CN104064613A - High-heat-dissipation type integrated backboard for solar cells and manufacturing method thereof - Google Patents

High-heat-dissipation type integrated backboard for solar cells and manufacturing method thereof Download PDF

Info

Publication number
CN104064613A
CN104064613A CN201410332759.XA CN201410332759A CN104064613A CN 104064613 A CN104064613 A CN 104064613A CN 201410332759 A CN201410332759 A CN 201410332759A CN 104064613 A CN104064613 A CN 104064613A
Authority
CN
China
Prior art keywords
heat conduction
dissipation type
resin
layer
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410332759.XA
Other languages
Chinese (zh)
Other versions
CN104064613B (en
Inventor
王同心
陈坤
刘晓娇
王强
蒋贤明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhong Tian Photovoltaic Materials Co Ltd
Original Assignee
Zhong Tian Photovoltaic Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhong Tian Photovoltaic Materials Co Ltd filed Critical Zhong Tian Photovoltaic Materials Co Ltd
Priority to CN201410332759.XA priority Critical patent/CN104064613B/en
Publication of CN104064613A publication Critical patent/CN104064613A/en
Application granted granted Critical
Publication of CN104064613B publication Critical patent/CN104064613B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a high-heat-dissipation type integrated backboard for solar cells. The high-heat-dissipation type integrated backboard for solar cells is characterized by comprising a weather-proof blocking layer, a high heat conduction layer and a protective layer, the weather-proof blocking layer is installed on and bonded to the reverse side of a substrate through a first heat conduction bonding layer, the high heat conduction layer is installed on and bonded to the obverse side of the substrate through a heat conduction bonding layer, and the protective layer is installed on the high heat conduction layer. By the adoption of the integrated structure, production efficiency of an assembly can be improved. As the reverse side of the substrate is made of such materials and high heat conduction annexing agents are added into the high heat conduction layer of the obverse side of the substrate, the heat conduction rate of the backboard is improved and then the power generation efficiency of the assembly is improved.

Description

A kind of heat dissipation type high integrated backboard used for solar batteries and manufacture method thereof
Technical field
The present invention relates to a kind of heat dissipation type high integrated backboard used for solar batteries and manufacture method thereof, relate in particular to a kind of used for solar batteries integrated backboard and manufacture method thereof of heat dissipation type high, belong to photovoltaic technology field.
Background technology
Along with the exhaustion of consumption increasingly of traditional fossil fuel, the mankind constantly seek new energy substitution scheme, solar energy is the green renewable resource of generally acknowledging at present, photovoltaic (PV) power generating industry has grown continuously and fast since the eighties in 20th century, how to effectively utilize solar energy and become the focus that current technical field of new energies is paid close attention to, according to " planning of regenerative resource Long-and Medium-term Development " of National Development and Reform Committee's establishment, to reach 2,500 ten thousand kilowatts to the year two thousand twenty China photovoltaic generation total capacity.In photovoltaic generating system, in PV assembly, along with the continuous irradiation of sunlight, silion cell plate can constantly heat up thereupon.Research shows, 1 DEG C of the every rising of silion cell temperature, its photovoltaic transfer ratio can decline 0.4%, has also reduced energy utilization rate, therefore how to make silion cell plate radiating and cooling become a large problem of current field of solar energy utilization to improve photovoltaic transfer ratio, but in industry, there is no ripe solution.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of heat dissipation type high integrated backboard used for solar batteries and manufacture method thereof, and the backboard that adopts the method to prepare has good cooling-down effect and good generating efficiency.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of heat dissipation type high integrated backboard used for solar batteries, comprise base material, its innovative point is: be arranged on this substrate backside and be bonded in the weather-proof barrier layer of described substrate backside by the first heat conduction adhesive linkage, be arranged on this base material positive and be bonded in the high thermal conductivity layer in described base material front by the second heat conduction adhesive linkage, cover the protective layer above described high thermal conductivity layer, described high thermal conductivity layer is by polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, one or more in organic siliconresin mix, in described high thermal conductivity layer, described the first heat conduction tack coat and the second heat conduction tack coat, be all added with high heat conduction additive, described high heat conduction additive is mixed by one or more in zinc oxide, silicon dioxide, diamond, carborundum, aluminium oxide, boron nitride, boron carbide, Graphene, aluminium nitride, metal powder.
Preferably, described base material is mixed by one or more in PETG, polybutylene terephthalate, poly terephthalic acid diallyl, anodic oxidation aluminium plate, Merlon, and the thickness of described base material is 5 μ m ~ 500 μ m.
Preferably, described weather-proof barrier layer is for being mixed by one or more in polyflon, polyvinylidene fluoride resin, polyfluoroethylene resin, ethene ~ tetrafluoroethylene copolymer resins, fluorinated ethylene propylene copolymer resin, daiflon, thermoplastic fluorine-containing resin, aluminium foil, and the thickness of described weather-proof barrier layer is 5 μ m ~ 300 μ m.
Preferably, described the first heat conduction adhesive linkage and described the second heat conduction adhesive linkage mix by one or more in polyurethane adhesive, organic silica gel, polymer hot melting glue, epoxide-resin glue, and the thickness of described the first heat conduction adhesive linkage and described the second heat conduction adhesive linkage is 1 μ m ~ 50 μ m.
Preferably; described protective layer is mixed by one or more in polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, organic siliconresin, and the thickness of described protective layer is 10 μ m ~ 500 μ m.
Preferably, described high thermal conductivity layer thickness is 15 μ m ~ 300 μ m.
Preferably, described high heat conduction additive accounts for respectively 1% ~ 80% of described high thermal conductivity layer, described the first heat conduction tack coat and described the second heat conduction tack coat part by weight.
Preferably, described high heat conduction additive is of a size of 0.1 μ m ~ 50 μ m.
The manufacture method of a kind of heat dissipation type high integrated backboard used for solar batteries, for the manufacture of above-mentioned a kind of heat dissipation type high integrated backboard used for solar batteries, comprise the following steps: first heat conduction adhesive is coated on to base material both sides, after being heating and curing, form the first heat conduction tack coat and the second heat conduction tack coat, by the first heat conduction adhesive linkage, weather-proof barrier layer is bonded to substrate backside, then by the second heat conduction adhesive linkage, high thermal conductivity layer is bonded to base material front, then hot pressing composite protection layer on high thermal conductivity layer, after rolling, treated base material is sent into baking oven slaking.
The invention has the advantages that: owing to being added with high heat conduction additive in high thermal conductivity layer and the second heat conduction tack coat, improve the thermal conductivity of backboard to 0.5-1.5W/mk, and make backboard there is good cooling-down effect, can reduce the working temperature 1-5 DEG C of assembly, and then improve assembly generating efficiency 1 ~ 7.5%.In addition, the sandwich construction of backboard makes it have the dual-use function of conventional backboard and lower floor's ethylene-vinyl acetate copolymer packaging adhesive film, has reduced the laminating step of the EVA of lower floor packaging adhesive film when assembly is produced, and has improved assembly production efficiency.
Embodiment
Heat dissipation type high of the present invention integrated backboard used for solar batteries; comprise base material; be arranged on this substrate backside and be bonded in the weather-proof barrier layer of substrate backside by the first heat conduction adhesive linkage; be arranged on this base material positive and be bonded in the high thermal conductivity layer in base material front by the second heat conduction adhesive linkage, cover the protective layer above high thermal conductivity layer.High thermal conductivity layer is mixed by one or more in polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, organic siliconresin, and this high thermal conductivity layer thickness is 15 μ m ~ 300 μ m.In high thermal conductivity layer, the first heat conduction tack coat and the second heat conduction tack coat, be all added with high heat conduction additive, high heat conduction additive is mixed by one or more in zinc oxide, silicon dioxide, diamond, carborundum, aluminium oxide, boron nitride, boron carbide, Graphene, aluminium nitride, metal powder.In addition, high heat conduction additive accounts for respectively 1% ~ 80% of high thermal conductivity layer and the first heat conduction tack coat and the second heat conduction tack coat part by weight, and high heat conduction additive is of a size of 0.1 μ m ~ 50 μ m.
Above-mentioned base material is mixed by one or more in PETG, polybutylene terephthalate, poly terephthalic acid diallyl, anodic oxidation aluminium plate, Merlon, and the thickness of base material is 5 μ m ~ 500 μ m.Above-mentioned weather-proof barrier layer is to be mixed by one or more in polyflon, polyvinylidene fluoride resin, polyfluoroethylene resin, ethylene-tetrafluoroethylene copolymer resin, fluorinated ethylene propylene copolymer resin, daiflon, thermoplastic fluorine-containing resin, aluminium foil, and the thickness of weather-proof barrier layer is 5 μ m ~ 300 μ m.Above-mentioned protective layer is mixed by one or more in polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, organic siliconresin, and the thickness of protective layer is 10 μ m ~ 500 μ m.
Wherein, the first heat conduction adhesive linkage and the second heat conduction adhesive linkage mix by one or more in polyurethane adhesive, organic silica gel, polymer hot melting glue, epoxide-resin glue, and the thickness of the first heat conduction adhesive linkage and the second heat conduction adhesive linkage is 1 μ m ~ 50 μ m.
The manufacture method of above-mentioned heat dissipation type high integrated backboard used for solar batteries; for the manufacture of above-mentioned heat dissipation type high integrated backboard used for solar batteries; comprise the following steps: first heat conduction adhesive is coated on to base material both sides; after being heating and curing, form the first heat conduction tack coat and the second heat conduction tack coat; by the first heat conduction adhesive linkage, weather-proof barrier layer is bonded to substrate backside; then by the second heat conduction adhesive linkage, high thermal conductivity layer is bonded to base material front; then hot pressing composite protection layer on high thermal conductivity layer, sends treated base material into baking oven slaking after rolling.
embodiment 1
Heat-conduction polyurethane adhesive (containing 30% mass fraction aluminium oxide) is coated on to the two sides that thickness is the anodic oxidation aluminium base of 250 microns, formation thickness is the first heat conduction tack coat and the second heat conduction tack coat of 10 microns, at 80-90 DEG C by adhesive baking-curing 10 minutes, then at 110 DEG C, the anodised aluminium back side, hot pressing composite thickness is that the polyfluoroethylene resin of 28 microns forms weather-proof barrier layer, then the polypropylene screen hot pressing that contains 10% mass fraction silicon nitride and 20% mass fraction aluminium oxide of 300 micron thickness is compounded in to the positive high thermal conductivity layer that forms of anodised aluminium at 150 DEG C, wherein silicon nitride is of a size of 3-5 μ m, aluminium oxide is of a size of 5-10 μ m.Then the ethylene vinyl acetate adhesive film hot pressing that by thickness is 150 microns at 110 DEG C is compounded in polypropylene film surface, puts into baking oven slaking 24h at 60 DEG C after rolling, obtains integrated high heat conduction photovoltaic back after cooling.
The integrated high heat conduction photovoltaic back that this embodiment obtains, thermal conductivity is 0.5W/mk, the relatively conventional backboard of the component efficiency after encapsulation can promote respectively 1.5%.
embodiment 2
Heat-conduction polyurethane adhesive (containing 30% mass fraction aluminium oxide) is coated on to the two sides that thickness is the base material of the PETG of 250 microns, formation thickness is the first heat conduction tack coat and the second heat conduction tack coat of 10 microns, at 80-90 DEG C by adhesive baking-curing 10 minutes, then at 120 DEG C, the back side of PETG, hot pressing composite thickness is that the polyvinylidene fluoride resin of 28 microns forms weather-proof barrier layer, then the front that the polyolefin film hot pressing that contains 20% mass fraction Graphene of 300 micron thickness is compounded in to PETG at 150 DEG C forms high thermal conductivity layer, then the ethylene vinyl acetate adhesive film hot pressing that by thickness is 100 microns at 110 DEG C is compounded in polyolefin film surface, after rolling at 60 DEG C slaking 24h, after cooling, obtain integrated high heat conduction photovoltaic back.
The integrated high heat conduction photovoltaic back that this embodiment obtains, thermal conductivity is respectively 1.0W/mk, and the relatively conventional backboard of the component efficiency after encapsulation can promote respectively 3%.
embodiment 3
Heat-conduction polyurethane adhesive (containing 30% mass fraction aluminium oxide) is coated on to the two sides that thickness is the base material of the PETG of 188 microns, formation thickness is the first heat conduction tack coat and the second heat conduction tack coat of 10 microns, at 80-90 DEG C by adhesive baking-curing 10 minutes, then at 120 DEG C, the back side of PETG, hot pressing composite thickness is that the polyfluoroethylene resin of 28 microns forms weather-proof barrier layer, then the front that the ethylene vinyl acetate adhesive film hot pressing that contains 20% mass fraction aluminium nitride and 30% Graphene of 300 micron thickness is compounded in to PETG at 130 DEG C forms high thermal conductivity layer, then the butvar adhesive film hot pressing that by thickness is 100 microns at 110 DEG C is compounded in high thermal conductivity layer surface, after rolling at 60 DEG C slaking 24h, after cooling, obtain integrated high heat conduction photovoltaic back.
The integrated high heat conduction photovoltaic back that this embodiment obtains, thermal conductivity is 1.5W/mk, the relatively conventional backboard of the component efficiency after encapsulation can promote respectively 3.5%.
Above the invention embodiment is had been described in detail, but content is only for the preferred embodiment of the invention, can not be considered to the practical range for limiting the invention.All equalization variation and improvement etc. of doing according to the invention application range, within all belonging to the patent covering scope of the invention.

Claims (9)

1. a heat dissipation type high integrated backboard used for solar batteries, comprise base material, it is characterized in that: be arranged on this substrate backside and be bonded in the weather-proof barrier layer of described substrate backside by the first heat conduction adhesive linkage, be arranged on this base material positive and be bonded in the high thermal conductivity layer in described base material front by the second heat conduction adhesive linkage, cover the protective layer above described high thermal conductivity layer, described high thermal conductivity layer is by polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, one or more in organic siliconresin mix, in described high thermal conductivity layer, described the first heat conduction tack coat and the second heat conduction tack coat, be all added with high heat conduction additive, described high heat conduction additive is mixed by one or more in zinc oxide, silicon dioxide, diamond, carborundum, aluminium oxide, boron nitride, boron carbide, Graphene, aluminium nitride, metal powder.
2. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, it is characterized in that: described base material is mixed by one or more in PETG, polybutylene terephthalate, poly terephthalic acid diallyl, anodic oxidation aluminium plate, Merlon, and the thickness of described base material is 5 μ m ~ 500 μ m.
3. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, it is characterized in that: described weather-proof barrier layer is for being mixed by one or more in polyflon, polyvinylidene fluoride resin, polyfluoroethylene resin, ethene ~ tetrafluoroethylene copolymer resins, fluorinated ethylene propylene copolymer resin, daiflon, thermoplastic fluorine-containing resin, aluminium foil, and the thickness of described weather-proof barrier layer is 5 μ m ~ 300 μ m.
4. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, it is characterized in that: described the first heat conduction adhesive linkage and described the second heat conduction adhesive linkage mix by one or more in polyurethane adhesive, organic silica gel, polymer hot melting glue, epoxide-resin glue, and the thickness of described the first heat conduction adhesive linkage and described the second heat conduction adhesive linkage is 1 μ m ~ 50 μ m.
5. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries; it is characterized in that: described protective layer is mixed by one or more in polyolefin, polyethylene, polypropylene, polyvinyl acetate, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl butyral resin, epoxy resin, acrylic resin, organic siliconresin, and the thickness of described protective layer is 10 μ m ~ 500 μ m.
6. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, is characterized in that: described high thermal conductivity layer thickness is 15 μ m ~ 300 μ m.
7. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, is characterized in that: described high heat conduction additive accounts for respectively 1% ~ 80% of described high thermal conductivity layer, described the first heat conduction tack coat and described the second heat conduction tack coat part by weight.
8. a kind of heat dissipation type high as claimed in claim 1 integrated backboard used for solar batteries, is characterized in that: described high heat conduction additive is of a size of 0.1 μ m ~ 50 μ m.
9. the manufacture method of a heat dissipation type high integrated backboard used for solar batteries, for the manufacture of a kind of heat dissipation type high integrated backboard used for solar batteries described in any one wherein in claim 1 to 8, it is characterized in that comprising the following steps: first heat conduction adhesive is coated on to base material both sides, after being heating and curing, form the first heat conduction tack coat and the second heat conduction tack coat, by the first heat conduction adhesive linkage, weather-proof barrier layer is bonded to substrate backside, then by the second heat conduction adhesive linkage, high thermal conductivity layer is bonded to base material front, then hot pressing composite protection layer on high thermal conductivity layer, after rolling, treated base material is sent into baking oven slaking.
CN201410332759.XA 2014-07-14 2014-07-14 A kind of heat dissipation type high integrated backboard used for solar batteries and its manufacture method Active CN104064613B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410332759.XA CN104064613B (en) 2014-07-14 2014-07-14 A kind of heat dissipation type high integrated backboard used for solar batteries and its manufacture method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410332759.XA CN104064613B (en) 2014-07-14 2014-07-14 A kind of heat dissipation type high integrated backboard used for solar batteries and its manufacture method

Publications (2)

Publication Number Publication Date
CN104064613A true CN104064613A (en) 2014-09-24
CN104064613B CN104064613B (en) 2017-07-11

Family

ID=51552239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410332759.XA Active CN104064613B (en) 2014-07-14 2014-07-14 A kind of heat dissipation type high integrated backboard used for solar batteries and its manufacture method

Country Status (1)

Country Link
CN (1) CN104064613B (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105633186A (en) * 2016-04-01 2016-06-01 常熟市冠日新材料有限公司 Back plane for high thermal conductivity solar cell and preparation method thereof
CN106593933A (en) * 2016-12-26 2017-04-26 重庆旭穆科技有限公司 Heat dissipation fan material
CN106856213A (en) * 2017-02-23 2017-06-16 南京日托光伏科技股份有限公司 A kind of conductive backings of suitable scale volume production and preparation method thereof
CN107195718A (en) * 2017-06-15 2017-09-22 绍兴文理学院 A kind of multilayered thermally-conductive type photovoltaic back material
CN107611209A (en) * 2017-10-26 2018-01-19 赖连容 A kind of solar cell backboard and its production method
CN107791629A (en) * 2017-11-30 2018-03-13 苏州市君悦新材料科技股份有限公司 A kind of fiber reinforcement type high performance composite film
CN108701731A (en) * 2015-12-23 2018-10-23 安姆科灵活交换有限公司 Heat reflection solar energy module
CN109560157A (en) * 2018-12-03 2019-04-02 常州回天新材料有限公司 A kind of solar cell backboard
CN110299425A (en) * 2019-06-26 2019-10-01 江苏康博光伏电力科技有限公司 A kind of photovoltaic back of rapid cooling
CN110757916A (en) * 2019-09-25 2020-02-07 苏州中来光伏新材股份有限公司 High-weather-resistance and high-moisture-resistance separation type solar cell back film and preparation method thereof
CN113348077A (en) * 2019-01-25 2021-09-03 迪睿合株式会社 Method for producing thermal conductive sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201232790A (en) * 2010-10-18 2012-08-01 Sumitomo Chemical Co Backsheet for solar cell and solar cell module
CN103299436A (en) * 2010-12-28 2013-09-11 栗村化学株式会社 Back sheet for solar cells and method for preparing the same
CN203192818U (en) * 2013-04-02 2013-09-11 昆山雅森电子材料科技有限公司 Heat dissipation type solar energy back plate
CN103606581A (en) * 2013-11-25 2014-02-26 云南云天化股份有限公司 Solar cell backboard, manufacturing method thereof and solar cell
CN103709953A (en) * 2013-11-15 2014-04-09 苏州赛伍应用技术有限公司 Polymer coating film and solar cell backboard containing polymer coating film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201232790A (en) * 2010-10-18 2012-08-01 Sumitomo Chemical Co Backsheet for solar cell and solar cell module
CN103299436A (en) * 2010-12-28 2013-09-11 栗村化学株式会社 Back sheet for solar cells and method for preparing the same
CN203192818U (en) * 2013-04-02 2013-09-11 昆山雅森电子材料科技有限公司 Heat dissipation type solar energy back plate
CN103709953A (en) * 2013-11-15 2014-04-09 苏州赛伍应用技术有限公司 Polymer coating film and solar cell backboard containing polymer coating film
CN103606581A (en) * 2013-11-25 2014-02-26 云南云天化股份有限公司 Solar cell backboard, manufacturing method thereof and solar cell

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108701731A (en) * 2015-12-23 2018-10-23 安姆科灵活交换有限公司 Heat reflection solar energy module
CN105633186A (en) * 2016-04-01 2016-06-01 常熟市冠日新材料有限公司 Back plane for high thermal conductivity solar cell and preparation method thereof
CN106593933A (en) * 2016-12-26 2017-04-26 重庆旭穆科技有限公司 Heat dissipation fan material
CN106856213A (en) * 2017-02-23 2017-06-16 南京日托光伏科技股份有限公司 A kind of conductive backings of suitable scale volume production and preparation method thereof
CN107195718A (en) * 2017-06-15 2017-09-22 绍兴文理学院 A kind of multilayered thermally-conductive type photovoltaic back material
CN107611209A (en) * 2017-10-26 2018-01-19 赖连容 A kind of solar cell backboard and its production method
CN107791629A (en) * 2017-11-30 2018-03-13 苏州市君悦新材料科技股份有限公司 A kind of fiber reinforcement type high performance composite film
CN109560157A (en) * 2018-12-03 2019-04-02 常州回天新材料有限公司 A kind of solar cell backboard
CN113348077A (en) * 2019-01-25 2021-09-03 迪睿合株式会社 Method for producing thermal conductive sheet
CN110299425A (en) * 2019-06-26 2019-10-01 江苏康博光伏电力科技有限公司 A kind of photovoltaic back of rapid cooling
CN110757916A (en) * 2019-09-25 2020-02-07 苏州中来光伏新材股份有限公司 High-weather-resistance and high-moisture-resistance separation type solar cell back film and preparation method thereof

Also Published As

Publication number Publication date
CN104064613B (en) 2017-07-11

Similar Documents

Publication Publication Date Title
CN104064613A (en) High-heat-dissipation type integrated backboard for solar cells and manufacturing method thereof
CN104057676B (en) A kind of solar energy backboard with heat sinking function and production technology thereof
KR101070871B1 (en) Back sheet of solar cell module for photovoltaic power generation
US20100288333A1 (en) Heat dissipating protective sheets and encapsulant for photovoltaic modules
CN104231701A (en) Infrared radiating coating for photovoltaic module backing plate and preparation method of radiating photovoltaic module backing plate
CN102832280A (en) Laminated packaging film for solar batteries
CN103681915B (en) High-radiation solar cell backboard
CN105633186A (en) Back plane for high thermal conductivity solar cell and preparation method thereof
CN102569454A (en) Backplane material, photovoltaic module using backplane material and manufacture method of photovoltaic module
CN103872162B (en) Low-working-temperature solar cell module
CN104112783B (en) High Performance Insulation photovoltaic and photothermal solar integrated plate core and preparation method thereof
CN103606581A (en) Solar cell backboard, manufacturing method thereof and solar cell
US20160013343A1 (en) Integrated photovoltaic and thermal module (pvt)
CN202473968U (en) Photovoltaic cell backplane and photovoltaic cell using the same
CN102569463A (en) Back film for back contact type solar cell and production process thereof
CN101359885A (en) Cogeneration solar boiler
JP2014236212A (en) Installation method of photovoltaic power generation film, photovoltaic power generation film built-in member, and photovoltaic power generation film
CN102005491B (en) High-fluorine mixcrystal coating solar photovoltaic cell back film and manufacturing method thereof
CN203787440U (en) New solar photovoltaic assembly
CN205428962U (en) Building photovoltaic light and heat integration component based on flexible photovoltaic cell thin slice of CIGS
CN108565308B (en) Photovoltaic cell assembly and manufacturing method thereof
CN104979418B (en) A kind of solar cell module with uniform heat conduction function
CN201913849U (en) Back plate material and photovoltaic component adopting same
CN106601846A (en) Light-focusing solar cell panel
CN207250537U (en) A kind of solar cell module

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant