CN103906345A - Radiating structure for printed circuit board - Google Patents
Radiating structure for printed circuit board Download PDFInfo
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- CN103906345A CN103906345A CN201310757357.XA CN201310757357A CN103906345A CN 103906345 A CN103906345 A CN 103906345A CN 201310757357 A CN201310757357 A CN 201310757357A CN 103906345 A CN103906345 A CN 103906345A
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- circuit board
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A radiating structure for a printed circuit board is provided. The radiating structure (1) has a through hole (7) of the printed circuit board (2) and the frame body (4) relative to the printed circuit board (2) position; heat conductivity gap (5) for filling the printed circuit board (2) and the frame (4); and heat conducting material (5) through hole relative (7) is filled with a conductive material used to prevent (5) the entering of filling material (8) therein.
Description
Technical field
The present invention relates to the radiator structure of printed circuit board (PCB).
Background technology
In the past, electronic-controlled installation etc. were arranged on electronic component on printed circuit board (PCB), and this printed circuit board (PCB) is received in metal framework and is formed.In such electronic-controlled installation, in the time that the electronic component that makes to be made up of semiconductor element etc. moves, electronic component is because power consumption produces heat.When the heat producing too much, when excess Temperature, make sometimes the function of electronic component and characteristic reduce, in addition, the life of product of electronic component shortens.Therefore, in electronic-controlled installation etc., there is the radiator structure of printed circuit board (PCB).
As the radiator structure of printed circuit board (PCB), sometimes for example at the periphery of electronic component, heat transmission through hole (through hole) is set, or applies heat radiation grease (Heat Conduction Material) and heat is dispelled the heat from printed circuit board (PCB) to metal framework (thermal component).
In Japanese Patent Publication 4-10356 communique, disclose following technology,, insulated substrate around the installation region of heat generation electronic component is offered multiple through holes, inner peripheral surface at multiple through holes forms heat dissipation film in the mode being communicated with the conductive region of inside and outside heat radiation dual-purpose, the heat heat radiation that heat generation electronic component is produced.
In Japanese Patent Publication 4-5686 communique, disclose following technology,, by the grease-filled thermal conductivity via to arranging towards the back side of printed circuit board (PCB) from the pattern of the mounting portion of integrated circuit, via via by the heat being produced by integrated circuit to the back side pattern transmission of printed circuit board (PCB) and dispel the heat.
But, in order to improve the heat transfer efficiency from printed circuit board (PCB) to thermal component, need to fill with Heat Conduction Material the gap of printed circuit board (PCB) and thermal component.In this case, use and on thermal component, apply Heat Conduction Material, printed circuit board (PCB) is pressed against on Heat Conduction Material and makes Heat Conduction Material fill the method in both gaps.
But in the situation that printed circuit board (PCB) has heat transmission through hole, Heat Conduction Material goes out to opposing face side leakage via heat transmission through hole sometimes.In the time that Heat Conduction Material spills, be difficult to managing for the coating amount of suitably filling the Heat Conduction Material in the gap of printed circuit board (PCB) and thermal component.In addition, in the time considering the leakage of this Heat Conduction Material, the coating amount of Heat Conduction Material increases, and cost increases.And then in order seamlessly to adhere to Heat Conduction Material on printed circuit board (PCB), in the case of the fixture pushing printed circuit board (PCB) that uses regulation, the Heat Conduction Material spilling can flow and drop to the region beyond heat radiation position along this fixture.
Summary of the invention
The present invention sets up in view of the above problems, and its object is to provide a kind of radiator structure of printed circuit board (PCB), even be also difficult for spilling in the situation that using the fluidity substances such as heat radiation grease as Heat Conduction Material, in addition, can suppress radiating efficiency and reduce.
In order to solve above-mentioned problem, the radiator structure of printed circuit board (PCB) of the present invention adopts following structure.
(1) radiator structure of the printed circuit board (PCB) of first aspect present invention has: the printed circuit board (PCB) with heat transmission through hole; At the thermal component of the position configuration relative with above-mentioned printed circuit board (PCB); Fill the Heat Conduction Material in the gap of above-mentioned printed circuit board (PCB) and above-mentioned thermal component, in the above-mentioned heat transmission through hole relative with above-mentioned Heat Conduction Material, be filled with the packing material for stoping above-mentioned Heat Conduction Material to flow into.
(2) on the basis aspect above-mentioned (1), mounting electronic parts on above-mentioned printed circuit board (PCB), the above-mentioned heat transmission through hole that is filled with above-mentioned packing material is arranged on the periphery of above-mentioned electronic component.
(3) on the basis aspect above-mentioned (1) or (2), above-mentioned packing material has the thermal coefficient of expansion corresponding with the thermal coefficient of expansion of above-mentioned printed circuit board (PCB).
(4) in above-mentioned (1)～(3) on the basis of either side, above-mentioned printed circuit board (PCB) is multilager base plate, and above-mentioned heat transmission through hole is through hole.
(5), in above-mentioned (1)～(4) on the basis of either side, the above-mentioned heat transmission through hole that is filled with above-mentioned packing material is covered by scolder resist.
In the radiator structure of printed circuit board (PCB) of the present invention, in the heat transmission through hole relative with Heat Conduction Material, be filled with the packing material for stoping Heat Conduction Material to flow into.Therefore,, even in the situation that Heat Conduction Material is made up of the fluidity substances such as grease that dispel the heat, also can prevent that Heat Conduction Material from going out to opposing face side leakage via heat transmission through hole.Can fully guarantee thus the amount of the Heat Conduction Material in the gap of filling printed circuit board (PCB) and thermal component.Therefore, can prevent the uneven thickness of Heat Conduction Material, between printed circuit board (PCB) or thermal component and Heat Conduction Material, produce the situation in gap, can suppress the reduction of radiating efficiency.
Like this, according to the present invention, even be also not easy to spill, in addition, can obtain the radiator structure of the printed circuit board (PCB) of the reduction that can suppress radiating efficiency in the situation that the fluidity substances such as heat radiation grease are used for to Heat Conduction Material.
Brief description of the drawings
Fig. 1 is the profile that represents the radiator structure of the printed circuit board (PCB) of embodiment of the present invention.
Fig. 2 is the plane graph that represents the printed circuit board (PCB) of embodiment of the present invention.
Fig. 3 A is the figure of the effect of the radiator structure of the printed circuit board (PCB) for embodiment of the present invention is described.
Fig. 3 B is the figure of the effect of the radiator structure of the printed circuit board (PCB) for embodiment of the present invention is described.
Embodiment
Below, with reference to the accompanying drawings of the radiator structure of the printed circuit board (PCB) of embodiment of the present invention.
In addition, in following accompanying drawing, be discernible size in order to make each parts, suitably change the engineer's scale of each parts.
Fig. 1 is the profile that represents the radiator structure 1 of the printed circuit board (PCB) of embodiment of the present invention.Fig. 2 is the plane graph that represents the printed circuit board (PCB) 2 of embodiment of the present invention.In addition corresponding to looking X-X section with shown in Fig. 2 of Fig. 1.
The radiator structure 1 of the printed circuit board (PCB) of present embodiment relates to the electronic-controlled installation (ECU:Electronic Control Unit) being equipped on vehicle.As shown in Figure 1, the radiator structure 1 of printed circuit board (PCB) has: printed circuit board (PCB) 2, the electronic component 3 of installing on this printed circuit board (PCB) 2, storage have been installed the framework (thermal component) 4 of electronic component 3 and filled the Heat Conduction Material 5 in the gap of printed circuit board (PCB) 2 and framework 4.
In addition, in Fig. 1, only represented the lower side body in framework 4, but side body (not shown) on passing through in this downside case top lid forms framework 4 entirety.The lower side body of framework 4, in the position configuration relative with printed circuit board (PCB) 2, works as thermal component.Framework 4 such as, is formed by the high metal parts of thermal diffusivity (cast aluminium etc.).
Printed circuit board (PCB) 2 is the multilager base plates with lamination structure, for example, use combination constructing method thereof to form.In each layer of printed circuit board (PCB) 2, form the conductive pattern 6 being formed by Copper Foil etc.The surperficial 2a of printed circuit board (PCB) 2 becomes the installed surface of mounting electronic parts 3.The electronic component 3 of present embodiment is provided with the package parts of the heating part 3a such as integrated circuit in being.Electronic component 3 has the portion of terminal 3b being electrically connected with conductive pattern 6.
In addition,, on printed circuit board (PCB) 2, except electronic component 3, the not shown electronic component being made up of electrolytic capacitor, FFT (Field effect transistor), resistance etc. is installed at least one party of surperficial 2a and back side 2b.
The Heat Conduction Material 5 of present embodiment is by the heat radiation composition of viscosity with mobility and regulation.As heat radiation grease, can use grease of silicone fluid.
Printed circuit board (PCB) 2 has through hole (heat transmission through hole) 7, and through hole 7 connects back side 2b side and arranges from surperficial 2a side on the thickness direction of printed circuit board (PCB) 2.Through hole 7 for example forms opening by laser processing on printed circuit board (PCB) 2, by plating, conductor 7a is set forms at the inner surface of opening and the periphery of opening.Through hole 7 passes through conductor 7a with the conductive pattern 6 of each layer of printed circuit board (PCB) 2 or is at least electrically connected and hot link with certain one deck as required., through hole 7 is as the heat producing at electronic component 3 is worked to the radiating part of rear side 2b heat conduction.
As shown in Figure 1, in the through hole 7 of the position configuration relative with Heat Conduction Material 5, be filled with packing material 8.Packing material 8 is for stoping Heat Conduction Material 5 to flow into through hole 7.Packing material 8 is the latch that are for example made up of resin etc., makes surperficial 2a and the non-connection of back side 2b of printed circuit board (PCB) 2 by stopping up through hole 7.As packing material 8, can, with in aqueous injection through hole 7, use curing thereafter material.Packing material 8 also can be cured from the beginning, inserts in through hole 7.
Be filled with the through hole 7 of packing material 8, be arranged on as illustrated in fig. 2 the periphery of electronic component 3.The through hole 7 that, is filled with packing material 8 is arranged in the installation region of the region that do not overlap with electronic component 3 while overlooking, non-electronic part 3.
As shown in Figure 1, the through hole 7 arranging in such region, be filled with packing material 8 is covered by scolder resist 9.As everyone knows, scolder resist 9 is used to form conductive pattern 6.
The through hole 7 of present embodiment is filled owing to being filled material 8, so scolder resist 9 can not fall into the inside of through hole 7, as shown in Figure 1, can form scolder resist 9 in the mode that covers through hole 7.The scolder resist 9 of present embodiment is arranged on surperficial 2a side and the back side 2b side of printed circuit board (PCB) 2.Therefore the through hole 7 that, is filled with packing material 8 utilizes scolder resist 9 that the opening of the opening of surperficial 2a side and back side 2b side is together sealed.
The effect of the radiator structure 1 of the printed circuit board (PCB) of above-mentioned formation then, is described with reference to Fig. 3 A, 3B.
Fig. 3 A, 3B are the figure of the effect of the radiator structure 1 of the printed circuit board (PCB) for embodiment of the present invention is described.
As mentioned above, the radiator structure 1 of printed circuit board (PCB) utilizes Heat Conduction Material 5 to fill the gap of printed circuit board (PCB) 2 and framework 4, improves the heat transfer efficiency to the framework 4 as thermal component.In order to form the radiator structure 1 of this printed circuit board (PCB), as shown in Figure 3A and 3B, in framework 4, apply Heat Conduction Material 5, printed circuit board (PCB) 2 is pressed on the Heat Conduction Material 5 of coating.In addition,, for Heat Conduction Material 5 is seamlessly attached on printed circuit board (PCB) 2, sometimes also use not shown fixture to exert pressure equably to printed circuit board (PCB) 2.
That is, as shown in Figure 3A, in framework 4, on the Heat Conduction Material 5 of coating, printed circuit board (PCB) 2 is carried out to aligned in position mounting, as shown in Figure 3 B, by pressing pressing printed circuit board 2, make Heat Conduction Material 5 fill the gap of printed circuit board (PCB) 2 and framework 4.Thereafter, by printed circuit board (PCB) 2 being fixed on screw to the radiator structure 1 that forms printed circuit board (PCB) in framework 4.Thus, the heat of electronic component 3 is transmitted to the back side 2b of printed circuit board (PCB) 2 via through hole 7 from the surperficial 2a of printed circuit board (PCB) 2, so via Heat Conduction Material 5, framework 4 to external cooling.
In the radiator structure 1 of printed circuit board (PCB) in the present embodiment, in the through hole relative with Heat Conduction Material 57, be filled with the packing material 8 for stoping Heat Conduction Material 5 to flow into.By this formation, even in the situation that Heat Conduction Material 5 is made up of fluidity substances such as heat radiation greases, also can prevent that Heat Conduction Material 5 from going out (with reference to Fig. 3 B) via through hole 7 to surperficial 2a side leakage.In addition, in the present embodiment, as shown in Figure 2, owing to being filled with packing material 8 in the through hole 7 of the periphery setting of electronic component 3, adhere on electronic component 3 so can effectively prevent inexpectancy.
In addition, even in the case of in order to use by pressing printed circuit board 2 not shown fixture, also can prevent that the Heat Conduction Material that escapes to surperficial 2a side from flowing and for example dropping to the situation in the region beyond heat radiation position along this fixture.
Like this, according to present embodiment, due to can prevent Heat Conduction Material 5 via through hole 7 to the spilling of surperficial 2a side, so become easily with the management of the amount of the Heat Conduction Material 5 in the gap of framework 4 for filling printed circuit board (PCB) 2, can suppress cost increase.In addition, owing to can fully guaranteeing the amount of Heat Conduction Material 5, so can prevent thickness attenuation of Heat Conduction Material 5 etc., can suppress the reduction of radiating efficiency.
In addition, in the present embodiment, packing material 8 has the thermal coefficient of expansion corresponding with the thermal coefficient of expansion of printed circuit board (PCB) 2.Like this, by making the thermal coefficient of expansion of packing material 8 and printed circuit board (PCB) 2 identical in fact, even printed circuit board (PCB) 2 by the heat of electronic component 3 hot stretched, because packing material 8 follows this and hot stretched, so can not make the conductor 7a of through hole 7 be subject to excessive thermal stress.Therefore, the breakage of conductor 7a can be prevented, in addition, the generation of packing material 8 from peeling off of through hole 7 etc. can be prevented.
And then in the present embodiment, the through hole 7 that is filled with packing material 8 is covered by scolder resist 9.By this formation, in the case of through hole 7 does not stop up completely by the material behavior of packing material 8, for example produce gap in the case of peeling off of causing by above-mentioned hot stretched, or in the time injecting, comprise and when bubble etc. is solidifying, form small hole etc. at packing material 8, also can stop up this gap or hole.Therefore, can prevent more reliably spilling of Heat Conduction Material 5.
Therefore, according to above-mentioned execution mode, the radiator structure 1 of printed circuit board (PCB) possesses: the printed circuit board (PCB) 2 with through hole 7; In the framework 4 of the position configuration relative with printed circuit board (PCB) 2; The Heat Conduction Material 5 of filling the gap of printed circuit board (PCB) 2 and framework 4 wherein, is filled with the packing material 8 for stoping Heat Conduction Material 5 to flow in the through hole relative with Heat Conduction Material 57.By adopting such formation, even the fluidity substances such as heat radiation grease are also being not easy to spill for Heat Conduction Material 5 in the situation that, can obtain in addition suppressing the radiator structure 1 of the printed circuit board (PCB) that radiating efficiency reduces.
Above, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the invention is not restricted to above-mentioned execution mode, the each component parts or the combination etc. that represent are in the above-described embodiment an example, can carry out various changes according to designing requirement etc. without departing from the spirit and scope of the invention.
For example, in the above-described embodiment, illustrated in the radiator structure of the printed circuit board (PCB) using in for motor vehicle electronic-controlled installation and applied situation of the present invention, but the radiator structure of printed circuit board (PCB) of the present invention also can be applied in the electronic installation beyond this.
Claims (5)
1. a radiator structure for printed circuit board (PCB), is characterized in that, has:
There is the printed circuit board (PCB) of heat transmission through hole;
At the thermal component of the position configuration relative with above-mentioned printed circuit board (PCB);
Fill the Heat Conduction Material in the gap of above-mentioned printed circuit board (PCB) and above-mentioned thermal component,
In the above-mentioned heat transmission through hole relative with above-mentioned Heat Conduction Material, be filled with the packing material for stoping above-mentioned Heat Conduction Material to flow into.
2. the radiator structure of printed circuit board (PCB) as claimed in claim 1, is characterized in that,
Mounting electronic parts on above-mentioned printed circuit board (PCB),
The above-mentioned heat transmission through hole that is filled with above-mentioned packing material is arranged on the periphery of above-mentioned electronic component.
3. the radiator structure of printed circuit board (PCB) as claimed in claim 1, is characterized in that,
Above-mentioned packing material has the thermal coefficient of expansion corresponding with the thermal coefficient of expansion of above-mentioned printed circuit board (PCB).
4. the radiator structure of printed circuit board (PCB) as claimed in claim 1, is characterized in that,
Above-mentioned printed circuit board (PCB) is multilager base plate,
Above-mentioned heat transmission through hole is through hole.
5. the radiator structure of printed circuit board (PCB) as claimed in claim 1, is characterized in that,
The above-mentioned heat transmission through hole that is filled with above-mentioned packing material is covered by scolder resist.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-281523 | 2012-12-25 | ||
| JP2012281523A JP2014127522A (en) | 2012-12-25 | 2012-12-25 | Heat radiation structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103906345A true CN103906345A (en) | 2014-07-02 |
Family
ID=50997427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310757357.XA Pending CN103906345A (en) | 2012-12-25 | 2013-12-06 | Radiating structure for printed circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP2014127522A (en) |
| CN (1) | CN103906345A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411085A (en) * | 2014-07-08 | 2015-03-11 | 北京鸿智电通科技有限公司 | Pcb |
| CN107820376A (en) * | 2016-09-14 | 2018-03-20 | 株式会社捷太格特 | Electronic-controlled installation |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6631384B2 (en) * | 2016-04-20 | 2020-01-15 | 株式会社デンソー | Power converter |
| JP6610497B2 (en) | 2016-10-14 | 2019-11-27 | オムロン株式会社 | Electronic device and manufacturing method thereof |
| JP2020202202A (en) * | 2019-06-06 | 2020-12-17 | 株式会社オートネットワーク技術研究所 | Circuit structure and electrical junction box |
| CN112689378B (en) * | 2019-10-18 | 2022-04-15 | 庆鼎精密电子（淮安）有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
| CN114938566A (en) * | 2022-06-14 | 2022-08-23 | 高创(苏州)电子有限公司 | Circuit board and display device with same |
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| JPH045686U (en) * | 1990-04-27 | 1992-01-20 | ||
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| CN101937910A (en) * | 2009-06-30 | 2011-01-05 | 株式会社日立高新技术 | LED light source, its manufacturing method, and LED-based photolithography apparatus and method |
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
| JP2011165903A (en) * | 2010-02-10 | 2011-08-25 | Rohm Co Ltd | Semiconductor module and method of manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000299541A (en) * | 1999-04-15 | 2000-10-24 | Ibiden Co Ltd | Printed wiring board |
| JP2009277784A (en) * | 2008-05-13 | 2009-11-26 | Toshiba Corp | Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus |
| JP2009290021A (en) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | Part-incorporated printed wiring board, method for manufacturing the wiring board, and electronic apparatus |
| JP2012009609A (en) * | 2010-06-24 | 2012-01-12 | Jtekt Corp | Multi-layer circuit board |
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2012
- 2012-12-25 JP JP2012281523A patent/JP2014127522A/en active Pending
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2013
- 2013-12-06 CN CN201310757357.XA patent/CN103906345A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045686U (en) * | 1990-04-27 | 1992-01-20 | ||
| JPH0410356U (en) * | 1990-05-15 | 1992-01-29 | ||
| CN101937910A (en) * | 2009-06-30 | 2011-01-05 | 株式会社日立高新技术 | LED light source, its manufacturing method, and LED-based photolithography apparatus and method |
| JP2011165903A (en) * | 2010-02-10 | 2011-08-25 | Rohm Co Ltd | Semiconductor module and method of manufacturing the same |
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104411085A (en) * | 2014-07-08 | 2015-03-11 | 北京鸿智电通科技有限公司 | Pcb |
| CN107820376A (en) * | 2016-09-14 | 2018-03-20 | 株式会社捷太格特 | Electronic-controlled installation |
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| Publication number | Publication date |
|---|---|
| JP2014127522A (en) | 2014-07-07 |
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Application publication date: 20140702 |