CN103938234A - Sealing structure of electroplating mould - Google Patents
Sealing structure of electroplating mould Download PDFInfo
- Publication number
- CN103938234A CN103938234A CN201410130148.7A CN201410130148A CN103938234A CN 103938234 A CN103938234 A CN 103938234A CN 201410130148 A CN201410130148 A CN 201410130148A CN 103938234 A CN103938234 A CN 103938234A
- Authority
- CN
- China
- Prior art keywords
- section
- cross
- micelle
- groove
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 title abstract description 11
- 238000007747 plating Methods 0.000 claims description 34
- 239000000693 micelle Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 5
- 238000003801 milling Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The invention discloses a sealing structure of an electroplating mould. The sealing structure comprises an electroplating mould body, wherein an electroplating area is arranged on the electroplating mould body; a groove is formed in the edge of the electroplating area; colloidal particles are embedded in the groove; the cross section of the groove is in a shape of L; the cross section of each colloidal particle is in a shape of L, which is the same as the shape of the cross section of the groove; a boss is arranged on a transverse straight section, near the bottom at the tail end of the electroplating area, of the cross section of each colloidal particle; gaps are formed among the bosses, the bottoms of the transverse straight sections of the cross sections of the colloidal particles and the upper surface of the groove; the top of the transverse straight section, which is near the tail end of the electroplating area, of the cross section of each colloidal particle, is of a sharp corner higher than the upper surface of the electroplating mould. The sealing structure has the beneficial effects of being good in sealing effect and simple to machine.
Description
Technical field
The present invention relates to a kind of plating mould sealed structure.
Background technology
This technology is applicable to selective electroplating mould, is applied to the lead frame of electronic component (IC, diode, LED, triode etc.), or bonder terminal partially plating gold, silver-plated, zinc-plated.Lead frame and terminal are metal materials (copper, iron or alloy), are banded coiled strip.Selective electroplating is the position of controlling plating district by special plating mould, guarantees to need the ground of plating to plate, and does not need the place of plating not plate.Due to the easy seepage of electroplating solution, plating is installed silicone-rubber seals (being commonly called as micelle) near district, and presses silica gel mask band at lead frame or the terminal back side, utilizes the elasticity of silica gel to help sealing current.As shown in Figure 1.There is boss the position of micelle Yu Du district contact.In fact tablet does not contact the whole plane of micelle like this, but only contacts boss, and pressure just can concentrate on boss like this, helps to improve sealing effectiveness.
Micelle need to be used the moulding of micelle mold injects, and prior art is to form above-mentioned boss in micelle counterdie machined grooves.Shortcoming is as follows:
1. working accuracy is low:
The groove of micelle counterdie is positioned at die cavity innermost, and therefore milling cutter must be very long, and in addition because milling cutter is very long, its elasticity is also very large, is subject to the extruding of material sidewall easily crooked in the course of processing, causes lug boss position inaccurate.And lug boss position must be positioned at plating area edge, therefore cannot avoid the extruding with sidewall.
2. machining period is long:
Micelle boss width is narrower, and pressure concentration effect is better, and therefore milling cutter diameter must be little.Conventionally use diameter 0.5mm milling cutter.Because milling cutter is not only thin but also long, so process velocity must be very slow, otherwise milling cutter easily fractures.This has just caused the prolongation in man-hour.
In addition, the right angle place of boss periphery has solution and gathers, and this position does not wish to plate, and also can plate precious metal, and because solution is bad in this position mobility, the brightness therefore plating is partially dark.Cause precious metal waste and aberration.In order to address this problem, conventionally can be on the peripheral processing of micelle boss inclined-plane as shown in Figure 3, but this inclined-plane needs to scan out for making swept-surface meticulousr more smooth with flat-end cutter from coil to coil on micelle mould, can only ten times even hundred times raising man-hour.
3. sealing effectiveness is poor:
Owing to using thinner milling cutter further to sacrifice process velocity and precision, milling cutter can not use thinner, therefore boss wider width, and load area is large, and pressure concentration is bad, and sealing effectiveness is poor.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of plating mould sealed structure.The scheme that the present invention adopts is:
A kind of plating mould sealed structure, comprise plating mould body, plating mould body is provided with electroplating region, electroplating region edge is provided with groove, in groove, be embedded with micelle, described groove cross-sectional shape is L shaped, micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, section anyhow in micelle cross section is provided with boss near the end bottom of electroplating region, anyhow between the section bottom in boss, micelle cross section and groove upper surface, have gap, the section anyhow in micelle cross section is the wedge angle that exceeds plating mould upper surface near the end top of electroplating region.
Preferably, plating mould upper surface is provided with band material, and the band material back side is provided with mask band.
Preferably, plating mould is provided with pottery nail.
Beneficial effect of the present invention is, the bottom processing boss around micelle plating district.In the time that micelle is installed and be pressed on mould, because micelle is resilient, therefore boss Hui Jiangdu district plane is around risen, and forms wedge angle and the peripheral gradient.Wedge angle area is minimum, sealing effectiveness is splendid, and the gradient is extremely meticulous and smooth curve, in addition due to boss good sealing effect, can do very shallowly, even product is pressed in above and wedge angle and slope can be flattened, and material and the large plane of micelle are fitted completely, easily not gathering completely, is therefore perfect for the effect of improving aberration and seepage.
Working depth on micelle mould generally only has percentum millimeter, and the land area that Working position is upper and lower mould, there is no the extruding of sidewall, can use the milling cutter that diameter 0.2mm is even less, the length of milling cutter only needs 0.1mm, therefore the intensity of milling cutter and rigidity are fine, and milling cutter distortion is little, and precision is high; Can be with the speed processing being exceedingly fast, without scanning inclined-plane, milling cutter only takes a round and can complete processing conventionally, and be 1/10th one of percentages even of traditional way man-hour.
Brief description of the drawings
Fig. 1 is prior art plating mould sealed structural representation.
Fig. 2 is the enlarged diagram in prior art micelle cross section.
Fig. 3 is prior art micelle Mould Machining schematic diagram.
Fig. 4 is plating mould sealed structural representation of the present invention.
Fig. 5 is the enlarged diagram in micelle of the present invention cross section.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further details.
Plating mould sealed structure, comprise plating mould body 1, plating mould body is provided with electroplating region 2, electroplating region edge is provided with groove 3, in groove, be embedded with micelle 4, described groove cross-sectional shape is L shaped, micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, 41 bottoms of the end near electroplating region of section anyhow in micelle cross section are provided with boss 42, anyhow between the section bottom in boss, micelle cross section and groove upper surface, have gap 43, the section anyhow in micelle cross section is the wedge angle 44 that exceeds plating mould upper surface near the end top of electroplating region.
Plating mould upper surface is provided with band material 5, and the band material back side is provided with mask band 6.
Plating mould is provided with pottery nail 7.
The above; it is only preferred embodiment of the present invention; not in order to limit the present invention, any trickle amendment that every foundation technical spirit of the present invention is done above embodiment, be equal to and replace and improve, within all should being included in the protection domain of technical solution of the present invention.
Claims (3)
1. a plating mould sealed structure, it is characterized in that, comprise plating mould body, plating mould body is provided with electroplating region, electroplating region edge is provided with groove, in groove, be embedded with micelle, described groove cross-sectional shape is L shaped, micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, section anyhow in micelle cross section is provided with boss near the end bottom of electroplating region, anyhow between the section bottom in boss, micelle cross section and groove upper surface, have gap, the section anyhow in micelle cross section is the wedge angle that exceeds plating mould upper surface near the end top of electroplating region.
2. plating mould sealed structure as claimed in claim 1, is characterized in that, plating mould upper surface is provided with band material, and the band material back side is provided with mask band.
3. plating mould sealed structure as claimed in claim 1, is characterized in that, plating mould is provided with pottery nail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410130148.7A CN103938234B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold seals structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410130148.7A CN103938234B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold seals structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103938234A true CN103938234A (en) | 2014-07-23 |
| CN103938234B CN103938234B (en) | 2016-09-14 |
Family
ID=51186095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410130148.7A Expired - Fee Related CN103938234B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold seals structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103938234B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788899A (en) * | 1993-09-22 | 1995-04-04 | Mitsubishi Plastics Ind Ltd | In-mold plating molds |
| US20060283713A1 (en) * | 2005-05-24 | 2006-12-21 | Shinko Electric Industries Co., Ltd. | Selective plating apparatus and selective plating method |
| CN102080243A (en) * | 2009-11-30 | 2011-06-01 | 曲悦峰 | Adjustable strip-plating die |
| CN102719865A (en) * | 2012-07-13 | 2012-10-10 | 曲悦峰 | Film plating mold |
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
-
2014
- 2014-04-02 CN CN201410130148.7A patent/CN103938234B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788899A (en) * | 1993-09-22 | 1995-04-04 | Mitsubishi Plastics Ind Ltd | In-mold plating molds |
| US20060283713A1 (en) * | 2005-05-24 | 2006-12-21 | Shinko Electric Industries Co., Ltd. | Selective plating apparatus and selective plating method |
| CN102080243A (en) * | 2009-11-30 | 2011-06-01 | 曲悦峰 | Adjustable strip-plating die |
| CN102719865A (en) * | 2012-07-13 | 2012-10-10 | 曲悦峰 | Film plating mold |
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103938234B (en) | 2016-09-14 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Changlong Dianjin Technology Co. Ltd. patent responsible person Document name: Notification that Application Deemed not to be Proposed |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN LONG DRAGON SPOT GOLD TECHNOLOGY LTD. Free format text: FORMER OWNER: QU YUEFENG Effective date: 20140903 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 518017 SHENZHEN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20140903 Address after: 5, 1 floor C District, 518000 Housing Science and Technology Park, Longhua street, Shenzhen, Guangdong, Baoan District, China Applicant after: Shenzhen Hong Kong Long Dragon Co., LTD. Address before: 518017 Guangdong city of Shenzhen province Futian District Liyang world gardens A 20F Applicant before: Qu Yuefeng |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 Termination date: 20190402 |