CN103965478A - 一种凹土基mq有机硅树脂的制备方法 - Google Patents
一种凹土基mq有机硅树脂的制备方法 Download PDFInfo
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- CN103965478A CN103965478A CN201410196378.3A CN201410196378A CN103965478A CN 103965478 A CN103965478 A CN 103965478A CN 201410196378 A CN201410196378 A CN 201410196378A CN 103965478 A CN103965478 A CN 103965478A
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- recessed soil
- silicone resin
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- soil matrix
- alkali lye
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- 229960000892 attapulgite Drugs 0.000 title abstract description 10
- 229910052625 palygorskite Inorganic materials 0.000 title abstract description 10
- 238000000034 method Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 title abstract description 7
- 239000011347 resin Substances 0.000 title abstract description 7
- 229910052710 silicon Inorganic materials 0.000 title abstract description 6
- 239000010703 silicon Substances 0.000 title abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 52
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 239000003513 alkali Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000006185 dispersion Substances 0.000 claims abstract description 14
- 239000002689 soil Substances 0.000 claims description 62
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 59
- 229920002050 silicone resin Polymers 0.000 claims description 49
- 239000011159 matrix material Substances 0.000 claims description 39
- 238000002360 preparation method Methods 0.000 claims description 28
- 239000000377 silicon dioxide Substances 0.000 claims description 25
- 235000012239 silicon dioxide Nutrition 0.000 claims description 25
- 229960001866 silicon dioxide Drugs 0.000 claims description 25
- 235000019353 potassium silicate Nutrition 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- -1 octadecyloxy phenyl TMOS Chemical compound 0.000 claims description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 230000007062 hydrolysis Effects 0.000 claims description 7
- 238000006460 hydrolysis reaction Methods 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- 230000001476 alcoholic effect Effects 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002585 base Substances 0.000 claims description 2
- DMZWVCJEOLBQCZ-UHFFFAOYSA-N chloro(ethenyl)silane Chemical compound Cl[SiH2]C=C DMZWVCJEOLBQCZ-UHFFFAOYSA-N 0.000 claims description 2
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical compound C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 claims description 2
- GTPDFCLBTFKHNH-UHFFFAOYSA-N chloro(phenyl)silicon Chemical compound Cl[Si]C1=CC=CC=C1 GTPDFCLBTFKHNH-UHFFFAOYSA-N 0.000 claims description 2
- VPZDAHBNTYZYHC-UHFFFAOYSA-N chlorosilylamine Chemical compound N[SiH2]Cl VPZDAHBNTYZYHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 238000005282 brightening Methods 0.000 abstract description 2
- 239000006229 carbon black Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 239000004115 Sodium Silicate Substances 0.000 abstract 1
- 239000003153 chemical reaction reagent Substances 0.000 abstract 1
- 239000005543 nano-size silicon particle Substances 0.000 abstract 1
- 239000012779 reinforcing material Substances 0.000 abstract 1
- 229910052911 sodium silicate Inorganic materials 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 230000002195 synergetic effect Effects 0.000 abstract 1
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000005051 trimethylchlorosilane Substances 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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Abstract
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107189442A (zh) * | 2017-06-27 | 2017-09-22 | 淮阴工学院 | 一种基于纳米凹土的改性甲基苯基硅树脂及其制备方法 |
CN108046839A (zh) * | 2017-12-19 | 2018-05-18 | 罗洪梅 | 一种化学改性凹土基多孔陶瓷及其制备方法 |
CN108239427A (zh) * | 2017-12-19 | 2018-07-03 | 成英 | 一种凹土纳米流体基地质聚合物荧光涂料及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101323667A (zh) * | 2008-06-24 | 2008-12-17 | 杭州师范大学 | 一种led封装补强用甲基乙烯基mq树脂的制备方法 |
CN101899157A (zh) * | 2010-07-22 | 2010-12-01 | 南昌大学 | 一种mq硅树脂的制备方法 |
CN102875811A (zh) * | 2011-07-12 | 2013-01-16 | 常州化学研究所 | 苯基乙烯基mq硅树脂的制备方法 |
CN103436035A (zh) * | 2013-08-19 | 2013-12-11 | 深圳市华创威实业有限公司 | 一种新型硅树脂 |
-
2014
- 2014-05-12 CN CN201410196378.3A patent/CN103965478B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101323667A (zh) * | 2008-06-24 | 2008-12-17 | 杭州师范大学 | 一种led封装补强用甲基乙烯基mq树脂的制备方法 |
CN101899157A (zh) * | 2010-07-22 | 2010-12-01 | 南昌大学 | 一种mq硅树脂的制备方法 |
CN102875811A (zh) * | 2011-07-12 | 2013-01-16 | 常州化学研究所 | 苯基乙烯基mq硅树脂的制备方法 |
CN103436035A (zh) * | 2013-08-19 | 2013-12-11 | 深圳市华创威实业有限公司 | 一种新型硅树脂 |
Non-Patent Citations (1)
Title |
---|
王国建,谢晶: "《水玻璃有机化法制备MQ硅树脂的研究》", 《建筑材料学报》, vol. 7, no. 3, 30 September 2004 (2004-09-30), pages 299 - 305 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107189442A (zh) * | 2017-06-27 | 2017-09-22 | 淮阴工学院 | 一种基于纳米凹土的改性甲基苯基硅树脂及其制备方法 |
CN108046839A (zh) * | 2017-12-19 | 2018-05-18 | 罗洪梅 | 一种化学改性凹土基多孔陶瓷及其制备方法 |
CN108239427A (zh) * | 2017-12-19 | 2018-07-03 | 成英 | 一种凹土纳米流体基地质聚合物荧光涂料及其制备方法 |
CN108239427B (zh) * | 2017-12-19 | 2020-04-17 | 青岛海源实业有限公司 | 一种凹土纳米流体基地质聚合物荧光涂料及其制备方法 |
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Address after: High tech Zone Guang River Road 272400 Shandong Jining City 16, Jining city quality inspection by quality inspection center of Shandong Applicant after: Zhang Guoqing Address before: 272401 Shandong city of Jining province Jiaxiang county Zhang Xiang Zhang Tun Yueguan No. 132 Applicant before: Zhang Guoqing |
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Inventor after: Zhang Guihua Inventor after: Yang Anjing Inventor after: Kang Jiaojiao Inventor after: Lv Guizhi Inventor after: Liu Yuanyuan Inventor after: Zhang Guoqing Inventor before: Zhang Yali Inventor before: Yin Zhenyan Inventor before: Zhang Guoqing Inventor before: Zeng Yongbin Inventor before: Zhang Qingjie |
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Effective date of registration: 20160303 Address after: 272400 junction of Torch Road and electromechanical two road, Jining hi tech Zone, Shandong Applicant after: SHANDONG CAYON TESTING TECHNOLOGY Co.,Ltd. Address before: High tech Zone Guang River Road 272400 Shandong Jining City 16, Jining city quality inspection by quality inspection center of Shandong Applicant before: Zhang Guoqing |
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Address after: No. 18, Taibailou West Road, Rencheng District, Jining City, Shandong Province, 2007 Patentee after: Shandong Jiayuan Testing Technology Co.,Ltd. Address before: 272400 north of the intersection of Huoju road and electromechanical Second Road, high tech Zone, Jining City, Shandong Province Patentee before: SHANDONG CAYON TESTING TECHNOLOGY Co.,Ltd. |