CN104051603A - 一种双面发光的led灯条的制造工艺 - Google Patents
一种双面发光的led灯条的制造工艺 Download PDFInfo
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- CN104051603A CN104051603A CN201410105630.5A CN201410105630A CN104051603A CN 104051603 A CN104051603 A CN 104051603A CN 201410105630 A CN201410105630 A CN 201410105630A CN 104051603 A CN104051603 A CN 104051603A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 238000005516 engineering process Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000003825 pressing Methods 0.000 claims description 17
- 239000004411 aluminium Substances 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000005286 illumination Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410105630.5A CN104051603B (zh) | 2014-03-20 | 2014-03-20 | 一种双面发光的led灯条的制造工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410105630.5A CN104051603B (zh) | 2014-03-20 | 2014-03-20 | 一种双面发光的led灯条的制造工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104051603A true CN104051603A (zh) | 2014-09-17 |
CN104051603B CN104051603B (zh) | 2017-06-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410105630.5A Expired - Fee Related CN104051603B (zh) | 2014-03-20 | 2014-03-20 | 一种双面发光的led灯条的制造工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN104051603B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105235114A (zh) * | 2015-10-19 | 2016-01-13 | 厦门多彩光电子科技有限公司 | 一种led灯丝模具及led灯丝制备方法 |
CN105762265A (zh) * | 2014-10-27 | 2016-07-13 | 财团法人工业技术研究院 | 发光装置及其制造方法 |
WO2021243673A1 (en) * | 2020-06-05 | 2021-12-09 | Tridonic Gmbh & Co Kg | Led lighting strip and the manufacturing system thereof |
WO2022036681A1 (zh) * | 2020-08-21 | 2022-02-24 | 柯银湖 | Led发光源装置及其制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110109235A1 (en) * | 2009-11-10 | 2011-05-12 | Link Uu | Expandable and controllable LED lighting strip |
CN102062323A (zh) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Led灯条和led灯的制造方法 |
CN102074557A (zh) * | 2009-10-21 | 2011-05-25 | 信越亚斯特科株式会社 | 发光装置 |
CN102694081A (zh) * | 2011-03-21 | 2012-09-26 | 展晶科技(深圳)有限公司 | 发光二极管制造方法 |
CN103187514A (zh) * | 2012-09-17 | 2013-07-03 | 中国科学院福建物质结构研究所 | 一种led封装结构 |
CN203118987U (zh) * | 2013-01-25 | 2013-08-07 | 廖旭文 | 双面发光的led灯板结构 |
CN103322525A (zh) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
CN203232909U (zh) * | 2013-04-18 | 2013-10-09 | 浙江深度照明有限公司 | 一种集成式led封装结构 |
-
2014
- 2014-03-20 CN CN201410105630.5A patent/CN104051603B/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074557A (zh) * | 2009-10-21 | 2011-05-25 | 信越亚斯特科株式会社 | 发光装置 |
US20110109235A1 (en) * | 2009-11-10 | 2011-05-12 | Link Uu | Expandable and controllable LED lighting strip |
CN102062323A (zh) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Led灯条和led灯的制造方法 |
CN102694081A (zh) * | 2011-03-21 | 2012-09-26 | 展晶科技(深圳)有限公司 | 发光二极管制造方法 |
CN103187514A (zh) * | 2012-09-17 | 2013-07-03 | 中国科学院福建物质结构研究所 | 一种led封装结构 |
CN203118987U (zh) * | 2013-01-25 | 2013-08-07 | 廖旭文 | 双面发光的led灯板结构 |
CN203232909U (zh) * | 2013-04-18 | 2013-10-09 | 浙江深度照明有限公司 | 一种集成式led封装结构 |
CN103322525A (zh) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105762265A (zh) * | 2014-10-27 | 2016-07-13 | 财团法人工业技术研究院 | 发光装置及其制造方法 |
CN105235114A (zh) * | 2015-10-19 | 2016-01-13 | 厦门多彩光电子科技有限公司 | 一种led灯丝模具及led灯丝制备方法 |
WO2021243673A1 (en) * | 2020-06-05 | 2021-12-09 | Tridonic Gmbh & Co Kg | Led lighting strip and the manufacturing system thereof |
WO2022036681A1 (zh) * | 2020-08-21 | 2022-02-24 | 柯银湖 | Led发光源装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104051603B (zh) | 2017-06-09 |
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Effective date of registration: 20190325 Address after: 224000 Yandu District Intelligent Terminal Industrial Park, Yancheng City, Jiangsu Province Patentee after: Yancheng Dongshan Precision Manufacturing Co., Ltd. Address before: 215107 No. 8 Fenghuangshan Road, Dongshan Industrial Park, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Dongshan Precision Manufacturing Co., Ltd. |
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Granted publication date: 20170609 Termination date: 20200320 |
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