CN104021415A - Electronic tag - Google Patents

Electronic tag Download PDF

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Publication number
CN104021415A
CN104021415A CN201410302623.4A CN201410302623A CN104021415A CN 104021415 A CN104021415 A CN 104021415A CN 201410302623 A CN201410302623 A CN 201410302623A CN 104021415 A CN104021415 A CN 104021415A
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CN
China
Prior art keywords
rfid antenna
integrated chip
radio frequency
metal connecting
frequency integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410302623.4A
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Chinese (zh)
Inventor
林仲珉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Fujitsu Microelectronics Co Ltd
Original Assignee
Nantong Fujitsu Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong Fujitsu Microelectronics Co Ltd filed Critical Nantong Fujitsu Microelectronics Co Ltd
Priority to CN201410302623.4A priority Critical patent/CN104021415A/en
Publication of CN104021415A publication Critical patent/CN104021415A/en
Pending legal-status Critical Current

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Abstract

The invention provides an electronic tag. The electronic tag comprises a support plate, radio frequency identification (RFID) antennas, an RF integrated chip, a first metal connecting wire and a second metal connecting wire, wherein the support plate comprises a first region and a second region; the RFID antennas are formed on the first region of the support plate and comprise first ends and second ends; the first ends spirally extend outwards to the second ends in a ring shape; the RF integrated chip is glued on the second region of the support plate and comprises a first interface and a second interface; the first metal connecting wire and the second metal connecting wire are arranged above the RF integrated chip and the RFID antennas; the first metal connecting wire electrically connects the first ends of the RFID antennas with the first interface of the RF integrated chip; the second metal connecting wire electrically connects the second ends of the RFID antennas with the second interface of the RF integrated chip. The electronic tag has the advantages that the electronic tag occupies a small area, and the RFID antennas have high repeatability and improved electrical properties.

Description

Electronic tag
Technical field
The present invention relates to REID, relate in particular to a kind of electronic tag.
Background technology
RFID (radio-frequency (RF) identification: Radio Frequency Identification) is a kind of contactless automatic identification technology, it is automatically identified destination object and is obtained related data by radiofrequency signal, identification work need not manual intervention, as the wireless version of bar code, RFID technology has the not available waterproof of bar code, high temperature resistant, long service life, read that distance is large, on label data can encrypt, store that data capacity is larger, the storage information change advantage such as freely, its application will bring revolutionary variation to the industry such as retail, logistics.
Basic rfid system is by reader (Reader) and electronic tag (or transponder, Transponder) two part compositions, wherein electronic tag (Tag): formed by RFID antenna and radio frequency integrated chip, each electronic tag has unique electronic code or preserves the electronic data of agreement form, is attached to and on object, identifies destination object; Reader (Reader): read the equipment of (sometimes can also write) label information, can be designed to hand-held or fixed.
Its principle of work of rfid system is: launch a set specific frequency signal to electronic tag by reader, in order to drive the internal circuit in electronic tag, inner data are sent to (Passive Tag, passive label or passive label), or electronic tag initiatively sends out inner data (Active Tag, active label or active tag), now reader just sequentially receives the data that electronic tag sends, thereby reaches the object of automatic identification destination object.
In prior art, RFID antenna is generally by coiling or directly wire is imbedded to the modes such as carrying tablet and made, and formation electronic tag is then packaged together the RFID antenna of making and radio frequency integrated chip.Mode by coiling forms metal wire or the some circles of wire coiling RFID antenna or wire is imbedded to carrying tablet formation RFID antenna, the RFID antenna forming can occupy larger space, and the repeatability of the coil of RFID antenna is lower, affect the electric property of RFID antenna.
Summary of the invention
The problem that the present invention solves is how to reduce the volume that RFID antenna occupies.
For addressing the above problem, the invention provides a kind of electronic tag, comprising: support plate, described support plate comprises first area and second area; Be positioned at the RFID antenna forming on the first area of support plate, described RFID antenna comprises first end and the second end, and described first end is spiral ring and extends outward onto the second end; Fit in the radio frequency integrated chip on the second area of support plate, described radio frequency integrated chip comprises first interface and the second interface; Be positioned at the first metal connecting line and the second metal connecting line of radio frequency integrated chip and RFID antenna top, described the first metal connecting line is electrically connected the first end of RFID antenna with the first interface of radio frequency integrated chip, the second metal connecting line is electrically connected the second end of RFID antenna with the second interface of radio frequency integrated chip.
Optionally, described spiral ring is round screw thread or square spiral.
Optionally, the width equal, each helical ring of the spacing between the adjacent helical ring of described RFID antenna equates.
Optionally, the thickness of described RFID antenna is 100 dust~50 micron, and the spacing between the adjacent helical ring of RFID antenna is 1 micron~5000 microns, and the width of the helical ring of RFID antenna is 1 micron~500 microns.
Optionally, the material of described RFID antenna is Al, Cu, Ag, Au, Pt or W.
Optionally, the part that does not connect RFID antenna and radio frequency integrated chip of described the first metal connecting line is unsettled above RFID antenna and radio frequency integrated chip, and the part that does not connect RFID antenna and radio frequency integrated chip of described the second metal connecting line is unsettled above RFID antenna and radio frequency integrated chip.
Optionally, also comprise, cover described RFID antenna, the plastic packaging layer of radio frequency integrated chip, the first metal connecting line, the second metal connecting line and support plate.
Compared with prior art, technical scheme of the present invention has the following advantages:
The RFID antenna of electronic tag of the present invention comprises first end and the second end, described first end is spiral ring and extends outward onto the second end, RFID antenna is that planar structure thereby the volume that occupies reduce, RFID antenna is spiral ring from first end and extends outward onto the second end and make antenna can have longer length, by the first metal connecting line and the second metal connecting line, can be very easily the first end of RFID antenna and second segment are drawn with radio frequency integrated chip and be electrically connected, technique be simple.
Further, the thickness of described RFID antenna is 100 dust~50 micron, spacing between the adjacent helical ring of RFID antenna is 1 micron~5000 microns, the width of the helical ring of RFID antenna is 1 micron~500 microns, the thinner thickness of RFID antenna, the width of the helical ring of RFID antenna is less, and the distance between adjacent helical ring is less, thereby the area that RFID antenna is occupied is less, be conducive to improve the integrated level of the RFID antenna forming.
Brief description of the drawings
Fig. 1~Fig. 4 is the structural representation of embodiment of the present invention electronic tag forming process.
Embodiment
As background technology is sayed, the RFID antenna of prior art directly forms by metal wire and wire, the diameter of metal wire and wire is larger, the space occupying of the RFID antenna forming is increased, and the RFID antenna that coiling forms is the space occupying that three-dimensional structure also can increase RFID antenna accordingly, distance between the RFID antenna adjacent windings that the mode of imbedding by mode and the wire of coiling in addition forms is wayward, make the repeatability of coil lower, the electric property of RFID antenna is reduced.
The embodiment of the present invention provides a kind of electronic tag and forming method thereof, on the first area of support plate, form RFID antenna, described RFID antenna comprises first end and the second end, described first end is spiral ring and extends outward onto the second end, the RFID antenna forming is that planar structure thereby the volume that occupies reduce, RFID antenna is spiral ring from first end and extends outward onto the second end and make antenna can have longer length, by lead key closing process, RFID antenna is connected with radio frequency integrated chip, technique is simple.
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.Describing in detail when the embodiment of the present invention, for ease of explanation, schematic diagram can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit the scope of the invention at this.In addition in actual fabrication, should comprise, the three-dimensional space of length, width and the degree of depth.
Fig. 1~Fig. 4 is the structural representation of embodiment of the present invention electronic tag forming process.
With reference to figure 1, support plate 200 is provided, described support plate 200 comprises first area and second area; On described support plate 200, form metal level 201.
Described support plate 200 is as the carrier of subsequent technique, and as the carrying carrier of the electronic tag of follow-up formation.
Described support plate 200 comprises the second area that first area is adjacent with first area, follow-up formation RFID antenna on the first area of support plate 200, the follow-up laminating radio frequency integrated chip in second area surface of support plate 200.It should be noted that, in Fig. 2 of the present embodiment, only show the first area of support plate.
In other embodiments of the invention, described support plate can comprise some (being more than or equal to 2) device area and the Cutting Road region between device area, on described device area, form electronic tag, follow-uply along Cutting Road region, the some electronic tags that form on support plate are divided into independently electronic tag, each device area comprises the second area that first area is adjacent with second area, on first area, form RFID antenna, follow-up laminating radio frequency integrated chip on second area surface.
Described support plate 200 can be silicon substrate, glass substrate or polymer resin substrate etc.
The follow-up RFID antenna that is used to form of described metal level 201.Can on described support plate 200, form metal level 201 by sputtering technology.
The material of described metal level 201 is Al, Cu, Ag, Au, Pt or W.The thickness of described metal level 201 is 100 dust~50 micron.
In conjunction with referring to figs. 2 and 3, Fig. 3 is the plan structure schematic diagram of Fig. 2, Fig. 2 is the cross-sectional view of Fig. 3 along line of cut AB aspect, metal level 201 described in etching (with reference to figure 1), on the first area of support plate 200, form RFID antenna 203, described RFID antenna 203 comprises first end 21 and the second end 22, and described first end 21 is spiral ring and extends outward onto the second end 22.
Before metal level described in etching 201, on described metal level 201, form patterned mask layer, in the mask layer of described image conversion, there is opening, described opening exposes the surface of the part metals layer that needs etching removal.Described patterned mask layer can be photoresist, forms opening by exposure and developing process (photoetching process) in photoresist layer.
Described in etching, metal level 201 adopts anisotropic dry etching, and such as adopting plasma etching industrial, the etching gas that plasma etching industrial adopts can be SF 6, NH 3, Cl 2, one or more in HBr.
The RFID antenna 203 of etching sheet metal 201 rear formation is spiral ring, and in the middle of first end 21 is positioned at, the second end 22 is positioned at outside, and RFID antenna 203 is spiral ring and extends to the second outside end 22 taking middle first end 21 as starting point.
Form RFID antenna than prior art by coiling and buried metal line, the embodiment of the present invention forms the RFID antenna 203 of plane by the integration making technology of photoetching and etching phase combination, the thickness of RFID antenna 203 can be thinner, the width of the helical ring of RFID antenna 203 can be less, distance between adjacent helical ring can be less, thereby the area that RFID antenna 203 is occupied is less, be conducive to improve the integrated level of the RFID antenna forming, spacing between the adjacent helical ring of the RFID antenna 203 of making by integrated technique in addition can equate, the width of each helical ring equates, thereby make RFID antenna 203 there is higher repeatability and uniform Electrical distribution, electric property while having improved RFID antenna work.
The quantity of the helical ring of described RFID antenna 203 is greater than 2, the thickness T of described RFID antenna 203 is 100 dust~50 micron, such as being 500 dust~10 micron, 1500 dust~5 micron, interval S between the adjacent helical ring of RFID antenna 203 is 1 micron~5000 microns, such as can be 5 microns~40 microns, 50 microns~150 microns, 200 microns~800 microns, 1000 microns~4000 microns, the width W of the helical ring of RFID antenna 203 is 1 micron~500 microns, such as can be 5 microns~40 microns, 50 microns~150 microns, 200 microns~450 microns.Need explanation time, in the embodiment of the present invention, definite mode of a helical ring is: do one through the central point of RFID antenna 203 and the straight line of first end 21, this straight line has some crossing intersection points with RFID antenna, choosing a certain intersection point is the first intersection point, arrive next intersection point as the second intersection point from the first intersection point along helical ring rotating 360 degrees, the helical ring between the first intersection point and the second intersection point is a helical ring.
In the present embodiment, the spiral ring of described RFID antenna 203 is round screw thread, and in other embodiments of the invention, the spiral ring of described RFID antenna 203 can be the spiral of square spiral or other shapes.
In other embodiments of the invention, described RFID antenna can also form by electroplating technology, the forming process of concrete described RFID antenna is: on the support plate of first area, form separation layer, in described separation layer, have the opening that exposes support plate surface, the shape of described opening is corresponding with the shape of RFID antenna to be formed; Adopt electroplating technology in opening, to fill full metal, form RFID antenna.
With reference to figure 4, radio frequency integrated chip 300 is provided, described radio frequency integrated chip 300 comprises first interface 301 and the second interface 302; Described radio frequency integrated chip 300 is fitted in to the second area surface of support plate; Form the first metal connecting line 304 and the second metal connecting line 303 by lead key closing process, described the first metal connecting line 304 is electrically connected the first end of RFID antenna 203 21 with the first interface 301 of radio frequency integrated chip 300, the second metal connecting line 303 is electrically connected the second end 22 of RFID antenna 203 with the second interface 302 of radio frequency integrated chip 300.
Described radio frequency integrated chip 300 and RFID antenna 203 form the transponder (or electronic tag) of radio-frequency recognition system, described radio frequency integrated chip 300 is for storing the information relevant to destination object, the signal that RFID antenna 203 is received is processed, and the relevant information of storage can be sent by RFID antenna 203.Described RFID antenna 203 is for receiving the radiofrequency signal of outside (reader), and for outwards sending radiofrequency signal.
Described radio frequency integrated chip 300 also has identification verification function, and in the time of the read signal of reader, described radio frequency integrated chip 300 can send authorization information the identity of reader is verified.
The transponder (or electronic tag) of the present embodiment can be the transponder (or electronic tag) of passive, active or half active form, described RFID antenna 203 can also produce induction current as coupled apparatus, provides driving-energy to radio frequency integrated chip 300 and RFID antenna 203.
The first interface 301 of described radio frequency integrated chip 300 and the second interface 302 can be metal pad, and first interface 301 and the second interface 302 are electrically connected with the internal circuit of radio frequency integrated chip 300.In the time fitting, the back side of described radio frequency integrated chip 300 can form cementing layer on (surface relative with the second interface with forming first interface), realizes the laminating on radio frequency integrated chip 300 and support plate second area surface by cementing layer.
In other embodiments of the invention, also can be by the second area surface of the back side of radio frequency integrated chip 300 and support plate by bonding technology (such as Direct Bonding, anode linkage technique etc.) laminating.
Described lead key closing process can be thermocompression bonding, supersonic bonding or hot pressing supersonic bonding.To form the first metal connecting line 304 as example, concrete bonding process is: first contact formation the first solder joint through the metal wire of chopper and the first interface 301 of radio frequency integrated chip 300 of bonder; Then chopper lifts and moves to the direction of the first end 21 of RFID antenna 203, forms metal camber line; Then chopper is downward, metal wire is contacted with the first end 21 of RFID antenna 203 and form the second solder joint, and cut off metal wire simultaneously, forms the first metal connecting line 304.
In embodiments of the invention, the RFID antenna 203 forming is spiral ring, in the middle of the first end 21 of RFID antenna 203 is positioned at, the second end 22 of RFID antenna is positioned at periphery, RFID antenna 203 is made by integrated technique, the first end of RFID antenna 203 is difficult to be drawn with radio frequency integrated chip 300 and be electrically connected by same layer metal level or metal wire, in the embodiment of the present invention, form the first metal connecting line 304 and the second metal connecting line 303 by lead key closing process and realize being connected of RFID antenna 203 and radio frequency integrated chip, technique is simple, and be easy to wiring.
The part that does not connect RFID antenna 203 and radio frequency integrated chip 300 that forms described the first metal connecting line 304 by lead key closing process is unsettled above RFID antenna 203 and radio frequency integrated chip 300, and the part that does not connect RFID antenna 203 and radio frequency integrated chip 300 of described the second metal connecting line 303 is unsettled above RFID antenna 203 and radio frequency integrated chip 300.
And, the first metal connecting line 304 and the second metal connecting line 303 are spatially separated, there is not point of crossing at the projection line of support plate in the first metal connecting line 304 and the second metal connecting line 303, prevent in the time forming plastic packaging layer, prevent that the first metal connecting line 304 and the second metal connecting line 303 from moving crossing and being electrically connected on locus.
Also comprise, form and cover described RFID antenna 203, the plastic packaging layer of radio frequency integrated chip 300, the first metal connecting line 304, the second metal connecting line 303 and support plate.
Described plastic packaging layer is for sealing and protect the electronic tag of formation; the material of described plastic packaging layer can be high molecular resin; such as being polyimide, epoxy resin, benzocyclobutene or polybenzoxazoles etc.; the material of described plastic packaging layer can be also other suitable materials, such as silicon nitride, monox etc.
Because the first metal connecting line 304 is unsettled across above radio frequency integrated chip 300 and RFID antenna 203, have larger pressure if formed in the process of plastic packaging layer, the first metal connecting line 304 can be pressed down and contact with RFID antenna 203 and cause short circuit.
The technique that forms described plastic packaging layer can be gluing process, spin coating proceeding or curtain coating (curtain coating) technique, in the process of formation plastic packaging layer, pressure is less, and can form the plastic packaging layer of thickness thicker (covering the overhanging portion of the first metal connecting line and the second metal connecting line).
The technique that forms described plastic packaging layer also can adopt without pressure (or pressure is very little) screen printing, turn and mould or Shooting Technique.
In other embodiments of the invention, in the time being formed with some electronic tags on described support plate, also comprise: cut described plastic packaging layer and support plate along the Cutting Road region of support plate, form some discrete electronic tags.Realize the batch making of electronic tag.
The embodiment of the present invention also provides a kind of electronic tag, please refer to Fig. 4, comprising:
Support plate (not shown), described support plate comprises first area and second area;
Be positioned at the RFID antenna 203 forming on the first area of support plate, described RFID antenna 203 comprises first end 21 and the second end 22, and described first end 21 is spiral ring and extends outward onto the second end 22;
Fit in the radio frequency integrated chip 300 on the second area of support plate, described radio frequency integrated chip 300 comprises first interface 301 and the second interface 302;
Be positioned at the first metal connecting line 304 and the second metal connecting line 303 of radio frequency integrated chip 300 and RFID antenna 203 tops, described the first metal connecting line 304 is electrically connected the first end of RFID antenna 203 21 with the first interface 301 of radio frequency integrated chip 300, the second metal connecting line 303 is electrically connected the second end 22 of RFID antenna 203 with the second interface 302 of radio frequency integrated chip 300.
Concrete, described spiral ring is round screw thread or square spiral.
Spacing between the adjacent helical ring of described RFID antenna 203 equates, the width of each helical ring equates.
The thickness of described RFID antenna 203 is 100 dust~50 micron, and the spacing between the adjacent helical ring of RFID antenna 203 is 1 micron~5000 microns, and the width of the helical ring of RFID antenna 203 is 1 micron~500 microns.
The material of described RFID antenna 203 is Al, Cu, Ag, Au, Pt or W.
The part that does not connect RFID antenna 203 and radio frequency integrated chip 300 of described the first metal connecting line 304 is unsettled above RFID antenna 203 and radio frequency integrated chip 300, and the part that does not connect RFID antenna 203 and radio frequency integrated chip 300 of described the second metal connecting line 303 is unsettled above RFID antenna 203 and radio frequency integrated chip 300.
Also comprise, cover described RFID antenna 203, the plastic packaging layer of radio frequency integrated chip 300, the first metal connecting line 304, the second metal connecting line 303 and support plate.
It should be noted that, in the present embodiment, please refer to restriction or the description of relevant portion in previous embodiment (electronic tag forming process) about other restrictions of electronic tag or description.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.

Claims (7)

1. an electronic tag, is characterized in that, comprising:
Support plate, described support plate comprises first area and second area;
Be positioned at the RFID antenna forming on the first area of support plate, described RFID antenna comprises first end and the second end, and described first end is spiral ring and extends outward onto the second end;
Fit in the radio frequency integrated chip on the second area of support plate, described radio frequency integrated chip comprises first interface and the second interface;
Be positioned at the first metal connecting line and the second metal connecting line of radio frequency integrated chip and RFID antenna top, described the first metal connecting line is electrically connected the first end of RFID antenna with the first interface of radio frequency integrated chip, the second metal connecting line is electrically connected the second end of RFID antenna with the second interface of radio frequency integrated chip.
2. electronic tag as claimed in claim 1, is characterized in that, described spiral ring is round screw thread or square spiral.
3. electronic tag as claimed in claim 1, is characterized in that, the spacing between the adjacent helical ring of described RFID antenna equates, the width of each helical ring equates.
4. electronic tag as claimed in claim 3, it is characterized in that, the thickness of described RFID antenna is 100 dust~50 micron, and the spacing between the adjacent helical ring of RFID antenna is 1 micron~5000 microns, and the width of the helical ring of RFID antenna is 1 micron~500 microns.
5. electronic tag as claimed in claim 1, is characterized in that, the material of described RFID antenna is Al, Cu, Ag, Au, Pt or W.
6. electronic tag as claimed in claim 1, it is characterized in that, the part that does not connect RFID antenna and radio frequency integrated chip of described the first metal connecting line is unsettled above RFID antenna and radio frequency integrated chip, and the part that does not connect RFID antenna and radio frequency integrated chip of described the second metal connecting line is unsettled above RFID antenna and radio frequency integrated chip.
7. electronic tag as claimed in claim 6, is characterized in that, also comprises, covers described RFID antenna, the plastic packaging layer of radio frequency integrated chip, the first metal connecting line, the second metal connecting line and support plate.
CN201410302623.4A 2014-06-27 2014-06-27 Electronic tag Pending CN104021415A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106295773A (en) * 2016-08-08 2017-01-04 深圳劲嘉集团股份有限公司 Paperboard and production technology with RFID antenna
CN108182465A (en) * 2017-12-28 2018-06-19 华东师范大学 A kind of preparation method of the paper substrates RFID flexible electronic labels with humidity sensor characteristic

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Publication number Priority date Publication date Assignee Title
US5399847A (en) * 1992-05-19 1995-03-21 Droz; Francois Card comprising at least one electronic element
CN1290377A (en) * 1999-05-15 2001-04-04 Kde株式会社 RF token and reading device thereof
CN1489806A (en) * 2000-12-18 2004-04-14 ������������ʽ���� Antenna for RFID
CN1832166A (en) * 2005-03-11 2006-09-13 株式会社瑞萨科技 Semiconductor device and a method for manufacturing the same
CN101341499A (en) * 2005-12-05 2009-01-07 斯迈达Ip有限公司 Chip card and method for production of a chip card
CN101447603A (en) * 2008-12-19 2009-06-03 上海集成电路研发中心有限公司 Antenna with progressive structure on RFID chip
CN101971194A (en) * 2007-12-19 2011-02-09 谢玉莲 Contact-less and dual interface inlays and methods for producing the same
CN102169551A (en) * 2011-01-27 2011-08-31 东莞锐发智能卡科技有限公司 SIM (Subscriber Identity Module) card production method and equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399847A (en) * 1992-05-19 1995-03-21 Droz; Francois Card comprising at least one electronic element
CN1290377A (en) * 1999-05-15 2001-04-04 Kde株式会社 RF token and reading device thereof
CN1489806A (en) * 2000-12-18 2004-04-14 ������������ʽ���� Antenna for RFID
CN1832166A (en) * 2005-03-11 2006-09-13 株式会社瑞萨科技 Semiconductor device and a method for manufacturing the same
CN101341499A (en) * 2005-12-05 2009-01-07 斯迈达Ip有限公司 Chip card and method for production of a chip card
CN101971194A (en) * 2007-12-19 2011-02-09 谢玉莲 Contact-less and dual interface inlays and methods for producing the same
CN101447603A (en) * 2008-12-19 2009-06-03 上海集成电路研发中心有限公司 Antenna with progressive structure on RFID chip
CN102169551A (en) * 2011-01-27 2011-08-31 东莞锐发智能卡科技有限公司 SIM (Subscriber Identity Module) card production method and equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106295773A (en) * 2016-08-08 2017-01-04 深圳劲嘉集团股份有限公司 Paperboard and production technology with RFID antenna
CN108182465A (en) * 2017-12-28 2018-06-19 华东师范大学 A kind of preparation method of the paper substrates RFID flexible electronic labels with humidity sensor characteristic

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Application publication date: 20140903