CN103972016A - Magnetron module and magnetron sputtering equipment - Google Patents
Magnetron module and magnetron sputtering equipment Download PDFInfo
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- CN103972016A CN103972016A CN201310029452.8A CN201310029452A CN103972016A CN 103972016 A CN103972016 A CN 103972016A CN 201310029452 A CN201310029452 A CN 201310029452A CN 103972016 A CN103972016 A CN 103972016A
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Abstract
The invention provides a magnetron module and magnetron sputtering equipment. The magnetron module comprises a magnet yoke backplate and magnets arranged on the magnet yoke backplate to form a magnetron of a preset shape. A plurality of backplate through holes penetrating through the thickness of the magnet yoke backplate are formed in the magnet yoke backplate. Each magnet is connected with one of the backplate through holes in a rotating mode. Rotating shafts, rotating relative to the backplate through holes, of the magnets are deviated from center shafts of the magnets and coincide with the axes of the backplate through holes. According to the magnetron module, the relative position of each magnet and the magnet yoke backplate can be adjusted independently without adopting magnet connecting parts, and therefore the adjusting process is simple, and the flexibility is good; moreover, the processing difficulty can be lowered, and the manufacturing and processing cost is reduced; in addition, as the minimum adjustment amount for adjusting the arrangement shape of the magnets is small, the accurate and smooth magnetron shape can be obtained.
Description
Technical field
The present invention relates to microelectronic processing technique field, particularly, relate to a kind of magnetron assembly and magnetron sputtering apparatus.
Background technology
Magnetron sputtering apparatus is to collide with by the deposition of material sputtering from target film forming equipment on workpiece to be machined by the particle in plasma and target.In actual applications, in order to improve the efficiency of sputter and the utilance of target, back at target is provided with magnetron, utilize magnetic field that magnetron produces to extend the movement locus of electronics, to increase the probability of electronics and process gas (as argon gas) collision, thereby improve the density of plasma, and then improve the efficiency of sputter and the utilance of target.
And, target for difformity, size, often need to adjust the parameter such as the spacing between the spacing of adjacent two magnet and the magnet of different magnetic poles in the arranging of magnet, same magnetic pole etc., so that technique reaches desirable target erosion uniformity and target utilization, this just needs a kind of magnetron assembly that can adjust easily above-mentioned parameter.
Fig. 1 a is the partial schematic diagram of existing a kind of magnetron assembly.Fig. 1 b is the vertical view of yoke backboard in Fig. 1 a.Fig. 1 c is the schematic diagram of magnet connector in Fig. 1 a.See also Fig. 1 a, Fig. 1 b and Fig. 1 c, magnetron assembly comprises a plurality of magnet 1, yoke backboard 2 and magnet connector 3.Wherein, on upper and lower two end faces of magnet 1, be respectively arranged with the first protuberance and the second protuberance (not shown); Magnet connector 3 is for a plurality of magnet 1 is serially connected, and makes the magnetic field distribution in the magnetic field that single magnet 1 produces even, and the quantity of magnet connector 3 and setting position corresponding one by one with quantity and the setting position of magnet 1; And magnet connector 3 comprises installing hole 31, screwed hole 32 and the slotted hole 33 that runs through respectively its thickness, wherein, installing hole 31 is positioned at the position near magnet connector 3 centers, and screwed hole 32 and slotted hole 33 lay respectively at the both sides of installing hole 31; On yoke backboard 2, adopt the mode of annular array to be intervally distributed with equably backboard through hole 20.
The assembling mode of above-mentioned magnetron assembly is specially: a plurality of magnet 1 is by the second protuberance being separately arranged in corresponding backboard through hole 20 and be connected rotationally with yoke backboard 2, and on yoke backboard 2, arrange the inside and outside magnetic pole that forms reservation shape, and the magnetic of the magnet 1 of arrangement formation internal magnetic pole is contrary with the magnetic of arranging the magnet 1 that forms outer magnetic pole; Each magnet 1 is by the first protuberance being arranged on it in the installing hole 31 of magnet connector 3 one to one and be connected rotationally with magnet connector 3; And, adjacent two magnet connectors 3 overlap each other, and make the position of screwed hole 32 of one of them the magnet connector 3 in adjacent two magnet connectors 3 and the position of the slotted hole 33 of another magnet connector 3 wherein corresponding, and magnet 1 axially on slotted hole 33 be positioned at screwed hole 32 above, then together with slotted hole 33 being rotatably connected to screwed hole 32 by bolt 34, and bolt 34 can move along its length in slotted hole 33.When needs redesign or adjust the shape of the inside and outside magnetic pole being formed by magnet 1, due to each magnet 1 and with it corresponding magnet connector 3 can relatively rotate, and adjacent two magnet connectors 3 can relatively rotate and move, thereby can adjust magnet 1 and be arranged in shape on yoke backboard 2 and the spacing between adjacent two magnet 1, thereby optimize the etching effect of target.
Inevitably there is in actual applications following problem in above-mentioned magnetron assembly:
One, above-mentioned magnetron assembly is to adopt chain structure magnet 1 being serially connected by magnet connector 3, thereby when adjustment magnet 1 is arranged in the shape on yoke backboard 2, must behind the position of determining magnet 1, correspondingly adjust the corresponding magnet connector 3 of this magnet 1 and be connected the position relationship between 3 with two adjacent magnet respectively, cause adjustment process loaded down with trivial details, and the flexibility of adjusting is poor.
Its two, the complex structure of magnet connector 3, thereby difficulty of processing is larger, and manufacture and processing cost higher.
They are three years old, because the minimum spacing between the installing hole 33 of adjacent two magnet connectors 3 has determined the minimum spacing between adjacent two magnet 1, and minimum spacing between the installing hole 33 of adjacent two magnet connectors 3 is relatively large because being subject to the restriction of the two syndeton, generally more than 5mm, the minimum adjustment amount that causes adjusting the shape that magnet 1 arranges is larger, thereby the shape that causes magnet 1 to be arranged on yoke backboard 2 is unsmooth, especially poorer in the flatness of the larger position of curvature, and position deviation is also larger, cause accurately arranging out the shape of desirable magnetron, and then bring harmful effect to the etching effect of target.
Summary of the invention
The present invention is intended at least solve one of technical problem existing in prior art, a kind of magnetron assembly and magnetron sputtering apparatus have been proposed, it is without adopting magnet connector just can adjust separately the relative position between each magnet and yoke backboard, thereby not only adjustment process is simple, flexibility is good, but also can reduce difficulty of processing and manufacture and processing cost; In addition, owing to adjusting, the minimum adjustment amount of shape of magnet arrangements is less, thereby can obtain comparatively accurately the shape of level and smooth magnetron again.
For realizing object of the present invention, provide a kind of magnetron assembly, comprise yoke backboard and be arranged on described yoke backboard to form the magnet of the magnetron of reservation shape, and on described yoke backboard, be provided with a plurality of backboard through holes that run through its thickness, described in each, magnet is rotatably connected with one of them in described a plurality of backboard through holes, and described magnet departs from the central shaft of described magnet with respect to the rotating shaft of described backboard through hole rotation, and with the dead in line of described backboard through hole.
Preferably, described backboard through hole adopts the mode of rectangular array spaced apart equably with respect to described yoke backboard place plane.
Preferably, the scope of the centre-to-centre spacing between adjacent two backboard through holes is at 3～5mm.
Wherein, described magnetron assembly also comprises connector and trip bolt, wherein said connector is used for described magnet to be fixedly connected with described yoke backboard, and in the surfaces opposite to each other of described connector and magnet, is provided with accordingly respectively the first location hole and the first protuberance cooperatively interacting; On the surface relative with described yoke backboard of described connector, be provided with eccentric orfice, the dead in line of the axis of described eccentric orfice and described backboard through hole; Described trip bolt passes described backboard through hole, and is threaded with described eccentric orfice.
Wherein, the surfaces opposite to each other of described magnet and described connector adopt binding agent to be bonded together.
Wherein, described connector adopts permeability magnetic material to make.
Wherein, described magnetron assembly also comprises upper cover plate, described upper cover plate is fixed on the end face of described yoke backboard of deviating from of described magnet, and the surfaces opposite to each other of described upper cover plate and described magnet are provided with respectively the second location hole and the second protuberance cooperatively interacting accordingly; And the top end face of described the second protuberance passes described the second location hole, and mutually concordant with the upper surface of described upper cover plate.
Wherein, described upper cover plate adopts permeability magnetic material to make.
Wherein, described yoke backboard adopts permeability magnetic material to make.
The present invention also provides a kind of magnetron sputtering apparatus, the magnetron assembly that comprises target and be arranged at target top, and described magnetron assembly is for scanning described target material surface, and described magnetron assembly has adopted above-mentioned magnetron assembly provided by the invention.
The present invention has following beneficial effect:
Magnetron assembly provided by the invention, because it has saved magnet connector of the prior art,, each magnet is fixed on correspondingly on backboard through hole independently, and the centre-to-centre spacing between adjacent two magnets can be passed through to select corresponding backboard through hole and free setting, and can not be subject to again the restriction of the syndeton of adjacent two magnet connectors, this not only can simplify the adjustment process of the position of magnet on yoke backboard, improve the flexibility of adjusting, but also can reduce difficulty of processing and manufacture and processing cost.In addition, because the position of each magnet arrangements on yoke backboard can also be by finely tuning relative its center line eccentric rotary of magnet, this can reduce to adjust the minimum adjustment amount of the position of magnet, thereby can improve the accuracy of adjustment, and then can obtain the comparatively accurate shape of level and smooth magnetron again, to optimize the etching effect of target.
Magnetron sputtering apparatus provided by the invention, it is by adopting magnetron assembly provided by the invention, not only can obtain the comparatively accurate shape of level and smooth magnetron again, thereby optimize the etching effect of target, but also can reduce difficulty of processing and manufacture and the processing cost of equipment.
Accompanying drawing explanation
Fig. 1 a is the partial schematic diagram of existing a kind of magnetron assembly;
Fig. 1 b is the vertical view of yoke backboard in Fig. 1 a;
Fig. 1 c is the schematic diagram of magnet connector in Fig. 1 a;
Fig. 2 is the cutaway view of magnetron assembly provided by the invention; And
Fig. 3 is the vertical view of the yoke backboard of magnetron assembly provided by the invention.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with accompanying drawing, magnetron assembly provided by the invention and magnetron sputtering apparatus are described in detail.
Fig. 2 is the cutaway view of magnetron assembly provided by the invention.Fig. 3 is the vertical view of the yoke backboard of magnetron assembly provided by the invention.See also Fig. 2 and Fig. 3, a kind of magnetron assembly provided by the invention, comprises yoke backboard 42, magnet 40, connector 41 and trip bolt 43.Wherein, yoke backboard 42 adopts permeability magnetic material to make, for example, and sus410 stainless steel, and on yoke backboard 42, be provided with a plurality of backboard through holes 421 that run through its thickness, in the present embodiment, backboard through hole 421 adopts the mode of rectangular array spaced apart equably with respect to yoke backboard 42 place planes, particularly, as shown in Figure 3, at yoke backboard 42, set up in the plane one and take the two-dimensional coordinate system that yoke backboard 42 center is initial point, wherein, X-axis is abscissa; Y-axis is ordinate, and from initial point, the edge to yoke backboard 42 adopts the mode of rectangular array spaced apart equably to backboard through hole 421, and preferably, the scope of the centre-to-centre spacing between adjacent two backboard through holes 421 is at 3～5mm.And, magnet 40 is by being connected and being fixed on yoke backboard 42 with one of them in a plurality of backboard through holes 421, thereby by a plurality of magnets 40 are arranged on yoke backboard 42, can form the inside and outside magnetic pole of reservation shape (, and arrange to form the magnetic of magnet 40 of internal magnetic pole contrary with the magnetic of magnet 40 of arranging formation outer magnetic pole the shape of magnetron).
By making backboard through hole 421 adopt the mode of rectangular array spaced apart equably with respect to yoke backboard 42 place planes, this adopts the arrangement mode of annular array to compare with prior art dorsulum through hole, a plurality of magnets 40 are being arranged on yoke backboard 42 so that it forms in the process of shape of predetermined magnetron, can more easily make spacing between the inside and outside magnetic pole of this magnetron approach equidistant, thereby can optimize the etching effect of target.Certainly, in actual applications, backboard through hole also can adopt other modes of annular array etc. to be distributed on yoke backboard, as long as can make a plurality of magnets be arranged in predetermined magnetron shape on yoke backboard, and needn't limit the distribution mode of backboard through hole on yoke backboard.
In addition, each magnet 40 is rotatably connected with corresponding backboard through hole 421, and the rotating shaft that magnet 40 rotates with respect to backboard through hole 421 departs from the central shaft 413 of magnet 40, and overlaps with the axis 431 of backboard through hole 421.Particularly, connector 41 adopts permeability magnetic material to make, for example, sus410 stainless steel, it is for being fixedly connected with magnet 40 with yoke backboard 42, and in the surfaces opposite to each other of connector 41 and magnet 40, be provided with accordingly respectively the first location hole 412 and the first protuberance 401 that cooperatively interact, by the first location hole 412 cooperatively interacting and the first protuberance 401, not only can facilitate the centering of connector 41 and magnet 40, but also can make the connection of connector 41 and magnet 40 more firm, thereby can improve the structural stability of magnetron assembly.And, on the surface relative with yoke backboard 42 of connector 41, be provided with eccentric orfice 411, the dead in line of the axis of eccentric orfice 411 and backboard through hole 421,, the axis of eccentric orfice 411 is magnet 40 with respect to the rotating shaft of backboard through hole 421 rotations, and and the central shaft 413 of magnet 40 between eccentric throw be D; Trip bolt 43 is through backboard through hole 421, and be threaded with eccentric orfice 411, easily understand, between trip bolt 43 and backboard through hole 421, be now matched in clearance, and and between eccentric orfice 411, be threaded engagement, thereby on the basis that magnet 40 is fixedly connected with yoke backboard 42, realizing the two can relatively rotate.
Preferably, loosening because the active force between magnet produces in order to prevent magnet 40 and connector 41, improve the connective stability between the two, the binding agent of the surfaces opposite to each other employing seccotine of magnet 40 and connector 41 etc. is bonded together.
The magnetron assembly providing due to the present embodiment has saved magnet connector of the prior art,, each magnet 40 is fixed on correspondingly on backboard through hole 421 independently, and the centre-to-centre spacing between adjacent two magnets 40 can be passed through to select corresponding backboard through hole 421 and free setting, and can not be subject to again the restriction of the syndeton of adjacent two magnet connectors, this not only can simplify the adjustment process of the position of magnet 40 on yoke backboard 42, improve the flexibility of adjusting, and can reduce difficulty of processing and manufacture and processing cost.In addition, the position being arranged on yoke backboard 421 due to each magnet 40 can also be by finely tuning relative its center line eccentric rotary of magnet 40, in other words, can make to a certain extent adjacent two magnets 40 close to each other or away from, thereby can be on the basis of shape of determining the magnetron that magnet 40 arrangements form, realization is finely tuned the shape of this magnetron, , can reduce to adjust the minimum adjustment amount of the position of magnet 40, thereby can improve the accuracy of adjustment, and then can obtain the comparatively accurate shape of level and smooth magnetron again, to optimize the etching effect of target.
In the present embodiment, magnetron assembly also comprises upper cover plate 44, it adopts permeability magnetic material to make, for example, sus410 stainless steel, and the end face that deviates from yoke backboard 42 that upper cover plate 44 is fixed on magnet 40 is (, the upper surface of magnet 40 in Fig. 2) upper, and the surfaces opposite to each other of upper cover plate 44 and magnet 40 are provided with respectively the second location hole and the second protuberance 402 cooperatively interacting accordingly; And the top end face of the second protuberance 402 is through this second location hole, and mutually concordant with the upper surface of upper cover plate 44, this can be avoided because the second protuberance 402 causes the magnetic field distribution in the magnetic field that magnet 40 produces inhomogeneous higher than the upper surface of magnet 40, and then can guarantee that the magnetic field distribution in the magnetic field that magnet 40 produces is even.
The present invention also provides a kind of magnetron sputtering apparatus, the magnetron assembly that comprises target and be arranged at target top, and this magnetron assembly is for target material surface is scanned, and the above-mentioned magnetron assembly that has adopted the present embodiment to provide.
The magnetron sputtering apparatus that the present embodiment provides, it is by the above-mentioned magnetron assembly that adopts the present embodiment to provide, not only can obtain the comparatively accurate shape of level and smooth magnetron again, thereby optimize the etching effect of target, but also can reduce difficulty of processing and manufacture and the processing cost of equipment.
Be understandable that, above execution mode is only used to principle of the present invention is described and the illustrative embodiments that adopts, yet the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a magnetron assembly, comprises yoke backboard and is arranged on described yoke backboard to form the magnet of the magnetron of reservation shape, and on described yoke backboard, being provided with a plurality of backboard through holes that run through its thickness, it is characterized in that,
Described in each, magnet is rotatably connected with one of them in described a plurality of backboard through holes, and described magnet departs from the central shaft of described magnet with respect to the rotating shaft of described backboard through hole rotation, and with the dead in line of described backboard through hole.
2. magnetron assembly according to claim 1, is characterized in that, described backboard through hole adopts the mode of rectangular array spaced apart equably with respect to described yoke backboard place plane.
3. magnetron assembly according to claim 2, is characterized in that, the scope of the centre-to-centre spacing between adjacent two backboard through holes is at 3～5mm.
4. magnetron assembly according to claim 1, is characterized in that, described magnetron assembly also comprises connector and trip bolt, wherein
Described connector is used for described magnet to be fixedly connected with described yoke backboard, and in the surfaces opposite to each other of described connector and magnet, is provided with accordingly respectively the first location hole and the first protuberance cooperatively interacting;
On the surface relative with described yoke backboard of described connector, be provided with eccentric orfice, the dead in line of the axis of described eccentric orfice and described backboard through hole;
Described trip bolt passes described backboard through hole, and is threaded with described eccentric orfice.
5. magnetron assembly according to claim 4, is characterized in that, the surfaces opposite to each other of described magnet and described connector adopt binding agent to be bonded together.
6. magnetron assembly according to claim 4, is characterized in that, described connector adopts permeability magnetic material to make.
7. magnetron assembly according to claim 1, it is characterized in that, described magnetron assembly also comprises upper cover plate, described upper cover plate is fixed on the end face of described yoke backboard of deviating from of described magnet, and the surfaces opposite to each other of described upper cover plate and described magnet are provided with respectively the second location hole and the second protuberance cooperatively interacting accordingly; And
The top end face of described the second protuberance passes described the second location hole, and mutually concordant with the upper surface of described upper cover plate.
8. magnetron assembly according to claim 7, is characterized in that, described upper cover plate adopts permeability magnetic material to make.
9. magnetron assembly according to claim 1, is characterized in that, described yoke backboard adopts permeability magnetic material to make.
10. a magnetron sputtering apparatus, the magnetron assembly that comprises target and be arranged at target top, described magnetron assembly, for described target material surface is scanned, is characterized in that, the magnetron assembly in described magnetron assembly employing claim 1-9 described in any one.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310029452.8A CN103972016B (en) | 2013-01-25 | 2013-01-25 | Magnetron assembly and magnetron sputtering apparatus |
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| CN201310029452.8A CN103972016B (en) | 2013-01-25 | 2013-01-25 | Magnetron assembly and magnetron sputtering apparatus |
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| CN103972016A true CN103972016A (en) | 2014-08-06 |
| CN103972016B CN103972016B (en) | 2016-08-31 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105632855A (en) * | 2014-10-28 | 2016-06-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron and magnetron sputtering equipment |
| CN105779952A (en) * | 2014-12-24 | 2016-07-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron assembly and magnetron sputtering equipment |
| CN106032569A (en) * | 2015-03-12 | 2016-10-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A magnetron assembly and a magnetron sputtering device |
| CN107435134A (en) * | 2016-05-27 | 2017-12-05 | 北京北方华创微电子装备有限公司 | Magnetron assembly and magnetron sputtering apparatus |
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| US4906347A (en) * | 1987-08-05 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Dry-etching apparatus |
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| CN102737928A (en) * | 2011-04-02 | 2012-10-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetic pole component, magnetron provided with magnetic pole component, sputtering chamber apparatus, and substrate processing device |
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| US4906347A (en) * | 1987-08-05 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Dry-etching apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105632855A (en) * | 2014-10-28 | 2016-06-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron and magnetron sputtering equipment |
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| CN105779952A (en) * | 2014-12-24 | 2016-07-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron assembly and magnetron sputtering equipment |
| CN105779952B (en) * | 2014-12-24 | 2021-06-08 | 北京北方华创微电子装备有限公司 | Magnetron assembly and magnetron sputtering equipment |
| CN106032569A (en) * | 2015-03-12 | 2016-10-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A magnetron assembly and a magnetron sputtering device |
| CN107435134A (en) * | 2016-05-27 | 2017-12-05 | 北京北方华创微电子装备有限公司 | Magnetron assembly and magnetron sputtering apparatus |
| CN107435134B (en) * | 2016-05-27 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Magnetron assembly and magnetron sputtering equipment |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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