CN104046319A - Physical polishing composition - Google Patents
Physical polishing composition Download PDFInfo
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- CN104046319A CN104046319A CN201410282411.4A CN201410282411A CN104046319A CN 104046319 A CN104046319 A CN 104046319A CN 201410282411 A CN201410282411 A CN 201410282411A CN 104046319 A CN104046319 A CN 104046319A
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- chemical mechanical
- hydrophilic group
- polishing composition
- mechanical polishing
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Abstract
The invention discloses a physical polishing composition. The physical polishing composition is characterized by comprising the following substances in parts by weight: 11-13 parts of alkylaryl sodium sulfonate, 9-14 parts of trisodium phosphate, 3-8 parts of sulfuric acid, 9-15 parts of alkylaryl sodium sulfonate, 2-3 parts of hollow glass beads, 1-2 parts of antioxidant, 9-15 parts of hydrophilic group surfactant, 4-6 parts of phosphating solution, 1-2 parts of nano-graphite powder, 7-13 parts of ammonia water, 7-10 parts of polypropylene, 9-16 parts of polyethylene, 7-13 parts of aluminium hydroxide, 11-18 parts of sorbitol, 1-8 parts of glycerol and 2-5 parts of calcium chloride. The chemical mechanical polishing slurry comprises hydrophilic group surface cleaning agent materials, so that the surface tension between the chemical mechanical polishing slurry and hydrophobic films can be reduced, and the chemical mechanical polishing slurry and the hydrophobic films are glued more tightly.
Description
Technical field
The present invention relates to a kind of physical grinding composition.
Background technology
In semi-conductor is manufactured, cmp (CMP) technology can realize the planarization of whole wafer, becomes one of step important in chip manufacturing process.In cmp, cmp agent (Slurry) is one of key element of cmp technology, and its performance directly affects the quality of surface of polished.When design cmp agent, hope can reach remove that speed is high, planeness good, uniform film thickness, noresidue, the few texts of defect.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of physical grinding composition.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of physical grinding composition, is characterized in that, comprises the material of following parts by weight: alkylaryl sodium iodate 11-13 part, tertiary sodium phosphate 9-14 part, sulfuric acid 3-8 part, sodium alkylarysulfonate 9-15 part, hollow glass micropearl 2-3 part, oxidation inhibitor 1-2 part, hydrophilic group tensio-active agent 9-15 part, Phosphating Solution 4-6 part, Nano graphite powder 1-2 part, ammoniacal liquor 7-13 part, polypropylene 7-10 part, polyethylene 9-16 part, aluminium hydroxide 7-13 part, sorbyl alcohol 11-18 part, glycerine 1-8 part, calcium chloride 2-5 part.
Cmp agent of the present invention comprises the clean property agent material in hydrophilic group surface, can reduce cmp agent and the surface tension between water-based film just, cmp agent and coloured glaze water-based film are more fitted tightly, thereby reduce the defect such as residue and particle on coloured glaze water-based film surface, improve the effect of cmp.
Embodiment
Embodiment 1
A kind of physical grinding composition, is characterized in that, comprises the material of following parts by weight: alkylaryl sodium iodate 11-13 part, tertiary sodium phosphate 9-14 part, sulfuric acid 3-8 part, sodium alkylarysulfonate 9-15 part, hollow glass micropearl 2-3 part, oxidation inhibitor 1-2 part, hydrophilic group tensio-active agent 9-15 part, Phosphating Solution 4-6 part, Nano graphite powder 1-2 part, ammoniacal liquor 7-13 part, polypropylene 7-10 part, polyethylene 9-16 part, aluminium hydroxide 7-13 part, sorbyl alcohol 11-18 part, glycerine 1-8 part, calcium chloride 2-5 part.
Claims (1)
1. a physical grinding composition, is characterized in that, comprises the material of following parts by weight: alkylaryl sodium iodate 11-13 part, tertiary sodium phosphate 9-14 part, sulfuric acid 3-8 part, sodium alkylarysulfonate 9-15 part, hollow glass micropearl 2-3 part, oxidation inhibitor 1-2 part, hydrophilic group tensio-active agent 9-15 part, Phosphating Solution 4-6 part, Nano graphite powder 1-2 part, ammoniacal liquor 7-13 part, polypropylene 7-10 part, polyethylene 9-16 part, aluminium hydroxide 7-13 part, sorbyl alcohol 11-18 part, glycerine 1-8 part, calcium chloride 2-5 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410282411.4A CN104046319A (en) | 2014-06-23 | 2014-06-23 | Physical polishing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410282411.4A CN104046319A (en) | 2014-06-23 | 2014-06-23 | Physical polishing composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104046319A true CN104046319A (en) | 2014-09-17 |
Family
ID=51499729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410282411.4A Pending CN104046319A (en) | 2014-06-23 | 2014-06-23 | Physical polishing composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104046319A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505318A (en) * | 2015-12-31 | 2016-04-20 | 王璐 | Wear-resistant metal grinding agent |
| CN105542714A (en) * | 2015-12-31 | 2016-05-04 | 王璐 | Improved suspending agent for grinding |
| CN116144270A (en) * | 2023-02-20 | 2023-05-23 | 湖南三安半导体有限责任公司 | Polishing solution and preparation method thereof |
-
2014
- 2014-06-23 CN CN201410282411.4A patent/CN104046319A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505318A (en) * | 2015-12-31 | 2016-04-20 | 王璐 | Wear-resistant metal grinding agent |
| CN105542714A (en) * | 2015-12-31 | 2016-05-04 | 王璐 | Improved suspending agent for grinding |
| CN116144270A (en) * | 2023-02-20 | 2023-05-23 | 湖南三安半导体有限责任公司 | Polishing solution and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140917 |
|
| WD01 | Invention patent application deemed withdrawn after publication |