CN103997877B - 一种高热流密度均温散热装置 - Google Patents
一种高热流密度均温散热装置 Download PDFInfo
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- CN103997877B CN103997877B CN201410188506.XA CN201410188506A CN103997877B CN 103997877 B CN103997877 B CN 103997877B CN 201410188506 A CN201410188506 A CN 201410188506A CN 103997877 B CN103997877 B CN 103997877B
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- CN
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- Prior art keywords
- heat
- foam copper
- pipe
- working medium
- heat pipe
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title abstract description 5
- 238000001816 cooling Methods 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000006260 foam Substances 0.000 claims abstract description 26
- 230000005494 condensation Effects 0.000 claims abstract description 8
- 238000009833 condensation Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000010622 cold drawing Methods 0.000 claims description 24
- 239000012530 fluid Substances 0.000 claims description 24
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract description 2
- 239000000498 cooling water Substances 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 description 8
- 238000007598 dipping method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410188506.XA CN103997877B (zh) | 2014-05-07 | 2014-05-07 | 一种高热流密度均温散热装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410188506.XA CN103997877B (zh) | 2014-05-07 | 2014-05-07 | 一种高热流密度均温散热装置 |
Publications (2)
Publication Number | Publication Date |
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CN103997877A CN103997877A (zh) | 2014-08-20 |
CN103997877B true CN103997877B (zh) | 2017-05-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410188506.XA Expired - Fee Related CN103997877B (zh) | 2014-05-07 | 2014-05-07 | 一种高热流密度均温散热装置 |
Country Status (1)
Country | Link |
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CN (1) | CN103997877B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104244680A (zh) * | 2014-09-25 | 2014-12-24 | 中国北方车辆研究所 | 一种复合水冷板 |
CN108125547B (zh) * | 2016-12-01 | 2023-09-22 | 佛山市顺德区美的电热电器制造有限公司 | 一种含不同孔径吸液芯的均温锅 |
CN106659090A (zh) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | 热管传导散热装置 |
CN107517575B (zh) * | 2017-09-28 | 2019-10-29 | 北京无线电测量研究所 | 一种轻质均温高效散热装置及电子设备 |
CN108024488B (zh) * | 2018-01-09 | 2023-10-17 | 无锡巨日电子科技有限公司 | 水套式线路板散热装置 |
CN108963998B (zh) * | 2018-06-05 | 2022-04-15 | 中国电力科学研究院有限公司 | 旋转式液态金属限流器 |
CN108627038A (zh) * | 2018-06-15 | 2018-10-09 | 杭州熵能热导科技有限公司 | 一种热管 |
CN113423244B (zh) * | 2021-06-28 | 2022-06-21 | 哈尔滨工业大学 | 一种铝基液冷散热结构的制备方法和应用 |
CN114641188A (zh) * | 2022-03-31 | 2022-06-17 | 深圳市嘉和达管业有限公司 | 一种内置有散热结构的均温板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2655423Y (zh) * | 2003-08-07 | 2004-11-10 | 华东船舶工业学院 | 一种高热流均温散热的热管式冷板 |
CN101848629B (zh) * | 2010-03-31 | 2012-02-15 | 华南理工大学 | 一种具有泡沫金属与铜粉复合毛细结构的均热板 |
CN103167780B (zh) * | 2011-12-16 | 2016-06-08 | 台达电子企业管理(上海)有限公司 | 功率模块用复合式散热器组件 |
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2014
- 2014-05-07 CN CN201410188506.XA patent/CN103997877B/zh not_active Expired - Fee Related
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Publication number | Publication date |
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CN103997877A (zh) | 2014-08-20 |
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Effective date of registration: 20190529 Address after: 211106 Xiangshan Villa 43-504, No. 9 Kaiyuan Xin Street, Jiangning District, Nanjing City, Jiangsu Province Patentee after: Yang Xiaobing Address before: 212003 Mengxi Road, Jingkou District, Zhenjiang, Jiangsu Province, No. 2 Patentee before: Jiangsu University of Science and Technology |
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Effective date of registration: 20190606 Address after: 211111 Room 107, Building 16, J6 Software Park, No. 6 General Road, Jiangning District, Nanjing City, Jiangsu Province Patentee after: NANJING BOSIWEN TECHNOLOGY CO.,LTD. Address before: 211106 Xiangshan Villa 43-504, No. 9 Kaiyuan Xin Street, Jiangning District, Nanjing City, Jiangsu Province Patentee before: Yang Xiaobing |
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Granted publication date: 20170503 |
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