CN103974608A - Substrate conveying apparatus and substrate conveying method - Google Patents
Substrate conveying apparatus and substrate conveying method Download PDFInfo
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- CN103974608A CN103974608A CN201410045181.XA CN201410045181A CN103974608A CN 103974608 A CN103974608 A CN 103974608A CN 201410045181 A CN201410045181 A CN 201410045181A CN 103974608 A CN103974608 A CN 103974608A
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Abstract
The invention provides a substrate conveying apparatus and a substrate conveying method which realize compactness of the apparatus without increasing number of components or cost. The substrate conveying apparatus (14) conveys a substrate (W) to a central area (A) carrying an electronic component; and the substrate is kept at a specified height at the central area. The substrate conveying apparatus is provided with a plurality of conveying portions (41,46) dividing the central area into a plurality of segmenting areas (A1,A2) in a conveying direction, wherein the plurality of conveying portions (41,46) and the plurality of segmenting areas (A1,A2) are arranged correspondingly; a lifting mechanism (61) which is provided with a supporting workbench (62) of a plurality of side beams (63,66) corresponding to the plurality of conveying portions and can realize lifting of the plurality of conveying portions by supporting the plurality of conveying portions with the a plurality of side beams. The lifting mechanism enables partial of the side beams to move from a supporting position for supporting the plurality of conveying portions, thereby selectively lifting the plurality of conveying portions to a specified height.
Description
Technical field
The present invention relates to a kind of in the erecting device of mounting electronic parts on substrate, towards carrying the base board delivery device of region conveying substrate and the carrying method of substrate.
Background technology
Current, in erecting device, as the base board delivery device to carrying region conveying substrate, known following structure, that is, be configured to multiple conveyer belts one row and form transport path (for example,, with reference to patent documentation 1).On transport path, be set with towards downstream from upstream: as the standby region of follow-up substrate move into buffering area, as the central area in the lift-launch region of substrate, as the buffering area of taking out of in the standby region of the substrate boarded parts.Moving into buffering area, central area, take out of on buffering area and configure accordingly respectively conveyer belt, carry out the conveying of substrate by the transmission of the substrate between conveyer belt.
Below the conveyer belt of central area, be provided with the support table for jack-up conveyer belt.Above the conveyer belt of central area, be provided with along the holding plate of the both sides of upper surface of base plate.If move into substrate from moving into buffering area to central area, utilize support table jack-up conveyer belt, by substrate by being pressed on holding plate.Then, between conveyer belt and holding plate, grip substrate with the height specifying, under this state, make mounting head move above substrate, implement the installation of electronic unit.
Patent documentation 1: TOHKEMY 2010-219142 communique
In the base board delivery device of recording at patent documentation 1, must on transport path, arrange and move into buffering area, take out of buffering area, these 3 regions, central area, the problem that exists device to maximize.Therefore, proposed a kind of base board delivery device, it replaces buffering area, central area is divided on throughput direction to multiple cut zone, and the cut zone of not carrying is used as buffering area.But, in this base board delivery device, must support table and drive source be set for each cut zone of central area, the problem that exists components number to increase and cost is increased.
Summary of the invention
The present invention proposes in view of above-mentioned actual conditions, and its object is, the carrying method of a kind of base board delivery device and substrate is provided, and it can not make components number and cost increase, densification that can implement device.
Base board delivery device of the present invention is to the lift-launch region conveying substrate that carries electronic unit, in described lift-launch region, described substrate is remained on to the height of regulation, it is characterized in that, have: multiple delivery section, described lift-launch region is divided into multiple cut zone on throughput direction, and the plurality of delivery section and described multiple cut zone arrange respectively accordingly; And elevating mechanism, it is by making to have the support table of the multiple support portions corresponding with described multiple delivery section, support described multiple delivery section via described multiple support portions, thereby can carry out the lifting of described multiple delivery section, described elevating mechanism, by from the Support Position of supporting delivery section, a part for described multiple support portions being moved, thereby optionally make described multiple delivery section rise to the height of described regulation.
The carrying method of substrate of the present invention is to the lift-launch region conveying substrate that carries electronic unit, in described lift-launch region, described substrate is remained on to the height of regulation, it is characterized in that, there is following step: described lift-launch region is divided into multiple cut zone on throughput direction, utilize the multiple delivery section that arrange accordingly respectively with described multiple cut zone, the step of carrying described substrate; And by making to have the support table of the multiple support portions corresponding with described multiple delivery section, support described multiple delivery section via described multiple support portions, thereby utilize the elevating mechanism of the lifting that can realize described multiple delivery section, from the Support Position of supporting delivery section, a part for described multiple support portions is moved, optionally make thus described multiple delivery section rise to the step of the height of described regulation.
According to said structure, by the cut zone of not carrying in multiple cut zone is used as buffering area, thereby the space that buffering area is used need to be set on transport path in addition.In addition, can, for cutting apart multiple cut zone of carrying behind region, use shared support table and drive source, optionally make multiple delivery section rise to the height of regulation.Therefore, can not make components number and cost increase, densification that can implement device.In addition, by a part of cut zone is used as buffering area, thereby can improve conveying beat.
In addition, in aforesaid substrate conveying device of the present invention, described elevating mechanism is corresponding with the length of the described substrate on throughput direction, optionally makes described multiple delivery section increase.According to this structure, can, in the situation that substrate is grown, make multiple delivery section increase simultaneously, in the situation that substrate is shorter, only make a part of delivery section increase.Therefore, can be corresponding with the length of substrate and suitably make delivery section increase, the province that can realize elevating mechanism can quantize.
In addition, in aforesaid substrate conveying device of the present invention, described elevating mechanism only makes the described support portion in described support table move.According to this structure, can utilize simple structure selectivity and make multiple delivery section rise to the height of regulation.
In addition, in aforesaid substrate conveying device of the present invention, described multiple support portions are configured in described support table slidably.According to this structure, can utilize simple structure selectivity and make multiple delivery section rise to the height of regulation.
In addition, in aforesaid substrate conveying device of the present invention, described support table is split into multiple workbench of cutting apart on throughput direction, and described elevating mechanism makes described support portion move with divided cutting apart together with workbench on throughput direction.According to this structure, can utilize simple structure selectivity and make multiple delivery section rise to the height of regulation.
In addition, in aforesaid substrate conveying device of the present invention, described multiple delivery section can be corresponding with the width of described substrate and adjust and carry width, described support table is split into multiple workbench of cutting apart on conveying Width, described elevating mechanism has and is carrying the independently drive source that workbench is corresponding of cutting apart of cutting apart on Width, corresponding with the width of described substrate and adjust the driving quantity of drive source.According to this structure, can use small-sized drive source, make support table lifting.In addition, by with the corresponding driving quantity that suitably controls drive source of width of substrate, thereby the province that can realize elevating mechanism can quantize.
The effect of invention
According to the present invention, lift-launch region is divided into multiple cut zone, by optionally making the delivery section corresponding with each cut zone rise to the height of regulation, thereby can not make components number and cost increase, densification that can implement device.
Brief description of the drawings
Fig. 1 is the oblique view of the related erecting device of present embodiment.
Fig. 2 is the schematic diagram of the related base board delivery device of present embodiment.
Fig. 3 is using central area first half related present embodiment as the key diagram of taking out of action of moving into that carries region.
Fig. 4 is using central area latter half related present embodiment as the key diagram of taking out of action of moving into that carries region.
Fig. 5 is using central area entirety related present embodiment as the key diagram of taking out of action of moving into that carries region.
Fig. 6 is the schematic diagram of the related base board delivery device of variation.
Fig. 7 is the schematic diagram of the related base board delivery device of other variation.
The explanation of symbol
1 erecting device
13 mounting heads
14 base board delivery devices
41 the 1st delivery section (delivery section)
46 the 2nd delivery section (delivery section)
61 elevating mechanisms
62 support table
63,66 curb girder portions (support portion)
64,67 cylinders
65 elevating motors (drive source)
71,72 holding plates
81,82 cut apart workbench
A central area (lift-launch region)
A1, A2 cut zone
W substrate
Embodiment
With reference to accompanying drawing, describe embodiments of the present invention in detail below.Fig. 1 is the oblique view of the related erecting device of present embodiment.In addition, below, the situation that base board delivery device of the present invention is applied to electronic component mounting apparatus is illustrated, but is not limited to this structure.Also base board delivery device of the present invention can be applied to other processing unit (plant)s.
As shown in Figure 1, erecting device 1 is configured to, and utilizes mounting head 13 to carry to substrate W from the electronic unit (not shown) of supplying with as the part feeder 12 of assembly supply device.In the central authorities of the pedestal 11 of erecting device 1, along X-direction placement substrate conveying device 14.Base board delivery device 14 is one distolateral from X-direction, and the substrate W before parts are installed moves into the below of mounting head 13, and by the substrate W after component mounting another distolateral the taking out of from X-direction.In addition, on pedestal 11, in the both sides across base board delivery device 14, configure multiple part feeders 12 in transversely arranged mode.
On each part feeder 12, can freely load and unload tep reel 21 is installed, on tep reel 21, be wound with the material containing band that has encapsulated multiple electronic units.Each part feeder 12, by the rotation of tep reel 21, is extracted electronic unit out successively towards the transmission position of being picked up by mounting head 13.In the transmission position of mounting head 13, from material containing band, surperficial covering band is peeled off, make material containing band bag in electronic unit expose to outside.
On pedestal 11, be provided with mounting head travel mechanism 15, this mounting head travel mechanism 15 makes mounting head 13 move along X-direction and Y direction.Mounting head travel mechanism 15 is supported by the column sections 16 being uprightly arranged on four jiaos of pedestal 11, with the height of regulation, mounting head 13 is moved from pedestal 11 upper surfaces along X-direction and Y direction.Mounting head travel mechanism 15 has: the Y-axis workbench 23 parallel with Y direction and sliding guidance portion 24, and it is supported in column sections 16; And the X-axis workbench 25 parallel with X-direction, it is supported in Y-axis workbench 23 and sliding guidance portion 24.On X-axis workbench 25, can support movably mounting head 13 along X-direction.
Mounting head travel mechanism 15 utilizes motor (not shown), along X-axis workbench 25, mounting head 13 is moved to X-direction.In addition, mounting head travel mechanism 15 utilizes motor (not shown) to make mounting head 13 together with X-axis workbench 25, moves to Y direction along Y-axis workbench 23 and sliding guidance portion 24.By this structure, mounting head 13 can move in the upper horizontal of substrate W, the electronic unit of supplying with is kept, and install on the desired locations of substrate W from part feeder 12.
Mounting head 13 has absorption suction nozzle (not shown) that can attract electrons parts.Absorption suction nozzle rotates around Z axis by not shown θ motor, moves up and down along Z-direction by Z axis motor.Mounting head 13 is configured to, and by driving respectively each absorption suction nozzle, thereby can adsorb multiple electronic units from part feeder 12.In addition, as long as the suction nozzle of mounting head 13 can take out electronic unit from part feeder 12, for example also can be by clamping suction nozzle.
In addition, in mounting head 13, be provided with shoot part 26 and height sensor (not shown) that teaching is used.Shoot part 26 is taken the electronic unit of transmission position and the mark of substrate W that are delivered to part feeder 12.Based on the photographic images of shoot part 26, the installation site of the absorption position to the electronic unit in X-direction and Y direction and substrate W is adjusted.Height sensor passes through towards electronic unit and substrate W light irradiation, and reverberation is subject to light, thereby carries out elevation measurement.According to the measurement result of height sensor, the installation site of the absorption position to the electronic unit in Z-direction and substrate W is adjusted.
On pedestal 11, from part feeder 12 towards the mobile route of the mounting head 13 of substrate W, be provided with the filming apparatus 17 that carries out high-precision component identification.Filming apparatus 17 is taken the electronic unit remaining on mounting head 13 from downside.By utilizing filming apparatus 17 to keep the state of electronic unit to take to mounting head 13, thereby the position skew of the classification to electronic unit, electronic unit etc. check.In addition, on erecting device 1, be provided with processor and the various memories etc. obtaining above-mentioned photographic images and measurement result and carry out various processing.Memory according to purposes by ROM(Read Only Memory), RAM(Random Access Memory) etc. in one or more storage medium form.
In the erecting device 1 forming like this, utilize base board delivery device 14 using the substrate W obtaining from previous operation to as carrying the central area A(in region with reference to Fig. 2) carry, at central area A, substrate W position is adjusted into the height (lift-launch altitude datum) of regulation.Then, under the state after substrate W position is adjusted, make mounting head 13 mobile to substrate top, implement the installation of electronic unit.In the case, central area A is divided into multiple cut zone A1, A2(with reference to Fig. 2), respectively the height of substrate W is carried out to position adjustment at each cut zone A1, A2.Therefore, as shown in along the shorter substrate W of throughput direction etc., only use in the situation of a part of cut zone, (temporarily keep the region of substrate) using remaining cut zone as buffering area and use.
With reference to Fig. 2, describe the related base board delivery device of present embodiment in detail below.Fig. 2 is the schematic diagram of the related base board delivery device of present embodiment.Fig. 2 A is the upper surface schematic diagram of base board delivery device, and Fig. 2 B is the side schematic view of base board delivery device.
As shown in Figure 2 A and 2 B, base board delivery device 14 by moving into portion 31, the 1st delivery section the 41, the 2nd delivery section 46, each conveyer belt 33,43,48,38 of taking out of portion 36 is configured to row, forms the transport path of substrate W.Move into the upstream side that portion 31 is positioned at transport path, be configured to, a pair of conveyer belt 33 is set on the opposite face of a pair of conveying 32.A pair of conveyer belt 33 is conveying mechanisms of conveyer belt mode of movement, is linked with and carries motor 34 on the driving pulley of conveying mechanism.On a pair of conveyer belt 33, load the two ends of the Width of substrate W, utilize conveyer belt 33 that the substrate W obtaining from previous operation is carried to the 1st delivery section 41.
1st, the 2nd delivery section 41,46 is configured to, and forms as the central area A that carries region in the central authorities of transport path, and a pair of conveyer belt 43,48 is set respectively on the opposite face of a pair of conveying 42,47.The 1st delivery section 41 forms the cut zone A1 of the first half of central area A, and the 2nd delivery section 46 forms the cut zone A2 of the latter half of central area A.A pair of conveyer belt the 43, the 48th, the conveying mechanism of conveyer belt mode of movement is linked with respectively and carries motor 44,49 on the driving pulley of conveying mechanism.If conveyer belt 43,48 receives substrate W from conveyer belt 33, at central area A, substrate W is positioned.
Take out of portion 36 and be positioned at the downstream of transport path, be configured to, a pair of conveyer belt 38 is set on the opposite face of a pair of conveying 37.A pair of conveyer belt 38 is conveying mechanisms of conveyer belt mode of movement, is linked with and carries motor 39 on the driving pulley of conveying mechanism.If conveyer belt 38 receives substrate W from conveyer belt 48, an operation is taken out of substrate W backward.In addition, a pair of conveying 32,37,42,47 makes fixed guide relative with movable guiding rail, and on movable guiding rail, link width is adjusted motor 51.Utilize width adjustment motor 51 make movable guiding rail and fixed guide away from or approach, corresponding with the width dimensions of substrate W and adjust and carry width.
On the A of central area, as multiple substrate detecting sensors, be provided with and move into transducer 53, the 1st stop sensor the 54, the 2nd stop sensor 55, take out of transducer 56.Move into transducer 53 detects moving into of substrate W in cut zone A1.The 1st stop sensor 54, in the cut zone A1 of central area A first half, detects the timing that stops of substrate W.The 2nd stop sensor 55, in the cut zone A2 of central area A latter half, detects the timing that stops of substrate W.Take out of transducer 56 in cut zone A2, taking out of of substrate W detected.In addition, for the control that uses each substrate detecting sensor, describe in the back.
Above the 1st, the 2nd delivery section 41,46, be provided with a pair of holding plate 71,72 relative with a pair of conveyer belt 43,48.Lower surface 71a, the 72a of holding plate 71,72 is corresponding with the lift-launch altitude datum of enforcement electro part carrying.Below the 1st, the 2nd delivery section 41,46, be provided with the elevating mechanism 61 that optionally makes the 1st, the 2nd delivery section 41,46 liftings.Elevating mechanism 61 rises the 1st, the 2nd delivery section 41,46, between conveyer belt 43,48 and holding plate 71,72, grips substrate W.Now, by making the upper surface Wa of substrate W and lower surface 71a, the 72a butt of holding plate 71,72, thereby substrate W is positioned to lift-launch altitude datum.
Elevating mechanism 61 has from the support table 62 of supported underneath the 1st, the 2nd delivery section 41,46.Support table 62 under initial condition from the 1st, the 2nd delivery section 41,46 downwards away from, rise by elevating motor 65, with the 1st, the 2nd delivery section 41,46 butts.In addition, in the bottom of the 1st, the 2nd delivery section 41,46, be provided with the multiple abutting parts 74,75 that protrude to support table 62 sides.Corresponding with multiple abutting parts 74,75 of the 1st, the 2nd delivery section 41,46, and in support table 62, be provided with the curb girder portion 63,66 as support portion.
By making each curb girder portion 63,66 and abutting part 74,75 butts, thereby in support table 62, support the 1st, the 2nd delivery section 41,46 via curb girder portion 63,66.1st, the 2nd delivery section 41,46 is by being supported on lifting in support table 62 via curb girder portion 63,66.In addition, each curb girder portion 63,66 and cylinder 64,67 link, and are configured in slidably in support table 62.Each curb girder portion 63,66, in support table 62, is supporting the Support Position of the 1st, the 2nd delivery section 41,46 and is departing between the non-Support Position of Support Position and move.
If make curb girder portion 63,66 move to Support Position, curb girder portion 63,66 and each abutting part 74,75 butts support the 1st, the 2nd delivery section 41,46 in support table 62.If make curb girder portion 63,66 move to non-Support Position, curb girder portion 63,66 separates from each abutting part 74,75, makes the 1st, the 2nd delivery section 41,46 away from support table 62.As noted above, by curb girder portion 63,66 is moved, remove the support of support table 62 to the 1st, the 2nd delivery section 41,46, thereby can optionally make the 1st, the 2nd delivery section 41,46 liftings.
With reference to Fig. 3 to Fig. 5, moving into of the related base board delivery device of present embodiment taken out of to action and describe.Fig. 3 is using central area first half related present embodiment as the key diagram of taking out of action of moving into that carries region.Fig. 4 is using central area latter half related present embodiment as the key diagram of taking out of action of moving into that carries region.Fig. 5 is using central area entirety related present embodiment as the key diagram of taking out of action of moving into that carries region.In addition, Fig. 3 to Fig. 5 shows an example, can suitably change.
With reference to Fig. 3, following structure is described, that is, and using the cut zone A1 of central area A first half as carrying region, to substrate W(shorter on throughput direction for example, and 50mm to 230mm) carry.In this structure, cylinder 64 is set to disconnection, curb girder portion 63 is positioned on Support Position.In addition, cylinder 67 is set to connection, curb girder portion 66 is positioned on non-Support Position.
In interval A, prepare output signal and connect, implement the action of moving into of substrate W.Connect if move into substrate W and make to move into transducer 53 from previous operation, make to carry motor 44 to drive, utilize conveyer belt 43 that substrate W is carried to the cut zone A1 of central area A first half.
If the 1st stop sensor 54 is connected by the conveying of substrate W, make to carry motor 44 to slow down, and drive elevating motor 65.Carry motor 44 that substrate W is stopped on the position of advancing about 20mm from the detection position of the 1st stop sensor 54.
As shown in Figure 3 C, if utilize elevating motor 65 to make support table 62 increase, the abutting part 74 of the 1st delivery section 41 and curb girder portion 63 butts of Support Position, the abutting part 75 of the 2nd delivery section 46 not with curb girder portion 66 butts of non-Support Position.Thus, only the 1st delivery section 41 rises with the state being supported in support table 62.Then, the upper surface Wa of the substrate W on conveyer belt 43 and holding plate 71 butts grip substrate W between conveyer belt 43 and holding plate 71.Like this, substrate W moved into cut zone A1 and be positioned at lift-launch altitude datum.In interval B, mounting head 13(is with reference to Fig. 1) move to the top of substrate W, implement the installation action of electronic unit.
In interval C, implement the action of taking out of of substrate W.If support table 62 declines, make to carry motor 44,49 to drive, again start the conveying of substrate W.If the 2nd stop sensor 55 is connected, prepare take out of signal connect, with previous substrate W take out of action concurrently, implement the action of moving into of follow-up substrate W.Then, move into follow-up substrate W from previous operation, move into transducer 53 and connect, utilize conveyer belt 43 together with previous substrate W, follow-up substrate W to be carried.Now, follow-up substrate W is delivered to the cut zone A1 of central area A first half, and previous substrate W is delivered to the cut zone A2 of central area A latter half.Then,, along with the conveying of previous substrate W, the 1st stop sensor 54 and the 2nd stop sensor 55 disconnect successively.
If the 1st stop sensor 54 is connected along with the conveying of follow-up substrate W, to carrying motor 44 to slow down, and drive elevating motor 65.Carry motor 44 that follow-up substrate W is stopped on the position of advancing about 20mm from the detection position of the 1st stop sensor 54.In addition, along with the conveying of previous substrate W, take out of transducer 56 and connect, to carrying motor 49 to slow down.Carry motor 49 that substrate W is stopped on the position of advancing about 5mm the detection position from taking out of transducer 56.If utilize elevating motor 65 to make support table 62 increase, only the 1st delivery section 41 rises with the state being supported in support table 62.
Then, the upper surface Wa of the substrate W on conveyer belt 43 and holding plate 71 butts grip substrate W between conveyer belt 43 and holding plate 71.Thus, substrate W is positioned to lift-launch altitude datum.Under this state, mounting head 13(is with reference to Fig. 1) mobile to substrate W top, the installation process of enforcement electronic unit.Now, previous substrate W is in cut zone A2 standby.
In interval D, prepare to move into signal and connect, again start the conveying of previous substrate W, the action of taking out of that operation is taken out of previous substrate W backward starts.As noted above, to take out of in action moving into shown in Fig. 3, elevating motor 65 drives as triggering taking the connection of the 1st stop sensor 54.In addition, the cut zone A2 of central area A latter half, the standby buffering area of the previous substrate W while action as moving into of follow-up substrate W is used.
With reference to Fig. 4, following structure is described, that is, and using the cut zone A2 of central area A latter half as carrying region, to substrate W(shorter on throughput direction for example, and 50mm to 230mm) carry.In this structure, cylinder 64 is set as connecting, curb girder portion 63 is positioned to non-Support Position.In addition, cylinder 67 is set as disconnecting, curb girder portion 66 is positioned to Support Position.
In interval A, prepare to take out of signal and connect, start the action of moving into of substrate W.If move into substrate W from previous operation, move into transducer 53 and connect, drive and carry motor 44, utilize conveyer belt 43 that substrate W is carried to the cut zone A1 of central area A first half.If along with the conveying of substrate W, the 1st stop sensor 54 is connected, and drives and carries motor 49, utilizes conveyer belt 48 that substrate W is carried to the cut zone A2 of central area A latter half.
Then, after the 2nd stop sensor 55 is connected, substrate W is advanced after predetermined distance, will carry motor 44,49 to slow down, and drive elevating motor 65.Carry motor 44,49 that substrate W is stopped on the position of advancing about 20mm from the detection position of the 2nd stop sensor 55.If carry motor 44 to stop, preparing to take out of signal and connect, with the installation process of previous substrate W concurrently, start the action of moving into of follow-up substrate W.
As shown in Figure 4 C, if utilize elevating motor 65 to make support table 62 increase, the abutting part 75 of the 2nd delivery section 46 and curb girder portion 66 butts of Support Position, the abutting part 74 of the 1st delivery section 41 not with curb girder portion 63 butts of non-Support Position.Thus, only make the 2nd delivery section 46 increase with the state being supported in support table 62.Then, make upper surface Wa and holding plate 72 butts of the substrate W on conveyer belt 48, between conveyer belt 48 and holding plate 72, grip substrate W.Like this, substrate W moved into cut zone A2 and be positioned at lift-launch altitude datum.
In interval B, make mounting head 13(with reference to Fig. 1) move to the top of substrate W, implement the installation action of electronic unit.During installation process, if connected because moving into of follow-up substrate W makes to move into transducer 53, drive and carry motor 44, utilize conveyer belt 43 that follow-up substrate W is carried to the cut zone A1 of central area A first half.
In interval C, implement the action of taking out of of substrate W.If support table 62 declines, drive and carry motor 49, again start the conveying of previous substrate W.On the other hand, if connected because the conveying of follow-up substrate W makes the 1st stop sensor 54, will carry motor 44 to slow down.Then, follow-up substrate W is in cut zone A1 standby, until taking out of of previous substrate W finished dealing with.If along with the conveying of previous substrate W, the 2nd stop sensor 55 disconnects, and takes out of transducer 56 and connects, and will carry motor 49 to slow down.Carry motor 49 that substrate W is stopped on the position of advancing about 5mm the detection position from taking out of transducer 56.
In interval D, prepare to move into signal and connect, again start the conveying of previous substrate W, the action of taking out of that operation is taken out of previous substrate W backward starts.As noted above, to take out of in action moving into shown in Fig. 4, elevating motor 65 will drive as triggering after the 2nd stop sensor 55 is connected mobile predetermined distance.In addition, the cut zone A1 of central area A first half, the standby buffering area of taking out of the subsequent substrate W while action that is used as previous substrate W is used.Therefore, in the time that taking out of of previous substrate W moved, can make follow-up substrate W approach to and carry also standby before region, thereby shorten pitch time.
With reference to Fig. 5, following structure is described, that is, and using central area A entirety as carrying region, to substrate W(longer on throughput direction for example, and 230mm to 570mm) carry.In this structure, cylinder 64,67 is set as disconnecting, curb girder portion 63,66 is positioned on Support Position.
In interval A, prepare to take out of signal and connect, start the action of moving into of substrate W.If move into substrate W from previous operation, move into transducer 53 and connect, drive and carry motor 44, utilize conveyer belt 43 that substrate W is carried to the cut zone A1 of central area A first half.If the 1st stop sensor 54 is connected along with the conveying of substrate W, drive and carry motor 49, utilize conveyer belt 48 that substrate W is carried to the cut zone A2 of central area A latter half.Then, connect metacoxal plate W at the 2nd stop sensor 55 and advance after predetermined distance, will carry motor 44,49 to slow down, and elevating motor 65 is driven.Carry motor 44,49 that substrate W is stopped on the position of advancing about 20mm from the detection position of the 2nd stop sensor 55.
As shown in Figure 5 C, if utilize elevating motor 65 to make support table 62 increase, curb girder portion 63,66 butts of the abutting part 74,75 of the 1st, the 2nd delivery section 41,46 and Support Position.Thus, the 1st, the 2nd delivery section 41,46 rises with the state being supported in support table 62.Then, make upper surface Wa and holding plate 71,72 butts of the substrate W on conveyer belt 43,48, between conveyer belt 43,48 and holding plate 71,72, grip substrate W.Like this, substrate W moved into central area A and be positioned at lift-launch altitude datum.
In interval B, make mounting head 13(with reference to Fig. 1) mobile to substrate W top, the installation action of enforcement electronic unit.In interval C, support table 62 is declined, drive and carry motor 44,49, start the action of taking out of of substrate W.As noted above, to take out of in action moving into shown in Fig. 5, elevating motor 65 will drive as triggering after the 2nd stop sensor 55 is connected mobile predetermined distance.
As noted above, the base board delivery device 14 related according to present embodiment, in the time of the conveying of the less substrate W of the length of throughput direction, some in multiple cut zone A1, A2 used as standby buffering area, therefore, the space that buffering area is used need to be set on transport path in addition.In addition, can, for cut zone A1, the A2 cutting apart central area A and obtain, use shared support table 62 and elevating motor 65, optionally make the 1st, the 2nd delivery section 41,46 liftings.Therefore, can not make components number and cost increase, densification that can implement device.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various changes and implement.In the above-described embodiment, in accompanying drawing, illustrated size and shape etc., be not limited thereto, and can in the scope of performance effect of the present invention, suitably change.In addition, only otherwise depart from the scope of the object of the invention, can suitably change and implement.
For example, be configured in the present embodiment, the curb girder portion 63,66 in support table 62 moved, but be not limited to this structure.Also can as shown in Figure 6, support table 62 be divided into multiple workbench 81 of cutting apart on throughput direction, curb girder portion 63,66 is moved together with cutting apart workbench 81.In the case, not to link cylinder in curb girder portion 63,66, but link cylinder respectively cutting apart on workbench 81.
In addition, in the present embodiment, the structure that the identical substrate W of width is carried has been described, but has been not limited to this structure.Also can be corresponding with the width dimensions of substrate W and adjust and carry width.In the case, also can as shown in Figure 7, on conveying Width, support table 62 be divided into multiple workbench 82 of cutting apart, adjust the corresponding and driven workbench 82 of cutting apart of width dimensions with substrate W.In the case, elevating mechanism 61 is with respectively to cut apart workbench 82 corresponding and have independently drive source.
As shown in Figure 7 A, in the case of the width dimensions of substrate W is less, make the conveying narrowed width between conveying 42,47, only use one to cut apart workbench 82.As shown in Figure 7 B, in the case of the width dimensions of substrate W is larger, the conveying width of 42,47 of conveyings is broadened, use 2 and cut apart workbench 82.Thus, can use small-sized drive source, make support table 62 liftings.In addition, by corresponding with the width dimensions of substrate W and suitably control the driving quantity of drive source, thereby the province that can realize elevating mechanism can quantize.
In addition, be configured in the present embodiment, central area A is divided into 2 cut zone A1, A2, but be not limited to this structure.As long as central area A is divided into multiple cut zone, for example, also can be divided into and be more than or equal to 3.
In addition, in the present embodiment, conveyer belt 43,48 is set on conveying 42,47, forms the 1st, the 2nd delivery section 41,46, but be not limited to this structure.As long as 1st, the 2nd delivery section 41,46 is configured to form transport path, and can conveying substrate W, it can be structure arbitrarily.
In addition, be configured in the present embodiment, in support table 62, be mounted slidably curb girder portion 63,66, but be not limited to this structure.Curb girder portion 63,66 also can be set in support table 62, to pass in and out.This structure can be avoided the contact between a part of delivery section and curb girder portion 63,66, and a part of delivery section is used as buffering area.
Industrial applicibility
As described above, the present invention has following effect, that is, can not make components number and cost increase, and densification that can implement device, is specially adapted to carrying the base board delivery device of region conveying substrate and the carrying method of substrate.
Claims (7)
1. a base board delivery device, it remains on described substrate in described lift-launch region the height of regulation to the lift-launch region conveying substrate that carries electronic unit,
It is characterized in that having:
Multiple delivery section are divided into multiple cut zone by described lift-launch region on throughput direction, and the plurality of delivery section and described multiple cut zone arrange respectively accordingly; And
Elevating mechanism, it supports described multiple delivery section via described multiple support portions, thereby can carry out the lifting of described multiple delivery section by making to have the support table of multiple support portions corresponding with described multiple delivery section,
Described elevating mechanism, by from the Support Position of supporting delivery section, a part for described multiple support portions being moved, thereby optionally makes described multiple delivery section rise to the height of described regulation.
2. base board delivery device according to claim 1, is characterized in that,
Described elevating mechanism, corresponding with the length of the described substrate on throughput direction, optionally make described multiple delivery section increase.
3. base board delivery device according to claim 1, is characterized in that,
Described elevating mechanism only makes the described support portion in described support table move.
4. base board delivery device according to claim 1, is characterized in that,
Described multiple support portion is configured in described support table slidably.
5. base board delivery device according to claim 1, is characterized in that,
Described support table is split into multiple workbench of cutting apart on throughput direction,
Described elevating mechanism makes described support portion move with divided cutting apart together with workbench on throughput direction.
6. base board delivery device according to claim 1, is characterized in that,
Described multiple delivery section can be corresponding with the width of described substrate and adjust and carry width,
Described support table is split into multiple workbench of cutting apart on conveying Width,
Described elevating mechanism has with carrying dividedly on Width cuts apart the independently drive source that workbench is corresponding, corresponding with the width of described substrate and adjust the driving quantity of drive source.
7. a carrying method for substrate, it remains on described substrate in described lift-launch region the height of regulation to the lift-launch region conveying substrate that carries electronic unit,
It is characterized in that thering is following step:
Described lift-launch region is divided into multiple cut zone on throughput direction, utilizes the multiple delivery section that arrange accordingly respectively with described multiple cut zone, the step of carrying described substrate; And
By making to have the support table of the multiple support portions corresponding with described multiple delivery section, support described multiple delivery section via described multiple support portions, thereby utilize the elevating mechanism of the lifting that can realize described multiple delivery section, from the Support Position of supporting delivery section, a part for described multiple support portions is moved, optionally make thus described multiple delivery section rise to the step of the height of described regulation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-021190 | 2013-02-06 | ||
| JP2013021190A JP6045376B2 (en) | 2013-02-06 | 2013-02-06 | Substrate transfer device and substrate transfer method |
Publications (2)
| Publication Number | Publication Date |
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| CN103974608A true CN103974608A (en) | 2014-08-06 |
| CN103974608B CN103974608B (en) | 2018-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410045181.XA Active CN103974608B (en) | 2013-02-06 | 2014-02-07 | The carrying method of base board delivery device, substrate |
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| JP (1) | JP6045376B2 (en) |
| CN (1) | CN103974608B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2014154620A (en) | 2014-08-25 |
| CN103974608B (en) | 2018-04-20 |
| JP6045376B2 (en) | 2016-12-14 |
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