CN104032323B - The cleaning agent that components and parts high temperature postwelding is suitable for - Google Patents
The cleaning agent that components and parts high temperature postwelding is suitable for Download PDFInfo
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- CN104032323B CN104032323B CN201410084785.5A CN201410084785A CN104032323B CN 104032323 B CN104032323 B CN 104032323B CN 201410084785 A CN201410084785 A CN 201410084785A CN 104032323 B CN104032323 B CN 104032323B
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Abstract
The cleaning agent that a kind of components and parts high temperature postwelding is suitable for, comprising following components (by volume percentages): organic amine 0.1 ∽ 5.0%, low-molecular-weight alcohol 0.1 ∽ 10.0%, water-soluble alcohol ether auxiliary agent 0.1 ∽ 5.0%, pluronic polymer 0.1 ∽ 5.0% and organic additive 0.1 ∽ 1.0%, remaining is deionized water.320 DEG C and high temperature above postwelding insulated paint are melted pyrolysis product and scaling powder cured residue cleaning performance is good, both solder joint quality after welding had been ensured, meet again environmental requirement, be particularly well-suited to the copper of electronic assemblies industry, especially electromagnetic component, iron-based stitch weld for solder with tin with enamel-cover copper conductor after cleaning.
Description
[technical field]
The present invention relates to the chemical method metal material except electrolysis clean and oil removing, particularly relate to include organic amine
Mixed liquor cleans or oil removing, particularly relates to electronic assemblies industry and is suitable for components and parts enforcement 320 DEG C and high temperature above postwelding thereof
Cleaning agent.
[background technology]
In electronic assemblies industry, after the welding of components and parts used particularly electromagnetic component, IEC 61249-2-21 must be reached
The Halogen standard of regulation, i.e. requires that bromine, chlorinity are respectively smaller than 900ppm, and the content summation of bromine and chlorine is less than 1500ppm；
After welding, ionic pollution degree is according to IPC J-STD-001B standard-required, ionic pollution degree < 10.04 μ g.NaCl/sq.in
(1.56 μ g.NaCl/cm2).
Prior art soldering processes often relate to the copper of electromagnetic component, iron-based stitch welds for solder with tin with enamel-cover copper conductor
Connect, be generally coated with insulated paint due to wire, be difficult to welding.Prior art mainly has two ways for this type of welding: a kind of
It is to improve pure tin furnace temperature, utilizes 320 DEG C and high temperature above to destroy melted for insulated paint, it is achieved the weldering of element stitch and wire
Connect.Its shortcoming is, high temperature postwelding has a large amount of insulated paint residue, and causes scaling powder generation chemical change, solidify to form and be difficult to
The residue removed.If cannot effectively clean, welding quality and follow-up serviceability will be had a strong impact on.Another kind is to use in advance
The insulated paint of wire welding position is removed by laser technology, exposes immersed solder in 320 DEG C of pure tin stoves after copper conductor base material, but past
Toward the removal of insulated paint be not 100% clean, also have part and remain so that having insulated paint residue after high-temperature soldering,
And the cured residue of scaling powder also must clean after high-temperature soldering.The shortcoming of which is more also to use special installation, work
Process flow is complicated.
Prior art cleaning agent, it is impossible to 320 DEG C and high temperature above postwelding insulated paint are melted pyrolysis product and scaling powder
Cured residue effectively cleans, and repeated multiple times cleaning is still unable to reach test stone, and part cleaning agent uses organic molten
Agent, is not only unable to reach surface ion dustiness and the requirement of the non-halogen standard of product, also the biggest to environmental hazard.
The cleaning agent that the present invention provides, it is possible to resolve the prior art soldering processes demand to cleaning agent, both can guarantee that welding
Rear solder joint quality, meets again environmental requirement, and be particularly well-suited to the copper of electromagnetic component, iron-based stitch with enamel-cover copper conductor with tin is
The cleaning of high temperature postwelding implemented by solder.
[summary of the invention]
There is provided the one can be effective in place of the technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art
Remove 320 DEG C and high temperature above postwelding insulated paint melts pyrolysis product and the cleaning agent of scaling powder cured residue, after cleaning
Weldment surface meets Halogen standard, and ionic pollution degree is reduced to < 1.56 μ g.NaCl/cm2Level.
The present invention solves described technical problem and employed technical scheme comprise that, the cleaning that a kind of components and parts high temperature postwelding is suitable for
Agent, comprises following component, by volume percentages: organic amine 0.1～5.0%, low-molecular-weight alcohol 0.1～10.0%, water-soluble
Alcohol ether auxiliary agent 0.1～5.0%, pluronic polymer 0.1～5.0% and organic additive 0.1～1.0%, remaining is deionized water.
Described organic amine is ethylenediamine, diethylenetriamine, triethylene tetramine, monoethanolamine, diethanol amine, triethanolamine and two
NMF, appoints and selects one or the mixing of its at least two.
Described low-molecular-weight alcohol is ethylene glycol, isopropanol, propane diols and glycerine, appoints and selects one or its at least two and mix
Close.
Described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propandiol butyl ether and triethylene glycol
Monobutyl ether, appoints and selects one or the mixing of its at least two.
Described pluronic polymer is polyethylene glycol, modified polypropylene glycol and PVP, appoints and selects one.
Described organic additive is alpha-pyrrolidone, petroleum ether and hexamethylene, appoints and selects one or the mixing of its at least two.
Described deionized water electrical conductivity < 10 μ S/cm.
Described molecular weight polyethylene glycol is 200 ~ 600.
Described modified polypropylene glycol is molecular weight 400 ~ 800, and modified in volume 1:4 mode by diethylene glycol and propane diols
It is polymerized.
Described PVP molecular weight < 6000.
The preparation method of described cleaning agent, comprises the steps:
1., under the environment temperature of 0 ~ 40 DEG C, deionized water is added in clean reactor；
2. add low-molecular-weight alcohol to stir；
3. add organic amine and pluronic polymer continues to stir；
4. being sequentially added into remaining ingredient, stirring is to mixing；
5. stop stirring, stand and filter.
Cleaning agent of the present invention comprises organic amine and provides the benefit that, dissolves and peels off 320 DEG C and high temperature above postwelding helps
Solder flux cured residue, butt welding point tin layers and layers of copper are corrosion-free, and water-soluble good, noresidue after deionized water cleaning；
Comprise low-molecular-weight alcohol to provide the benefit that, clean weldment surface electrolyte residues, water-soluble good, deionized water
Noresidue after cleaning, it is ensured that after weldment cleans, ionic pollution degree is up to standard；
Comprise water-soluble alcohol ether to provide the benefit that: assist various component dissolubility in deionized water, improve component
Mixing uniformity, and butt-welding fitting metal level is corrosion-free, water-soluble good, deionized water clean after noresidue；
Comprise pluronic polymer to provide the benefit that: improve the wellability on weldment surface, it is ensured that cleaning agent butt-welding fitting solder joint
Abundant cleaning；
Comprise organic additive to provide the benefit that: butt welding point insulated paint residue makes its Fast-swelling, accelerate it and dissolve stripping
From, it is achieved Rapid Cleaning；
The use of deionized water can ensure that weldment surface is up to standard with regard to halogen-free environmental and surface ion cleannes.
The most relatively, cleaning agent of the present invention has the advantages that after cleaning with described cleaning agent,
Clean through three grades of deionized waters again, i.e. can reach ionic pollution degree standard-required, without special installation, technological process letter
Single, solder joint will not be occurred to corrode, operating personnel and environment will not be had undesirable effect.
[detailed description of the invention]
22 preferred embodiments presented below in conjunction with such as this specification end form 1 ~ 5, make the present invention further
Describe in detail.Respectively this embodiment all comprises following components, by volume percentages: organic amine 0.1 ~ 5.0%, low-molecular-weight
Alcohol 0.1 ~ 10.0%, water-soluble alcohol ether auxiliary agent 0.1 ~ 5.0%, pluronic polymer 0.1 ~ 5.0% and organic additive 0.1 ~ 1.0%,
Remaining is deionized water, but content presents the most in the table.
Described organic amine is ethylenediamine, diethylenetriamine, triethylene tetramine, monoethanolamine, diethanol amine, triethanolamine and two
NMF, appoints and selects one or its two kinds mixing.
Described low-molecular-weight alcohol is ethylene glycol, isopropanol, propane diols and glycerine, appoints and selects one or its two kinds mixing.
Described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propandiol butyl ether and triethylene glycol
Monobutyl ether, appoints and selects one or its two kinds mixing.
Described pluronic polymer is polyethylene glycol, modified polypropylene glycol and PVP, appoints and selects one.
Described organic additive is alpha-pyrrolidone, petroleum ether and hexamethylene, appoints and selects one or the mixing of its at least two.
Described deionized water electrical conductivity < 10 μ S/cm.
The optimum weight scope of described polyethylene glycol is 200 ~ 600, certainly can also is that other molecular weight.
Described modified polypropylene glycol optimum weight scope is 400 ~ 800, and by diethylene glycol and propane diols with volume 1:4
Mode modified poly forms, and certainly can also is that other molecular weight, and other mode modified polies form.
Described PVP optimum weight scope be < 6000, certainly can also is that other molecular weight.
The generally high-temperature soldering technique with tin as solder: pure tin furnace temperature 320 DEG C, except 1 second insulated paint time, soaks scaling powder
1 second time, 1.2 seconds scolding tin time.After being respectively washed 10,000 components and parts welding with the cleaning agent of in form 22 preferred embodiments
Weldment, the data recorded with regard to its every effect after cleaning are shown in following form 7.From form 6 and the data of form 7,
The circuit board that i.e. can reach 100% ratio with the cleaning agent of 22 preferred embodiments after once cleaning is non-halogen.Standard surface ion
Qualification rate after dustiness once cleans is the highest, has reached more than 99.88%.Cleaning agent of the present invention is to 320 DEG C and above height
After temperature welding, to melt a cleaning performance of pyrolysis product and scaling powder cured residue splendid for insulated paint, need not repeated multiple times clearly
Wash, improve cleaning efficiency.
The above embodiment only have expressed the preferred embodiment of the present invention, can not therefore be interpreted as this
The restriction of bright the scope of the claims;It should be pointed out that, for the person of ordinary skill of the art, without departing from present inventive concept
On the premise of, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention;Therefore, all with the present invention
Equivalents that right is done and modification, all should belong to the covering scope of the claims in the present invention.
Claims (4)
1. the cleaning agent that components and parts high temperature postwelding is suitable for, comprises following components, by volume percentages: organic amine 0.1 ~
5.0%, low-molecular-weight alcohol 0.1 ~ 10.0%, water-soluble alcohol ether auxiliary agent 0.1 ~ 5.0%, pluronic polymer 0.1 ~ 5.0% and have machine aided
Agent 0.1 ~ 1.0%, remaining is deionized water；Described organic amine is ethylenediamine, diethylenetriamine, triethylene tetramine, triethanolamine
And dimethylformamide, appoint and select one or the mixing of its at least two；Described low-molecular-weight alcohol is ethylene glycol, isopropanol, propane diols
And glycerine, appoint and select one or the mixing of its at least two；Described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether and/or propane diols
Butyl ether；Described pluronic polymer is polyethylene glycol, modified polypropylene glycol and PVP, appoints and selects one；Described organic additive be α-
Pyrrolidones, petroleum ether and hexamethylene, appoint and select one or the mixing of its at least two.
2. cleaning agent as claimed in claim 1, described molecular weight polyethylene glycol is 200 ~ 600.
3. cleaning agent as claimed in claim 1, described modified polypropylene glycol is molecular weight 400 ~ 800, and by diethylene glycol and
Propane diols forms with volume 1:4 mode modified poly.
4. cleaning agent as claimed in claim 1, described PVP molecular weight < 6000.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410084785.5A CN104032323B (en) | 2014-03-10 | 2014-03-10 | The cleaning agent that components and parts high temperature postwelding is suitable for |
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|---|---|---|---|
| CN201410084785.5A CN104032323B (en) | 2014-03-10 | 2014-03-10 | The cleaning agent that components and parts high temperature postwelding is suitable for |
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| CN104032323A CN104032323A (en) | 2014-09-10 |
| CN104032323B true CN104032323B (en) | 2016-08-31 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104294305B (en) * | 2014-09-30 | 2016-06-29 | 江苏中容铜业有限公司 | A kind of can the copper material detergent of rapid preparing |
| CN106216883B (en) * | 2016-07-19 | 2018-02-13 | 徐州工程学院 | One kind is used for Cu Mg Sn Fe composite nano materials laser scaling powders and preparation method thereof |
| CN111117816A (en) * | 2019-12-31 | 2020-05-08 | 苏州市晶协高新电子材料有限公司 | Novel welding slag cleaning agent and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6699829B2 (en) * | 2002-06-07 | 2004-03-02 | Kyzen Corporation | Cleaning compositions containing dichloroethylene and six carbon alkoxy substituted perfluoro compounds |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
| CN102108518B (en) * | 2009-12-25 | 2014-07-23 | 安集微电子（上海）有限公司 | Anticorrosive cleaning solution for metal |
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