CN103978321A - Phosphorous-containing novel cadmium-free silver solder - Google Patents
Phosphorous-containing novel cadmium-free silver solder Download PDFInfo
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- CN103978321A CN103978321A CN201410196256.4A CN201410196256A CN103978321A CN 103978321 A CN103978321 A CN 103978321A CN 201410196256 A CN201410196256 A CN 201410196256A CN 103978321 A CN103978321 A CN 103978321A
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- Prior art keywords
- solder
- phosphorous
- free silver
- cadmium
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a phosphorous-containing novel cadmium-free silver solder. The phosphorous-containing novel cadmium-free silver solder comprises the following components in percentage by mass: 24.0 to 26.0 percent of Ag, 34.0 to 36.0 percent of Zn, 0.1 to 0.32 percent of P, and the balance of Cu. The phosphorous-containing novel cadmium-free silver solder is low in silver content, few in added alloy elements, wide in raw material source, low in cost and easy to process, popularize and use.
Description
Technical field
The invention belongs to soldering tech field, relate to a kind of solder, especially a kind of phosphorous novel cadmium-free silver brazing alloy, can be used for the materials such as soldering silver and silver alloy, copper and copper alloy, steel.
Background technology
In silver-base solder, with the best performance of silver-bearing copper zinc cadmium solder, this is that to have fusion temperature low due to this solder, the advantage such as wetability and spreadability are good, and mechanical property is good, and the price of solder is lower.But cadmium is harmful element, at high temperature, cadmium vapor is very big to harm, and non-degradable.Therefore, forbid one after another both at home and abroad containing the use of cadmium solder in household appliances, and make great efforts research and development cadmium-free silver brazing alloy.
The research of cadmium-free silver brazing alloy is mainly concentrated on to 2 directions: taking Ag-Cu-Zn as matrix, one is to add a kind of alloying element, and a kind of is the alloying element that adds two or more.In silver solder, addible alloying element mainly contains four kinds, is respectively general alloying element, rare earth element, surface active element and harmful alloying element.Silver solder use amount is large at present, and silver-colored price is higher, causes silver solder cost high.
Summary of the invention
The object of the invention is to overcome the shortcoming of above-mentioned prior art, a kind of phosphorous novel cadmium-free silver brazing alloy is provided, it adds appropriate surface active element in solder, can improve the performance of solder, is conducive to reduce the cost of solder.
The object of the invention is to be achieved through the following technical solutions:
This phosphorous novel cadmium-free silver brazing alloy, by percentage to the quality, comprising: Ag is that 24.0%～26.0%, Cu is that 39.0%～41.0%, Zn is that 34.0%～36.0%, P is 0.1%～0.32%.
Further, by percentage to the quality, described Ag is 24.97% to above phosphorous novel cadmium-free silver brazing alloy, Zn is 33.40%, P is 0.133%, surplus is Cu.
Further, by percentage to the quality, described Ag is 25.34% to above phosphorous novel cadmium-free silver brazing alloy, Zn is 34.84%, P is 0.32%, surplus is Cu.
Compared with prior art, the present invention has following beneficial effect:
1) silver content of the present invention reduces by 5%, effectively reduces cost;
2) 729 DEG C～740 DEG C of solidus of the present invention, have raise approximately 30 DEG C; 771 DEG C～778 DEG C of liquidus curves, have reduced approximately 10 DEG C, and solid-liquid phase line interval reduces approximately 40 DEG C;
3) the wetting ratio of the present invention in red copper increased 0.48;
4) microhardness of the present invention has reduced 61Hv, and processing characteristics increases;
5) the present invention makes the shearing strength of red copper-red copper brazed seam improve 48MPa.
In sum, silver content of the present invention is lower, and the alloying element kind of interpolation is few, easily process, and raw material sources is wide at solder, and cost is lower, is easy to promote the use of.
Brief description of the drawings
Fig. 1 is the microstructure figure of solder of the present invention;
Fig. 2 is the X-ray diffraction analysis collection of illustrative plates of solder of the present invention.
Detailed description of the invention
The present invention proposes a kind of phosphorous novel cadmium-free silver brazing alloy, by percentage to the quality, comprising: Ag is that 24.0%～26.0%, Cu is that 39.0%～41.0%, Zn is that 34.0%～36.0%, P is 0.1%～0.32%.
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail:
Embodiment 1
In the present embodiment, the composition of solder is by percentage to the quality: Ag24.97%, Zn33.40%, P0.133%, surplus are Cu.
The solder solidus temperature of the present embodiment is 729 DEG C, and liquidus temperature is 771 DEG C, and solid, liquid phase line temperature interval is 42 DEG C.Wetting in red copper than being 1.67, electrical conductivity is 11.6MS/m, and microhardness is 209Hv, and the shearing strength of red copper-red copper brazed seam of institute's soldering is 204MPa.
Embodiment 2
In the present embodiment, the composition of solder is by percentage to the quality: Ag25.34%, Zn34.84%, P0.32%, surplus are Cu.
The solder solidus temperature of the present embodiment is 740 DEG C, and liquidus temperature is 778 DEG C, and solid, liquid phase line temperature interval is 38 DEG C.Wetting in red copper than being 1.92, electrical conductivity is 12.1MS/m, and microhardness is 216Hv, and the shearing strength of red copper-red copper brazed seam of institute's soldering is 196MPa.
Its microscopic structure of the solder of above two embodiment is comparatively even, does not contain the large intermetallic compound of fragility in solder.As depicted in figs. 1 and 2:
As can be seen from Figure 1, the fine microstructures of solder is even, without continuous thick fragility tissue.As can be seen from Figure 2, solder is mainly used (Ag)+(Cu)+CuZn.Known in conjunction with Fig. 1, the matrix of solder is (Cu)+CuZn, and white needle shape tissue is mainly (Ag).In this solder system, the main solid solution of P is in Cu.
Embodiment 3
In the present embodiment, the composition of solder is by percentage to the quality: Ag24%, Zn35%, P0.32%, surplus are Cu.
Embodiment 4
In the present embodiment, the composition of solder is by percentage to the quality: Ag26%, Zn36%, P0.1%, surplus are Cu.
Embodiment 5
In the present embodiment, the composition of solder is by percentage to the quality: Ag25%, Zn34%, P0.2%, surplus are Cu.
Phosphorous novel cadmium-free silver brazing alloy of the present invention is compared with now widely used BAg30CuZn, and its silver content reduces by 5%, cost; 729 DEG C～740 DEG C of solidus, have raise approximately 30 DEG C; 771 DEG C～778 DEG C of liquidus curves, have reduced approximately 10 DEG C, and solid-liquid phase line interval reduces approximately 40 DEG C; And its wetting ratio in red copper has increased 0.48; This solder microhardness has reduced 61Hv, and processing characteristics increases; It makes the shearing strength of red copper-red copper brazed seam improve 48MPa.
Claims (3)
1. a phosphorous novel cadmium-free silver brazing alloy, is characterized in that, by percentage to the quality, comprising: Ag is that 24.0%～26.0%, Zn is that 34.0%～36.0%, P is 0.1%～0.32%, and surplus is Cu.
2. phosphorous novel cadmium-free silver brazing alloy according to claim 1, is characterized in that, by percentage to the quality, described Ag is 24.97%, Zn is 33.40%, P is 0.133%, surplus is Cu.
3. phosphorous novel cadmium-free silver brazing alloy according to claim 1, is characterized in that, by percentage to the quality, described Ag is 25.34%, Zn is 34.84%, P is 0.32%, surplus is Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196256.4A CN103978321A (en) | 2014-05-09 | 2014-05-09 | Phosphorous-containing novel cadmium-free silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196256.4A CN103978321A (en) | 2014-05-09 | 2014-05-09 | Phosphorous-containing novel cadmium-free silver solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103978321A true CN103978321A (en) | 2014-08-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410196256.4A Pending CN103978321A (en) | 2014-05-09 | 2014-05-09 | Phosphorous-containing novel cadmium-free silver solder |
Country Status (1)
| Country | Link |
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| CN (1) | CN103978321A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014259A (en) * | 2015-07-13 | 2015-11-04 | 江西金世纪特种焊接材料有限公司 | Seamless flux-cored wire and processing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049624A (en) * | 1990-06-14 | 1991-03-06 | 国家建筑材料工业局人工晶体研究所 | Solder, brazing flux and uses thereof |
| CN1616182A (en) * | 2004-12-08 | 2005-05-18 | 哈尔滨工业大学 | Medium temperature Ag base brazing filler metal and its preparing method |
| CN102009282A (en) * | 2009-09-08 | 2011-04-13 | 韩国邦迪株式会社 | Filler metal alloy compositions |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| WO2013175290A1 (en) * | 2012-05-23 | 2013-11-28 | Gmb Export Srl | Alloy for braze welding |
| US20140030139A1 (en) * | 2012-07-30 | 2014-01-30 | Alcoma Metal Co., Ltd. | Cu-P-Ag-Zn BRAZING ALLOY |
-
2014
- 2014-05-09 CN CN201410196256.4A patent/CN103978321A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049624A (en) * | 1990-06-14 | 1991-03-06 | 国家建筑材料工业局人工晶体研究所 | Solder, brazing flux and uses thereof |
| CN1616182A (en) * | 2004-12-08 | 2005-05-18 | 哈尔滨工业大学 | Medium temperature Ag base brazing filler metal and its preparing method |
| CN102009282A (en) * | 2009-09-08 | 2011-04-13 | 韩国邦迪株式会社 | Filler metal alloy compositions |
| WO2013175290A1 (en) * | 2012-05-23 | 2013-11-28 | Gmb Export Srl | Alloy for braze welding |
| US20140030139A1 (en) * | 2012-07-30 | 2014-01-30 | Alcoma Metal Co., Ltd. | Cu-P-Ag-Zn BRAZING ALLOY |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
Non-Patent Citations (1)
| Title |
|---|
| 王星平等: "合金元素对Ag-Cu-Zn系钎料影响的研究现状及发展趋势", 《电焊机》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014259A (en) * | 2015-07-13 | 2015-11-04 | 江西金世纪特种焊接材料有限公司 | Seamless flux-cored wire and processing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140813 |
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| RJ01 | Rejection of invention patent application after publication |