CN104053315A - 外壳 - Google Patents

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Publication number
CN104053315A
CN104053315A CN201310076068.3A CN201310076068A CN104053315A CN 104053315 A CN104053315 A CN 104053315A CN 201310076068 A CN201310076068 A CN 201310076068A CN 104053315 A CN104053315 A CN 104053315A
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China
Prior art keywords
layer
skin
shell
composition surface
internal layer
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CN201310076068.3A
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English (en)
Inventor
那丽红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Futaihong Precision Industry Co Ltd
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Shenzhen Futaihong Precision Industry Co Ltd
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Application filed by Shenzhen Futaihong Precision Industry Co Ltd filed Critical Shenzhen Futaihong Precision Industry Co Ltd
Priority to CN201310076068.3A priority Critical patent/CN104053315A/zh
Priority to TW102109388A priority patent/TW201442588A/zh
Priority to US13/974,420 priority patent/US20140255634A1/en
Priority to JP2014041324A priority patent/JP2014172396A/ja
Publication of CN104053315A publication Critical patent/CN104053315A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163Indexing scheme relating to constructional details of the computer
    • G06F2200/1633Protecting arrangement for the entire housing of the computer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1355Elemental metal containing [e.g., substrate, foil, film, coating, etc.]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

一种外壳,其包括一基层和一软质层,该基层包括外层和内层,该软质层为硅胶层,该软质层与该内层分别成型于该外层相对的两个表面上,并且该软质层包覆该内层靠近外层的边缘。

Description

外壳
技术领域
本发明涉及一种外壳。
背景技术
壳体是电子装置的主要零组件之一,其广泛应用于电话、计算机、游戏机、照相机等电子装置上,这些电子装置壳体的美观程度及触觉效果也愈来愈受到人们的关注与重视。大多数电子装置都采用塑料注射成型来制造壳体,为进一步使壳体具有良好的触感,现有电子产品壳体一般采用了烤漆工艺或皮革或织物作为塑料壳体的外层。而皮革或织物做为壳体的外层不具备防水的功能,而且在这种材料制成的外壳上再添加装饰较为困难,另外在使用时壳体易受环境中水的侵蚀或空气中水分的影响,减少壳体使用寿命。
发明内容
针对上述问题,有必要提供一种手感较好且耐用的外壳。
一种外壳,其包括一基层和一软质层,该基层包括外层和内层,该软质层为硅胶材质制成,该软质层与该内层分别成型于该外层相对的两个表面上,并且该软质层包覆该内层靠近外层的边缘。
上述的外壳与现有技术相比,既有柔软的触感,又可以防止环境中的水分影响,经久耐用,而且可以保护外层。
附图说明
图1为本发明较佳实施方式外壳的立体示意图。
图2为图1所示外壳沿II-II方向剖视图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
本发明外壳100可以是移动电话、电脑、相机等电子装置的壳体,也可以是盖体或者容纳盒之类的制品等。请参阅图1,本发明较佳实施例的外壳100包括一基层10及一软质层20。
请一并参阅图2,所述基层10包括内层11及外层12。该内层11为塑料材料制成,如聚氯乙烯或聚碳酸酯等。该外层12为铁、钢等金属材质制成,其具有第一接合面121及与第一接合面121相对的第二接合面122。本实施例中,该基层10通过模内注射成型技术成型,具体为,该外层12通过冲压成形,然后,在该成型的外层12上蚀刻贯穿该外层12的镂空图案,本实施例中,该花纹由数个通孔组成;之后,放入成型模内注射熔融状态下的塑料,该塑料可以为彩色,冷却后于该外层12的第一接合面121上形成所述内层11,并且在注射熔融状态的塑料时,塑料进入通孔(图未标)内将通孔贯满,从而使该内层11与该外层12结合,此时,第二接合面122仍为平滑面,且可以看到通孔内被注入塑料后形成的彩色花纹。
该软质层20为硅胶材料制成,其形成于该基层10的第二接合面122上。本实施例中,该软质层20为透明硅胶,该软质层20成型于基层10之前是先将硅胶材料制成一硅胶片,然后通过热压工艺将该硅胶片成型于该基层10的外层12的第二接合面122上。该基层10与该软质层20形成所述外壳100具体步骤为:将该基层10的外层12的第二接合面122经过电浆处理活化,再对该第二接合面122通过结合剂进行浸泡,时间为8-10秒,烘烤加热10秒,以便硅胶与该外层12更好的结合;然后将硅胶片状的软质层20与该外层12的第二接合面122结合,最后通过热压工艺将该软质层20成型于该基层10上。
为使该外壳100在与电子装置装配时可以达到防水效果,在热压时可以使该软质层20由第二接合面122贴敷至该外层12的第一接合面121上的内层11的边缘;形成一防水层21,并且可以在基层10的周缘间隔设置数个凹槽13,热压时该软质层20的硅胶将凹槽13填充,再贴敷至内层11的边缘,使该贴敷至该内层11的硅胶结合更稳固。
本发明的外壳100既有柔软的触感,又可以防止环境中的水分影响,经久耐用,还可以达到对电子装置防水效果;并且该基层10在成型时,就由塑料材质的内层与金属材质的外层12镶嵌形成装饰图案纹,并通过软质层20透出,不只增强该外壳100美感,而且图案成型工艺简单,不会破坏软质层20表面柔软度,又能保护图案永久性,如此提高外壳100的生产效率及使用寿命。
另外,本领域技术人员还可在本发明较佳实施方式权利要求公开的范围和精神内做其他形式和细节上的各种修改、添加和替换。当然,这些依据本发明较佳实施方式精神所做的各种修改、添加和替换等变化,都应包含在本发明较佳实施方式所要求保护的范围之内。

Claims (6)

1.一种外壳,其包括一基层和一软质层,其特征在于:该基层包括外层和内层,该软质层为硅胶层,该软质层与该内层分别成型于该外层相对的两个表面上,并且该软质层包覆该内层靠近外层的边缘。
2.如权利要求1所述的外壳,其特征在于:该外层为铁件或者钢材,该外层上形成有镂空的图案。
3.如权利要求2所述的外壳,其特征在于:该外层包括第一接合面及与第一接合面相对的第二接合面,该内层注射成型于第一接合面上,该软质层热压成型于第二接合面上。
4.如权利要求3所述的外壳,其特征在于:该软质层在热压时由第二接合面贴敷至该第一接合面上的内层的边缘而形成一防水层。
5.如权利要求4所述的外壳,其特征在于:该外层和内层形成的基层周缘设有数个凹槽,该软质层成型于外层时将凹槽填充,再贴敷至内层。
6.如权利要求1所述的外壳,其特征在于:该内层为塑料层,该塑料可以是聚氯乙烯或聚碳酸酯。
CN201310076068.3A 2013-03-11 2013-03-11 外壳 Pending CN104053315A (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201310076068.3A CN104053315A (zh) 2013-03-11 2013-03-11 外壳
TW102109388A TW201442588A (zh) 2013-03-11 2013-03-15 外殼
US13/974,420 US20140255634A1 (en) 2013-03-11 2013-08-23 Device housing and method for making the same
JP2014041324A JP2014172396A (ja) 2013-03-11 2014-03-04 ケース体

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Application Number Priority Date Filing Date Title
CN201310076068.3A CN104053315A (zh) 2013-03-11 2013-03-11 外壳

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JP (1) JP2014172396A (zh)
CN (1) CN104053315A (zh)
TW (1) TW201442588A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104626457A (zh) * 2014-12-31 2015-05-20 东莞市九瀛新材料有限公司 容器外表面的硅橡胶注射成型方法
CN105607700A (zh) * 2015-12-22 2016-05-25 联想(北京)有限公司 一种壳体及电子设备
CN105897967A (zh) * 2016-05-31 2016-08-24 苏州金口五金工具有限公司 一种双层手机壳及其制造方法
CN106182577A (zh) * 2016-07-13 2016-12-07 王朝翔 对外表面具有凸起图形面板的注射包覆层的加工工艺及具有包覆层的表面视角为三维的面板
CN107615900A (zh) * 2016-01-19 2018-01-19 华为技术有限公司 电子设备防水方法、装置及电子设备

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US20170043523A1 (en) * 2015-08-13 2017-02-16 Chih-Chia WEI Thermoplastic Shell Assembly Formed Integrally by Embedding and Sticking and Method for Manufacturing the Shell Assembly
CN105291348B (zh) * 2015-11-05 2018-06-26 深圳市铠沃科技有限公司 一种液态硅胶同时包导电胶和塑胶的包胶工艺
US10455747B2 (en) * 2017-07-11 2019-10-22 Microsoft Technology Licensing, Llc Additively manufactured protrusions
CN109676856A (zh) * 2019-01-29 2019-04-26 东莞市松裕塑胶皮具制品有限公司 手机壳及其成型方法
CN114980604B (zh) * 2022-04-29 2024-01-26 富钰精密组件(昆山)有限公司 壳体结构及其制备方法、电子设备

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US4613143A (en) * 1984-04-11 1986-09-23 Federal-Mogul Corporation Dual-lip shaft seal with one spring-urged lip
JP3086930U (ja) * 2001-12-26 2002-07-05 郭 春 富 ハウジング外表面の震動吸収構造
CN101779949B (zh) * 2005-03-09 2013-03-13 库蒂森斯股份公司 嵌入有微电子***的三维粘合剂器件
CN101618656B (zh) * 2008-06-30 2013-04-24 深圳富泰宏精密工业有限公司 表面具有图案的塑制品及其制备方法
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104626457A (zh) * 2014-12-31 2015-05-20 东莞市九瀛新材料有限公司 容器外表面的硅橡胶注射成型方法
CN105607700A (zh) * 2015-12-22 2016-05-25 联想(北京)有限公司 一种壳体及电子设备
CN107615900A (zh) * 2016-01-19 2018-01-19 华为技术有限公司 电子设备防水方法、装置及电子设备
CN107615900B (zh) * 2016-01-19 2019-12-24 华为技术有限公司 电子设备防水方法、装置及电子设备
US10531584B2 (en) 2016-01-19 2020-01-07 Huawei Technologies Co., Ltd. Waterproofing method for electronic device
CN105897967A (zh) * 2016-05-31 2016-08-24 苏州金口五金工具有限公司 一种双层手机壳及其制造方法
CN106182577A (zh) * 2016-07-13 2016-12-07 王朝翔 对外表面具有凸起图形面板的注射包覆层的加工工艺及具有包覆层的表面视角为三维的面板

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Publication number Publication date
JP2014172396A (ja) 2014-09-22
US20140255634A1 (en) 2014-09-11
TW201442588A (zh) 2014-11-01

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Application publication date: 20140917