CN103913876A - Dry etching carrying device and dry etching device - Google Patents
Dry etching carrying device and dry etching device Download PDFInfo
- Publication number
- CN103913876A CN103913876A CN201410098750.7A CN201410098750A CN103913876A CN 103913876 A CN103913876 A CN 103913876A CN 201410098750 A CN201410098750 A CN 201410098750A CN 103913876 A CN103913876 A CN 103913876A
- Authority
- CN
- China
- Prior art keywords
- diaphragm
- dry etching
- bogey
- substrate
- dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The invention relates to the technical field of manufacture for liquid crystal display devices, and discloses a dry etching carrying device and a dry etching device. The dry etching carrying device comprises a base station, a plurality of dry etching electrodes and protective films. The dry etching electrodes are arranged on the base station and are used for supporting substrates; each protective film sleeves the corresponding dry etching electrode and separates the dry etching electrode from the corresponding substrate, and the Vickers hardness of the protective films is lower than the Vickers hardness of the substrates. According to the technical scheme, the dry etching carrying device and the dry etching device have the advantages that the substrates are in direct contact with the protective films, and the Vickers hardness of the protective films is lower than the Vickers hardness of the substrates, so that the substrates can be prevented from being scratched by the protective films when the substrates and the protective films slide relatively, the safety of the substrates can be improved during etching, a reject ratio of the etched substrates can be reduced, and the quality of the etched substrates can be improved.
Description
Technical field
The present invention relates to the technical field that liquid crystal indicator is produced, refer more particularly to a kind of bogey for dry etching and dry etching device.
Background technology
In liquid crystal indicator production industry, glass substrate, in the time carrying out dry etching, generally adopts plasma to carry out etching to glass substrate, fixes if glass substrate is not carried out to position in this process, glass substrate will drift about, and affects etching effect and accuracy.For fixing glass substrate, general lower base station in dry etching device uses the dry electrostatic force absorption glass substrate that electrode produces of carving, concrete, while being positioned at the plasma etching of substrate top, produce negative charge, dry electrode generation at the quarter positive charge of supporting substrate, utilize electrostatic adsorption to be fixed glass substrate, prevent its drift.The bogey using when dry quarter as shown in Figure 1, comprise base station 1, on this base station 1, there are multiple pores 3, be arranged on the multiple electrodes 2 at dry quarter for support glass substrate on base station 1, because the dry electrode 2 of carving is coated higher than the pottery of glass substrate by hardness, under the impact of long-term electrostatic interaction and other factors, dry other materials of having carved electrode 2 surface precipitations, and easily stick to firmly glass substrate lower surface, therefore finish dry quarter, when glass substrate lifts from bogey, glass substrate lower surface is very easily scratched by the utmost point, form many small slight cracks (line), and in subsequent technique, there is fast rise (reaching 300 ℃) and fast-descending (room temperature) in the temperature of glass substrate, cause glass substrate slight crack to expand, and glass substrate inside is formed to certain destruction, carve with dry that electrode 2 contacts and the glass substrate homogeneity of peripheral position reduces, in the time that light passes through, easily cause scattering of light, formation stamp is bad.
Summary of the invention
The invention provides a kind of bogey and dry etching device, in order to improve the security of substrate when the etching, reduce the fraction defective after etching, improve the quality after base plate carving and corrosion.
The invention provides a kind of bogey for dry etching, this bogey comprises:
Base station;
Be arranged at described base station the electrode at multiple dry quarter for supporting substrate;
Be set in electrode by the diaphragm of described dry quarter electrode and described substrate isolates at each dry quarter, and the webster hardness of described diaphragm is lower than the webster hardness of described substrate.
In technique scheme; substrate directly contacts with diaphragm; because the webster hardness of diaphragm is lower than the webster hardness of substrate; therefore; while occurring sliding between substrate and diaphragm, diaphragm can not scratch substrate, has improved the security of substrate in the time of etching; reduce the fraction defective after etching, and then improved the quality after base plate carving and corrosion.
Preferably, in the time of described diaphragm and described substrate contacts, the diameter of the contact area of described diaphragm and described substrate is between 0.3mm～0.5mm.Define the contact area of diaphragm and substrate, avoid contacting excessive.
Preferably, in described diaphragm the thickness of the part above described dry quarter electrode tip between 0.2mm～0.7mm.Guarantee that dry quarter, electrode can be lived substrate by Electrostatic Absorption.
Preferably, described multiple diaphragm connects by junctional membrane.Be convenient to installation and the production of diaphragm.
Preferably, described multiple diaphragm and described junctional membrane are structure as a whole.Be convenient to installation and the production of diaphragm.
Preferably, described junctional membrane is fixedly connected with described base station by web member.Make dry the quarter on electrode that be fixed on that diaphragm can be stable.
Preferably, described junctional membrane is connected with described base station is bonding.By bonding agent, diaphragm is fixed on to dry quarter on electrode.
Preferably, described diaphragm is organic composite material diaphragm, plastic protective film for plastics or resin protection film.There is stronger support strength and lower webster hardness.
Preferably, described diaphragm is teflon diaphragm or acrylic resin diaphragm.There is stronger support strength and lower webster hardness.
The present invention also provides a kind of dry etching device, and this dry etching device comprises above-mentioned any bogey.
In technique scheme; substrate directly contacts with diaphragm; because the webster hardness of diaphragm is lower than the webster hardness of substrate; therefore; while occurring sliding between substrate and diaphragm; diaphragm can not scratch substrate, has improved the security of substrate in the time of etching, and then has improved the quality after base plate carving and corrosion.
Accompanying drawing explanation
Fig. 1 is the structural representation of bogey of the prior art;
The structural representation of the bogey that Fig. 2 provides for the embodiment of the present invention;
The use state reference map that the diaphragm that Fig. 3 provides for the embodiment of the present invention and junctional membrane are structure as a whole;
The structural representation of the diaphragm that the xsect that Fig. 4 provides for the embodiment of the present invention is taper;
The structural representation of the diaphragm that the xsect that Fig. 5 provides for the embodiment of the present invention is arc.
Reference numeral:
The dry electrode 3-pore of carving of 1-base station 2-
4-diaphragm 5-junctional membrane 6-web member
Embodiment
In order to improve the security of substrate when the etching, reduce the fraction defective after etching, and then improved the quality after base plate carving and corrosion, the embodiment of the present invention provides a kind of bogey.In technical scheme of the present invention; be set with the diaphragm of webster hardness lower than substrate dry quarter on electrode, make dry carve electrode in the time of bearing substrate by diaphragm and substrate contacts, avoided substrate to be scratched; improve the security of substrate in the time of etching, and then improved the quality after base plate carving and corrosion.For making the object, technical solutions and advantages of the present invention clearer, below as an example of nonrestrictive embodiment example, the present invention is described in further detail.
As shown in Figure 2, Fig. 2 shows the structure of the bogey that the embodiment of the present invention provides, and in the present embodiment, describes as an example of glass substrate example.
The embodiment of the present invention provides a kind of bogey for dry etching, and this bogey comprises:
Base station 1;
Be arranged at base station 1 electrode 2 at multiple dry quarter for supporting substrate;
Be set in electrode 2 will dryly carve the diaphragm 4 of electrode 2 and substrate isolates at each dry quarter, and the webster hardness of diaphragm 4 is lower than the webster hardness of substrate.
In the above-described embodiments; substrate supports by bogey in the time of etching, and now, substrate directly contacts with diaphragm 4; and by the dry static of carving electrode 2, substrate adsorption is fixed; because the webster hardness of diaphragm 4 is lower than the webster hardness of substrate, therefore, while occurring sliding between substrate and diaphragm 4; diaphragm 4 can not scratch substrate; improve the security of substrate in the time of etching, reduced the fraction defective after etching, and then improved the quality after base plate carving and corrosion.
Diaphragm 4 is wherein organic composite material diaphragm 4, plastic protective film for plastics 4 or resin protection film 4.Concrete, this diaphragm 4 can be by teflon, polyacrylic resin is that the physical and chemical stability of main material is good and high temperature resistant, high strength, impact-resistant organic composite material or other plastics, resin material is prepared from, as: teflon, this material is except above-mentioned performance, also there is excellent resistance to chemical corrosion, also there is an excellent mechanical property-friction factor little, its friction factor is between 0.01～0.10, add that its webster hardness is also less than glass substrate, therefore can not damage glass substrate, also can under special producing environment, stablize use.In addition, in order to reach request for utilization, can use graphite, molybdenum disulfide, alundum (Al2O3), glass, carbon fiber as filling material, improve pure teflon mechanical property.And acrylic resin is selected impact resistance acrylic resin, it it is added after the elastic body impact modifying agents such as EP rubbers, polyolefin, also has stronger physical and mechanical property and shock resistance except having the excellent properties of conventional acrylic resin.
The electrode at dry quarter arranging on base station 12 adopts arrayed or other mode to arrange; diaphragm 4 with each dry quarter electrode 2 corresponding one by one; because dry quarter between electrode 2 isolated; therefore; in order to facilitate the installation of diaphragm 4, preferably, multiple diaphragms 4 connect by junctional membrane 5; thereby facilitate diaphragm 4 being sleeved on dry location while carving on electrode 2, be convenient to the installation of diaphragm 4.Better; as a kind of preferred version; multiple diaphragms 4 are structure as a whole with junctional membrane 5; thereby be convenient to production and the installation of diaphragm 4; meanwhile, diaphragm 4 and the dry strength of joint of carving between electrode 2 have been strengthened, there is relative motion between glass substrate and diaphragm 4 time; diaphragm 4 disperses power by junctional membrane 5, thereby has guaranteed dry the quarter on electrode 2 that be sleeved on that diaphragm 4 can be stable.
In the time that diaphragm 4 is made, diaphragm 4 and junctional membrane 5 can adopt one-body molded, increase the stability of diaphragm 4, can adopt different production technologies in concrete preparation process, as: the method preparations such as extrusion modling, die methods or 3D printing.Whole diaphragm is the film of whole Zhang Yiti after preparing, and diaphragm 4 on every two electrodes connects by junctional membrane 5.Meanwhile, existing dry quarter has pore 3 on electrode 2 base station 1, has the through hole mating with this pore 3, thereby guarantee that the cold air blowing out from pore 3 can contact with glass substrate on junctional membrane 5.For the cold air that guarantees to blow out can fully contact with glass substrate, preferably, in the time that diaphragm 4 contacts with glass substrate, the diameter of the contact area of diaphragm 4 and substrate is between 0.3mm～0.5mm.Concrete; diaphragm 4 can occur in the time contacting with glass substrate must deformation; form a circular surface of contact; in order to guarantee that cold air can fully contact with glass substrate; therefore; diaphragm 4 is the smaller the better with the contact area of glass substrate, preferably, the diameter of this circle surface of contact can be 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm etc. any between 0.3mm to the numerical value between 0.5mm.
In the time of bogey support glass substrate; need to glass substrate be fixed by the dry static of carving on electrode 2; therefore; the dry thickness of carving the diaphragm 4 on electrode 2 can not be too thick; to guarantee that the dry static of carving on electrode 2 can adsorb glass substrate; preferably, in described diaphragm 4 thickness of the part above described dry electrode at quarter 2 tops between 0.2mm～0.7mm.At the thickness of the diaphragm 4 on dry top of carving electrode 2 between 0.2mm～0.7mm, the thickness that is positioned at the dry diaphragm 4 of carving electrode 2 tops can be: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm etc. are any thickness value between 0.2mm～0.7mm arbitrarily.Better, this thickness is chosen as 0.5mm, has guaranteed that diaphragm 4 has certain thickness, makes diaphragm 4 can have enough intensity, and the excessive breakage that causes of avoiding wearing and tearing meanwhile, has also guaranteed that the static that dry quarter, electrode 2 produced can adsorb glass substrate.
The contour structures of diaphragm 4 can be selected different shapes; as: as described in the xsect of diaphragm 4 be cone-shaped shape as shown in Figure 3 and Figure 4; also can adopt arc surfaced shape as shown in Figure 5, or other any enforceable contour structures, will not enumerate at this.
Can find out by foregoing description, diaphragm 4 only needs to carve electrode 2 by doing and glass substrate is kept apart, the diaphragm 4 that only need be positioned at dry top, top of carving electrode 2 has certain thickness, and diaphragm 4 is not excessive with the contact area of glass substrate, for the feature at diaphragm 4 other positions without limiting, therefore, diaphragm 4 other parts can adopt hollow out or other structures even to reduce its cost, also can adopt the dry structure of carving electrode 2 that wraps as shown in Figure 3 and Figure 4 simultaneously, its concrete structure can be determined according to practical condition.
In the time of diaphragm 4 concrete installation; can adopt different connected modes to be fixed; as fixing by web member 6; or bonding by bonding agent, as shown in Figure 4 and Figure 5, adopt and using web member 6 to be fixed on base station 1 every one section of suitable distance; as shown in Figure 3; adopt cementing agent, junctional membrane 5 is close on base station 1, thereby guarantee flatness and the stability of the bogey after attaching.
The embodiment of the present invention also provides a kind of dry etching device, and this dry etching device comprises above-mentioned any bogey.
In the above-described embodiments; adopt substrate directly to contact with diaphragm 4; and by the dry static of carving electrode 2, substrate adsorption is fixed; because the webster hardness of diaphragm 4 is lower than the webster hardness of substrate, therefore, while occurring sliding between substrate and diaphragm 4; diaphragm 4 can not scratch substrate; improve the security of substrate in the time of etching, reduced the fraction defective after etching, and then improved the quality after base plate carving and corrosion.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (10)
1. for a bogey for dry etching, it is characterized in that, comprising:
Base station;
Be arranged at described base station the electrode at multiple dry quarter for supporting substrate;
Be set in electrode by the diaphragm of described dry quarter electrode and described substrate isolates at each dry quarter, and the webster hardness of described diaphragm is lower than the webster hardness of described substrate.
2. bogey as claimed in claim 1, is characterized in that, in the time of described diaphragm and described substrate contacts, the diameter of the contact area of described diaphragm and described substrate is between 0.3mm～0.5mm.
3. bogey as claimed in claim 1, is characterized in that, the thickness of the part in described diaphragm above described dry quarter electrode tip is between 0.2mm～0.7mm.
4. the bogey as described in claim 1～3 any one, is characterized in that, described multiple diaphragms connect by junctional membrane.
5. bogey as claimed in claim 4, is characterized in that, described multiple diaphragms and described junctional membrane are structure as a whole.
6. bogey as claimed in claim 5, is characterized in that, described junctional membrane is fixedly connected with described base station by web member.
7. bogey as claimed in claim 5, is characterized in that, described junctional membrane is connected with described base station is bonding.
8. bogey as claimed in claim 5, is characterized in that, described diaphragm is organic composite material diaphragm, plastic protective film for plastics or resin protection film.
9. bogey as claimed in claim 8, is characterized in that, described diaphragm is teflon diaphragm or acrylic resin diaphragm.
10. a dry etching device, is characterized in that, comprises the bogey as described in claim 1～9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410098750.7A CN103913876B (en) | 2014-03-17 | 2014-03-17 | A kind of bogey and dry etching device for dry etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410098750.7A CN103913876B (en) | 2014-03-17 | 2014-03-17 | A kind of bogey and dry etching device for dry etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103913876A true CN103913876A (en) | 2014-07-09 |
| CN103913876B CN103913876B (en) | 2017-07-04 |
Family
ID=51039678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410098750.7A Expired - Fee Related CN103913876B (en) | 2014-03-17 | 2014-03-17 | A kind of bogey and dry etching device for dry etching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103913876B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106094269A (en) * | 2016-06-20 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of etching device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101192557A (en) * | 2006-11-30 | 2008-06-04 | 佳能安内华股份有限公司 | Power supply apparatus and deposition method using the power supply apparatus |
| CN101246836A (en) * | 2007-02-14 | 2008-08-20 | 东京毅力科创株式会社 | Substrate carrying platform and process method for its surface |
| CN101261952A (en) * | 2007-03-06 | 2008-09-10 | 东京毅力科创株式会社 | Substrate carrying bench and substrate treatment device |
| CN202307791U (en) * | 2011-11-15 | 2012-07-04 | 北京京东方光电科技有限公司 | Dry etching bottom electrode and dry etching device |
| CN103149751A (en) * | 2013-02-19 | 2013-06-12 | 北京京东方光电科技有限公司 | Lower part electrode and manufacturing method thereof |
| CN103177920A (en) * | 2011-12-26 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Etching device with rectangular inductive coupling coil |
| CN203084388U (en) * | 2013-02-19 | 2013-07-24 | 北京京东方光电科技有限公司 | Lower part electrode |
| CN103500695A (en) * | 2013-10-08 | 2014-01-08 | 京东方科技集团股份有限公司 | Dry etching lower electrode and dry etching device |
-
2014
- 2014-03-17 CN CN201410098750.7A patent/CN103913876B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101192557A (en) * | 2006-11-30 | 2008-06-04 | 佳能安内华股份有限公司 | Power supply apparatus and deposition method using the power supply apparatus |
| CN101246836A (en) * | 2007-02-14 | 2008-08-20 | 东京毅力科创株式会社 | Substrate carrying platform and process method for its surface |
| CN101261952A (en) * | 2007-03-06 | 2008-09-10 | 东京毅力科创株式会社 | Substrate carrying bench and substrate treatment device |
| CN202307791U (en) * | 2011-11-15 | 2012-07-04 | 北京京东方光电科技有限公司 | Dry etching bottom electrode and dry etching device |
| CN103177920A (en) * | 2011-12-26 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Etching device with rectangular inductive coupling coil |
| CN103149751A (en) * | 2013-02-19 | 2013-06-12 | 北京京东方光电科技有限公司 | Lower part electrode and manufacturing method thereof |
| CN203084388U (en) * | 2013-02-19 | 2013-07-24 | 北京京东方光电科技有限公司 | Lower part electrode |
| CN103500695A (en) * | 2013-10-08 | 2014-01-08 | 京东方科技集团股份有限公司 | Dry etching lower electrode and dry etching device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106094269A (en) * | 2016-06-20 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of etching device |
| CN106094269B (en) * | 2016-06-20 | 2019-01-11 | 京东方科技集团股份有限公司 | A kind of etching device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103913876B (en) | 2017-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI683748B (en) | Laminated glass article and method for forming the same | |
| CN104851889A (en) | Foldable substrate, manufacturing method thereof, and flexible display device | |
| RU2012151319A (en) | ELECTRICAL CONNECTIONS IN ELECTRONIC CONTACT LENSES | |
| US20150041049A1 (en) | Method for making curved touch module | |
| CN102785384B (en) | Flattening device | |
| CN103913876A (en) | Dry etching carrying device and dry etching device | |
| TW200724379A (en) | Thermoplastic resin sheets provided with functionality by transfer method and their production processes | |
| Yang et al. | Versatile Agar‐Zwitterion Hybrid Hydrogels for Temperature Self‐Sensing and Electro‐Responsive Actuation | |
| CN103811332B (en) | A kind of lower electrode base station and dry etching equipment of dry etching equipment | |
| CN205404935U (en) | Glass spheric glass is plane with separator and holds camera lens that leans on | |
| CN203484180U (en) | Portable test-tube rack | |
| CN109056049B (en) | Preparation method of nano porous silicon biconcave lens | |
| CN109056050A (en) | A kind of preparation method of nano-structure porous silicon biconvex lens | |
| CN205765396U (en) | A kind of fixture for optical glass | |
| CN205427380U (en) | Prevent liquid crystal display of static | |
| CN204176442U (en) | A kind of LED flat lamp being convenient for changing LED light source | |
| CN111765908A (en) | Method for preparing silver nanowire embedded PDMS flexible capacitive sensor based on template method | |
| CN201859841U (en) | Silicon wafer marking device | |
| CN104777925A (en) | Plate and preparation method thereof | |
| CN203784827U (en) | Novel LED lens for backlight of liquid crystal display | |
| CN203922995U (en) | Random self-supporting vacuum isolation component | |
| CN109616573B (en) | Laser peeling device for flexible substrate and laser peeling method for flexible substrate | |
| CN203325834U (en) | Support pin and plasma etching apparatus | |
| TWI273322B (en) | Backlight module | |
| CN209110866U (en) | A kind of sand extension jig for optical mirror slip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20200317 |