CN103912808A - LED (light emitting diode) luminous subassembly and lamp thereof - Google Patents
LED (light emitting diode) luminous subassembly and lamp thereof Download PDFInfo
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- CN103912808A CN103912808A CN201410102232.8A CN201410102232A CN103912808A CN 103912808 A CN103912808 A CN 103912808A CN 201410102232 A CN201410102232 A CN 201410102232A CN 103912808 A CN103912808 A CN 103912808A
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Abstract
The invention discloses an LED (light emitting diode) luminous subassembly. The LED luminous subassembly comprises an LED luminous body and an L-shaped support, wherein the LED luminous body can emit light in the double directions; the L-shaped support is used for fixing the luminous body and is made of materials with high heat-conduction characteristics; a U-shaped notch is formed in the middle of a vertical end of the L-shaped support; the LED luminous body which can emit light in the double directions is fixed with the support body on two sides of the U-shaped notch through a welding layer; and a luminous chip of the LED luminous body is correspondingly arranged on the U-shaped notch. By using the technical scheme, the structure stability on the LED luminous body and the support is improved, and the heat dissipation efficiency of the LED luminous body is improved. Moreover, the LED luminous subassembly is low in manufacturing cost, and can be widely applied to lamps such as bulb lamps and candle lamps.
Description
Technical field
The present invention relates to a kind of LED luminescence component, particularly relate to and a kind ofly can realize the LED luminescence component of all-round optical illumination and the applied light fixture of this luminescence component.
Background technology
Traditional LED luminescence component often can only be realized unidirection luminous, and as shown in Figure 1, LED luminescence chip 4 is arranged on the surface of substrate 3, its light-emitting area can only be unidirection luminous towards deviating from substrate one side, its lighting angle is less than 180 °, and its light intensity middle part is concentrated, and surrounding progressively decays.
Then industry is developed again the LED luminescence component of a all-round light, as shown in Fig. 2-1, this luminescence component is provided with an aluminium base 100, Yan Xiang the same side, edge of this aluminium base 100 is provided with some bending parts 110 to upper process, adopt the monolateral mode of pasting to be provided with a LED light emitting source 200 with capable of bidirectional luminescence at the top of this bending part 110, this LED light source 200 is general adopts transparency carrier 210 as the carrier of LED luminescence chip and for the bending part 110 of the aluminium base 100 that bonds, the material of this transparency carrier 210 is generally made up of clear glass or sapphire glass, belong to easy crisp material, and owing to pasting fixing by pad 220 between this transparency carrier 210 and the bending part 110 of aluminium base 100, because the area of pad 220 is limited, once cause this luminescence component to occur collision in transportation, vibrations, when the non-controllable factors such as impact, the transparency carrier 210 of pasting/being welded on bending part 110 by pad is prone to fracture, cause whole group of luminescence component to be scrapped, luminescence chip 230 is installed on transparency carrier 210 simultaneously, because transparency carrier 210 adopts clear glass or sapphire glass material, material itself does not have heat conduction effect, therefore the power of LED luminescence chip 230 disposed thereon less (being generally no more than 0.2W), the utilization that cannot carry high-power LED luminescence chip, finally between aluminium base 100 and transparency carrier 210, lack the design of dielectric voltage withstand due to this technical scheme, referring to Fig. 2-2, conducting channel 120 on aluminium base 100 is powered to the LED luminescence chip 23 ' on transparency carrier 210 by pad 220, but the bonding that will realize transparency carrier 210 and aluminium base bending part 110 due to pad 220 is fixed, realize again LED luminescence chip 230 is powered, therefore the area of pad 220 can not be too small, but because the width of aluminium base 100 bending parts 110 is limited, finally cause pad 220 too short with the frontier distance of the vertical and horizontal of aluminium base bending part 110, as shown in the figure, its border of being laterally close to bending part 110 is without creep age distance, and longitudinal creep age distance H ' is too short, be less than 2mm, therefore easily produce high voltage flash flower phenomenon and (see Fig. 2-3, Fig. 2-4), cannot test by dielectric voltage withstand.
Summary of the invention
Main purpose of the present invention is to provide a kind of Stability Analysis of Structures, the good all-round smooth LED luminescence component of heat-conducting effect.
Secondary objective of the present invention is to guarantee the demand of this LED luminescence component dielectric voltage withstand.
The 3rd object of the present invention is to realize the practical application of above-mentioned LED luminescence component in light fixture.
For achieving the above object, technical solution of the present invention is:
A kind of LED luminescence component, it has the LED illuminator of capable of bidirectional luminescence and for fixing the L-type support of this illuminator, the LED illuminator of described capable of bidirectional luminescence comprises a transparency carrier, LED luminescence chip, the positive and negative surface of this transparency carrier is respectively the first first type surface and the second first type surface, on the first first type surface, be provided with the first conducting channel, described LED luminescence chip is arranged on the first first type surface, and the first conducting channel is electrically connected with LED luminescence chip; Described L-type support is made up of the transverse end that has the vertical end of thermal conduction characteristic and have heat conduction, insulation characterisitic concurrently; Described vertical end middle part is provided with breach, and the width of this breach is more than or equal to the width of LED luminescence chip on LED illuminator, and is less than the width of transparency carrier; Described transverse end cross section comprises electrode layer, insulating barrier and heat-conducting layer from top to bottom, and its electrode layer is provided with the second conducting channel, and this second conducting channel is mutually gone here and there by the wire of a shell wrap insulate layer with the first conducting channel or be in parallel; Transparency carrier on described LED illuminator is vertically held and is interfixed by weld layer and L-type support, and its luminescence chip correspondence is arranged on this breach.
Further, the weld layer on described transparency carrier is greater than based on corresponding safe voltage and corresponding standard creep age distance with the minimum range between the first conducting channel on the first first type surface.
Further, the first described conducting channel and the second conducting channel respectively to L-type support vertically the heat-conducting layer minimum range of end and transverse end be all greater than based on corresponding safe voltage and corresponding standard creep age distance.
Further, the aluminium base that described L-type support is formed in one or be jointly spliced to form by the aluminium base of the heat pipe of vertically holding and transverse end.
Further, it also comprises wavelength conversion layer, and it is arranged on described light-emitting diode chip for backlight unit, the first first type surface and the second first type surface.
Further, the width of described L-type support breach is more than or equal to the width of wavelength conversion layer on LED illuminator, and is less than the width of transparency carrier.
Further, described transparency carrier is transparent alumina or aluminium nitride ceramics.
Further, the transverse end of described L-type support can be provided with some unidirection luminous bodies.
A light fixture that uses the LED luminescence component that technique scheme makes, this light fixture is made up of lamp adapter assembly, radiating seat, lampshade and luminescence component, and this luminescence component is arranged on radiating seat.
Further, this light fixture comprises two groups of luminescence components, the transverse end of the L-type support of these two groups of luminescence components side by side, and its vertically end relatively arrange, the first first type surface of these two groups of luminescence components arranges in opposite directions simultaneously.
Further, described luminescence component be less than the air line distance to lampshade perpendicular to the second first type surface perpendicular to the first first type surface to the air line distance of lampshade
Further, the vertical end of the L-type support of two groups of described luminescence components is arranged side by side and in line.
Further, the L-type support of the described luminescence component vertically height of end approaches lampshade, and the irradiating angle that is arranged on the LED luminescence chip on L-type support breach is just larger, and the range of exposures of whole group of light fixture is just larger.
Adopt after such scheme, can be achieved as follows useful technique effect:
1,, because transparency carrier interfixes by the aluminium base of weld layer and U-shaped breach both sides, one guarantees that capable of bidirectional luminescence LED illuminator glazed thread can see through U-shaped breach and outwards carry out light radiation, realizes the illumination of the all-round light of LED luminescence component;
2, increased the weld layer area between transparency carrier and aluminium base or heat pipe, that guarantees that LED luminescence component can be very firm is arranged on aluminium base, even if in transportation, there is inevitably extruding, collision, impact and can not cause fracture or the damage between illuminator and aluminium base;
3, the weld layer on transparency carrier is greater than based on corresponding safe voltage and corresponding standard creep age distance with the minimum range between the first conducting channel on the first first type surface, simultaneously owing to going here and there by wire between the first conducting channel, the second conducting channel or parallel connection, guarantee that the first conducting channel, the second conducting channel are all greater than based on corresponding safe voltage and corresponding standard creep age distance to the heat-conducting layer minimum range H of L-type support, can guarantee this group luminescence component dielectric voltage withstand needs;
4, this transparency carrier adopts transparent alumina or aluminium nitride ceramics, compare traditional clear glass or sapphire glass, there is preferably thermal conduction characteristic, the heat that can guarantee to be arranged on the LED luminescence chip on this substrate sees through this transparency carrier and outwards spreads, simultaneously as mentioned above, the U-shaped breach of aluminium base the contact area having increased between transparency carrier and aluminium base is set, the transparency carrier that further promotes the heat of LED luminescence chip to see through to have thermal conduction characteristic by aluminium base or heat pipe rapidly to external diffusion (as radiating seat etc.), greatly reduce heat on LED luminescence chip, improve the service life of whole LED luminescence component, realize the business application of high-capacity LED luminescence chip simultaneously.
5, by this luminescence component practice in LED light fixture, as bulb lamp, candle lamp, meet at some high power LED lamps that specific area needs lumen degree is high, range of exposures is wide, and simple and easy, the Stability Analysis of Structures of above-mentioned lamp assembly assembling, excellent in heat dissipation effect, long service life.
Brief description of the drawings
Fig. 1 is unidirection luminous LED light fixture schematic diagram in background technology;
Fig. 2-1st, a kind of all-round smooth LED luminescence component schematic diagram in background technology;
Fig. 2-2nd, power supply circuits connection diagram in background technology;
Fig. 2-3 are to Fig. 2-4th, the spark-over schematic diagram that background technology exists in the time carrying out electric insulation voltage-withstand test;
Fig. 3-1 is to Fig. 3-3rd, the parts explosion of LED luminescence component of the present invention and installation diagram;
Fig. 3-4th, LED luminescence component L-type support transverse end of the present invention is with the schematic diagram of LED illuminator;
Fig. 4 is the schematic diagram that LED luminescence component of the present invention applies to bulb lamp;
Fig. 5 is the schematic diagram that LED luminescence component of the present invention applies to candle lamp.
Detailed description of the invention
For the technical scheme of the present invention of further explaining, below by specific embodiment, the present invention is specifically addressed.
If Fig. 3-1 is to as shown in Fig. 3-4, a kind of LED luminescence component, comprises that one has the LED illuminator 1 of capable of bidirectional luminescence and for fixing the L-type support 2 of this illuminator.
The LED illuminator 1 of this capable of bidirectional luminescence comprises a transparency carrier 11, LED luminescence chip 12 and wavelength conversion layer 13.This transparency carrier 11 is made up of transparent alumina or aluminium nitride ceramics, material itself has certain thermal conduction characteristic but does not have conductive characteristic, it just, anti-surface is respectively the first first type surface 111 and the second first type surface 112, on the first first type surface, be provided with first conducting channel 113 of powering for LED luminescence chip 12, described LED luminescence chip 12 is arranged on the first first type surface 111, and have at least part light to transmit from the second first type surface 112 through the first first type surface 111, therefore LED luminescence chip 12 is greater than the light intensity that transmits the second main light emission face from the second first type surface 112 from the first first type surface 111 to the light intensity of extraradial the first main light emission face, described wavelength is changed 13 layers and is arranged at described light-emitting diode chip for backlight unit 12, on the first first type surface 111 and the second first type surface 112, described wavelength conversion layer 13 absorbs the light that described light-emitting diode chip for backlight unit 12 sends at least partly, and convert the wavelength of different range to, as white light etc.,
Described L-type support 2 is made up of with the transverse end 201 that has heat conduction and insulation characterisitic concurrently the vertical end 200 with thermal conduction characteristic, described transverse end cross section comprises electrode layer from top to bottom, insulating barrier and heat-conducting layer (not shown), this L-type support 2 can be made up of integrated aluminium base, also can use aluminium base by transverse end 201, and vertically hold 200 use metal heat-conducting materials or heat pipe is spliced to form jointly, , vertically be provided with breach in the middle part of end 200 at this support 2, this breach is U-shaped breach 21, its width is more than or equal to the width of LED luminescence chip 12 on LED illuminator 1, and be less than 11 width of transparency carrier, guarantee that light can see through this breach and outwards carry out light radiation, electrode layer in these L-type support 2 transverse end 201 is provided with the second conducting channel 114, transparency carrier 11 on described LED illuminator 1 vertically holds 200 to interfix by weld layer 22 and L-type support 2, i.e. the rack body of U-shaped breach 21 both sides, and its luminescence chip 12 correspondences are arranged on this U-shaped breach 21,
Simultaneously weld layer 22 is greater than based on corresponding safe voltage and corresponding standard creep age distance with the minimum range H between the first conducting channel 113 on the first first type surface 111, because the scolding tin of weld layer 22 belongs to easy conductive material, transparency carrier 11 belongs to insulation material, when the first conducting channel 113 to the distance of weld layer 22 is greater than based on corresponding safe voltage and corresponding standard creep age distance, ensure its dielectric voltage withstand characteristic.
Owing to going here and there by the wire 115 of shell wrap insulate layer between the first conducting channel 113, the second conducting channel 114 or parallel connection, guarantee that wire 115 is in galvanization simultaneously, can not destroy whole group of luminescence component dielectric voltage withstand characteristic;
And the first conducting channel 113, the second conducting channel 114 respectively to the vertical end 200 of L-type support or aluminium transverse end 201 heat-conducting layer minimum range H be all greater than based on corresponding safe voltage and corresponding standard creep age distance, because the heat-conducting layer of the vertical end 200 of L-type support and transverse end 201 is electric conductor, the first conducting channel 113, the second conducting channel 114 are had to enough safety creepage distances between above-mentioned electric conductor, meet the requirement of this luminescence component dielectric voltage withstand, the electric heating of simultaneously realizing product separates;
The transverse end of this L-type support 2 can have additional several unidirection luminous bodies 23 simultaneously, for increasing the light intensity of the transverse end (horizontal ends) of this luminescence component.
As shown in Figure 4, this figure has shown the embodiment that applies to bulb lamp of this luminescence component, this bulb lamp comprises lamp adapter assembly 31, radiating seat 32, lampshade 33 and two groups adopt the luminescence component 34 that technical scheme is made above, the transverse end 3412 of the L-type support 341 of these two groups of luminescence components 34 side by side, and it vertically holds 3411 to be relatively arranged on radiating seat 32, and the first first type surface 342 of two groups of luminescence components arranges in opposite directions, be provided with several unidirection luminous LED illuminators 35 in the transverse end 3412 of L-type support 341, adopt 2 groups of luminescence components to arrange seat mode, because the first first type surface 342 arranges in opposite directions, LED luminescence component 34 is near lampshade 33, and the first main light emission face 342 is towards lampshade 33 positions, , be less than the air line distance to lampshade 33 perpendicular to the second first type surface 343 perpendicular to the first first type surface 342 to the air line distance of lampshade 33, therefore the brightness of bulb lamp side and visual angle have been increased, the some unidirection luminous LED illuminator 35 at L-type support transverse end place simultaneously, increase the light intensity of the transverse end (horizontal ends) of this light fixture, realize the lighting system of the all-round light of this bulb lamp, simultaneously because L-type support can adopt the integrated aluminium base of excellent in heat dissipation effect or by vertically holding 3411 for heat pipe, formation that transverse end 3412 is the common splicing of aluminium base (illustrate shown be that integrated L-type aluminium base is as embodiment), can be by the heat of LED luminescence chip or LED illuminator by passing through L-type aluminium base 341 along radiating seat 32 to external diffusion, increase the radiating efficiency of LED luminescence chip, the service life of having improved luminescence component.
As shown in Figure 5, this figure has shown the embodiment that applies to candle lamp of this luminescence component, ball bulb lamp structure shown in its basic structure and Fig. 4 is basically identical, just the transverse end of the L-type support 341 of two groups of LED luminescence components 34 is not provided with unidirection luminous LED illuminator, this L-type support 341 adopts the vertically heat pipe 3411 of end to be jointly spliced to form with the aluminium base 3412 of transverse end simultaneously, although two groups of LED luminescence components 34 are to be also arranged on abreast on radiating seat 32 and its first first type surface 342 arranges in opposite directions, but the vertical end of the L-type support 341 of two groups of luminescence components is arranged side by side and in line, and the height that it should be noted that L-type support 341 vertical ends 3411 is higher, the irradiating angle that is arranged on the LED luminescence chip on the U-shaped breach of L-type support is just larger, the range of exposures of whole group of light fixture is just larger.
Above-described embodiment and diagram non-limiting product form of the present invention and style, suitable variation and modification that any person of an ordinary skill in the technical field does it, all should be considered as not departing from patent category of the present invention.
Claims (11)
1. a LED luminescence component, it is characterized in that: comprise thering is the LED illuminator of capable of bidirectional luminescence and for fixing the L-type support of this illuminator, the LED illuminator of described capable of bidirectional luminescence comprises a transparency carrier, LED luminescence chip, the positive and negative surface of this transparency carrier is respectively the first first type surface and the second first type surface, on the first first type surface, be provided with the first conducting channel, described LED luminescence chip is arranged on the first first type surface, and the first conducting channel is electrically connected with LED luminescence chip; Described L-type support is made up of the transverse end that has the vertical end of thermal conduction characteristic and have heat conduction, insulation characterisitic concurrently; Described vertical end middle part is provided with breach, and the width of this breach is more than or equal to the width of LED luminescence chip on LED illuminator, and is less than the width of transparency carrier; Described transverse end cross section comprises electrode layer, insulating barrier and heat-conducting layer from top to bottom, and its electrode layer is provided with the second conducting channel, and this second conducting channel is mutually gone here and there by the wire of a shell wrap insulate layer with the first conducting channel or be in parallel; Transparency carrier on described LED illuminator is vertically held and is interfixed by weld layer and L-type support, and its luminescence chip correspondence is arranged on this breach.
2. a kind of LED luminescence component as claimed in claim 1, is characterized in that: the weld layer on described transparency carrier is greater than based on corresponding safe voltage and corresponding standard creep age distance with the minimum range between the first conducting channel on the first first type surface.
3. a kind of LED luminescence component as claimed in claim 1, is characterized in that: the first described conducting channel and the second conducting channel respectively to L-type support vertically the heat-conducting layer minimum range of end and transverse end be all greater than based on corresponding safe voltage and corresponding standard creep age distance.
4. a kind of LED luminescence component as claimed in claim 1, is characterized in that: the aluminium base that described L-type support is formed in one or be that heat pipe and transverse end are that aluminium base is spliced to form jointly by vertical end.
5. a kind of LED luminescence component as claimed in claim 1, is characterized in that: described transparency carrier is transparent alumina or aluminium nitride ceramics.
6. a kind of LED luminescence component as claimed in claim 1, is characterized in that: the transverse end of described L-type support can be provided with some unidirection luminous bodies.
7. a LED light fixture, is characterized in that: it is by lamp adapter assembly, radiating seat, lampshade and be made up of to arbitrary luminescence component claimed in claim 6 claim 1, and this luminescence component is arranged on radiating seat.
8. a kind of LED light fixture as claimed in claim 7, it is characterized in that: this light fixture comprises two groups of luminescence components, the transverse end of the L-type support of these two groups of luminescence components side by side, and its vertically end relatively arrange, the first first type surface of these two groups of luminescence components arranges in opposite directions simultaneously.
9. LED light fixture as claimed in claim 7, described luminescence component be less than the air line distance to lampshade perpendicular to the second first type surface perpendicular to the first first type surface to the air line distance of lampshade.
10. LED light fixture as claimed in claim 8, is characterized in that: the vertical end of the L-type support of two groups of described luminescence components is arranged side by side and in line.
11. LED light fixtures as claimed in claim 7, it is characterized in that: the L-type support of the described luminescence component vertically height of end approaches lampshade, the irradiating angle that is arranged on the LED luminescence chip on L-type support breach is just larger, and the range of exposures of whole group of light fixture is just larger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102232.8A CN103912808B (en) | 2014-03-19 | 2014-03-19 | A kind of LED luminescence component and light fixture thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102232.8A CN103912808B (en) | 2014-03-19 | 2014-03-19 | A kind of LED luminescence component and light fixture thereof |
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| Publication Number | Publication Date |
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| CN103912808A true CN103912808A (en) | 2014-07-09 |
| CN103912808B CN103912808B (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410102232.8A Expired - Fee Related CN103912808B (en) | 2014-03-19 | 2014-03-19 | A kind of LED luminescence component and light fixture thereof |
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Cited By (5)
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| CN104180234A (en) * | 2014-08-25 | 2014-12-03 | 深圳市天电光电科技有限公司 | LED lighting device, wireless communication light source and manufacturing method thereof |
| CN104864374A (en) * | 2015-05-26 | 2015-08-26 | 陈莹莹 | Heat dissipation conductor device of LED lamp panel |
| WO2016004723A1 (en) * | 2014-07-11 | 2016-01-14 | 陈弘昌 | Omni-directional led lamp |
| CN107990177A (en) * | 2017-12-16 | 2018-05-04 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
| CN111486351A (en) * | 2014-08-07 | 2020-08-04 | 晶元光电股份有限公司 | Lighting device |
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| US20080013318A1 (en) * | 2006-07-14 | 2008-01-17 | Edison Opto Corporation | Light emitting diode lamp assembly |
| EP2584245A1 (en) * | 2011-10-17 | 2013-04-24 | Luminova GmbH | LED module with a sheet metal heat sink |
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| CN111486351A (en) * | 2014-08-07 | 2020-08-04 | 晶元光电股份有限公司 | Lighting device |
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| CN107990177A (en) * | 2017-12-16 | 2018-05-04 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
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| CN103912808B (en) | 2016-09-28 |
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