.1, Bondlayer1.2,, Bondlayer1.N
1; The chip layer of paster on Bondlayer1 layer is defined as Bondlayer2 layer, and each chip of Bondlayer2 layer is defined as respectively Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N
2; The rest may be inferred, and each chip of BondlayerM layer is defined as respectively BondlayerM.1, BondlayerM.2 ... BondlayerM.N
m;
Step 2: adjust camera position, whether what judge blur-free imaging in visual field is Base layer, is the recognition feature of lead frame unit to be identified to location; If Base layer welding position is lead frame pin, without identification, by pin position and angle be made as definite value;
Step 3: adjust camera position and make Bondlayer1 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer1 layer correspondence;
Step 4: from Bondlayer1 layer, analyze Bondlayer1 layer each chip identification feature and position relationship; If there are a plurality of separate chips to identify respectively location, and by the position data assignment of each chip to chip corresponding in Bondlayer1 layer data storehouse; If Base layer only has one to follow chip, lead frame unit 1 and this are followed to relative position between chip and angle-data assignment to this chip corresponding in Bondlayer1 layer data storehouse, or separately this is followed that chip identification feature identify location and this chip to correspondence in Bondlayer1 layer data storehouse by its position and angle-data assignment;
Step 5: adjust camera position and make successively each chip layer blur-free imaging in visual field, corresponding camera position data are deposited in the database of each Bondlayer layer correspondence;
Step 6: for arbitrary chip BondlayerI, J, I is the level number at chip place, J is that chip is in the sequence number of I floor, if this chip BondlayerI, on J, only have one to follow chip, calculate this position of following chip identification feature and angle and by its assignment to this corresponding chip of following of Bondlayer (I+1) layer, or calculate this and follow chip identification feature and this chip BondlayerI, the relative position between J recognition feature and angle the chip of following to this correspondence of Bondlayer (I+1) layer by its assignment; If this chip BondlayerI, has at least two separate chips on J, these chips are identified respectively to location, and by the elements of a fix assignment of these chip identification features to chip corresponding to Bondlayer (I+1) layer; Travel through each chip of each chip layer, until complete the identification location of all chips, the elements of a fix assignment of all chip identification features is given to the corresponding chip of corresponding chip layer.
The present invention uses the delamination process of chip and recognition feature and matching process to make whole system no longer be confined to single layer of chips target or one chip model, and the dirigibility of system and adaptability all significantly improve.Meanwhile, because every layer of layering processed, its recognition system back-stage management database clear and definite, when chip layer or lead frame row are changed, dosed or delete to needs, no longer needs again whole recognition system to be arranged or defined, and operating process is simple and quick.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 is the welding work pieces structural representation with many row's multilayer chiops.
Fig. 2 is chip target and follows chip relative position relation schematic diagram.
Fig. 3 is chip target and follows chip position schematic diagram.
Fig. 4 Full-automatic aluminum thread pressure welding machine of the present invention pressure welding target identification and positioning system block diagram.
Fig. 5 is Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method process flow diagram of the present invention.
Embodiment
As shown in Figure 4, Full-automatic aluminum thread pressure welding machine pressure welding target identification and positioning system of the present invention comprises: hierarchical definition module successively, Base layer locating module, first camera adjusting module, Bondlayer1 layer chip identification locating module, I camera adjusting module, BondlayerI layer chip identification locating module.
As shown in Figure 5, Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method of the present invention is specific as follows:
Step 1: according to the relations of dependence of pressure welding target, for different working linings defines; As shown in Figure 1, lead frame unit 1 is defined as Base layer, and directly the chip layer of paster on lead frame is defined as Bondlayer1 layer, and Bondlayer1 layer has two chips, is defined as respectively Bondlayer1.1, Bondlayer1.2; The chip layer of paster on Bondlayer1 layer is defined as Bondlayer2 layer, and Bondlayer2 layer has four chips, is defined as respectively Bondlayer2.1, Bondlayer2.2, Bondlayer2.3, Bondlayer2.4;
Step 2: adjust camera position, whether what judge blur-free imaging in visual field is Base layer, is the position of the recognition feature of lead frame unit 1 and angle-data to be made as to definite value.Recognition feature can be the limit at any point and place thereof in four summit A, B, C, D, finds the angle on this point coordinate and limit, place thereof, for example, using summit A and AB limit as recognition feature, find the angle on summit A and AB limit; Also location all can be identified to as recognition feature in four summits and four limits of lead frame unit 1.If Base layer welding position is lead frame pin 4, without identification, the coordinate of pin 4 is for being made as definite value.
Step 3: adjust camera position (if camera is varifocal, adjusting the focal length of camera) and make Bondlayer1 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer1 layer correspondence.
Step 4: from Bondlayer1 layer, analyze Bondlayer1 layer each chip identification feature and position relationship.If there are a plurality of separate chips to identify respectively location, and by the position of each chip identification feature and angle-data assignment to chip corresponding in Bondlayer1 layer data storehouse; If Base layer only has one to follow chip, lead frame unit 1 recognition feature and this are followed to relative position between chip identification feature and angle-data assignment to chip corresponding in Bondlayer1 layer data storehouse.Described recognition feature can be the printed conductor around of frame line, texture, welding region of chip or the straight line that represents welding region, asterism etc.
As shown in Figure 1, Bondlayer1 layer has two separate chips, needs these two chips to identify respectively location.If the welding region of two chips is around with printed conductor, can be using printed conductor as recognition feature, by the angle assignment on the coordinate on four summits of printed conductor and four limits to the Bondlayer1.1 in Bondlayer1 layer data storehouse, Bondlayer1.2.
Step 5: adjust camera position and make Bondlayer2 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer2 layer correspondence.
Step 6: chip identification feature and the position relationship of analyzing Bondlayer2 layer.If the separate location of identifying respectively of chip chamber, and by the position of each chip identification feature and angle-data assignment to chip corresponding in Bondlayer1 layer data storehouse; If chip chamber is followed relation, the obvious chip of selective recognition feature is as identifying object, determine identifying object recognition feature and follow relative position and the angular relationship between chip identification feature, and by identifying object recognition feature with follow relative position between chip identification feature and angle-data assignment to chip corresponding in Bondlayer1 layer data storehouse.
As shown in Figure 1, Bondlayer2 layer has three separate chips to be positioned on chip Bondlayer1.1, need respectively the position coordinates of three chip identification features and angle assignment to chip Bondlayer2.1 corresponding in Bondlayer2 layer data storehouse, Bondlayer2.2, Bondlayer2.3.
As shown in Figure 2, the recognition feature of chip Bondlayer1.2 is welding region printed conductor around, and its four summits are A
1.2, B
1.2, C
1.2, D
1.2, the recognition feature of chip Bondlayer2.4 is welding region two straight line A around
2.4d
2.4, B
2.4c
2.4, Bondlayer1.2 and Bondlayer2.4 follow relation.Because Bondlayer2.4 sticks on Bondlayer1.2, therefore when the identification search of carrying out Bondlayer1.2, without identifying in whole field range or mating, can utilize the chip position of Bondlayer1.2 and size restrictions to go out the plain region of searching of Bondlayer2.4.Also after finding chip Bondlayer1.2 position, according to Bondlayer1.2 and Bondlayer2.4 position relationship can obtain Bondlayer2.4 position location.As the aluminum steel having welded can affect the feature extraction of Bondlayer2.4, further restricted searching area, makes the recognition feature in region of search more clear, but the feature that must guarantee in region of choosing of region of search has uniqueness.Chip Bondlayer2.4 can adopt following method to determine that it follows position relationship.
Calculate the upper A of Bondlayer1.2
1.2point and the upper A of Bondlayer2.4
2.4distance S between point
x1.2, S
y1.2and A
1.2d
1.2limit and straight line A
2.4d
2.4between angle theta
2.4', by S
x1.2, S
y1.2and θ
2.4assignment is to chip Bondlayer2.4 corresponding in Bondlayer2 layer data storehouse.If straight line A
2.4d
2.4be blocked, also can pass through straight line B
2.4c
2.4calculate position between two chips and angular relationship assignment to Bondlayer2.4.
As shown in Figure 3, chip Bondlayer2.4 also can adopt the method for independent identification location to determine its position and angle.As calculated A
2.4coordinate and the straight line A of point
2.4d
2.4angle θ
2.4, or calculate A simultaneously
2.4point, B
2.4coordinate and straight line A
2.4d
2.4, B
2.4c
2.4angle θ
2.4.
The welding region of substrate Base layer is owing to being fixed position on lead frame, and welding coordinate can be made as definite value, does not need to set by identification.When the welding position on weld layer need to be adjusted according to chip position, utilize identification to position.For the chip on Bondlayer1, between analysis chip, whether there is position relationship.When each chip is separate, be each chip definition recognition feature or matching process; When following between target while being related to, select the obvious chip of feature as identifying object.Navigate to behind the position of identifying object, according to identifying object and the position relationship of following chip, can find the position of following chip.When Bondlayer2 exists, first, according to the identification region of search scope of the position relationship constraint Bondlayer2 of Bondlayer1 and Bondlayer2, then in this region, carry out target localization.For avoiding the impact of other target that existing bonding wire or feature are close, for each identification target arranges area-of-interest, making to identify coupling work just carries out at region of interest domain search, for chip features, some chip is arranged to recognizing site and identification angle, so that identification clarification of objective is more outstanding.When there is multi-row lead frame frame, for each basalis arranges identification reference position, and repeat the analyzing and processing process of above-mentioned single basalis.
Claims (2)
1. a Full-automatic aluminum thread pressure welding machine pressure welding target identification and positioning system, is characterized in that comprising following module:
Hierarchical definition module successively: the mode that adopts successively classification to frame unit with and on chip define, lead frame unit is defined as to Base layer, directly the chip layer of paster on lead frame is defined as Bondlayer1 layer, each chip of Bondlayer1 layer is defined as respectively Bondlayer1.1, Bondlayer1.2,, Bondlayer1.N
1; The chip layer of paster on Bondlayer1 layer is defined as Bondlayer2 layer, and each chip of Bondlayer2 layer is defined as respectively Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N
2; The rest may be inferred, and each chip of BondlayerM layer is defined as respectively BondlayerM.1, BondlayerM.2 ... BondlayerM.N
m;
Base layer locating module: adjust camera position, whether what judge blur-free imaging in visual field is Base layer, adjustment camera position, whether what judge blur-free imaging in visual field is Base layer, is the recognition feature of lead frame unit to be identified to location; If Base layer welding position is lead frame pin, without identification, by pin position and angle be made as definite value;
First camera adjusting module: adjust camera position and make Bondlayer1 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer1 layer correspondence;
Bondlayer1 layer chip identification locating module: from Bondlayer1 layer, analyze Bondlayer1 layer each chip identification feature and position relationship; If there are a plurality of separate chips to identify respectively location, and by the position data assignment of each chip to chip corresponding in Bondlayer1 layer data storehouse; If Base layer only has one to follow chip, lead frame unit and this are followed to relative position between chip and angle-data assignment to this chip corresponding in Bondlayer1 layer data storehouse, or separately this is followed that chip identification feature identify location and this chip to correspondence in Bondlayer1 layer data storehouse by its position and angle-data assignment;
I camera adjusting module: adjust camera position and make successively each chip layer blur-free imaging in visual field, corresponding camera position data are deposited in the database of each Bondlayer layer correspondence;
BondlayerI layer chip identification locating module: for arbitrary chip BondlayerI, J, I is the level number at chip place, J is that chip is in the sequence number of I floor, if this chip BondlayerI, on J, only have one to follow chip, calculate this position of following chip identification feature and angle and by its assignment to this corresponding chip of following of Bondlayer (I+1) layer, or calculate this and follow chip identification feature and this chip BondlayerI, the relative position between J recognition feature and angle the chip of following to this correspondence of Bondlayer (I+1) layer by its assignment; If this chip BondlayerI, has at least two separate chips on J, these chips are identified respectively to location, and by the elements of a fix assignment of these chip identification features to chip corresponding to Bondlayer (I+1) layer; Travel through each chip of each chip layer, until complete the identification location of all chips, the elements of a fix assignment of all chip identification features is given to the corresponding chip of corresponding chip layer.
2. a Full-automatic aluminum thread pressure welding machine pressure welding target recognition positioning method, is characterized in that comprising the steps:
Step 1: the mode that adopts successively classification to frame unit with and on chip define, lead frame unit is defined as to Base layer, directly the chip layer of paster on lead frame is defined as Bondlayer1 layer, each chip of Bondlayer1 layer is defined as respectively Bondlayer1.1, Bondlayer1.2,, Bondlayer1.N
1; The chip layer of paster on Bondlayer1 layer is defined as Bondlayer2 layer, and each chip of Bondlayer2 layer is defined as respectively Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N
2; The rest may be inferred, and each chip of BondlayerM layer is defined as respectively BondlayerM.1, BondlayerM.2 ... BondlayerM.N
m;
Step 2: adjust camera position, whether what judge blur-free imaging in visual field is Base layer, is the recognition feature of lead frame unit to be identified to location; If Base layer welding position is lead frame pin, without identification, by pin position and angle be made as definite value;
Step 3: adjust camera position and make Bondlayer1 layer chip blur-free imaging in visual field, and camera position data are now deposited in the database of Bondlayer1 layer correspondence;
Step 4: from Bondlayer1 layer, analyze Bondlayer1 layer each chip identification feature and position relationship; If there are a plurality of separate chips to identify respectively location, and by the position data assignment of each chip to chip corresponding in Bondlayer1 layer data storehouse; If Base layer only has one to follow chip, lead frame unit 1 and this are followed to relative position between chip and angle-data assignment to this chip corresponding in Bondlayer1 layer data storehouse, or separately this is followed that chip identification feature identify location and this chip to correspondence in Bondlayer1 layer data storehouse by its position and angle-data assignment;
Step 5: adjust camera position and make successively each chip layer blur-free imaging in visual field, corresponding camera position data are deposited in the database of each Bondlayer layer correspondence;
Step 6: for arbitrary chip BondlayerI, J, I is the level number at chip place, J is that chip is in the sequence number of I floor, if this chip BondlayerI, on J, only have one to follow chip, calculate this position of following chip identification feature and angle and by its assignment to this corresponding chip of following of Bondlayer (I+1) layer, or calculate this and follow chip identification feature and this chip BondlayerI, the relative position between J recognition feature and angle the chip of following to this correspondence of Bondlayer (I+1) layer by its assignment; If this chip BondlayerI, has at least two separate chips on J, these chips are identified respectively to location, and by the elements of a fix assignment of these chip identification features to chip corresponding to Bondlayer (I+1) layer; Travel through each chip of each chip layer, until complete the identification location of all chips, the elements of a fix assignment of all chip identification features is given to the corresponding chip of corresponding chip layer.
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