CN104037109A - Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip - Google Patents

Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip Download PDF

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Publication number
CN104037109A
CN104037109A CN201410169888.1A CN201410169888A CN104037109A CN 104037109 A CN104037109 A CN 104037109A CN 201410169888 A CN201410169888 A CN 201410169888A CN 104037109 A CN104037109 A CN 104037109A
Authority
CN
China
Prior art keywords
rotating disk
chip
packing machine
automatically detects
automatic detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410169888.1A
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Chinese (zh)
Inventor
陈延林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Yi Jijia Electromechanical Technology Co Ltd
Original Assignee
Suzhou Yi Jijia Electromechanical Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Yi Jijia Electromechanical Technology Co Ltd filed Critical Suzhou Yi Jijia Electromechanical Technology Co Ltd
Priority to CN201410169888.1A priority Critical patent/CN104037109A/en
Publication of CN104037109A publication Critical patent/CN104037109A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container Filling Or Packaging Operations (AREA)

Abstract

The invention discloses an automatic detection, sealing and bagging machine of IC chips. The machine is provided with a rack, a material taking and placing device and an XY sliding table, wherein a large rotating disk and a small rotating disk are arranged on a countertop of the rack, and the large rotating disk is in transmission and matching connection with the small rotating disk. The automatic detection, sealing and bagging machine of the IC chip can achieve automatic detection, automatic classification and automatic packaging of IC chips, integrates multiple functions, reduces the working time, requires less manpower, improves the production efficiency, and facilitates reduction of the production cost.

Description

IC chip automatically detects envelope and selects Belt packing machine
Technical field
The invention belongs to and relate to IC chip technology field, relate to more specifically a kind of IC chip and automatically detect envelope and select Belt packing machine.
Background technology
At present, IC chip is the chip that can carry write information, and every field tool has been widely used.But the production testing of IC chip, class wrapping are all to adopt hand labour, and therefore this just needs a large amount of manpower and working time, have virtually improved labour cost and have reduced production efficiency.
Summary of the invention
The object of the invention is to solve the problem of above-mentioned proposition, provide a kind of a kind of IC chip with the operation of mechanical automation instead of manual automatically to detect envelope and select Belt packing machine.
The object of the invention is to realize as follows: a kind of IC chip automatically detects envelope and selects Belt packing machine, there is frame, the deck plate of described frame is provided with large rotating disk and little rotating disk, and described large rotating disk and little rotating disk transmission are connected, and also have the materials device of picking and placeing and XY slide unit.
Above-mentioned a kind of IC chip automatically detects envelope and selects Belt packing machine, and described large rotating disk bottom is provided with the first servomotor that drives large rotating disk to rotate.
Above-mentioned a kind of IC chip automatically detects envelope and selects Belt packing machine, and described little rotating disk bottom is provided with the second servomotor that drives little rotating disk to rotate.
Above-mentioned a kind of IC chip automatically detects envelope and selects Belt packing machine, also comprises the man-machine control panel being connected with envelope material sack filling machine.
Above-mentioned a kind of IC chip automatically detects envelope and selects Belt packing machine, and the surface of described frame is provided with transparent door and window.
Advantage of the present invention: this IC chip automatically detects envelope material sack filling machine and enough realizes automatic detection, the automatic classification of IC chip, automatically packs, integrate multi-functional, not only reduce the operating time, the manpower needing is few, enhance productivity, and be conducive to reduce production costs.
 
Brief description of the drawings
For content of the present invention is more easily expressly understood, according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation, wherein below
Fig. 1 is structural representation of the present invention;
Fig. 2 is the vertical view of this practical metal plate punching part automatic aligning conveyer;
Fig. 3 is the left view of this practical metal plate punching part automatic aligning conveyer;
Reference numeral: 1, frame, 2, transparent door and window, 3, man-machine control panel, 4, XY slide unit, 6, large rotating disk, 7, little rotating disk, 13, pick and place materials device, 14, deck plate, 15, the first servomotor, 16, the second servomotor.
 
embodiment:
See Fig. 1, shown in Fig. 2 and Fig. 3, a kind of IC chip automatically detects envelope and selects Belt packing machine, there is frame 1, the deck plate 14 of described frame 1 is provided with large rotating disk 6 and little rotating disk 7, and described large rotating disk 6 is connected with little rotating disk 7 transmissions, also has the materials device of picking and placeing 13 and XY slide unit 4; Described large rotating disk 6 bottoms are provided with the first servomotor 15 that drives large rotating disk 6 to rotate; Described little rotating disk 7 bottoms are provided with the second servomotor 16 that drives little rotating disk 7 to rotate; Also comprise the man-machine control panel 3 being connected with envelope material sack filling machine; The surface of described frame 1 is provided with transparent door and window 2.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.

Claims (5)

1. an IC chip automatically detects envelope and selects Belt packing machine, there is frame (1), it is characterized in that: the deck plate (14) of described frame (1) is provided with large rotating disk (6) and little rotating disk (7), described large rotating disk (6) is connected with little rotating disk (7) transmission, also has the materials device of picking and placeing (13) and XY slide unit (4).
2. a kind of IC chip according to claim 1 automatically detects envelope and selects Belt packing machine, it is characterized in that: described large rotating disk (6) bottom is provided with the first servomotor (15) that drives large rotating disk (6) to rotate.
3. a kind of IC chip according to claim 1 automatically detects envelope and selects Belt packing machine, it is characterized in that: described little rotating disk (7) bottom is provided with the second servomotor (16) that drives little rotating disk (7) to rotate.
4. a kind of IC chip according to claim 1 automatically detects envelope and selects Belt packing machine, it is characterized in that: also comprise the man-machine control panel (3) being connected with envelope material sack filling machine.
5. a kind of IC chip according to claim 1 automatically detects envelope and selects Belt packing machine, it is characterized in that: the surface of described frame (1) is provided with transparent door and window (2).
CN201410169888.1A 2014-04-25 2014-04-25 Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip Pending CN104037109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410169888.1A CN104037109A (en) 2014-04-25 2014-04-25 Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410169888.1A CN104037109A (en) 2014-04-25 2014-04-25 Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip

Publications (1)

Publication Number Publication Date
CN104037109A true CN104037109A (en) 2014-09-10

Family

ID=51467830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410169888.1A Pending CN104037109A (en) 2014-04-25 2014-04-25 Automatic detection, sealing and bagging machine of IC (Integrated Circuit) chip

Country Status (1)

Country Link
CN (1) CN104037109A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105809076A (en) * 2014-12-31 2016-07-27 沈阳友联电子装备有限公司 Data wiring equipment of intelligent card chip module
CN105809075A (en) * 2014-12-31 2016-07-27 沈阳友联电子装备有限公司 Card writing device of cos downloading and initiation mechanism of an intelligent card chip and card writing method thereof
CN106981437A (en) * 2017-03-09 2017-07-25 铜陵三佳山田科技股份有限公司 Sorting characterization processes and its equipment for QFN BGA semiconductor chips
CN108761306A (en) * 2018-05-18 2018-11-06 广州立杏科技有限公司 A kind of safe coronary artery bypass surgery medical sterilizing equipment
CN108957287A (en) * 2018-05-18 2018-12-07 孙丽荣 A kind of desert photovoltaic plant technology

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105809076A (en) * 2014-12-31 2016-07-27 沈阳友联电子装备有限公司 Data wiring equipment of intelligent card chip module
CN105809075A (en) * 2014-12-31 2016-07-27 沈阳友联电子装备有限公司 Card writing device of cos downloading and initiation mechanism of an intelligent card chip and card writing method thereof
CN105809076B (en) * 2014-12-31 2018-01-12 沈阳友联电子装备有限公司 A kind of data writing device of smart card chip module
CN105809075B (en) * 2014-12-31 2018-01-12 沈阳友联电子装备有限公司 A kind of cos of intelligent card chip is downloaded and the write cards device and its card writing method of initialization mechanism
CN106981437A (en) * 2017-03-09 2017-07-25 铜陵三佳山田科技股份有限公司 Sorting characterization processes and its equipment for QFN BGA semiconductor chips
CN106981437B (en) * 2017-03-09 2020-12-08 铜陵三佳山田科技股份有限公司 Sorting detection process and equipment for QFN-BGA semiconductor chip
CN108761306A (en) * 2018-05-18 2018-11-06 广州立杏科技有限公司 A kind of safe coronary artery bypass surgery medical sterilizing equipment
CN108957287A (en) * 2018-05-18 2018-12-07 孙丽荣 A kind of desert photovoltaic plant technology

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140910

WD01 Invention patent application deemed withdrawn after publication