CN103922016A - Thermal-insulation heat-resisting package bag - Google Patents
Thermal-insulation heat-resisting package bag Download PDFInfo
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- CN103922016A CN103922016A CN201410152005.6A CN201410152005A CN103922016A CN 103922016 A CN103922016 A CN 103922016A CN 201410152005 A CN201410152005 A CN 201410152005A CN 103922016 A CN103922016 A CN 103922016A
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Abstract
The invention discloses a thermal-insulation heat-resisting package bag. The thermal-insulation heat-resisting package bag comprises a surface protecting layer and an inner thermal insulating layer, wherein the protecting layer is a coating layer made of lyotropic poly-p-phenylene terephthalamide, the thermal insulating layer is made of polypropylene plastics, antioxidants, stuffing bulking agents, heat stabilizers, light stabilizers and coupling agents, the antioxidants are p-phenylenediamine, the stuffing bulking agents are carborundum, the heat stabilizers are S,S'-double (Thioglycoic Acid di-iso-octyl sebacate) 2-n-octyl tin, the light stabilizers are phenyl salicylate, and the coupling agents are aminopropyltriethoxysilane. The thermal-insulation heat-resisting package bag has the advantages that the package bag is not prone to damage under high temperature, production cost is low, the inner polypropylene plastics are stable in quality, non-poisonous and non-pollution purposes are achieved, storage is safe, and the storage effect is good.
Description
Technical field
The present invention relates to plastic wrapping, particularly relate to a kind of thermal-insulation heat-resistant packaging bag.
Background technology
Plastics are to synthesize or natural macromolecule resin is main material.Add after various auxiliary agents, under certain temperature and pressure, be ductile, can fix a class material of its shape after cooling.Natural or synthetic macromolecule resin molecule is under molten condition, and the process of the auxiliary agent molecule that around distributes is uniformly plasticizing, has reached this process having plastified, and does not also reach, and is considered to not yet plastify.Plastic wrapping is one of four large materials in packing business: paper and cardboard account for 30%, and plastics account for 25%, and metal accounts for 25%, and glass accounts for 15%.The most material of existing plastic bag and structure are comparatively simple, at high temperature very easily damage, and productive costs is uprised, due to the problem of plastics own, some product has toxin, and the product being placed in plastic bag is impacted simultaneously, thereby personal safety is worked the mischief, and result of use is not good enough.
Summary of the invention
The technical matters that the present invention mainly solves is to provide a kind of thermal-insulation heat-resistant packaging bag, and this thermal-insulation heat-resistant packaging bag contributes to packaging bag to be at high temperature not easy to damage, and productive costs is low, inner acrylic plastering steady quality, nontoxic pollution-free, storage safe, stores effective.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of thermal-insulation heat-resistant packaging bag is provided, comprise the protective layer on top layer and the thermal insulation layer of internal layer, the dope layer that described protective layer consists of lyotropic polyparaphenylene terephthalamide, described thermal insulation layer is by acrylic plastering and antioxidant, extending agent, heat stabilizer, light stabilizer and coupling agent are made, described antioxidant is p-phenylenediamine (PPD), described extending agent is emery powdor, described heat stabilizer is S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-, described light stabilizer is septichen phenyl ester, described coupling agent is aminopropyl triethoxysilane.
In a preferred embodiment of the present invention, in described thermal insulation layer, the shared percentage by weight of each composition is respectively described acrylic plastering and accounts for 75.9%-80.4%, described p-phenylenediamine (PPD) accounts for 2.8%-3.7%, described emery powdor accounts for 11.4%-12.3%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.6%-2.5%, and described septichen phenyl ester accounts for 1.3%-2.2%, and described aminopropyl triethoxysilane accounts for 2.5%-3.4%.
In a preferred embodiment of the present invention, in described thermal insulation layer, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 79.9%, described p-phenylenediamine (PPD) accounts for 2.9%, described emery powdor accounts for 11.5%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.7%, and described septichen phenyl ester accounts for 1.4%, and described aminopropyl triethoxysilane accounts for 2.6%.
In a preferred embodiment of the present invention, in described thermal insulation layer, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 76.4%, described p-phenylenediamine (PPD) accounts for 3.6%, described emery powdor accounts for 12.2%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 2.4%, and described septichen phenyl ester accounts for 2.1%, and described aminopropyl triethoxysilane accounts for 3.3%.
In a preferred embodiment of the present invention, the thickness of described protective layer is 0.3mm, and the thickness of described thermal insulation layer is 0.2mm.
The invention has the beneficial effects as follows: the present invention contributes to packaging bag to be at high temperature not easy to damage, and productive costs is low, inner acrylic plastering steady quality, nontoxic pollution-free, storage safe, stores effective.
The specific embodiment
Fig. 1 is the cutaway view in thermal-insulation heat-resistant packaging bag one preferred embodiment of the present invention;
In accompanying drawing, each mark is as follows: 1, protective layer, 2, thermal insulation layer.
The specific embodiment
Below the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
A kind of thermal-insulation heat-resistant packaging bag, as shown in Figure 1, comprise the protective layer 1 on top layer and the thermal insulation layer 2 of internal layer, the dope layer that described protective layer 1 consists of lyotropic polyparaphenylene terephthalamide, described thermal insulation layer 2 is by acrylic plastering and antioxidant, extending agent, heat stabilizer, light stabilizer and coupling agent are made, described antioxidant is p-phenylenediamine (PPD), described extending agent is emery powdor, described heat stabilizer is S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-, described light stabilizer is septichen phenyl ester, described coupling agent is aminopropyl triethoxysilane.
Further, in described thermal insulation layer 2, the shared percentage by weight of each composition is respectively described acrylic plastering and accounts for 75.9%-80.4%, described p-phenylenediamine (PPD) accounts for 2.8%-3.7%, described emery powdor accounts for 11.4%-12.3%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.6%-2.5%, and described septichen phenyl ester accounts for 1.3%-2.2%, and described aminopropyl triethoxysilane accounts for 2.5%-3.4%.
Further, in described thermal insulation layer 2, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 79.9%, described p-phenylenediamine (PPD) accounts for 2.9%, described emery powdor accounts for 11.5%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.7%, and described septichen phenyl ester accounts for 1.4%, and described aminopropyl triethoxysilane accounts for 2.6%.
Further, in described thermal insulation layer 2, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 76.4%, described p-phenylenediamine (PPD) accounts for 3.6%, described emery powdor accounts for 12.2%, described S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 2.4%, and described septichen phenyl ester accounts for 2.1%, and described aminopropyl triethoxysilane accounts for 3.3%.
Further, the thickness of described protective layer 1 is 0.3mm, and the thickness of described thermal insulation layer 2 is 0.2mm.
The beneficial effect of thermal-insulation heat-resistant packaging bag of the present invention is: the present invention contributes to packaging bag to be at high temperature not easy to damage, and productive costs is low, inner acrylic plastering steady quality, and nontoxic pollution-free, storage safe, stores effective.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a thermal-insulation heat-resistant packaging bag, it is characterized in that: comprise the protective layer on top layer and the thermal insulation layer of internal layer, the dope layer that described protective layer consists of lyotropic polyparaphenylene terephthalamide, described thermal insulation layer is by acrylic plastering and antioxidant, extending agent, heat stabilizer, light stabilizer and coupling agent are made, described antioxidant is p-phenylenediamine (PPD), described extending agent is emery powdor, described heat stabilizer is S, two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-, described light stabilizer is septichen phenyl ester, described coupling agent is aminopropyl triethoxysilane.
2. thermal-insulation heat-resistant packaging bag according to claim 1, it is characterized in that, in described thermal insulation layer, the shared percentage by weight of each composition is respectively described acrylic plastering and accounts for 75.9%-80.4%, described p-phenylenediamine (PPD) accounts for 2.8%-3.7%, described emery powdor accounts for 11.4%-12.3%, described S, and two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.6%-2.5%, described septichen phenyl ester accounts for 1.3%-2.2%, and described aminopropyl triethoxysilane accounts for 2.5%-3.4%.
3. thermal-insulation heat-resistant packaging bag according to claim 2, it is characterized in that, in described thermal insulation layer, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 79.9%, described p-phenylenediamine (PPD) accounts for 2.9%, described emery powdor accounts for 11.5%, described S, and two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 1.7%, described septichen phenyl ester accounts for 1.4%, and described aminopropyl triethoxysilane accounts for 2.6%.
4. thermal-insulation heat-resistant packaging bag according to claim 2, it is characterized in that, in described thermal insulation layer, the shared percentage by weight of each composition is specially described acrylic plastering and accounts for 76.4%, described p-phenylenediamine (PPD) accounts for 3.6%, described emery powdor accounts for 12.2%, described S, and two (the different monooctyl ester of the sulfo-Glycolic acid) dioctyltins of S'-account for 2.4%, described septichen phenyl ester accounts for 2.1%, and described aminopropyl triethoxysilane accounts for 3.3%.
5. thermal-insulation heat-resistant packaging bag according to claim 1, is characterized in that, the thickness of described protective layer is 0.3mm, and the thickness of described thermal insulation layer is 0.2mm.
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CN201410152005.6A CN103922016A (en) | 2014-04-16 | 2014-04-16 | Thermal-insulation heat-resisting package bag |
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CN201410152005.6A CN103922016A (en) | 2014-04-16 | 2014-04-16 | Thermal-insulation heat-resisting package bag |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2503011Y (en) * | 2001-10-12 | 2002-07-31 | 吴兴国 | Combined flexible packing bag |
CN1428276A (en) * | 2001-12-28 | 2003-07-09 | 党令军 | Composite packaging bag |
CN1668667A (en) * | 2002-07-12 | 2005-09-14 | 纳幕尔杜邦公司 | Liquid crystalline polymers, processes for their manufacture, and articles thereof |
CN202319191U (en) * | 2011-11-02 | 2012-07-11 | 卓高泰(广州)包装有限公司 | High-temperature resistant food packaging sheet |
CN102827418A (en) * | 2012-09-14 | 2012-12-19 | 苏州谷力生物科技有限公司 | Polypropylene (PP) corrugated foam plastic film and preparation method thereof |
CN202895845U (en) * | 2012-10-29 | 2013-04-24 | 常州市贝瑞包装材料有限公司 | Polypropylene/EVOH (ethylene-vinyl alcohol copolymer) composite hard sheet |
CN203020685U (en) * | 2012-11-08 | 2013-06-26 | 沈阳信达信息科技有限公司 | Heat-resistant environment-friendly bag |
CN203306385U (en) * | 2013-06-13 | 2013-11-27 | 天津市有为印刷包装有限公司 | Food package bag |
-
2014
- 2014-04-16 CN CN201410152005.6A patent/CN103922016A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2503011Y (en) * | 2001-10-12 | 2002-07-31 | 吴兴国 | Combined flexible packing bag |
CN1428276A (en) * | 2001-12-28 | 2003-07-09 | 党令军 | Composite packaging bag |
CN1668667A (en) * | 2002-07-12 | 2005-09-14 | 纳幕尔杜邦公司 | Liquid crystalline polymers, processes for their manufacture, and articles thereof |
CN202319191U (en) * | 2011-11-02 | 2012-07-11 | 卓高泰(广州)包装有限公司 | High-temperature resistant food packaging sheet |
CN102827418A (en) * | 2012-09-14 | 2012-12-19 | 苏州谷力生物科技有限公司 | Polypropylene (PP) corrugated foam plastic film and preparation method thereof |
CN202895845U (en) * | 2012-10-29 | 2013-04-24 | 常州市贝瑞包装材料有限公司 | Polypropylene/EVOH (ethylene-vinyl alcohol copolymer) composite hard sheet |
CN203020685U (en) * | 2012-11-08 | 2013-06-26 | 沈阳信达信息科技有限公司 | Heat-resistant environment-friendly bag |
CN203306385U (en) * | 2013-06-13 | 2013-11-27 | 天津市有为印刷包装有限公司 | Food package bag |
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Application publication date: 20140716 |