CN103911110A - Organosilicon adhesive - Google Patents
Organosilicon adhesive Download PDFInfo
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- CN103911110A CN103911110A CN201310582369.3A CN201310582369A CN103911110A CN 103911110 A CN103911110 A CN 103911110A CN 201310582369 A CN201310582369 A CN 201310582369A CN 103911110 A CN103911110 A CN 103911110A
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- silicone resin
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Abstract
The invention discloses an organosilicon adhesive. The adhesive comprises the following components by weight: 50-80 parts of a silicone resin, 20-40 parts of silicon dioxide powder, 10-20 parts of alumina powder, 20-40 parts of zinc phosphate, 10-20 parts of asbestos powder, 20-40 parts of toluene and 20-40 parts of acetone. Compared with a conventional adhesive, the organosilicon adhesive has the following beneficial effects that (1) the adhesive provided by the invention has high bonding strength, excellent insulativity, high and low temperature resistance, corona resistance, water resistance, dampproofness and chemical mediator resistance; and (2) the organosilicon adhesive has a wide application range and can be used at a temperature ranging from -60 DEG C to 500 DEG C for a long time.
Description
Technical field
The invention belongs to adhesive technology field, more specifically relate to a kind of organic silicon adhesive.Background technology
Organic silicon adhesive generally can be divided into the tackiness agent taking silicone resin as base-material and the large class of the tackiness agent taking silicon rubber as base-material two.When silicone resin uses as tackiness agent, conventional siloxanes is base-material, uses tetraalkoxysilane and four titan-alkoxide acid esters crosslinking curings.Be applicable to building sealant, high-temperature resistance adhesive and low temperature resistant tackiness agent.Organo-silicone rubber is generally room temperature curing type, has two kinds of single component and two-packs, and its maximum feature is to have high thermal resistance.
Summary of the invention
The object of the invention is to overcome the deficiency that prior art exists, a kind of organic silicon adhesive is provided.
For achieving the above object, the present invention has taked following technical scheme:
A kind of organic silicon adhesive, in weight part, composed of the following components:
Silicone resin: 50～80, silicon dioxide powder: 20～40,
Aluminum oxide powder: 10～20, zinc phosphate: 20～40,
Asbestos powder: 10～20, toluene: 20～40, acetone: 20～40.
The preparation technology of described organic silicon adhesive is: by proportioning, each component is mixed, get final product to obtain finished product after being uniformly dispersed.
Compared with prior art, the present invention has following beneficial effect:
(1) cohesive strength of the present invention is high, has the performances such as good insulativity, resistant of high or low temperature, resistance to corona, water-fast, protection against the tide and resistant to chemical media;
(2) use temperature of the present invention is in extensive range, can be for a long time between-60～500 DEG C.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of organic silicon adhesive, in weight part, composed of the following components:
Silicone resin: 50, silicon dioxide powder: 20, aluminum oxide powder: 10,
Zinc phosphate: 20, asbestos powder: 10, toluene: 20, acetone: 20.
Embodiment 2
A kind of organic silicon adhesive, in weight part, composed of the following components:
Silicone resin: 80, silicon dioxide powder: 40, aluminum oxide powder: 20,
Zinc phosphate: 40, asbestos powder: 20, toluene: 40, acetone: 40.
Embodiment 3
A kind of organic silicon adhesive, in weight part, composed of the following components:
Silicone resin: 60, silicon dioxide powder: 30, aluminum oxide powder: 15,
Zinc phosphate: 30, asbestos powder: 16, toluene: 30, acetone: 30.
The preparation technology of described organic silicon adhesive is: by proportioning, each component is mixed, get final product to obtain finished product after being uniformly dispersed.
Claims (4)
1. an organic silicon adhesive, is characterized in that, in weight part, composed of the following components:
Silicone resin: 50～80, silicon dioxide powder: 20～40,
Aluminum oxide powder: 10～20, zinc phosphate: 20～40,
Asbestos powder: 10～20, toluene: 20～40, acetone: 20～40.
2. a kind of organic silicon adhesive according to claim 1, is characterized in that, in weight part, composed of the following components:
Silicone resin: 50, silicon dioxide powder: 20, aluminum oxide powder: 10,
Zinc phosphate: 20, asbestos powder: 10, toluene: 20, acetone: 20.
3. a kind of organic silicon adhesive according to claim 1, is characterized in that, in weight part, composed of the following components:
Silicone resin: 80, silicon dioxide powder: 40, aluminum oxide powder: 20,
Zinc phosphate: 40, asbestos powder: 20, toluene: 40, acetone: 40.
4. a kind of organic silicon adhesive according to claim 1, is characterized in that, in weight part, composed of the following components:
Silicone resin: 60, silicon dioxide powder: 30, aluminum oxide powder: 15,
Zinc phosphate: 30, asbestos powder: 16, toluene: 30, acetone: 30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310582369.3A CN103911110A (en) | 2013-11-18 | 2013-11-18 | Organosilicon adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310582369.3A CN103911110A (en) | 2013-11-18 | 2013-11-18 | Organosilicon adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103911110A true CN103911110A (en) | 2014-07-09 |
Family
ID=51037125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310582369.3A Pending CN103911110A (en) | 2013-11-18 | 2013-11-18 | Organosilicon adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103911110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108059942A (en) * | 2017-12-27 | 2018-05-22 | 成都新柯力化工科技有限公司 | It is a kind of for compound inslation binding agent of electrical equipment and preparation method thereof |
| CN112812739A (en) * | 2020-12-31 | 2021-05-18 | 河北诚和龙盛电力工程有限公司 | Silicone rubber self-adhesive tape and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009011777A2 (en) * | 2007-07-13 | 2009-01-22 | Momentive Performance Materials Inc. | Curable silicon-containing compositions possessing high translucency |
| CN101429418A (en) * | 2007-11-06 | 2009-05-13 | 吕柏涛 | Method for producing organic silica gel adhesive agent |
-
2013
- 2013-11-18 CN CN201310582369.3A patent/CN103911110A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009011777A2 (en) * | 2007-07-13 | 2009-01-22 | Momentive Performance Materials Inc. | Curable silicon-containing compositions possessing high translucency |
| CN101429418A (en) * | 2007-11-06 | 2009-05-13 | 吕柏涛 | Method for producing organic silica gel adhesive agent |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108059942A (en) * | 2017-12-27 | 2018-05-22 | 成都新柯力化工科技有限公司 | It is a kind of for compound inslation binding agent of electrical equipment and preparation method thereof |
| CN112812739A (en) * | 2020-12-31 | 2021-05-18 | 河北诚和龙盛电力工程有限公司 | Silicone rubber self-adhesive tape and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140709 |