CN103995629A - Static capacitor input typed device - Google Patents
Static capacitor input typed device Download PDFInfo
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- CN103995629A CN103995629A CN201410016199.7A CN201410016199A CN103995629A CN 103995629 A CN103995629 A CN 103995629A CN 201410016199 A CN201410016199 A CN 201410016199A CN 103995629 A CN103995629 A CN 103995629A
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Abstract
The invention provides a static capacitor input type device, which, used as a material for the grounding pattern, can inhibit the difference of the sensitivity even using the material with low conductivity. The static capacitor input device comprises a substrate (10), an electrode pattern (2) pasted on the face of the basal plate (10), and a grounding pattern (3) which is pasted on the other surface of the substrate (10); the grounding pattern (3) has a first grounding pattern (31) formed by the first material (61) and a second grounding pattern formed by the second material (62) the conductivity of which is higher than that of the first material (61); the first grounding pattern is formed by laminating with the electrode pattern, and when the second grounding pattern (32) is in contact with the first grounding pattern (31), the laminating area (2B) with the electrode pattern (2) is formed.
Description
Technical field
The present invention relates to capacitance type input device, particularly a kind of variation by electrostatic capacitance detects the capacitance type input device of the approximated position of finger etc.
Background technology
Capacitance type input device, be detecting sensor portion electrostatic capacitance and as the device of input media.Capacitance type input device, for example, has and on substrate, forms the sensor portion of drive electrode and detecting electrode and comprise drive electrode is applied and drives the driving circuit of signal and process the circuit part from the testing circuit of the detection signal of detecting electrode.Thus, by the variation of the electrostatic capacitance between drive electrode and detecting electrode, for example, can detect approaching of finger etc.In addition,, if at a plurality of position configuration drive electrodes and detecting electrode, can detect the approximated position of finger etc.
Capacitance type input device, requires the noise to producing from other electronic equipment or by charged finger, contact the anti-patience of the static of generation.In order to prevent noise and static countermeasure, in capacitance type input device, except the electrode pattern of drive electrode and detecting electrode, generally also grounding pattern to be set.In addition, known: for example, by the region that downside (rear side of substrate) spreads all over while overlooking and electrode pattern is overlapping of substrate forming the electrode pattern of drive electrode and detecting electrode grounding pattern to be set, thereby make to be blended into the noise decrease in detection signal, make detection signal stable.
On the substrate of capacitance type input device, can use and there is flexual film substrate.When substrate is film substrate, generally carry out by the setting of printing grounding pattern.By being printed in the resin material of paste, mixed the electrically conductive ink of the powder (for example, metal powder) with electric conductivity the conductive material of heat hardening, can, by forming grounding pattern, in simpler operation, manufacture.
In patent documentation 1, disclose: in capacitance type input device, by printing, form electrode pattern, in grounding pattern, print the low silver-colored ink of electrically conductive ink (silver-colored ink) phase specific conductivity of using with electrode pattern.
Fig. 8 is the vertical view of disclosed capacitance type input device 100 in patent documentation 1.Fig. 9 is that the part of capacitance type input device is in the past amplified longitudinal section, Fig. 9 (a) is that the part of amplifying a part for the longitudinal section that the A-A line with Fig. 8 blocks is amplified longitudinal section, and Fig. 9 (b) is that the part of amplifying a part for the longitudinal section that the B-B line with Fig. 8 blocks is amplified longitudinal section.As shown in Fig. 8 and Fig. 9, the table side of flexual film substrate 110 102 forms sensor portions 120, on the surperficial 110a of film substrate 110, directly or across insulation course, forms a plurality of Y drive electrodes 111 and a plurality of detecting electrode 112.In addition, on the surface of Y drive electrode 111 and detecting electrode 112, be provided with sensor side insulation course 114, X drive electrode 113 is formed on sensor side insulation course 114.
The dorsal part 103 forming circuit portions of film substrate 110, on the 110b of the back side of film substrate 110, form the ground plane (screen layer) 117 forming with conductive material.Ground plane 117 forms the roughly whole region from dorsal part overlapping operation face.As shown in Figure 9, the back side of ground plane 117 is covered by circuit side insulation course 118.At the back side of this circuit side insulation course 118, be formed with wiring layer.
Prior art document
Patent documentation
Patent documentation 1:JP JP 2012-190218 communique
Brief summary of the invention
Yet therefore grounding pattern need to, replace silver-colored ink with electrodes lay region with extensive region more than area, preferably uses material cheaply.On the other hand, because material conductance is low cheaply, therefore use the resistance value of the grounding pattern of the material that conductance is low to uprise.Therefore, have following problem: if in the resistance value of grounding pattern, have deviation the change width of resistance value become large, the detection sensitivity of capacitance type input device just there will be deviation.Therefore, cannot use the lower cost materials that conductance is low.
Summary of the invention
The present invention, for addressing the above problem, its object is, even if a kind of material as grounding pattern is provided, uses the material that conductance is low also can suppress the static capacity type sensor of the deviation of sensitivity.
Capacitance type input device of the present invention, has: substrate; Electrode pattern, it is layed in a face of described substrate; And grounding pattern, it is layed in another face of described substrate, described grounding pattern has: the first grounding pattern being formed by the first material and the second grounding pattern being formed by conductance the second material higher than described the first material, the region that described the first grounding pattern spreads all over while overlooking and described electrode pattern is overlapping and forming, and described the second grounding pattern, under the state contacting with described the first grounding pattern, form and surround while overlooking and region that described electrode pattern is overlapping.
According to this structure, the grounding pattern of laying on another face of substrate, spread all over while overlooking and region that electrode pattern that a face of substrate is laid is overlapping and form the first grounding pattern, while overlooking to surround and the frame shape in the overlapping region of electrode pattern form the second grounding pattern.And, because the second grounding pattern contacts with the first grounding pattern, therefore, can reduce by the second grounding pattern the resistance value of grounding pattern.So, in the first material, can use the material that conductance is low.Therefore, even if use the low material of conductance in the first material, also can reduce the resistance value of grounding pattern, thereby, the deviation of sensitivity can be suppressed.And even the second high material expensive of conductance, also few owing to being used to form the use amount of the second grounding pattern of frame shape, therefore, the cost of grounding pattern integral body is low.
In addition, in capacitance type input device of the present invention, on another face of described substrate, have at the stacked insulation course of at least a portion of described the first grounding pattern and the wiring pattern that is electrically connected to the described electrode pattern of laying at the opposite side of described insulation course, described wiring pattern is by unified formation of described the second material that is used to form described the second grounding pattern.
According to this structure, the wiring pattern being formed and the second grounding pattern can be made as to same operation by the second material.So, compare with the situation of the second grounding pattern with forming respectively wiring pattern, can reduce operation.
In capacitance type input device of the present invention, described the first material is the conductive material of carbon containing.
According to this structure, because the first material is the conductive material of carbon containing, so cost is low.So even if the area of the first grounding pattern is larger, the cost of grounding pattern is also low.
In capacitance type input device of the present invention, described the second material is the conductive material of argentiferous.
According to this structure, because the second material is the conductive material of argentiferous, therefore, conductance is high.So, even if the second grounding pattern of frame shape forms carefullyyer, also can reduce the resistance value of grounding pattern.
In capacitance type input device of the present invention, described the first grounding pattern forms by printing.
According to this structure, the first grounding pattern being formed by the first material, prints electrically conductive ink material and makes its sclerosis and form, and therefore, compares with the method such as evaporation, easily manufactures.
In capacitance type input device of the present invention, described the second grounding pattern forms by printing.
According to this structure, the second grounding pattern consisting of the second material, is electrically conductive ink material is printed and make its sclerosis and form, and therefore, compares with the method that the pattern that uses the film forming such as evaporation or photoetching forms, and easily manufactures.In addition, compare with methods such as evaporations, owing to can improving the service efficiency of material, therefore, further cost degradation.
Invention effect
According to the present invention, due to surround while overlooking and the frame shape in the region that electrode pattern is overlapping forms the second grounding pattern, therefore, even if the resistance value of the first grounding pattern is high, also can reduce by the second grounding pattern the resistance value of grounding pattern.So, in the first material, can use the material that conductance is low.Therefore, even if use the low material of conductance in the first material, also can reduce the resistance value of grounding pattern, thereby, the deviation of sensitivity can be suppressed.Therefore,, even use the low material of conductance as the material of grounding pattern, also can provide the capacitance type input device of the deviation that can suppress sensitivity.
Accompanying drawing explanation
Fig. 1 means the schematic diagram of the capacitance type input device of embodiments of the present invention, is (a) vertical view, is (b) upward view, is (c) right side view.
Fig. 2 is the local amplification view that a part for the schematic sectional view blocking with II-II line of Fig. 1 (a) is amplified.
Fig. 3 is the local amplification view that a part for the schematic sectional view blocking with III-III line of Fig. 1 (a) is amplified.
Fig. 4 is the diagrammatic bottom view that explanation forms the substrate before grounding pattern.
Fig. 5 is the diagrammatic bottom view of explanation the first grounding pattern.
Fig. 6 is the schematic diagram of explanation the second grounding pattern and wiring pattern.
Fig. 7 is the schematic diagram of explanation the second grounding pattern.
Fig. 8 is the vertical view of existing capacitance type input device.
Fig. 9 is that longitudinal section is amplified in the part of existing capacitance type input device, (a) being that longitudinal section is amplified in the part of amplifying a part for the longitudinal section that the A-A line with Fig. 8 blocks, is (b) that longitudinal section is amplified in the part of amplifying a part for the longitudinal section that the B-B line with Fig. 8 blocks.
Symbol description:
1-capacitance type input device,
2-electrode pattern,
3-grounding pattern,
4-insulation course,
4a-peristome,
6-wiring pattern,
7-circuit part,
8-protective seam,
10-substrate,
15,16,17-through hole,
21-the first electrode,
22-the second electrode,
25-interlayer insulating film,
26-protects pattern,
31-the first grounding pattern,
31a-peristome,
32-the second grounding pattern,
The wiring of 32a-ground connection,
32b-welding disk,
61-the first material,
62-the second material,
65,66-filling through hole material,
71-circuit substrate,
72-IC encapsulation,
73-connector.
Embodiment
[the first embodiment]
Below, the capacitance type input device 1 in embodiments of the present invention, describes with reference to accompanying drawing.And in order to make to illustrate easy to understand, accompanying drawing has suitably changed size.
Fig. 1 means the schematic diagram of the capacitance type input device 1 of embodiments of the present invention.Fig. 1 (a) is vertical view, and Fig. 1 (b) is upward view, and Fig. 1 (c) is right side view.Fig. 2 is the schematic sectional view blocking with II-II line of Fig. 1 (a).Fig. 3 is the schematic sectional view blocking with III-III line of Fig. 1 (a).
As shown in FIG. 1 to 3, the capacitance type input device 1 of present embodiment has: substrate 10; Operating surface is the electrode pattern 2 of laying on a face of substrate 10; The grounding pattern 3 of laying on another face of substrate 10; With circuit part 7.
Substrate 10 is that for example thickness is the flexual film substrate of 0.2mm left and right.The material of substrate 10 is for example PET (tygon).And, on substrate 10, be formed with through hole 15,16,17.
As shown in Fig. 1 (a), the electrode pattern 2 of laying on a face of substrate 10, is formed by a plurality of the first electrodes 21 and a plurality of the second electrode 22.The scope of configured electrodes pattern 2 is made as to electrode pattern region 2A.
A plurality of the first electrodes 21 devices spaced apart and adjacent in X1-X2 direction, and in Y1-Y2 side, extend upward respectively.In addition, a plurality of the second electrodes 22 devices spaced apart and adjacent in Y1-Y2 direction, and in X1-X2 side, extend upward respectively.As shown in Figure 2, a plurality of the first electrodes 21 are configured under interlayer insulating film 25 and the second electrode 22, and the second electrode 22 contacts with filling through hole material 66 in the position of through hole 16.The first electrode 21, as shown in Figure 3, contacts with filling through hole material 65 in the position of through hole 15.The first electrode 21, in the position of the intersection point with the second electrode 22, make intersecting below of interlayer insulating film 25 and the second electrode 22, in the position not covered by interlayer insulating film 25 and the second electrode 22, as shown in Fig. 1 (a), with almost diamond shape, expose.The second electrode 22 forming in a narrow margin with the intersection point place of the first electrode 21, in the position of not exposing the first electrode 21, forms the almost diamond shape of wide cut in Y1-Y2 direction.
As shown in Fig. 1 (b), on another face of substrate 10, be formed with grounding pattern 3 and circuit part 7.And, as shown in FIG. 2 and 3, on another face of substrate 10, although be also laminated with insulation course 4 and protective seam 8, in Fig. 1 (b), for ease of understanding grounding pattern 3, omitted insulation course 4 and protective seam 8.
Grounding pattern 3 has the first grounding pattern 31 consisting of the first material 61 and the second grounding pattern 32 consisting of the second material 62.Then, the first grounding pattern 31 spreads all over whole of another side of substrate 10 and forms, and the second grounding pattern 32, under the state contacting with the first grounding pattern 31, forms and surrounds while overlooking and the frame shape of the region 2B that electrode pattern 2 is overlapping.And, in the position of through hole 15,16,17, at the first grounding pattern 31 and insulation course 4, be provided with opening.In Fig. 1 (b), for ease of understanding grounding pattern 3, to the first grounding pattern 31, the second grounding pattern 32, give shade.
The first material 61 for example, is the conductive material of carbon containing.The second material 62 for example, is the conductive material of argentiferous.
Circuit part 7, consists of the circuit substrate 71 that IC encapsulation 72 and connector 73 have been installed.Circuit part 7 via wiring pattern 6 and in the through hole 15,16 of substrate 10 formed filling through hole material 65,66, and be electrically connected to a plurality of the first electrodes 21 and a plurality of the second electrode 22.In IC encapsulation 72, be provided with driving circuit or testing circuit, can process the electric signal using a plurality of the first electrodes 21 and a plurality of the second electrode 22 as drive electrode and detecting electrode.Connector 73, connects not shown outside wiring, provides power supply, and be the terminal for output signal output to driving circuit or testing circuit.And, in Fig. 1 (b), for ease of understanding, to wiring pattern 6, also give shade.
Capacitance type input device 1, is by the variation of the electrostatic capacitance between a plurality of the first electrodes 21 and a plurality of the second electrode 22, detects the approaching device of finger etc.Due to dispose operating surface be a plurality of the first electrodes 21 set in the X1-X2 direction of electrode pattern region 2A and in Y1-Y2 direction set a plurality of the second electrodes 22, therefore, for example as described below, can detect the planimetric position of finger on operating surface etc.
By IC, encapsulate driving circuit set in 72, with regular time interval, to a plurality of the first electrodes 21, for example, from X1 side, apply in order the voltage of pulse type.
If in order the first electrode 21 is made as to X from X1 side
1, X
2..., X
m, work as drive electrode and to X
1while applying the voltage of pulse type, if by X
2be made as detecting electrode, at X
2the middle meeting immediate current that flows.Because this electric current depends on X
1with X
2between the size of formed electrostatic capacitance, so when finger etc. approaches, can be because of X
1with X
2between the size of formed electrostatic capacitance change, and the magnitude of current is changed.On the other hand, in the ensuing time, as drive electrode and to X
2apply the voltage of pulse type, by X
3as detecting electrode, detect the magnitude of current.So, extremely by X
mtill order as detecting electrode, in order in the enterprising line scanning of X2 direction.By X
1, X
2..., X
mbe made as in the magnitude of current of detecting electrode, because the magnitude of current of the detecting electrode in the approximated position of finger etc. is different, therefore, can infer the approaching X coordinates such as finger.In addition, when the drive electrode among the first electrode 21 applies the voltage of pulse type, if other two the first electrodes 21 of diverse location are made as to detecting electrode, detect each magnitude of current simultaneously, the detection resolution for X coordinate can be improved, X coordinate can be more correctly inferred.
Similarly, to the second electrode 22, can carry out in order same scanning from Y1 side.By IC, encapsulate driving circuit set in 72, with regular time interval to a plurality of the second electrodes 22, for example, from Y1 side, apply in order the voltage of pulse type, according to Y
1, Y
2..., Y
nthe magnitude of current of each detecting electrode, can infer the approaching Y coordinates such as finger.
By carrying out in order the scanning of directions X and the scanning of Y-direction, infer approaching X coordinate and the Y coordinates such as finger.Such electric scanning completes after one time at short notice, can repeatedly carry out, and therefore, the move operation in the time of can also be for touch operation faces such as fingers is inferred.
And, the detection method of the electrostatic capacitance in capacitance type input device 1, is not limited to above-mentioned example, for example, the first electrode 21 is made as to drive electrode, and the second all electrodes 22 is made as to the alternate manners such as each magnitude of current that detecting electrode detects Y1-Y2 direction is also fine.
So, capacitance type input device 1, detects the electrostatic capacitance of the electrode pattern 2 of laying on a face of the substrate 10 of operating surface (a plurality of the first electrodes 21 and a plurality of the second electrode 22).Now, in order to suppress from the interference beyond the object of finger etc., and at surrounding's laying grounding pattern 3 of electrode pattern 2.
In the present embodiment, on another face of substrate 10, lay grounding pattern 3, make can to electrode pattern 2, not propagate and disturb from the opposition side of operating surface.In addition, make grounding pattern 3 ground connection, so that can not make the detection of electrostatic capacitance unstable because of the static of human body from charged etc.Therefore, the grounding pattern 3 of present embodiment, spreads all over while overlooking and region 2B that electrode pattern 2 is overlapping and form the first grounding pattern 31 being formed by the first material 61, so that can not propagate the interference from the opposition side of operating surface.And, the second grounding pattern 32 being formed by conductance the second material 62 higher than the first material 61, under the state contacting with the first grounding pattern 31, form and surround while overlooking and the frame shape of the region 2B that electrode pattern 2 is overlapping, to reduce the stake resistance of grounding pattern 3.
And, as shown in FIG. 1 to 3, on a face of the substrate 10 of operating surface, when overlooking and the overlapping region of the second grounding pattern 32 form protection pattern 26.This protects pattern 26, is situated between and is connected and ground connection with the second grounding pattern 32 by through hole 17.By protection pattern 26, suppress the interference noise of operating surface side or by static, caused charged.
In the capacitance type input device 1 of present embodiment, the first electrode 21, the second electrode 22, the first grounding pattern 31, the second grounding pattern 32, wiring pattern 6 and filling through hole material 65,66, form by printing respectively.With reference to Fig. 4～Fig. 7, the first grounding pattern 31 and the second grounding pattern 32 in forming for printing describe.
Fig. 4 is the diagrammatic bottom view that explanation forms grounding pattern 3 substrate 10 before.Fig. 5 is the diagrammatic bottom view of explanation the first grounding pattern 31.Fig. 6 is the schematic diagram of explanation the second grounding pattern 32 and wiring pattern 6.Fig. 7 is the schematic diagram of explanation the second grounding pattern 32.
On substrate 10, as shown in Figure 4, be pre-formed through hole 15,16,17.Then, printing filling through hole material 65,66, so that this through hole 15,16 (with reference to Fig. 2 and Fig. 3) of landfill.Then, in Fig. 4, on a face of not shown substrate 10, carry out the printing of the first electrode 21.Between the printing of the first electrode 21 and the printing of the second electrode 22, form interlayer insulating film 25, as shown in Figure 2, making the intersection point insulation of the first electrode 21 and the second electrode 22 is not short circuit.Then, carry out the printing of the second electrode 22.And the first electrode 21 also can be configured to 2 layers of structure by a plurality of electrode parts in the almost diamond shape shown in Y1-Y2 side upwardly extending wiring portion and Fig. 1 (a).For example, after forming the thinner wiring portion of live width, can carry out stacked to the electrode layer of the almost diamond shape shown in Fig. 1 (a).In addition, this electrode layer also can form when the printing of the second electrode 22.In addition, the second electrode 22 is also made as 2 layers of structure of same wiring portion and electrode part, in the first electrode 21 and the second electrode 22, can the electrode layer of almost diamond shape be carried out stacked respectively.In Fig. 4, represent to overlook the apparent time region 2B overlapping with the electrode pattern 2 that forms the first electrode 21 shown in Fig. 1 (a) and the second electrode 22.
Then, another face at substrate 10, carries out the printing of the first grounding pattern 31.By this printing, form as shown in Figure 5 the first grounding pattern 31 being formed by the first material 61.Now, in the first grounding pattern 31, form accordingly peristome 31a with the position of the through hole 15,16,17 of substrate 10.
Then, as shown in Figure 6, in order to carry out the insulation with wiring pattern 6, the region 2B that insulation course 4 forms while overlooking and electrode pattern 2 is overlapping.And, at insulation course 4, also with the position of the through hole 15,16 of substrate 10 to forming accordingly peristome 4a.Then, the second grounding pattern 32 is unified to form by printing with wiring pattern 6.By this printing, form the second grounding pattern 32 and the wiring pattern 6 that by the second material 62, are formed.
Now, the second grounding pattern 32, as shown in Figure 6, prints for surrounding the frame shape of insulation course 4.Thus, the second grounding pattern 32 becomes the state contacting with the first grounding pattern 31 shown in Fig. 5, and, as shown in Figure 7, form and surround while overlooking and the frame shape of the region 2B that electrode pattern 2 is overlapping.On the other hand, the wiring pattern 6 shown in Fig. 6, across insulation course 4, does not contact with ground grounding pattern 31.Wiring pattern 6, is laid on the opposite side of insulation course 4, and, in the position of peristome 4a and peristome 31a, join with substrate 10 and filling through hole material 65,66, thereby be electrically connected to electrode pattern 2.And the second grounding pattern 32 has the ground connection wiring 32a being connected with circuit part 7.In addition,, in the second grounding pattern 32, be formed with the welding disk 32b (Fig. 7) that can be connected with the ground terminal etc. that has carried the electronic equipment of capacitance type input device 1.Jie keeps idiostatic (earthing potential) by welding disk 32b with the ground terminal of electronic equipment and grounding pattern 3, can suppress reliably interference noise or by static, caused charged.And, in the present embodiment, although the second grounding pattern 32 forms with continual continuous frame shape, also can a part be interrupted.
Then,, along wiring pattern 6, except the installation welding disk (not shown) of connecting circuit portion 7, also form the protective seam 8 of drape line pattern 6.This installs welding disk, carried the circuit substrate 71 that IC encapsulation 72 and connector 73 are installed, and the connecting portion set with circuit substrate 71 is connected.
Interlayer insulating film 25, insulation course 4 and protective seam 8, preferably used the resistance material of adhesion and insulativity excellence.They can use same resistance material.In addition, also the resistance material of the resistance material of adhesion excellence and insulativity excellence can be carried out stackedly, be configured to respectively more than 2 layers.The thickness of 1 layer is respectively several μ m～several 10 μ m left and right, for example, as interlayer insulating film 25,3 layers of resistance material can be carried out stackedly, and is made as the thickness of 50 μ m left and right.
The thickness of the first electrode 21, the second electrode 22, the first grounding pattern 31, the second grounding pattern 32, wiring pattern 6 for example, is several μ m～several 10 μ m left and right.The live width of wiring pattern 6 for example, is 0.1mm left and right.
In the present embodiment, the first grounding pattern 31 being formed by the first material 61, by printing and form carbon paste as electrically conductive ink material.Carbon paste is comparatively cheap conductive material, the situation that applicable large area applies.In addition, it is less deteriorated, and long-term reliability is excellent.Carbon paste is in dissolving the adhesive resin of state, to sneak into the small carbon filling materials such as carbon black, carbon fiber, carbon nano-tube.Carbon paste, can be according to the needs of electric conductivity, printing etc., separately or two or more mix, and by the different carbon paste of particle diameter.As electrically conductive ink material, according to the shape of electrode, carbon paste is carried out to serigraphy, and make its dry sclerosis or heat hardening.
The first grounding pattern 31 consisting of the first material 61, is that printing conductive inks material and the formation of hardening are compared with methods such as evaporations, and cost is low.In addition, compare with methods such as evaporations, easy to manufacture.When the thickness of the first material 61 is 10 μ m left and right, can obtain the resistance value of 1k Ω left and right.
In the present embodiment, the first electrode 21, the second electrode 22, the second grounding pattern 32 and wiring pattern 6, formed by the second material 62 of argentiferous.The second material 62, as electrically conductive ink material, is used in the adhesive resin of the state that dissolves the silver paste containing the silver-colored fiber of powdery, forms the pattern of electrode layer, and make its dry sclerosis or heat hardening by serigraphy.Although silver paste is more expensive conductive material, its conductance is high, and long-term reliability is excellent.When the thickness of the second material 62 is 10 μ m left and right, can obtain the resistance value of 0.1 Ω left and right.In addition, filling through hole material 65,66 is also used same conductive material.
The second grounding pattern 32 consisting of the second material 62, owing to electrically conductive ink material being printed and its sclerosis being formed, therefore, compares with using the pattern formation method of the film forming such as evaporation or photoetching, easy to manufacture.In addition, compare with methods such as evaporations, owing to can improving the service efficiency of material, therefore, further cost degradation.
The first electrode 21 and the second electrode 22, can make live width compared with thin low-resistance wiring material and the stacking material combination forming with regulation area and form.For example, in the thinner low-resistance wiring material of live width, can use the silver paste identical with wiring pattern 6 as electrically conductive ink material.In the formed stacking material of area with regulation, can use the carbon paste identical with the first grounding pattern 31 as electrically conductive ink material.
Below, for the effect based on as present embodiment, describe.
In the capacitance type input device 1 of present embodiment, the grounding pattern 3 of laying on another face of substrate, spread all over while overlooking and a face of substrate on the overlapping region 2B of the electrode pattern 2 laid form the first grounding pattern 31, and to surround while overlooking and the frame shape of the region 2B that electrode pattern 2 is overlapping forms the second grounding pattern 32.And, because the second grounding pattern 32 contacts with the first grounding pattern 31, therefore, can pass through the second grounding pattern 32, reduce the resistance value of grounding pattern 3.So, in the first material 61, can use the material that conductance is low.Therefore, even use the material that conductance is low in the first material 61, also can reduce the resistance value of grounding pattern 3, therefore, can suppress the deviation of sensitivity.And even if high the second material 62 of conductance is for more expensive, also few owing to being used to form the use amount of the second grounding pattern 32 of frame shape, the cost of grounding pattern 3 integral body can step-down.
In the capacitance type input device 1 of present embodiment, the wiring pattern being formed 6 and the second grounding pattern 32 can be made as to same operation by the second material.So, compare with the situation of the second grounding pattern 32 with forming respectively wiring pattern 6, can reduce operation.
In the capacitance type input device 1 of present embodiment, because the first material 61 is conductive materials of carbon containing, therefore, cost is low.Thereby large even if the area of the first grounding pattern 31 becomes, the cost of grounding pattern 3 is step-down also.
In the capacitance type input device 1 of present embodiment, because the second material 62 is conductive materials of argentiferous, therefore, conductance is high.Thus, even if form the second grounding pattern 32 of thin frame shape, also can reduce the resistance value of grounding pattern 3.For example, if the second grounding pattern 32 is made as to the conductance high material identical with wiring pattern 6, can make the live width of the second grounding pattern 32 attenuate, and, can unify to form wiring pattern 6 and the second grounding pattern 32.
In the capacitance type input device 1 of present embodiment, the first grounding pattern 31 consisting of the first material 61, owing to electrically conductive ink material being printed and its sclerosis being formed, therefore, compares with methods such as evaporations, and cost is low.In addition, compare with the method for evaporation etc., easy to manufacture.
In the capacitance type input device 1 of present embodiment, the second grounding pattern 32 consisting of the second material 62, prints electrically conductive ink material and makes its sclerosis and form, therefore, compare with the method for using the film forming of evaporation etc. or the pattern of photoetching to form, easily manufacture.In addition, compare with the method for evaporation etc., owing to can improving the service efficiency of material, therefore, further cost degradation.
As mentioned above, although specifically understand the capacitance type input device 1 of embodiments of the present invention, the present invention is not limited to above-mentioned embodiment, within not departing from the scope of aim, can carry out various changes and implement.For example, can be out of shape like that as follows to implement, these embodiments also belong to the scope of technology of the present invention.
(1) in the present embodiment, although the first grounding pattern 31 is formed at whole of another face of substrate 10, also can from the overlapping position of the second grounding pattern 32 further expansion laterally.The second grounding pattern 32 so long as when overlooking and the overlapping region 2B of electrode pattern 2 more by outer circumferential side, can be also the position separating.And, in order to reduce the use amount of the second material 62 as far as possible, be preferably and approach while overlooking and the position of the region 2B that electrode pattern 2 is overlapping.
(2) in the present embodiment, forming the second material 62 of the second grounding pattern 32, can be also the low material of conductive material conductance higher than the first material 61 conductances and that ratio is used in wiring pattern 6.Although can not form with wiring pattern 6 is unified, so long as the conductance of the needs of grounding pattern 3, than the conductance of the conductive material using in wiring pattern 6 is low, be also fine.
(3) in the present embodiment,, although operating surface is illustrated as plane, the operating surface with curved surface is also fine.
Claims (6)
1. a capacitance type input device, has:
Substrate;
Electrode pattern, it is layed in a face of described substrate; With
Grounding pattern, it is layed in another face of described substrate,
Described grounding pattern has: the first grounding pattern being formed by the first material and the second grounding pattern being formed by conductance the second material higher than described the first material,
The region that described the first grounding pattern spreads all over while overlooking and described electrode pattern is overlapping and forming, and
Described the second grounding pattern, under the state contacting with described the first grounding pattern, forms and surrounds while overlooking and region that described electrode pattern is overlapping.
2. capacitance type input device according to claim 1, is characterized in that,
On another face of described substrate, have at the stacked insulation course of at least a portion of described the first grounding pattern and the wiring pattern that is electrically connected to the described electrode pattern of laying at the opposite side of described insulation course,
Described wiring pattern is by unified formation of described the second material that is used to form described the second grounding pattern.
3. capacitance type input device according to claim 1, is characterized in that,
Described the first material is the conductive material of carbon containing.
4. capacitance type input device according to claim 1, is characterized in that,
Described the second material is the conductive material of argentiferous.
5. capacitance type input device according to claim 1, is characterized in that,
Described the first grounding pattern forms by printing.
6. capacitance type input device according to claim 1, is characterized in that,
Described the second grounding pattern forms by printing.
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| JP2013-029916 | 2013-02-19 | ||
| JP2013029916A JP6161189B2 (en) | 2013-02-19 | 2013-02-19 | Capacitive input device |
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| CN103995629A true CN103995629A (en) | 2014-08-20 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000181612A (en) * | 1998-12-16 | 2000-06-30 | Fujitsu Takamisawa Component Ltd | Coordinate input device |
| CN1445645A (en) * | 2002-03-18 | 2003-10-01 | 阿尔卑斯电气株式会社 | Coordinate input device and luqid crystal display device using the device |
| JP2005018138A (en) * | 2003-06-23 | 2005-01-20 | Alps Electric Co Ltd | Input device |
| CN1576799A (en) * | 2003-07-11 | 2005-02-09 | 阿尔卑斯电气株式会社 | Capacitive sensor |
| JP2009086184A (en) * | 2007-09-28 | 2009-04-23 | Casio Comput Co Ltd | Liquid crystal display device with touch panel |
| CN101950223A (en) * | 2009-07-09 | 2011-01-19 | 阿尔卑斯电气株式会社 | Input media |
| CN102236195A (en) * | 2010-04-21 | 2011-11-09 | 三星电机株式会社 | Display device having capacitive touch screen |
| CN102262488A (en) * | 2010-05-24 | 2011-11-30 | 欧姆龙株式会社 | Static Capacity Type Input Device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5856822A (en) * | 1995-10-27 | 1999-01-05 | 02 Micro, Inc. | Touch-pad digital computer pointing-device |
| JP4054102B2 (en) * | 1997-03-27 | 2008-02-27 | 東芝電子エンジニアリング株式会社 | Liquid crystal display device and manufacturing method thereof |
| JP5281551B2 (en) * | 2009-02-20 | 2013-09-04 | アルプス電気株式会社 | Capacitive input device |
| JP5532636B2 (en) * | 2009-03-11 | 2014-06-25 | 三菱電機株式会社 | Semiconductor device |
| JP2010219425A (en) * | 2009-03-18 | 2010-09-30 | Toshiba Corp | Semiconductor device |
| KR101073333B1 (en) * | 2009-08-27 | 2011-10-12 | 삼성모바일디스플레이주식회사 | Touch Screen Panel and fabrication method thereof |
| KR101093351B1 (en) * | 2010-04-12 | 2011-12-14 | 삼성모바일디스플레이주식회사 | Touch Screen Panel |
| JP2011232641A (en) * | 2010-04-28 | 2011-11-17 | Toshiba Mobile Display Co Ltd | Liquid crystal display device |
| US8923014B2 (en) * | 2010-08-19 | 2014-12-30 | Lg Display Co., Ltd. | Display device having touch panel |
| US20120326992A1 (en) * | 2011-06-27 | 2012-12-27 | Silicon Integrated Systems Corp. | Touch Panel for Providing a Shield Against Noise |
-
2013
- 2013-02-19 JP JP2013029916A patent/JP6161189B2/en active Active
-
2014
- 2014-01-14 CN CN201410016199.7A patent/CN103995629A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000181612A (en) * | 1998-12-16 | 2000-06-30 | Fujitsu Takamisawa Component Ltd | Coordinate input device |
| CN1445645A (en) * | 2002-03-18 | 2003-10-01 | 阿尔卑斯电气株式会社 | Coordinate input device and luqid crystal display device using the device |
| JP2005018138A (en) * | 2003-06-23 | 2005-01-20 | Alps Electric Co Ltd | Input device |
| CN1573667A (en) * | 2003-06-23 | 2005-02-02 | 阿尔卑斯电气株式会社 | Electrostatic capacitive touch pad |
| CN1576799A (en) * | 2003-07-11 | 2005-02-09 | 阿尔卑斯电气株式会社 | Capacitive sensor |
| JP2009086184A (en) * | 2007-09-28 | 2009-04-23 | Casio Comput Co Ltd | Liquid crystal display device with touch panel |
| CN101950223A (en) * | 2009-07-09 | 2011-01-19 | 阿尔卑斯电气株式会社 | Input media |
| CN102236195A (en) * | 2010-04-21 | 2011-11-09 | 三星电机株式会社 | Display device having capacitive touch screen |
| CN102262488A (en) * | 2010-05-24 | 2011-11-30 | 欧姆龙株式会社 | Static Capacity Type Input Device |
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| Publication number | Publication date |
|---|---|
| JP6161189B2 (en) | 2017-07-12 |
| JP2014160316A (en) | 2014-09-04 |
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