CN104009147A - LED multifunctional packaging structure and packaging technology thereof - Google Patents
LED multifunctional packaging structure and packaging technology thereof Download PDFInfo
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- CN104009147A CN104009147A CN201410260893.3A CN201410260893A CN104009147A CN 104009147 A CN104009147 A CN 104009147A CN 201410260893 A CN201410260893 A CN 201410260893A CN 104009147 A CN104009147 A CN 104009147A
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- led
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- metal foil
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- foil electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses an LED multifunctional packaging structure and a packaging technology of the LED multifunctional packaging structure. The packaging structure comprises a substrate and a plurality of LED chips. The substrate is composed of a metal foil electrode layer, a heat-conduction metal layer and an insulating isolation layer, wherein the insulating isolation layer is located between the metal foil electrode layer and the heat-conduction metal layer and plays a role in bonding connection, insulation and heat conduction. A plurality of electrode separating lines in the vertical or horizontal direction are carved on the metal foil electrode layer. With the electrode separating lines being center lines, a plurality of mounting holes for fixing the LED chips are formed in the substrate. The mounting holes are throughout the metal foil electrode layer and the insulating isolation layer of the substrate, so that the bottoms of the LED chips fixed in the mounting holes make direct contact with the heat-conduction metal layer. The positive electrodes and the negative electrodes of the LED chips are welded to the surfaces of left metal foil electrode layers and right metal foil electrode layers of the electrode separating lines where the chips are located respectively through gold wires. The LED packaging technology is greatly simplified, and automation, scale expansion, and standardization of LED packaging production are facilitated.
Description
Technical field
The present invention relates to the multi-functional encapsulating structure of a kind of LED and packaging technology thereof, belong to LED encapsulation technology field.
Background technology
At present, conventionally adopt in two ways about the encapsulation of LED, the one, simple grain encapsulation, although have the better advantage of performance reliability, exists that production efficiency is lower, encapsulation and the defect such as assembling production cost is high, heat dispersion is poor; Another kind of mode is module type encapsulation; by tens even the LED chip of up to a hundred be directly encapsulated on the circuit base plate designing in advance; composition array module; the advantages such as production efficiency is higher although this packaged type has, encapsulation and lower, the good heat dispersion performance of assembling production cost; but there is the poor shortcoming of performance reliability in this packaged type; once certain grain or a few chips are wherein damaged, and will cause whole module service behaviour variation maybe can not use.
Summary of the invention
The problems referred to above that exist for prior art, the object of this invention is to provide the advantage of a kind of high efficiency that can realize module type packaged type, low cost, perfect heat-dissipating, the performance reliability that can realize again simple grain packaged type is high, use advantage flexibly, can meet LED from small-power, power to powerful any encapsulation requirement, and can also realize the multi-functional encapsulating structure of LED and the packaging technology thereof of after ageing test, carrying out secondary encapsulation.
For achieving the above object, the present invention adopts following technical scheme:
The multi-functional encapsulating structure of a kind of LED, comprise substrate and some LED chips, it is characterized in that: described substrate is made up of metal foil electrode layer, heat-conducting metal layer and the dielectric isolation layer that plays bonding, insulation, conductive force between metal foil electrode layer and heat-conducting metal layer; There is the electrode separation line of some horizontal or vertical directions in described metal foil electrode layer delineation, line centered by described electrode separation line, on described substrate, offer some installing holes for fixed L ED chip, described installing hole is through metal foil electrode layer and the dielectric isolation layer of substrate, and the bottom that makes to be fixed on the LED chip in installing hole directly contacts with heat-conducting metal layer; The positive and negative electrode of LED chip is welded on respectively the surface of the left and right metal foil electrode layer of this chip place electrode separation line by gold thread.
Described metal foil electrode layer is preferably Copper Foil or aluminium foil.
Described heat-conducting metal layer is preferably aluminium sheet or copper coin.
As preferred version, described dielectric isolation layer is formed by the high-heat-conductivity glue that insulate.
As a kind of embodiment, described installing hole is arranged in the groove coaxial with it, and described groove is formed jointly by metal foil electrode layer, heat-conducting metal layer and dielectric isolation layer; Shape, the depth and the large I of described groove require to carry out respective design according to different size chip and light-output.
As a kind of embodiment, in described installing hole, be fixed with one or many LED chips.
As a kind of embodiment, the surface of described metal foil electrode layer all or part be coated with reflective membrane coating, to form metal reflective face.
The packaging technology of the above-mentioned multi-functional encapsulating structure of LED of the present invention, comprises the steps:
A) make substrate;
B) on the metal foil electrode layer of described substrate, delineate the electrode separation line of some horizontal or vertical directions;
C) line centered by described electrode separation line is offered some installing holes on described substrate;
D) LED chip is fixed in installing hole;
E), after crystal-bonding adhesive is dry, be welded to connect the gold thread of the positive and negative electrode of LED chip and the left and right metal foil electrode layer of this chip place electrode separation line;
F) carry out filler or encapsulating.
A kind of manufacture craft of described substrate comprises the steps:
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top.
The another kind of manufacture craft of described substrate comprises the steps:
A0, at the surperficial press flute of heat-conducting metal layer;
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top.
The delineation of described electrode separation line can adopt the method such as etching or laser.
Compared with prior art, the present invention has following conspicuousness progress:
1) the present invention only need be by changing thickness and the area of described substrate, just can realize LED from small-power, power until powerful encapsulation requirement.
2) the present invention only need carry out classifying rationally by the metal foil electrode layer to as substrate top layer, and substrate is cut, just can realize the encapsulation requirement of LED from discrete device to various LED connection in series-parallel array modules, packaging technology and product development process are simplified, shorten product development cycle, reduced production cost.
3) the multi-functional encapsulating structure of LED provided by the invention can directly carry out preliminary examination or ageing test, to find early the LED damaging, and in the time of scribing, these LED that damaged of tripping, also can realize if desired secondary encapsulation, the reliability of packaged LED array module is further ensured, further to improve performance reliability and the consistency of LED product.The multi-functional encapsulating structure of LED provided by the invention, after the required module of cutting, while having indivedual LED to damage as found in module, still can divide cutting, large module can become little module by scribing, and little module can become LED section or simple grain LED by scribing, make LED in encapsulation process, scrappage is reduced to the limit.
4) the multi-functional encapsulating structure of LED provided by the invention is realizing before discrete cutting, can carry out electrical property fast detecting, and testing result directly can be printed on to the surface of substrate or pass through printout, as the foundation of follow-up assembled LED product, not only improve production efficiency, and ensured the quality standard of LED product.
5) the upper lower metal layer of substrate, for LED chip provides a very short heat conduction and area of dissipation to greatest extent, has reduced the thermal resistance of LED chip, reliability and the useful life of having improved LED product effectively.
6) encapsulation institute glue consumption is few, has not only saved cost, has simplified packaging technology, and has reduced thermal resistance.
7) the multi-functional encapsulating structure of LED provided by the invention is in the time realizing connection in series-parallel array module packaging, needn't the concrete LED product structure of forethought and carry out respectively line design, can after first large-scale production, carry out corresponding scribing, therefore greatly shortened the construction cycle of LED product, development process and the production technology of LED product are simplified, be convenient to the scale of LED Realization of Product, automation and standardized production simultaneously, and can be down-stream enterprise and carry out product development, structural design and production and bring great convenience; Especially, the present invention also can realize LED and exempt from welding assembly technique, has further simplified the production technology of downstream product, has improved production efficiency and the reliability of downstream product, can greatly reduce the production cost of downstream product.
In a word; the present invention is by the original creation encapsulating structure of design; greatly simplify the packaging technology of LED; shorten the construction cycle of LED product, improved reliability and the consistency of LED product, be conducive to realize LED encapsulation automation, scale and standardized production simultaneously; effectively improve the production efficiency of LED encapsulation; reduce the production cost of LED product, thereby made LED product introduction high-performance, low cost epoch step breakthrough major step, there is conspicuousness progress.
Brief description of the drawings
Fig. 1 is the Facad structure schematic diagram of a kind of substrate to be packaged of providing of embodiment 1;
Fig. 2 is the side structure schematic diagram of substrate described in embodiment 1;
Fig. 3 is simple grain chip in Fig. 1 in die bond, welds gold thread but partial structurtes schematic diagram during without encapsulating;
Fig. 4 is the cross section structure schematic diagram of Fig. 3;
Fig. 5 is the Facad structure schematic diagram of a kind of substrate to be packaged of providing of embodiment 2;
Fig. 6 is simple grain chip in Fig. 5 in die bond, welds gold thread but partial structurtes schematic diagram during without encapsulating;
Fig. 7 is the cross section structure schematic diagram of Fig. 6;
Fig. 8 is the partial structurtes schematic diagram of the single installing hole that provides of embodiment 3;
Fig. 9 is the cross section structure schematic diagram of Fig. 8;
Figure 10 is the Facad structure schematic diagram of a kind of LED substrate to be packaged shown in Fig. 5 after encapsulation;
Figure 11 is the structural representation of Figure 10 being cut apart again to the eight strings five LED array module also obtaining;
Figure 12 is the structural representation of the LED array module after Figure 10 is again cut apart obtain two four strings five module and connected;
Figure 13 is the structural representation that Figure 10 is divided into 5 section of eight string LED module;
Figure 14 is that a kind of eight strings five provided by the invention LED module is also at the status architecture schematic diagram that occurs to repair when certain chip damages.
In figure: 1, metal foil electrode layer; 1a, positive electrode region; 1b, negative electrode area; 2, heat-conducting metal layer; 3, dielectric isolation layer; 4, installing hole; 5, electrode separation line; 6, LED chip; 7, gold thread; 8, groove; 8a, left reflective surface; 8b, right reflective surface; 9, the LED after encapsulation.
Embodiment
Below in conjunction with specific embodiments and the drawings, further set forth the present invention.
Embodiment 1
As shown in Figures 1 to 4: the multi-functional encapsulating structure of a kind of LED that the present embodiment provides, comprise substrate and some LED chips, described substrate is made up of metal foil electrode layer 1, heat-conducting metal layer 2 and the dielectric isolation layer 3 that plays bonding, insulation, conductive force between metal foil electrode layer 1 and heat-conducting metal layer 2; On described metal foil electrode layer 1, delineation has the electrode separation line 5 of some horizontal or vertical directions, line centered by described electrode separation line 5, on described substrate, offer some installing holes 4 for fixed L ED chip 6, described installing hole 4 is through metal foil electrode layer 1 and the dielectric isolation layer 3 of substrate, and the bottom that makes to be fixed on the LED chip 6 in installing hole 4 directly contacts with heat-conducting metal layer 2; The positive and negative electrode of LED chip 6 is welded on respectively the surface (as the 1a in Fig. 3 and 1b) of the left and right metal foil electrode layer 1 of this chip place electrode separation line 5 by gold thread 7.
Described metal foil electrode layer 1 is preferably Copper Foil or aluminium foil, and described heat-conducting metal layer 2 is preferably aluminium sheet or copper coin, and described dielectric isolation layer 3 is formed by insulation high-heat-conductivity glue.
The packaging technology of the multi-functional encapsulating structure of LED described in the present embodiment, comprises the steps:
A) make substrate:
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top.
B) on the metal foil electrode layer of described substrate, delineate the electrode separation line of some horizontal or vertical directions;
C) line centered by described electrode separation line is offered some installing holes on described substrate;
D) LED chip is fixed in installing hole;
E), after crystal-bonding adhesive is dry, be welded to connect the gold thread of the positive and negative electrode of LED chip and the left and right metal foil electrode layer of this chip place electrode separation line;
F) carry out encapsulating.
The delineation of described electrode separation line can adopt the method such as etching or laser.
Can meet the heat radiation requirement of different LED watt level by changing the thickness of substrate bottom and packaging density.
The size and shape of described installing hole can carry out respective design according to the specification of different chips; The surface of described metal foil electrode layer can be taked all or part is coated with reflective membrane coating, to form all or localized metallic reflective surface.
Embodiment 2
As shown in Figures 5 to 7: the multi-functional encapsulating structure of a kind of LED that the present embodiment provides, only be with the difference of embodiment 1: described installing hole 4 is arranged in the groove coaxial with it 8, described groove 8 is formed jointly by metal foil electrode layer 1, heat-conducting metal layer 2 and dielectric isolation layer 3, and shape, the depth and the large I of described groove 8 require to carry out respective design according to different size chip and light-output.
The surface of described metal foil electrode layer can be taked all or part is coated with reflective membrane coating, makes the inner surface of groove 8 form two of the left and right metal reflective face (as the 8a in Fig. 6 and 8b) taking electrode separation line 5 as symmetry axis.
The packaging technology of the multi-functional encapsulating structure of LED described in the present embodiment, comprises the steps:
A) make substrate:
A0, at the surperficial press flute of heat-conducting metal layer;
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top;
B) on the metal foil electrode layer of described substrate, delineate the electrode separation line of some horizontal or vertical directions;
C) line centered by described electrode separation line is offered installing hole in the groove of described substrate compacting;
D) LED chip is fixed in installing hole;
E), after crystal-bonding adhesive is dry, be welded to connect the gold thread of the positive and negative electrode of LED chip and the left and right metal foil electrode layer of this chip place electrode separation line;
F) carry out filler.
The delineation of described electrode separation line can adopt the method such as etching or laser.
Can meet the heat radiation requirement of different LED watt level by changing the thickness of substrate bottom and packaging density.
Embodiment 3
As shown in Figure 8 and Figure 9: the multi-functional encapsulating structure of a kind of LED that the present embodiment provides, is only with the difference of embodiment 2: in described installing hole 4, be provided with many chip array modules.
Figure 10 is the Facad structure schematic diagram of a kind of LED substrate to be packaged shown in Fig. 5 after encapsulation, and 9 in figure is the LED after encapsulating.
If technological requirement encapsulation be after first going here and there and array module, can be in Figure 10 (being the array modules of a kind of five and eight strings) structure 4 horizontal electrode separator bars of scribing again, just can easily obtain the string of eight shown in Figure 11 five LED array module also; In the array modular structure shown in Figure 11, if there is certain LED open circuit breakage, eight LED of this string will all not work so, considering under the prerequisite of each branch road current-sharing, wish after a certain grain LED open circuit breakage, reduce while not working LED quantity as far as possible, can be by changing horizontal bar broken string, cut apart the structure of the LED array module after two four strings five forming shown in Figure 12 module are connected again, total string number are constant, but LED string mode in module change to some extent, at this moment, in the time of a certain LED open circuit breakage, only have four LED not work.In concrete use, also can be divided into two strings five also and then the modules of four strings according to actual conditions, when at this moment certain LED damages, only have two LED not work.We also can be as required equally, is divided into the module of connecting again after varying number LED goes here and there also.For example: can be divided into three strings five also, two strings five also, three strings five also, and then be together in series, the connection in series-parallel number that module is total or constant.According to different actual conditions, the different scribings to this encapsulating structure can be passed through in a word, various technological requirements can be very easyly met neatly.
Equally, if technological requirement encapsulation be discrete LED time, we or equally on the encapsulating structure shown in Figure 10, mark four horizontal stripings.As shown in figure 13, article four, the LED in encapsulating structure is divided into five by horizontal striping, as long as the LED on five connects with the mains simultaneously, on platform, all LED can one-time detection complete (this is that current discrete LED encapsulation technology cannot realize).In figure, chain-dotted line represents herein by the line of LED cutting, after detection, to cut along this chain-dotted line, can obtain a discrete LED of grain.
In the time of large-scale production, the present invention also can realize the LED module after encapsulation is adopted to scan mode fast detecting, and testing result is directly printed on to LED surface simultaneously, or with printer output, using the foundation as follow-up assembled LED product, not only can enhance productivity, and ensure the quality standard of LED product.
Because LED electrode of the present invention is the table plane at LED, this feature makes LED in the time of assembled LED product, can realize easily and exempt from welding assembly and exempt from REPAIR WELDING.Wherein one of method can rely on the mode of close contact to realize and interconnect or introduce power supply as button cell.
Encapsulating structure provided by the invention in actual applications, also has easy repair function rapidly.Taking Figure 14 as example, if this eight string five and module in have LED to damage, as beaten that poor LED open circuit breakage in figure time, at this moment we are as long as couple together the horizontal striping that damages LED both sides, as being equipped with the blockage place connection of oblique line in figure.The LED damaging before repairing can make eight LED not work, and after simple repairing, only has that grain of damage not work.If eight shown in Figure 14 string five is not overall module, but formed by five sections of (eight LED sections of being in series) parallel combinations, so in the time that certain LED damages, need only replacing wherein one section can repair.Or by the method reparation of above module.If eight shown in Figure 14 string five is also combined and formed by discrete LED, so in the time that certain LED damages, as long as take off, that LED of having damaged more renews, repair very convenient simply.
Finally be necessary described herein: above embodiment, only for technical scheme of the present invention is described in more detail, can not be interpreted as limiting the scope of the invention; Some nonessential improvement that those skilled in the art's foregoing according to the present invention is made and adjustment all belong to protection scope of the present invention.
Claims (10)
1. the multi-functional encapsulating structure of LED, comprise substrate and some LED chips, it is characterized in that: described substrate is made up of metal foil electrode layer, heat-conducting metal layer and the dielectric isolation layer that plays bonding, insulation, conductive force between metal foil electrode layer and heat-conducting metal layer; There is the electrode separation line of some horizontal or vertical directions in described metal foil electrode layer delineation, line centered by described electrode separation line, on described substrate, offer some installing holes for fixed L ED chip, described installing hole is through metal foil electrode layer and the dielectric isolation layer of substrate, and the bottom that makes to be fixed on the LED chip in installing hole directly contacts with heat-conducting metal layer; The positive and negative electrode of LED chip is welded on respectively the surface of the left and right metal foil electrode layer of this chip place electrode separation line by gold thread.
2. the multi-functional encapsulating structure of LED as claimed in claim 1, is characterized in that: described metal foil electrode layer is Copper Foil or aluminium foil.
3. the multi-functional encapsulating structure of LED as claimed in claim 1, is characterized in that: described heat-conducting metal layer is aluminium sheet or copper coin.
4. the multi-functional encapsulating structure of LED as claimed in claim 1, is characterized in that: described dielectric isolation layer is formed by the high-heat-conductivity glue that insulate.
5. the multi-functional encapsulating structure of LED as claimed in claim 1, is characterized in that: described installing hole is arranged in the groove coaxial with it, and described groove is formed jointly by metal foil electrode layer, heat-conducting metal layer and dielectric isolation layer.
6. the multi-functional encapsulating structure of the LED as described in claim 1 or 5, is characterized in that: in described installing hole, be fixed with one or many LED chips.
7. the multi-functional encapsulating structure of the LED as described in claim 1 or 5, is characterized in that: the surface of described metal foil electrode layer all or part be coated with reflective membrane coating, to form metal reflective face.
8. a packaging technology for the multi-functional encapsulating structure of LED claimed in claim 1, is characterized in that, comprises the steps:
A) make substrate;
B) on the metal foil electrode layer of described substrate, delineate the electrode separation line of some horizontal or vertical directions;
C) line centered by described electrode separation line is offered some installing holes on described substrate;
D) LED chip is fixed in installing hole;
E), after crystal-bonding adhesive is dry, be welded to connect the gold thread of the positive and negative electrode of LED chip and the left and right metal foil electrode layer of this chip place electrode separation line;
F) carry out filler or encapsulating.
9. packaging technology as claimed in claim 8, is characterized in that, the manufacture craft of described substrate comprises the steps:
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top;
Or, comprise the steps:
A0, at the surperficial press flute of heat-conducting metal layer;
A1, gluing on heat-conducting metal layer;
A2, metal foil electrode layer is bonded in to heat-conducting metal layer top.
10. packaging technology as claimed in claim 8, is characterized in that: the delineation of described electrode separation line adopts etching or laser means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410260893.3A CN104009147A (en) | 2014-06-12 | 2014-06-12 | LED multifunctional packaging structure and packaging technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410260893.3A CN104009147A (en) | 2014-06-12 | 2014-06-12 | LED multifunctional packaging structure and packaging technology thereof |
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| CN104009147A true CN104009147A (en) | 2014-08-27 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586006A (en) * | 2001-09-13 | 2005-02-23 | 卢西雅股份公司 | Led-luminous panel and carrier plate |
| US20060043382A1 (en) * | 2003-02-07 | 2006-03-02 | Nobuyuki Matsui | Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus |
| US20110121349A1 (en) * | 2009-11-25 | 2011-05-26 | Everlight Electronics Co., Ltd. | Light-emitting diode and manufacturing method thereof |
| CN102412361A (en) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | Laminated heat dissipation substrate and electronic assembly structure using same |
| CN103227273A (en) * | 2012-01-25 | 2013-07-31 | 新光电气工业株式会社 | Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
-
2014
- 2014-06-12 CN CN201410260893.3A patent/CN104009147A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586006A (en) * | 2001-09-13 | 2005-02-23 | 卢西雅股份公司 | Led-luminous panel and carrier plate |
| US20060043382A1 (en) * | 2003-02-07 | 2006-03-02 | Nobuyuki Matsui | Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus |
| US20110121349A1 (en) * | 2009-11-25 | 2011-05-26 | Everlight Electronics Co., Ltd. | Light-emitting diode and manufacturing method thereof |
| CN102412361A (en) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | Laminated heat dissipation substrate and electronic assembly structure using same |
| CN103227273A (en) * | 2012-01-25 | 2013-07-31 | 新光电气工业株式会社 | Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
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