CN103971784A - Novel organic/inorganic nano-composite electric conduction slurry and preparing method of novel organic/inorganic nano-composite electric conduction slurry - Google Patents

Novel organic/inorganic nano-composite electric conduction slurry and preparing method of novel organic/inorganic nano-composite electric conduction slurry Download PDF

Info

Publication number
CN103971784A
CN103971784A CN201310027057.6A CN201310027057A CN103971784A CN 103971784 A CN103971784 A CN 103971784A CN 201310027057 A CN201310027057 A CN 201310027057A CN 103971784 A CN103971784 A CN 103971784A
Authority
CN
China
Prior art keywords
electric conduction
slurry
conductive
organic
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310027057.6A
Other languages
Chinese (zh)
Other versions
CN103971784B (en
Inventor
邱辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiu Peng Chemical Co Ltd
Original Assignee
Shanghai Jiu Peng Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jiu Peng Chemical Co Ltd filed Critical Shanghai Jiu Peng Chemical Co Ltd
Priority to CN201310027057.6A priority Critical patent/CN103971784B/en
Publication of CN103971784A publication Critical patent/CN103971784A/en
Application granted granted Critical
Publication of CN103971784B publication Critical patent/CN103971784B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention belongs to the chemical technical field, and particularly relates to novel organic/inorganic nano-composite electric conduction slurry and a preparing method of the novel organic/inorganic nano-composite electric conduction slurry. The electric conduction slurry is composed of film forming matter, electric conduction fillers, coupling agents, auxiliaries and water; the novel electric conduction slurry prepared with the preparing method is good in electric conduction performance, small in density, high in fineness and low in cost, and has the advantages of being durable and stable in electric conduction performance, fine and smooth in electric conduction film, resistant to abrasions, resistant to impact, uvioresistant and the like. In order to well disperse the electric conduction fillers into the electric conduction slurry to form an electric conduction network, an appropriate number of electric conduction coupling agents are further added in a system. The requirement for the electric conduction performance of the electric conduction slurry can be met by adjusting the adding number of the electric conduction fillers. The electric conduction fillers used in the novel organic/inorganic nano-composite electric conduction slurry are composed of organic components and inorganic components, the organic components are polythiophene, and the inorganic components are aluminum-doped zinc oxide nanometer electric conduction materials. The uvioresistant capacity and the scratch-resistant and abrasion-resistant effects of the electric conduction film formed by the electric conduction slurry can be effectively improved through the aluminum-doped zinc oxide nanometer electric conduction materials. By means of the electric conduction slurry prepared with the preparing method, the electrical conductivity value of the electric conduction film ranges from 800 S/cm to 1200 S/cm.

Description

A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof
Technical field
The invention belongs to chemical technology field, be specifically related to a kind of novel conductive slurry and preparation method thereof.
Background technology
Electrocondution slurry refers to and is coated on non-conductive substrate, the functional slurry of a class that makes it to have conduction current and get rid of accumulate static charge ability.Electrocondution slurry has the advantages such as easy construction, equipment are simple, with low cost, applied range.Because electrocondution slurry has broad application prospects in fields such as electronics, building and space flight, therefore, become one of the study hotspot in electric conducting material field in recent years.
At present, electrocondution slurry both domestic and external is mainly addition type electrocondution slurry.At present, common electrocondution slurry is according to the difference of conductive filler, and being divided into carbon is that slurry and metal are slurry.Carbon is that the main feature of slurry is that cost of material is lower, and conductivity is better.As, Chen Zhipeng etc. are at patent " electrocondution slurry and preparation method thereof for photovoltaic cell that contains carbon black auxiliary agent " (application number: disclose a kind of photovoltaic cell that contains carbon black auxiliary agent electrocondution slurry and preparation method thereof 201110280802.9), described slurry is made up of the component of following mass percent: conductive phase 60~95%, inorganic binder 0.5~8%, organic carrier 2~40%, sintering inhibitor 0.1~10%, additive 0~10%, the mass percent sum of each component is 100%; Described sintering inhibitor is carbon black.The slurry forming based on this invention slurry has higher sintering temperature, wider sintering range and sintering time still less, has suppressed the generation of the bad phenomenon such as thermal stress, microcrack, silicon chip bending; Zhu Wanchao is at patent " a kind of environmental-friendly conductive sizing agent and preparation method thereof " (application number: 201010124887), open one is widely used in thin film switch, printing contact, radio frequency interference shielding, heating element, flexible circuit, the non-halogen environmental-friendly conductive sizing agent in the fields such as plating and multilayer circuit board and preparation method thereof, made conducting powder 15~30%, solvent 45~75% by following mass percentage content component, macromolecule resin 8~15%, additive 0.1~5%; Conducting powder is made up of the conductive carbon powder of mass percent 40~70% and 30~60% aquadag powder; Solvent is butyl cellosolve or butyl carbitol acetate; Additive comprises dispersant, defoamer, levelling agent, guarantees not produce because containing halogen any noxious substance in use procedure, meets the instructions for use that enters European Union member countries; Mr. Zhang etc. are at patent " preparation method of the screen printing water electrocondution slurry based on carbon-carbon-copper composite packing " (application number: disclose a kind of screen printing water electrocondution slurry based on carbon-carbon-copper composite packing and preparation method thereof 200910217326).Copper powder, 0~10% nanoscale acetylene black and 3~40% micron order graphite using mass fraction as 0~10% submicron order organic polymer parcel are as conductive filler, using 20~80% water-base resins (20~70% the aqueous solution) as adhesive, water is as primary solvent, a small amount of polyol ethers, as cosolvent, at room temperature obtains after sonic oscillation and strong stirring.Submicron-grade superfine copper powder add the electric conductivity that has effectively improved silk screen printing conductive film the curing temperature that has reduced electrocondution slurry.This waterborne conductive cost of sizing agent based on carbon-carbon-copper composite packing is low, preparation method is simple, free from environmental pollution, is applied to screen printing technique and can in different base, makes various conductive films on a large scale, microelectrode, the connecting line of DSSC and the wire of radio-frequency card etc.; Li Yingshuo etc. are at patent " electrocondution slurry that contains carbon nano-tube and the printed circuit board (PCB) that uses it " (application number: a kind of electrocondution slurry that comprises carbon nano-tube is provided 200910134492), when thering is excellent conductivity, can not lose the inherent characteristic of carbon nano-tube self.
Metal is that slurry general performance is comparatively stable, but cost is relatively high.As, Chu Yongguo is at patent " electrocondution slurry and preparation technology thereof for the large power thick film circuit based on stainless steel substrate " (application number: the large power thick film circuit of the invention 02139895) based on stainless steel substrate is made up of solid phase composition and organic binder bond with electrocondution slurry, the ratio (weight ratio) of solid phase composition and organic binder bond is (70~90): (30~10), and in described solid phase composition, the ratio (weight ratio) of silver-colored palladium composite powder and microcrystalline glass powder is (99.5~95): (0.5~5); In silver palladium composite powder, the particle diameter of palladium powder and silver powder is less than 2 μ m, and the ratio (weight ratio) of palladium powder and silver powder is: (1~10): (99~90).This slurry has that solderability is good, sheet resistance is low, with dielectric paste and the advantage such as resistance slurry is compatible, the dynamo-electric integrality of solder joint is good, Rong Minzhi etc. are at patent " low-content nanometer conducting silver paste and preparation method thereof " (application number: 03113552) for conductive filler content in solving common electrocondution slurry is more, colloid viscosity is higher, thereby be unsuitable for multilayer circuit board through hole connect problem, according to nano silver particles self assembly and low temperature fusion welding property, the nano-silver powder that utilizes microemulsion method to make, prepare low content nano silver particles filling epoxy resin one-component electrocondution slurry, in reaching better electric conductivity, greatly reduce colloid viscosity, thereby have broad application prospects, be applicable to electronic component to fix in the circuit board, interelectrode connection, and the through hole being particularly conducive between multilayer circuit board connects, A rice field etc. patent " for the electrocondution slurry of multilayer capacitor exit " (application number: 95119478.X) provide a kind of exit electrod composition for multi-layer capacitor, it be suitable for use as electroplate matrix, low-temperature sintering make its thermal stress resistance ability improve (high reliability).For the exit electrod composition of multi-layer capacitor with noble metal granule and weight be noble metal granule weight 0.5 to 7wt%, glass breakover point is that 400 to 500 DEG C, glass softening point are the inorganic adhesive formation of 400 to 550 DEG C; Mountain name is firm in patent " electrocondution slurry " (application number: a kind of electrocondution slurry is provided 96101415), and it prevents that copper powder from oxidation occurring and good solderability and final strength is provided effectively.It by copper powder, account for copper powder weight 2-20% glass frit, account for the organic carrier of solid constituent (copper powder and glass frit) weight 10-30% and have solution, the boron of high boiling acid ester solution, boric acid organic salt solution and thering is the solution composition in high boiling alcohol with lower boiling borate, the amount of this solution is 0.01-0.5% (in boron, based on copper powder); The modest allusion quotation of pine is at patent " copper alloy powder for electroconductive paste " (application number: a kind of copper alloy powder for electroconductive paste is provided 02824162), one or both that it is characterized in that copper alloy powder comprises the Cu of 80~99.9 quality % and 0.1~20 quality % are selected from the element of Ta and W, and have the particle mean size of 0.1~1 μ m.This copper alloy powder has the sintering initial temperature higher than copper powders, the heat resistance that high non-oxidizability is become reconciled, the sweet equality of defending discloses a kind of based semiconductor chip attach low-temperature sintering type conductive slurry and preparation technology thereof in patent " based semiconductor chip attach low-temperature sintering type conductive slurry and preparation technology thereof " (application number 200810030682), formed by solid phase composition and organic binder bond, wherein solid phase composition and organic binder bond are 70~90: 30~10 compositions by weight, solid phase composition is to be 65~90 by weight by sheet and spherical compound silver powder and glass dust: 35~10 are mixed, wherein the ratio of the weight of spherical and flake silver powder is 5~15: 95~85, the average grain diameter of compound silver powder is less than 4 μ m, glass dust is PbO-Al2O3-SiO2 glass frit, main component quality proportion is: PbO95%~60%, Al 2o 32%~30%, SiO 21%~20%, TiO 20.5%~20%, the weight ratio of each component in organic binder bond: terpinol 50~70%, tributyl citrate 35~15%, lecithin 5~1%, ethyl cellulose 8~3%, rilanit special 5~10%, dimethylbenzene 2~10%.The present invention has high thermal conductance, high conduction, low-expansion coefficient, high-cooling property; Zhang Zhigang is at patent " a kind of preparation method of photoelectric sensitivity conductive slurry " (application number: disclose a kind of preparation method of photoelectric sensitivity conductive slurry 200710307725), first Photoepolymerizationinitiater initiater, sensitizer, photonasty activated monomer, acrylic adhesives, the organic material with electro optic effect and atent solvent have been heated to 50 DEG C and are uniformly mixed and make organic solvent; Then Ag powder and glass powder with low melting point are mixed and made into inorganic powder; Finally inorganic powder and organic solvent are uniformly mixed, on three beaming roller milling trains, mix and obtain photoelectric sensitivity conductive slurry afterwards.Owing to containing one or more the organic material with electro optic effect in this slurry, drying coated good photoelectric sensitivity conductive Ag slurry under the effect of highfield, after dry, molecular polarization orientation is fixed in Ag conductive layer, this conductive layer shows optical anisotropy and has negative crystal birefringent characteristic, and optical axis and ultraviolet exposure incident light direction same vertical are in display panel; The refined grade in island, north is at patent " electrocondution slurry and manufacture method thereof " (application number: the preparation method who discloses a kind of electrocondution slurry 200710103215).Metal powder granulates is dispersed in the slurry matrix of being made up of resin material; Metal powder granulates defines and the reacted dissolving superficial layer of acid solution separately; Can there is high conductivity with the reacted metal powder granulates of acid solution; The electrocondution slurry that comprises described metal powder granulates can demonstrate sufficiently high conductivity; Therefore, described electrocondution slurry can be used in the line pattern that for example forms meticulous line pattern and be formed for high speed signal; Mountains and rivers are very great waits at patent " wiring plate of electrocondution slurry and this electrocondution slurry of use " (application number: the preparation method who discloses a kind of electrocondution slurry 200680010682).Owing to by silk screen printing etc., electrocondution slurry being deployed on plate, then dry and sintering, can form the good circuit of conductivity, so sort circuit is widely used in the assembly of electronic installation, this electrocondution slurry is by being dispersed in metal dust and frit in organic carrier and forming.The show of mulberry island is inferior in patent " electrocondution slurry " (application number: 200380109308.X), provide conducting powder can high fit rate, the reliability of conductivity or resistance to migration is superior and by reduce silver-plated amount price competitiveness also high, be suitable for forming welding electrode with and the electrocondution slurry used of electroconductive binder.This electrocondution slurry is characterised in that, it contains conducting powder and adhesive, the roughly spherical silver coating copper powder that described conducting powder contains 80~97 % by weight and the flat of 3~20 % by weight silver coating copper powder; Chen Xiaodong is at patent " a kind of silicon solar cell back face is electrocondution slurry and preparation method thereof for electrode " (application number: disclose a kind of crystal silicon solar batteries backplate electrocondution slurry and preparation method thereof 201110237357), described slurry is prepared from by conductive metal powder, metal binding agent, organic carrier, the functional additive mixed grinding of constant weight umber ratio; Tan Fubin is at patent " composition of aluminum conductive electric slurry for positive temperature coefficient heat-variable resistor and preparation method " (application number: the composition and the preparation method that relate to a kind of positive temperature coefficient thermistor aluminum electrode slurry 200610048681), the composition of this slurry comprises the aluminium powder of mass percent 45-65%, the inorganic binder of 20-35%, the organic binder bond of 15-30%.Inorganic binder is flint glass powder or lead-free glass powder; Organic binder bond is rosin ethyl cellulose organic bond.After mixing, be rolled to fineness 15-20 μ m with three-high mill, viscosity 65000-75000mPaS, obtains aluminum conductive electric slurry product.The aluminum conductive electric slurry that rolling is obtained on barium titanate doping semiconductor chip, forms aluminium paste electrode, i.e. positive temperature coefficient thermistor through silk screen printing, sintering, electrode and substrate form good ohmic contact, adhere to well, and resistance change rate is little, electrode is not oxidized, and aluminium film is without obscission; Tan Fubin etc. are at patent " synthesizing silicon solar energy cell back field aluminum electrocondution slurry " (application number: the preparation method who relates to the synthetic silicon solar cell back surface field of a kind of chemical method aluminum conductive electric slurry 200610011050), this slurry comprises the aluminium powder of mass percent 70-80%, the modification organic bond of 30-20%, the indium powder of 0.1-5.0%, the glass of 0.1-5.0%, through obtaining after preparation.Inorganic bond glass is in the time of preparation slurry, add boron powder simultaneously, dimethyl siloxane, stearate, in the simultaneous oxidation of slurry sintering film forming, decompose and obtain frit, and one-step synthesis inorganic bond glass participates in reaction, it is high that this slurry has cell photoelectric conversion efficiency, conductivity is good, to the feature of silicon substrate adhesion-tight, the monocrystalline silicon that thickness is less than the 125 × 125mm of 210 microns or 156 × 156mm is slight curving, and the polysilicon of 156 × 156mm is not bending, aluminium film surface is smooth, do not play aluminium pill, non-foaming, EVA bonding can not peeled off not peeling of ash, lead content control is between 0-500ppm, for low leaded or unleaded environment-friendly type slurry, Liu Bin etc. are at patent " electrocondution slurry, preparation method and the electrode being made by it " (application number: disclose a kind of electrocondution slurry 201110456581), comprise silver powder, inorganic binder, organic binder bond, light trigger, reactive diluent and solvent, inorganic binder does not comprise alkaline earth oxide.This invention, by improving the formula of glass dust, avoids glass dust to react with the organic binder bond in slurry, thereby extends the holding time of slurry, has improved the storage stability of slurry; Vast seas etc. are at patent " preparation method of aluminum conductive paste of high-performance environment protection solar cell " (application number: the preparation method who discloses a kind of aluminum conductive paste of high-performance environment protection solar cell 200910213827), the aluminum conductive electric slurry making by the method is not leaded, solve problem of environmental pollution, the coefficient of linear expansion of the lead-free glass powder obtaining in preparation process and silicon chip approach, and have improved the success rate after firing.The preparation process of this slurry comprises the preparation of (1) glass dust; (2) preparation of inorganic bond glass metal powder; (3) making of organic carrier; (4) select the C powder of 2-5 μ m with for subsequent use; (5) preparation of aluminum conductive electric slurry: what this slurry was 75~85% by percentage by weight be nitrided the aluminium powder of aluminium parcel, the organic carrier of 9-20%, 3~4% inorganic bond glass metal powder, 1~3% C powder form, total amount 100%, after mixing, be ground to granularity with three-roller and reach 15-30 μ m, obtain the product that viscosity is 25000-35000Mpas; Permitted literary talent etc. at patent " planting the hot curing conductive silver slurry of making radio-frequency (RF) identification (RFID) label antenna " (application number: disclose a kind of hot curing conductive silver slurry of making radio-frequency (RF) identification (RFID) label antenna by silk screen printing 200810167515).Mass percent consists of: organic-silicon-modified bisphenol A epoxide resin, 10-30; Latent curing agent, 2-20; Curing accelerator, 1-5; Auxiliary agent, 0.1-2; Solvent, 0-10, flake silver powder, 0-80; Spherical silver powder, 0-80.In organic-silicon-modified bisphenol A epoxide resin, contain siloxanes.Latent curing agent is: part methyl-etherified amino resins and cyanate modified imidazole curing agent or its mixture, be used in conjunction with epoxy resin cure promoter.Hot curing conductive silver slurry rheological charactristics is that typical shearing becomes alkene body, at paper substrates or PETG (PET), polyimides (PI), or on the plastic film flexible parent metal such as polyvinyl chloride (PVC), various picture and text are made in silk screen printing, are specially adapted to make radio-frequency (RF) identification (RFID) label antenna; Permitted literary talent etc. at patent " a kind of ultraviolet light curing conductive silver slurry of making radio-frequency (RF) identification (RFID) label antenna " (application number: the ultraviolet light curing conductive silver slurry that discloses a kind of making radio-frequency (RF) identification (RFID) label antenna 200810167513), mass percent consists of: ultraviolet curable resin, 5-35; Reactive diluent, 1-20; Light trigger, 1-5; Auxiliary agent, 0.1-2; Solvent, 0-10, flake silver powder, 0-80; Spherical silver powder, 0-80.Wherein, ultraviolet curable resin is organic-silicon-modified bisphenol-A epoxy acrylic resin, fluorine modified bisphenol A epoxy acrylic resin, polyurethane-modified polyacrylate resin or its mixture.Ultraviolet light curing conductive silver slurry rheological charactristics is that typical shearing becomes alkene body, can on the plastic film flexible parent metals such as paper substrates and PETG (PET), polyimides (PI) or polyvinyl chloride (PVC), silk screen printing make various picture and text, be specially adapted to make radio-frequency (RF) identification (RFID) label antenna; Zheng Jianhuas etc. are at patent " a kind of front electrode of solar battery conductive silver slurry with good printing performance " (application number: a kind of conductive slurry for front electrode of solar battery is provided 200810038138), comprise conducting metal silver powder, glass dust and organic carrier.Its feature is that this kind of electrocondution slurry adopted the cellulose of two kinds of different viscosities as thickener, has improved the thixotropy of slurry, makes it have good printing performance, the gate electrode line neat in edge of printing off, and the slump is little, and perpendicularity is good.Have higher short circuit current and fill factor, curve factor, less series resistance by cell piece that this slurry is printed, phototranstormation efficiency is high.Battery also has superior mechanical property simultaneously; Zhou Dongxiang etc. are at patent " a kind of preparation method of nickel based conductive slurry " (application number: the preparation method that a kind of nickel based conductive slurry is provided 200810047907), prepare submicron order nickel chromium triangle mixed metal powder with the mixed solution of inferior sodium phosphate reduced nickel saline solution and aqueous solution of chromium salt, on submicron order nickel chromium triangle mixed metal powder surface, clad nano silvery obtains nickel based metal powder.Prepare electrocondution slurry using nickel based metal powder as conductive phase, and in slurry, add antioxidant boron, the oxidation resistance temperature of electrocondution slurry can reach 900 DEG C, the nickel based metal powder making, except the interior electrode for multi-layer ceramics MLPTCR, can also substitute the noble metal electrode such as silver, palladium for multilayer ceramic capacitor, extraordinary microwave ceramics, piezoelectric ceramic, Cao build patent " black conductive slurry and use the plasma display of this slurry " (application number: a kind of black conductive slurry is provided 200810113553) and uses the plasma display of this electrocondution slurry in, this electrocondution slurry comprises inorganic powder and is used to form the organic principle of display device panel electrode, wherein said inorganic powder is by the powder constituent of glass powder and conducting metal, the average grain diameter of described metal dust is in the scope of 10 to 1000 nanometers, and be preferably no more than 800 nanometers, more preferably no more than 380 nanometers, and in the time that described conducting metal is silver, the particle diameter of metal dust is not less than 14 nanometers.Wherein, the total weight of the inorganic powder based on metal dust and glass dust composition, the weight percentage of described metal dust is 10~95%, Wang Weis etc. are at patent " plasma display of electrocondution slurry and this slurry of use " (application number: propose a kind of electrocondution slurry that is used to form plasma display electrode 200810114629), comprise conductive metal powder, organic components and glass powder with low melting point, it is characterized in that, described conductive metal powder is made up of the metal dust of particle diameter different size between 0.2 to 3.5, to improve the conductivity of unit mass metal, Zhang Zhigang is at patent " anti-Ag diffusion photosensitive and conductive pulp and preparation method thereof " (application number: relate to a kind of anti-Ag diffusion photosensitive and conductive pulp and preparation method thereof 200810150977), component and mass percent thereof that this electrocondution slurry comprises are respectively: Ag powder 50~80%, functional metal powder 2~20%, adhesion promoter 2~15%, photonasty organic system 16~30%, described functional metal powder is zinc, tin, bismuth, wherein a kind of metal powder in lead or wherein two or more metal alloy powder, described photonasty organic system includes Photoepolymerizationinitiater initiater monomer, reactive diluent, prepolymer, atent solvent.Preparation condition of the present invention is content with very little, and adopt this kind of slurry to prepare BUS and the ADD conductive electrode in plasma panel, can effectively prevent that Ag is diffused in transparent dielectric layer, avoid the phenomenon of transparent dielectric layer flavescence, significantly improve the quality of display screen demonstration image; Zhu Wanchao is at patent " a kind of low-temperature conductive slurry " (application number: the low-temperature cured conductive paste that relates to fields such as can be used for keyboard lines printing, thin film switch, electronic radio frequency tags 200810232755), especially a kind of low-temperature conductive slurry, be characterized in, in weight portion, it consists of: conductive metal powder 50~70, solvent 10~30, macromolecule resin 0.1~30, additive 0~10.The present invention is directed to the defect that prior art exists, a kind of conductive powder body being mixed by carbon-iron alloy powder and silver powder is provided, the electrocondution slurry that adopts this powder to mix, not only can reduce costs, and has also overcome simultaneously and has moved the shortcomings such as the short circuit that causes due to silver; Zhu Wanchao is at patent " a kind of manufacture method of photo-thermal curing conductive slurry " (application number: relate to screen printing technique field 200910021738), especially a kind of manufacture method of the photo-thermal curing conductive slurry for silk screen printing, 1) select diethylene adipate or 1 by mass fraction, 4-butyrolactone, as solvent, is uniformly mixed to homogeneous state with hard polyester resin and soft mylar under the condition of 60 DEG C; 2) add polyester acrylate or aliphatic urethane acrylate by mass fraction, add reactive diluent to be uniformly mixed by mass fraction; 3) add light trigger, light stabilizer, activator by mass fraction, dispersant, is uniformly mixed at normal temperatures; 4) add flake silver powder by mass fraction, be uniformly mixed; 5) mixed slurry is ground, obtain final electrocondution slurry.The conductive silver paste of photo-thermal curing of the present invention, can increase printed resolution, enhances productivity, and cost is low, is conducive to carrying out of environmental protection work; Sieve generation waits forever at patent " vanadium-silver low melting glass and the electrocondution slurry that contains this glass " (application number: relate to a kind of vanadium-silver low melting glass as bonding phase in conductivity electronics slurry composition and the conductivity electronics slurry that contains this low-melting-point glass 200710087034).This low-melting-point glass and functional powder are hybridly prepared into compound powder, are dispersed in the paste composition that is mixed with toughness in organic solution, for making the conductive component of various electronic devices and components.Bonding effect has been softened in low-melting-point glass melting in the time of high temperature sintering.While making electronic devices and components, sintering temperature is between 300 DEG C to 500 DEG C.Its composition characteristic is to contain vanadium oxide and silver oxide; Add after other composition, glass has that can be low to moderate the transition temperature of 200 DEG C and chemical stability and mechanical strength good; The great grade of little Yu is at patent " electrocondution slurry " (application number: electrocondution slurry is provided 200780047126), it comprises as the metal powder of raw material, thermosetting resin and has carboxyl and the flux activity compound of phenolic hydroxyl group, this electrocondution slurry has high conductivity, is suitable for the application of fine pitch; The fine grade of Miyazaki's filial piety is at patent " ceramic electronic components of electrocondution slurry and lamination " (application number: the electrocondution slurry of the interior electrode for making laminated ceramic electronic unit is provided 01122368) and has adopted the laminated ceramic electronic unit of this electrocondution slurry.Electrocondution slurry is made up of following: the conductive powder that is mainly nickel; Organic carrier; Compd A, it contains at least one in magnesium and calcium, is metal salts of organic acids, oxide powder, the organic complex salt of metal and/or alkoxide; And compd B, it has containing at least one the hydrolyzable reactive group in Ti and Zr, and sticks on conductive powder surface; The fine grade of Miyazaki's filial piety is at patent " electrocondution slurry and adopt the ceramic electronic components of lamination of this slurry " (application number: provide 01122370) and should be used for the laminated ceramic electronic unit making the electrocondution slurry of interior electrode and adopt this electrocondution slurry.Electrocondution slurry is the conductive powder being mainly made up of nickel; Organic carrier; Compd A, it is at least one in metal salts of organic acids, organic metal complex salt and alkoxide and contains at least one in magnesium, calcium and barium; With at least one the compd B of hydrolysis containing in aluminium and silicon; Wherein the compd B of hydrolysis sticks on conductive powder surface; The grand will of Jitian etc. are at patent " electrocondution slurry " (application number: a kind of electrocondution slurry is provided 01125847); using conductive powder, organic binder bond and solvent as main component, wherein this slurry also contains at least one that select from the group of N-acylamino acid and salt formation thereof.The shelf characteric of this electrocondution slurry greatly improves, even if also can not there is separation or the precipitation of conductive powder through long-term storage; Large next benevolence etc. are at patent " conductive paste and the method with its manufacture laminated ceramic electronic component " (application number: a kind of conductive paste is provided 01132696), comprise 5% to 18% the organic solvent being formed by solvent and adhesive by weight, 80% to 93% spherical or granular conductive metal powder by weight, and there is the particle diameter within the scope of 0.1 to 50 μ m, and 2% to 10% the toner with particle diameter within the scope of approximately 0.1 to 50 μ m by weight, that it is insoluble to this solvent and there is low-level water absorption.In the time that this conductive paste is used to form the access opening conductor that will change outer electrode end into, there is no the shape distortion of access opening conductor.And can be limited in the breakage that produces crack on the conducting metal of roasting and be limited near ceramic region access opening conductor; PJ Laurence Oliviers etc. are at patent " for the thick film conductor paste compositions of microwave applications LTCC band " (application number: relate to thick film conductive composition 200610077665), it comprises conducts electricity composition and the organic carrier of bronze, one or more frits or ceramic oxide, also relate to described composition for LTCC (low temperature concurrent roasting pottery), be used for preparing fo multi-layer electronic circuit and the purposes for high frequency microelectronic applications; Jin Zhonghan etc. are at patent " conductive paste composition and the method for utilizing its manufacture multilayer ceramic capacitor " (application number: a kind of conductive paste composition is provided 201010255736) and has utilized this conductive paste composition to manufacture the method for multilayer ceramic capacitor.This conductive paste composition comprises metal powder and resin glue, and the mean particle size range of metal powder is 50nm to 300nm, and based on the metal powder of 100 weight portions, the total content of resin glue is 4 weight portion to 10 weight portions.Resin glue comprises from being that 250000 to 400000 high molecular weight polyvinyl alcohol butyral resin and weight average molecular weight are at least one resin of selecting the group that forms of 50000 to 150000 low molecular weight polyethylene butyral resin by rosin ester, weight average molecular weight; Former controlling also waited at patent " ceramic powders, conductive paste, multilayer ceramic electronic component and manufacture method thereof " (application number: for to multilayer ceramic electronic component, suppress the generation of crackle 200710086092), improve fabrication yield.
By to prior art investigation discovery, there is no at present the report of organic/inorganic nano composite conducting slurry.And such electrocondution slurry is compared with existing product, organic moiety can diffuse to form conductive network better in system, and inorganic nano current-carrying part can improve the mechanical performance of conducting film.
Summary of the invention
The object of the invention is to propose a kind of novel electrocondution slurry, this organic/inorganic nano composite conducting slurry has the advantages such as electric conductivity is stable, anti-uv-ray is strong, wear-resisting, can make up carbon series conductive slurry color and deeply, in use be prone to and disperse inhomogeneous deficiency and metal series conductive slurry that conductive filler migration or oxidized and form the shortcoming opening circuit easily occurs.
The electrocondution slurry that the present invention proposes, is made up of film forming matter, conductive filler, coupling agent, water and auxiliary agent, and the percentage by weight of each component is:
Above each component weight sum meets 100.
In the present invention, film forming matter can adopt the one in aqueous epoxy resins, water-borne acrylic resin, water-based fluorocarbon resin.
In the present invention, described conductive filler is made up of organic and inorganic two parts, and organic component is polythiophene, and inorganic component is Al-Doped ZnO nanometer conductive material.Al-Doped ZnO nanometer conductive material can effectively improve electrocondution slurry and form the anti-uv-ray of conducting film and scratch resistance, wear-resisting effect.Mass percent between organic and inorganic two parts composition is 100: 1~20.
In the present invention, coupling agent adopts tetrabutyl titanate mostly, also can use silane coupler.
In the present invention, the auxiliary agent adding is mainly water-based wetting dispersing agent.
Preparation method of the present invention is as follows:
(1) by said ratio, auxiliary agent is joined in film forming matter, fully stir with dispersion machine;
(2) coupling agent, conductive filler are joined in the mixture of step (1), fully stir;
(3) in the mixed system of step (2), add water, stir;
(4) the removal impurity that sieves, obtains finished product electrocondution slurry.
The present invention utilizes organic/inorganic nano composite conducting material as conductive filler, has prepared the novel high-effective conductive slurry of a class.Conductive filler used has the plurality of advantages such as fineness is high, conductivity is high, electric conductivity is lasting, and therefore, the electrocondution slurry of preparing with this conductive filler will have wide market application foreground.
The prepared electrocondution slurry of the present invention is along with the increase of conductive filler addition, and the conductivity of conducting film improves constantly.In the time that the addition of conductive filler should be controlled between 40wt%~50wt%, the conductivity magnitude range of corresponding conducting film is 800~1200S/cm.The present invention can according to actual needs, by adjusting the addition of complex conductive fillers, control the conductivity of conducting film.
The density of the present invention's Al-Doped ZnO electric conducting material used is 5.6g/cm 3, average grain diameter is 20~50nm.Conductive polythiophene is blue material; Al-Doped ZnO electrical-conductive nanometer material is faint yellow powder.
In the present invention, add appropriate coupling agent.Conventionally adding of inorganic nano electric conducting material, is difficult to be dispersed in preferably in electrocondution slurry form network configuration, and adding of coupling agent, is conducive to conductive filler and forms stable conductive network.Research shows, coupling agent hand over applicable addition account for system gross mass percentage 1~5% time.
Electrocondution slurry prepared by the present invention is along with the rising of conducting film temperature, and conducting film change in resistance is little, illustrates that electrocondution slurry has good electricity thermal stability.
In order to measure the impact of different conducting film thickness on conducting film resistivity, adopt the method for GB1727-79 repeatedly to brush, to obtain the conducting film of different-thickness.For the good conducting film of film forming, thickness is little on the impact of conducting film resistivity.Conductive filler in this explanation conducting film has been evenly dispersed in conducting film, can in recoat, not occur the local variation that causes resistivity of assembling.
Electrical conduction mechanism of the present invention is: the organic/inorganic nano complex conductive fillers adding forms three-dimensional conductive network in whole coating, and electronics easily moves freely by conductive network and tunnel effect.
Tool of the present invention has the following advantages:
1, the present invention first by polythiophene and conduction Al-Doped ZnO nano material in conjunction with utilizing a kind of raw material sources wide, in liberal supply, low-cost mixed valence metal-oxide powder is as conductive filler, therefore the electrocondution slurry of, preparing has function admirable, environmental protection, the advantage such as with low cost.
2, electrocondution slurry preparation technology of the present invention is simple, and conductive layer evenness is good, strong adhesion.Electrocondution slurry provided by the invention can make up carbon series conductive slurry color and deeply, in use be prone to and disperse inhomogeneous deficiency and metal series conductive slurry that conductive filler migration or oxidized and form the shortcoming opening circuit easily occurs.
3, the electrocondution slurry electric conductivity excellence that the present invention prepares, conductivity is up to 800-1200S/cm.
4, the present invention will have the Al-Doped ZnO electrical-conductive nanometer material of excellent conductive performance and mechanical strength as the filler of electrocondution slurry first, Al-Doped ZnO nanometer conductive material can effectively improve electrocondution slurry and form the anti-uv-ray of conducting film and scratch resistance, wear-resisting effect, for the preparation of such functional conductive slurry provides a kind of new thinking.
Embodiment
Below by specific embodiment, the present invention is further illustrated.
Embodiment 1:
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 1 o'clock, and the conductivity of conducting film is 800S/cm.
Embodiment 2
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 20 o'clock, and the conductivity of conducting film is 1050S/cm.
Embodiment 3:
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 1 o'clock, and the conductivity of conducting film is 1200S/cm.
Embodiment 4:
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 5 o'clock, and the conductivity of conducting film is 850S/cm.
Embodiment 5:
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 5 o'clock, and the conductivity of conducting film is 1200S/cm.
Embodiment 5:
The basic recipe of this electrocondution slurry is:
Above-mentioned raw materials is proportionally carried out to dispersed with stirring, be mixed with electrocondution slurry finished product.In above-mentioned organic/inorganic nano complex conductive fillers, organic and inorganic part mass ratio are 100: 15 o'clock, and the conductivity of conducting film is 900S/cm.

Claims (7)

1. a novel conductive slurry, is characterized in that being made up of film forming matter, conductive filler, coupling agent, auxiliary agent and water, and the percentage by weight of each component is:
Above each component weight sum meets 100.
2. novel conductive slurry according to claim 1, is characterized in that film forming matter adopts the one of water-based fluorocarbon resin, aqueous epoxy resins, water-borne acrylic resin.
3. novel conductive slurry according to claim 1, is characterized in that conductive filler is made up of organic and inorganic two parts, and organic component is polythiophene, and inorganic component is Al-Doped ZnO nanometer conductive material.Al-Doped ZnO nanometer conductive material can effectively improve electrocondution slurry and form the anti-uv-ray of conducting film and scratch resistance, wear-resisting effect.Mass percent between organic and inorganic two parts composition is 100: 1~20.
4. novel conductive slurry according to claim 1, is characterized in that adopting water as solvent.
5. novel conductive slurry according to claim 1, is characterized in that coupling agent adopts the one of tetrabutyl titanate or silane coupler.
6. novel conductive slurry according to claim 1, the auxiliary agent of employing is water-based wetting dispersing agent, so be dispersed in better in system with electrical-conductive nanometer zinc oxide.
7. a preparation method for novel conductive slurry as claimed in claim 1, is characterized in that concrete steps are as follows:
(1) by said ratio, auxiliary agent is joined in film forming matter, fully stir with dispersion machine;
(2) coupling agent, conductive filler are joined in the mixture of step (1), fully stir;
(3) in the mixture of step (2), add water, stir;
(4) the removal impurity that sieves, obtains finished product electrocondution slurry.
CN201310027057.6A 2013-01-24 2013-01-24 A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof Expired - Fee Related CN103971784B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310027057.6A CN103971784B (en) 2013-01-24 2013-01-24 A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310027057.6A CN103971784B (en) 2013-01-24 2013-01-24 A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof

Publications (2)

Publication Number Publication Date
CN103971784A true CN103971784A (en) 2014-08-06
CN103971784B CN103971784B (en) 2016-08-17

Family

ID=51241170

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310027057.6A Expired - Fee Related CN103971784B (en) 2013-01-24 2013-01-24 A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof

Country Status (1)

Country Link
CN (1) CN103971784B (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104610802A (en) * 2015-02-02 2015-05-13 芜湖市宝艺游乐科技设备有限公司 Waterproof polyethylene powder coating containing nanometer silver grafted colloidal graphite and preparation method of waterproof polyethylene powder coating
CN105513713A (en) * 2015-12-07 2016-04-20 西安工程大学 Method for preparing medium and low temperature ZnO electronic paste
CN105575464A (en) * 2016-03-01 2016-05-11 东莞珂洛赫慕电子材料科技有限公司 Organic solidification curing resistor slurry and preparation method thereof
CN106297949A (en) * 2015-05-27 2017-01-04 苏州市贝特利高分子材料股份有限公司 High conductivity low-temperature silver slurry and preparation method thereof
CN106336618A (en) * 2016-09-12 2017-01-18 中电科芜湖钻石飞机制造有限公司 High-heat-conductivity carbon fiber composite material and preparation method thereof
CN106502020A (en) * 2017-01-13 2017-03-15 合肥微晶材料科技有限公司 A kind of controllable conductivity light modulation structure and preparation method thereof
CN107393628A (en) * 2017-08-31 2017-11-24 西安欣贝电子科技有限公司 A kind of halogen-free type organic polymer silver conductive paste
CN107955512A (en) * 2017-12-10 2018-04-24 江西九鹏科技股份有限公司 A kind of compound weather-proof conductive anti-corrosive pulp of graphene/polythiophene
CN108666000A (en) * 2018-06-07 2018-10-16 太仓萃励新能源科技有限公司 A kind of preparation method of N-type Halogen electrocondution slurry
CN108666001A (en) * 2018-06-07 2018-10-16 太仓萃励新能源科技有限公司 A kind of preparation method of N-type electrocondution slurry
CN108838407A (en) * 2018-06-28 2018-11-20 浙江加州国际纳米技术研究院台州分院 A kind of phosphate/nano silver composite conductive powder
CN108986984A (en) * 2018-06-07 2018-12-11 太仓萃励新能源科技有限公司 A kind of preparation method of N-type electrocondution slurry
CN109215828A (en) * 2018-08-22 2019-01-15 湖南省国银新材料有限公司 A kind of welding low temperature drying silver paste and preparation method thereof
CN110108394A (en) * 2019-05-20 2019-08-09 中国科学院重庆绿色智能技术研究院 Large area array separate type pressure sensor and preparation method thereof, waterborne conductive slurry and preparation method thereof
CN110662313A (en) * 2018-06-29 2020-01-07 河北金雕新材料科技有限公司 Preparation method of water-based graphene far-infrared conductive paste
CN113707360A (en) * 2021-10-22 2021-11-26 西安宏星电子浆料科技股份有限公司 Thick film resistor paste suitable for different types of stainless steel substrates
CN114334215A (en) * 2022-01-06 2022-04-12 浙江优英光电科技有限公司 Electrode slurry for ohmic contact of P-type emitter region of silicon solar cell
CN115642000A (en) * 2022-12-23 2023-01-24 西北工业大学 Preparation method of conductive copper paste capable of being subjected to photon sintering

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1944555A (en) * 2006-10-23 2007-04-11 深圳清华大学研究院 Environment friendly nano static conductive paint and its preparing method
CN1948381A (en) * 2006-10-27 2007-04-18 东华大学 Conductive polymer material and its preparation method
US20070141251A1 (en) * 1999-12-09 2007-06-21 Ebara Corporation Method of forming thin metal films on substrates
CN101712839A (en) * 2009-11-13 2010-05-26 徐州工业职业技术学院 Method for preparing organic-inorganic macromolecular compound conductive paint by utilizing like emulsion or solution technique
CN102348297A (en) * 2011-10-19 2012-02-08 信阳市环宇针织服装有限公司 Nano carbon-fiber composite electrical heating material and preparing method thereof
US8114705B2 (en) * 2008-05-30 2012-02-14 Fujifilm Corporation Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141251A1 (en) * 1999-12-09 2007-06-21 Ebara Corporation Method of forming thin metal films on substrates
CN1944555A (en) * 2006-10-23 2007-04-11 深圳清华大学研究院 Environment friendly nano static conductive paint and its preparing method
CN1948381A (en) * 2006-10-27 2007-04-18 东华大学 Conductive polymer material and its preparation method
US8114705B2 (en) * 2008-05-30 2012-02-14 Fujifilm Corporation Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus
CN101712839A (en) * 2009-11-13 2010-05-26 徐州工业职业技术学院 Method for preparing organic-inorganic macromolecular compound conductive paint by utilizing like emulsion or solution technique
CN102348297A (en) * 2011-10-19 2012-02-08 信阳市环宇针织服装有限公司 Nano carbon-fiber composite electrical heating material and preparing method thereof

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104610802A (en) * 2015-02-02 2015-05-13 芜湖市宝艺游乐科技设备有限公司 Waterproof polyethylene powder coating containing nanometer silver grafted colloidal graphite and preparation method of waterproof polyethylene powder coating
CN106297949A (en) * 2015-05-27 2017-01-04 苏州市贝特利高分子材料股份有限公司 High conductivity low-temperature silver slurry and preparation method thereof
CN108538442B (en) * 2015-05-27 2020-07-17 苏州市贝特利高分子材料股份有限公司 Preparation method of high-conductivity low-temperature silver paste
CN106297949B (en) * 2015-05-27 2018-05-11 苏州市贝特利高分子材料股份有限公司 High conductivity low temperature silver paste
CN108538442A (en) * 2015-05-27 2018-09-14 苏州市贝特利高分子材料股份有限公司 The preparation method of high conductivity low temperature silver paste
CN105513713A (en) * 2015-12-07 2016-04-20 西安工程大学 Method for preparing medium and low temperature ZnO electronic paste
CN105575464A (en) * 2016-03-01 2016-05-11 东莞珂洛赫慕电子材料科技有限公司 Organic solidification curing resistor slurry and preparation method thereof
CN106336618A (en) * 2016-09-12 2017-01-18 中电科芜湖钻石飞机制造有限公司 High-heat-conductivity carbon fiber composite material and preparation method thereof
CN106502020B (en) * 2017-01-13 2019-06-21 合肥微晶材料科技有限公司 A kind of controllable conductivity light modulation structure and preparation method thereof
CN106502020A (en) * 2017-01-13 2017-03-15 合肥微晶材料科技有限公司 A kind of controllable conductivity light modulation structure and preparation method thereof
CN107393628A (en) * 2017-08-31 2017-11-24 西安欣贝电子科技有限公司 A kind of halogen-free type organic polymer silver conductive paste
CN107955512A (en) * 2017-12-10 2018-04-24 江西九鹏科技股份有限公司 A kind of compound weather-proof conductive anti-corrosive pulp of graphene/polythiophene
CN108986984A (en) * 2018-06-07 2018-12-11 太仓萃励新能源科技有限公司 A kind of preparation method of N-type electrocondution slurry
CN108666001A (en) * 2018-06-07 2018-10-16 太仓萃励新能源科技有限公司 A kind of preparation method of N-type electrocondution slurry
CN108666000A (en) * 2018-06-07 2018-10-16 太仓萃励新能源科技有限公司 A kind of preparation method of N-type Halogen electrocondution slurry
CN108838407A (en) * 2018-06-28 2018-11-20 浙江加州国际纳米技术研究院台州分院 A kind of phosphate/nano silver composite conductive powder
CN110662313B (en) * 2018-06-29 2023-03-31 河北金雕新材料科技有限公司 Preparation method of water-based graphene far-infrared conductive paste
CN110662313A (en) * 2018-06-29 2020-01-07 河北金雕新材料科技有限公司 Preparation method of water-based graphene far-infrared conductive paste
CN109215828A (en) * 2018-08-22 2019-01-15 湖南省国银新材料有限公司 A kind of welding low temperature drying silver paste and preparation method thereof
CN110108394A (en) * 2019-05-20 2019-08-09 中国科学院重庆绿色智能技术研究院 Large area array separate type pressure sensor and preparation method thereof, waterborne conductive slurry and preparation method thereof
CN113707360A (en) * 2021-10-22 2021-11-26 西安宏星电子浆料科技股份有限公司 Thick film resistor paste suitable for different types of stainless steel substrates
CN113707360B (en) * 2021-10-22 2022-02-25 西安宏星电子浆料科技股份有限公司 Thick film resistor paste suitable for different types of stainless steel substrates
CN114334215A (en) * 2022-01-06 2022-04-12 浙江优英光电科技有限公司 Electrode slurry for ohmic contact of P-type emitter region of silicon solar cell
CN114334215B (en) * 2022-01-06 2023-10-17 浙江优英光电科技有限公司 Electrode slurry for ohmic contact of P-type emitter region of silicon solar cell
CN115642000A (en) * 2022-12-23 2023-01-24 西北工业大学 Preparation method of conductive copper paste capable of being subjected to photon sintering
CN115642000B (en) * 2022-12-23 2023-04-07 西北工业大学 Preparation method of conductive copper paste capable of being subjected to photon sintering

Also Published As

Publication number Publication date
CN103971784B (en) 2016-08-17

Similar Documents

Publication Publication Date Title
CN103971784B (en) A kind of novel organic/inorganic nano composite conducting slurry and preparation method thereof
CN104021838B (en) A kind of polythiophene/mixed valence metal oxide works in coordination with electrocondution slurry and preparation method thereof
CN103113786B (en) Graphene conductive ink and preparation method thereof
CN104464883A (en) Graphene electrocondution slurry with dispersants adsorbed on surface and manufacturing method and application thereof
CN107578838A (en) Recyclable electrocondution slurry of a kind of low cost and preparation method thereof
CN107274965A (en) Electric slurry and its manufacture method based on low-melting-point metal micro-nano powder
CN102723121B (en) Conductive adhesive composition for solar cell and solar cell module thereof
CN103666363B (en) Conductive adhesive containing conductive macromolecules and preparation method thereof
CN110232984B (en) Printing conductive silver paste and preparation method thereof
CN104021842A (en) Graphene composite copper thick film conductive slurry and preparation method thereof
CN103839605A (en) Electrocondution slurry and preparation method and application of electrocondution slurry
CN107236485B (en) A kind of dendritic heat curing type pastes conducting resinl and preparation method thereof
CN101976688A (en) Solar cell light-receiving surface electrode and manufacturing method thereof
CN104658634A (en) Crystalline silicon solar battery back electrode silver paste and preparation method thereof
CN111448670B (en) conductive paste
CN102592704A (en) Aluminum paste for solar energy battery and preparation method thereof
CN111243781A (en) Silver paste and preparation method and application thereof
CN102855961B (en) Paste for formation of solar cell back electrodes and preparation method thereof
KR101452962B1 (en) Conductive paste composition and semiconductor devices comprising the same
CN109273136A (en) A kind of solderable conductive silver paste and preparation method thereof that can be low-temperature fast-curing
CN107622809A (en) A kind of copper electrode paste and preparation method thereof
CN104858437A (en) Nano silver paste for printing conducting circuit and preparation method of nano silver paste
KR101555323B1 (en) Conductive paste composition and semiconductor devices comprising the same
KR101452961B1 (en) Conductive paste composition and semiconductor devices comprising the same
CN104882187A (en) Polythiophene-based low-density composite conductive paste and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160817

Termination date: 20210124

CF01 Termination of patent right due to non-payment of annual fee