CN103934569B - A kind of hierarchical slicing method based on selective laser sintering - Google Patents
A kind of hierarchical slicing method based on selective laser sintering Download PDFInfo
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- CN103934569B CN103934569B CN201410175610.5A CN201410175610A CN103934569B CN 103934569 B CN103934569 B CN 103934569B CN 201410175610 A CN201410175610 A CN 201410175610A CN 103934569 B CN103934569 B CN 103934569B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/38—Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a kind of hierarchical slicing method based on selective laser sintering, comprise the stl file reading part to be processed; Determine the maximum of the maximin of fabrication orientation, lift height, the maximum of step error and surface roughness; Tri patch in STL model is carried out ground floor section on fabrication orientation; According to each bar limit and relative each tri patch of layer plane outline polygon, calculate the minimum lift height that lower one deck meets required precision; The outline line processing and obtain this section that sorts is carried out according to every thick intersection point set group to this layer of section layer by layer.The present invention, according to the surface characteristics of profiled member, can regulate the thickness of section automatically, has the advantage that operand is few, computing time is short, computational efficiency is high, and can significantly improve article surface quality and geometrical accuracy.
Description
Technical field
The present invention relates to rapid shaping research field, particularly relate to a kind of hierarchical slicing method based on selective laser sintering.
Background technology
Rapid shaping technique is also known as RP technique, a kind of the information such as the geometry of parts, structure are set up digitized description model, then these information are outputted to computer-controlled dynamo-electric integrated manufacturing system, by pointwise, by-line, carry out material by face three-dimensional packing shaping, thus reach the modernization method manufacturing actual parts quickly and accurately.Because rapid shaping is processed according to cross section profile from level to level, therefore, before processing must with hierarchy slicing software by threedimensional model along shaping short transverse, carry out hierarchy slicing process every certain thickness, to extract the profile in cross section.
According to rapid shaping principle, example is processed as with laser forming, laser scanning line carries out scanning sintering by synusia figure to dusty material, the cylindricality synusia that to be formed with this figure be cross section, and the synusia shape of actual 3D solid between this cylindricality synusia and two adjacent sections is differentiated.When lift height is excessive, the feature of the point, line, surface on some 3D solids between two sections will lose, and formed precision reduces.When the part being simultaneously inclined plane to contour surface carries out layering, along with the increase of lift height, step error strengthens thereupon, will have a strong impact on the surface quality of workpiece.If it is too little that lift height is got, although can improve formed precision, working (machining) efficiency is by influenced.Therefore lift height choose should consider how to retain preferably fine feature on 3D solid, meet surface quality requirements prerequisite under, larger layers be adopted as far as possible thick.For a formation system, when sintering specific moulding material, thickness choose the restriction having a maximum sintering thickness (character and the decision such as laser power, sweep speed by material) and minimum sintering thickness (being determined by the granularity of material).
Current existing various rapidform machine is all with hierarchy slicing software, and its slice thickness is all definite value usually.That is, no matter workpiece is in the difference of the complex-shaped degree of differing heights, all slicing treatment is carried out according to identical thickness.This Measures compare is simple and easy to realize, but when selected Thickness ratio is larger, easily cause the error that profiled member is larger, when selected thickness is less, the precision of profiled member is high, but the shaping time is just long, shaping efficiency step-down.
Summary of the invention
Goal of the invention: the present invention aims to provide effective hierarchical slicing method of the adaptivity that a kind of operand is few, computing time is short, computational efficiency is high, the method is according to the surface characteristics of profiled member, automatically can regulate the thickness of section, article surface quality and geometrical accuracy can be significantly improved.
Technical scheme: a kind of hierarchical slicing method based on selective laser sintering, is characterized in that, comprise the following steps:
(1) stl file of part to be processed is read;
(2) maximum of the maximin of fabrication orientation, lift height, the maximum of step error and surface roughness is determined;
(3) tri patch in STL model is carried out ground floor section on fabrication orientation;
(4) according to each bar limit and relative each tri patch of layer plane outline polygon, the minimum lift height that lower one deck meets required precision is calculated;
(5) carry out according to every thick intersection point set group to this layer of section layer by layer the outline line processing and obtain this section that sorts.
In described step (4), the concrete steps that the lower one deck of calculating meets the minimum lift height of required precision are:
If the minimum and maximum coordinate value of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
Suppose that at floor height be the aspect of Z, a tri patch F and section S-phase are handed over, and two extreme coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can be tried to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, thus can the some normal equation of this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxcan this tri patch F allow maximum lift height:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bthe maximum lift height that tri patch F allows can be obtained:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, then utilize the point of 3D solid, face, limit topological relation to find the tri patch adjacent with tri patch F, and continue the lift height calculating adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, then get h
tminfor the thickness that lower one deck is cut into slices;
If h
t≤ h
min, then stop calculating, get h
minfor the thickness that lower one deck is cut into slices;
If travel through this layer of all crossing tri patch, the h obtained
tall be more than or equal to h
max, then h is got
maxfor the thickness that lower one deck is cut into slices.
In described step (5) according to every thick intersection point set group to this layer of section layer by layer concrete steps that process obtains the outline line in this section of carrying out sorting be: obtain down thick from level to level by step (4), find the tri patch F that crossing with lower one deck section
0{ A, B, C} try to achieve two crossing intersection points, find and tri patch F according to topological relation
0adjacent tri patch F
1, and try to achieve next intersection point, travel through this layer of all crossing tri patch successively until arrive first tri patch F
0terminate, obtain the outline line of this layer of section.
Beneficial effect: the present invention is when determining the lift height of lower one deck, do not need trial cut process repeatedly, only need the apex coordinate utilizing each limit on current synusia polygonal cross-sectional profile, and the point of the tri patch corresponding relation relevant to each limit and 3D solid, face, limit topology information, just directly can calculate the lift height that lower one deck meets layering required precision (step error and surface roughness), simplify calculating, improve computational efficiency.The thickness of being cut into slices by self-adaptative adjustment controls shaping speed and precision, thus can effectively enhance productivity and the quality of production, especially for the profiled member of complicated structure, under the prerequisite ensureing shaping speed, the precision of workpiece is greatly improved.
Accompanying drawing explanation
Fig. 1 is schematic flow sheet of the present invention;
Fig. 2 is part tringle coal structure chart of the present invention;
Fig. 3 be of the present invention cut into slices by adaptive layered after thickness schematic diagram;
Fig. 4 is the two-dimensional representation of thickness of the present invention.
Detailed description of the invention
As shown in Figure 1,2,3, 4, a kind of hierarchical slicing method based on selective laser sintering, comprises the following steps:
(1) stl file generated by CAD part drawing to be processed is read;
(2) maximum of the maximin of fabrication orientation, lift height, the maximum of step error and surface roughness is determined;
(3) tri patch in STL model is carried out ground floor section on fabrication orientation;
(4) according to each bar limit and relative each tri patch of layer plane outline polygon, calculate the minimum lift height that lower one deck meets required precision, concrete steps are:
If the minimum and maximum coordinate value of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
Suppose that at floor height be the aspect of Z, a tri patch F and section S-phase are handed over, and two extreme coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can be tried to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, thus can the some normal equation of this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxcan this tri patch F allow maximum lift height:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bthe maximum lift height that tri patch F allows can be obtained:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, then utilize the point of 3D solid, face, limit topological relation to find the tri patch adjacent with tri patch F, and continue the lift height calculating adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, then get h
tminfor the thickness that lower one deck is cut into slices;
If h
t≤ h
min, then stop calculating, get h
minfor the thickness that lower one deck is cut into slices;
If travel through this layer of all crossing tri patch, the h obtained
tall be more than or equal to h
max, then h is got
maxfor the thickness that lower one deck is cut into slices.
(5) carry out according to every thick intersection point set group to this layer of section layer by layer the outline line processing and obtain this section that sorts, concrete steps are: obtain down thick from level to level by step (4), find the tri patch F that crossing with lower one deck section
0{ A, B, C} try to achieve two crossing intersection points, find and tri patch F according to topological relation
0adjacent tri patch F
1, and try to achieve next intersection point, travel through this layer of all crossing tri patch successively until arrive first tri patch F
0terminate, obtain the outline line of this layer of section.
The present invention, according to the surface characteristics of profiled member, can regulate the thickness of section automatically, has the advantage that operand is few, computing time is short, computational efficiency is high, and can significantly improve article surface quality and geometrical accuracy.When determining the lift height of lower one deck, do not need trial cut process repeatedly, only need the apex coordinate utilizing each limit on current synusia polygonal cross-sectional profile, and the point of the tri patch corresponding relation relevant to each limit and 3D solid, face, limit topology information, just directly can calculate the lift height that lower one deck meets layering required precision (step error and surface roughness), simplify calculating, improve computational efficiency.The thickness of being cut into slices by self-adaptative adjustment controls shaping speed and precision, thus can effectively enhance productivity and the quality of production, especially for the profiled member of complicated structure, under the prerequisite ensureing shaping speed, the precision of workpiece is greatly improved.
Claims (2)
1. based on a hierarchical slicing method for selective laser sintering, it is characterized in that, comprise the following steps:
(1) stl file of part to be processed is read;
(2) maximum of the maximin of fabrication orientation, lift height, the maximum of step error and surface roughness is determined;
(3) tri patch in STL model is carried out ground floor section on fabrication orientation;
(4) according to each bar limit and relative each tri patch of layer plane outline polygon, the minimum lift height that lower one deck meets required precision is calculated; Wherein, the concrete steps that the lower one deck of calculating meets the minimum lift height of required precision are:
If the minimum and maximum coordinate value of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
Suppose that at floor height be the aspect of Z, a tri patch F and section S-phase are handed over, and two extreme coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can be tried to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, thus can the some normal equation of this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxcan this tri patch F allow maximum lift height:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bthe maximum lift height that tri patch F allows can be obtained:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, then utilize the point of 3D solid, face, limit topological relation to find the tri patch adjacent with tri patch F, and continue the lift height calculating adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, then get h
tminfor the thickness that lower one deck is cut into slices;
If h
t≤ h
min, then stop calculating, get h
minfor the thickness that lower one deck is cut into slices;
If travel through this layer of all crossing tri patch, the h obtained
tall be more than or equal to h
max, then h is got
maxfor the thickness that lower one deck is cut into slices;
(5) carry out according to every thick intersection point set group to this layer of section layer by layer the outline line processing and obtain this section that sorts.
2. the hierarchical slicing method based on selective laser sintering according to claim 1, it is characterized in that, in described step (5) according to every thick intersection point set group to this layer of section layer by layer concrete steps that process obtains the outline line in this section of carrying out sorting be: obtain down thick from level to level by step (4), find the tri patch F that crossing with lower one deck section
0{ A, B, C} try to achieve two crossing intersection points, find and tri patch F according to topological relation
0adjacent tri patch F
1, and try to achieve next intersection point, travel through this layer of all crossing tri patch successively until arrive first tri patch F
0terminate, obtain the outline line of this layer of section.
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| CN105149791B (en) * | 2015-08-07 | 2017-03-08 | 武汉嘉铭激光有限公司 | A kind of big width laser etching system and control method |
| CN106925782B (en) * | 2017-01-19 | 2019-08-02 | 南京航空航天大学 | A kind of LMD laser manufacturing process based on bionic function |
| CN107671286B (en) * | 2017-09-26 | 2019-06-14 | 北京恒创增材制造技术研究院有限公司 | A method of improving metal 3D printing speed |
| CN108995219B (en) * | 2018-05-31 | 2021-04-20 | 共享智能铸造产业创新中心有限公司 | Slicing method with variable layer thickness, 3D printing method and 3D printed product |
| CN110889902B (en) * | 2018-09-11 | 2024-01-12 | 北京京东尚科信息技术有限公司 | Three-dimensional modeling method and device |
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