CN103904038A - Millimeter wave surface mounting type encapsulating outer shell based on low-temperature co-fired ceramic technology - Google Patents
Millimeter wave surface mounting type encapsulating outer shell based on low-temperature co-fired ceramic technology Download PDFInfo
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- CN103904038A CN103904038A CN201410113959.6A CN201410113959A CN103904038A CN 103904038 A CN103904038 A CN 103904038A CN 201410113959 A CN201410113959 A CN 201410113959A CN 103904038 A CN103904038 A CN 103904038A
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Abstract
The invention relates to a millimeter wave surface mounting type encapsulating outer shell based on a low-temperature co-fired ceramic technology. The millimeter wave surface mounting type encapsulating outer shell structurally comprises a cavity internal co-fired chip bonding area, a ceramic wall, microstrip lines and a cavity external after-fired weldable metalized conductor layer, and a whole body is made of low-temperature co-fired ceramic. The millimeter wave surface mounting type encapsulating outer shell based on the low-temperature co-fired ceramic technology has the advantages that reliability is high; the structural design is simple, and the millimeter wave surface mounting type encapsulating outer shell is only composed of the cavity internal co-fired chip bonding area, the ceramic wall, the microstrip lines and the cavity external after-fired weldable metalized conductor layer; surface mounting can be achieved through welding, glue bonding and other modes; the requirement of a user for cap sealing can be met, and hermetic sealing can be achieved; the millimeter wave surface mounting type encapsulating outer shell has good temperature characteristics, a small thermal expansion coefficient and a stable dielectric constant, and is high in reliability.
Description
Technical field
The present invention is a kind of novel millimeter wave surface-mount type package casing based on LTCC Technology.
Background technology
Meet market determines millimeter wave encapsulation development trend to the cost performance of millimeter wave product, miniaturization, integrated level, high-performance, low cost are the target that people pursue all the time, and multi-chip millimeter wave modular package technology has well been mixed these factors, will be one of development trend of millimeter wave encapsulation.General, the modularization of millimeter wave encapsulation technology simplified the packaging technology of product, tests conveniently, improves the productivity of system product, reduce production costs, the time of expedite product listing and upper amount, adapts to the variation of engineering, has improved the reliability of product.
LTCC (LTCC) technology is a kind of low-temperature sintered ceramics powder to be made to the accurate and fine and close green band of thickness, on green band, utilize the techniques such as laser drilling, micropore slip casting, accurate conductor paste printing, metallic conductor gluing, rear burning to make needed circuitous pattern, and multiple passive components are imbedded wherein, then overlap together, in 900 ℃ of following temperature ranges, sinter molding goes out the technology of required form device.Having good high-frequency and high-Q characteristic, have good temperature characterisitic, the less good characteristic such as thermal coefficient of expansion and less dielectric constant, is the good carrier of millimeter wave modular package and performance high reliability.
Summary of the invention
What the present invention proposed is a kind of novel millimeter wave surface-mount type package casing based on LTCC Technology, and in 28GHz ~ 32GHz frequency range, microwave property is good.
Technical solution of the present invention: the novel millimeter wave surface-mount type package casing based on LTCC, overall dimension is 5.40mm × 4.60mm × 0.8mm, and its structure is that after comprising outside Qiang Neigongshao die bonding district, ceramic wall, microstrip line and chamber, burning can weld metal conductor layer; Its lumen Nei Gongshao die bonding district is made up of ground metallization conductor layer, ceramic cavity Gong Shao die bonding district, wherein ground metallization conductor layer is can be connected by weld metal layer with rear burning outside chamber by the solid matter hole in ceramic matrix, realize Gong Shao die bonding district ground connection performance, install and fixation for chip provides, ceramic cavity provides the installing space of the maximum 2.50mm × 2.60mm × 0.20mm of volume range for chip; Ceramic wall is made up of package casing side wall and input/output port pottery wall, and wherein package casing side wall provides insulation blocking, airtight and welding carrying effect for chip is installed, and input/output port pottery wall is protected and carrying effect for microstrip line provides; After outside chamber, burning can weld metal conductor layer be to burn layer of metal conductor after the whole extexine of package casing, for package casing provides the effect of the interconnection of capping, Surface Mount and ground connection, realizes surface mount by welding, gluing form.
Beneficial effect of the present invention:
1) realized millimeter wave frequency band signal transmission within the scope of 28GHz ~ 32GHz;
2) structural design is simple, adopts LTCC technique, can realize surface-mount type encapsulation, can realize user's level Hermetic Package, stablizes highly reliable operational environment for chip provides, and has met greatly line module millimeter wave package casing demand;
3) package casing microwave applications scope is in millimeter wave frequency band; Entire body is made up of LTCC,
Working frequency range is within the scope of 28GHz ~ 32GHz, and voltage standing wave ratio is less than 1.35, and isolation is greater than 35dB, be better than-1dB of insertion loss;
4) can meet the process requirements such as SMT, carrier band automatic welding, traditional-handwork soldering;
5) can meet the requirement of user's sealing cap, realize level Hermetic Package, user's chip is protected, stable operational environment is provided.
Accompanying drawing explanation
Fig. 1 is a kind of voltage standing wave ratio schematic diagram of the novel millimeter wave surface-mount type package casing based on LTCC.
Fig. 2 is a kind of insertion loss schematic diagram of the novel millimeter wave surface-mount type package casing based on LTCC.
Fig. 3 is a kind of isolation schematic diagram of the novel millimeter wave surface-mount type package casing based on LTCC.
Gong Shao die bonding district, die bonding and Bonding Jun Keci district realize, and can be connected by weld metal layer, and isolated by ceramic matrix by solid matter hole in ceramic matrix with rear burning; Pottery wall, for chip plays insulation blocking, airtight effect; Microstrip line, chip and the transmission of outside millimeter-wave signal are interconnected in this district and realize; Rear burning can weld metal conductor layer, can capping realizes airtightly, can realize surface-mount type interconnection with external circuit.
Embodiment
Contrast accompanying drawing, novel millimeter wave surface-mount type package casing based on LTCC Technology can weld metal conductor layer four parts be made up of rear burning outside Qiang Neigongshao die bonding district, ceramic wall, microstrip line and chamber, and overall dimension is 5.40mm × 4.60mm × 0.8mm.
The microwave applications scope of described package casing is in millimeter wave frequency band, and its working frequency range is within the scope of 28GHz ~ 32GHz, and voltage standing wave ratio is less than 1.35, and isolation is greater than 35dB, be better than-1dB of insertion loss.
Described package casing entire body is made up of LTCC, has good temperature characterisitic, less thermal coefficient of expansion and stable dielectric constant, and reliability is high.
Described package casing project organization is simple, only can weld metal conductor layer four parts be made up of rear burning outside Qiang Neigongshao die bonding district, ceramic wall, microstrip line and chamber.Qiang Neigongshao die bonding district is made up of ground metallization conductor layer, ceramic cavity Gong Shao die bonding district, ground metallization conductor layer can be connected by weld metal layer with rear burning by the solid matter hole in ceramic matrix, realize Gong Shao die bonding district ground connection performance, install and fixation for chip provides, ceramic cavity provides the installing space of the maximum 2.50mm × 2.60mm × 0.20mm of volume range for chip; Ceramic wall is made up of package casing side wall and input/output port pottery wall, and side wall provides insulation blocking, airtight and welding carrying effect for chip is installed, and input/output port pottery wall is protected and carrying effect for microstrip line provides; After outside chamber, burning can weld metal conductor layer be to burn layer of metal conductor after the whole extexine of package casing, for package casing provides capping, Surface Mount to connect and the effect of ground connection.
Described package casing can be realized surface mount by forms such as welding, gluings, meets the process requirements such as SMT, carrier band automatic welding, traditional-handwork soldering.
Described package casing can meet the requirement of user's sealing cap, realizes level Hermetic Package, and user's chip is protected, and stable operational environment is provided.
This package casing can carry the chip of maximum 2.50mm × 2.60mm × 0.20mm, and can realize chip and external isolation; Having can weld metal bottom surface, can realize the encapsulation of shell surface-mount type; Can realize millimeter-wave signal transmission in 28GHz ~ 32GHz frequency range.
The implementation method of the novel millimeter wave surface-mount type package casing based on LTCC Technology, comprises the steps,
1) after, burn the technology mode that metallised conductors layer burns after by gluing and realize, there is weldability;
2) transmit by the microstrip line millimeter wave frequency band signal of realizing through walls inside and outside of cavity;
3) interconnection of chip metallised conductors floor burnt after outside solid matter hole and chamber by Qiang Neigongshao die bonding district;
4) adopt conventional low temperature (850 ℃) common burning porcelain technique.
The present invention uses ceramics green ceramic band to be provided by FERRO company, can weld metal slurry be that FERRO company provides too, can need in the time that low-temperature sintering is shunk, match with ceramic matrix by weld metal slurry.
The present invention adopts conventional LTCC production Technology.By on the accurate and fine and close green band of size, utilize laser drilling, micropore slip casting, tie, the technique such as accurate conductor paste printing is made needed circuitous pattern and can weld metal layer, utilize the techniques such as laser is begun to speak, lamination to make the ceramic chips of needed definite shape, mold the LTCC surface-mount type shell of definite shape by high precision temperature control stove low-temperature sintering.
In packaging shell structure of the present invention, weld zone is can weld metal conductor layer; Can weld metal conductor layer thickness in 8 μ m ~ 15 μ m scopes; Metallization lines printing precision is ± 30 μ m.
Claims (5)
1. the novel millimeter wave surface-mount type package casing based on LTCC, after it is characterized in that comprising outside Qiang Neigongshao die bonding district, ceramic wall, microstrip line and chamber, burning can weld metal conductor layer, entire body is made up of LTCC, and overall dimension is 5.40mm × 4.60mm × 0.8mm.
2. the novel millimeter wave surface-mount type package casing based on LTCC according to claim 1, it is characterized in that described Qiang Neigongshao die bonding district is made up of ground metallization conductor layer, ceramic cavity Gong Shao die bonding district, wherein ground metallization conductor layer is can be connected by weld metal layer with rear burning outside chamber by the solid matter hole in ceramic matrix, realize Gong Shao die bonding district ground connection performance, install and fixation for chip provides, ceramic cavity provides the installing space of the maximum 2.50mm × 2.60mm × 0.20mm of volume range for chip.
3. the novel millimeter wave surface-mount type package casing based on LTCC according to claim 1, it is characterized in that described ceramic wall is made up of package casing side wall and input/output port pottery wall, wherein package casing side wall provides insulation blocking, airtight and welding carrying effect for chip is installed, and input/output port pottery wall is protected and carrying effect for microstrip line provides; After outside chamber, burning can weld metal conductor layer be to burn layer of metal conductor after the whole extexine of package casing, for package casing provides the effect of the interconnection of capping, Surface Mount and ground connection, realizes surface mount by welding, gluing form.
4. the millimeter wave surface-mount type package casing based on LTCC Technology according to claim 1, it is characterized in that package casing microwave applications scope is in millimeter wave frequency band, its working frequency range is within the scope of 28GHz ~ 32GHz, voltage standing wave ratio is less than 1.35, isolation is greater than 35dB, be better than-1dB of insertion loss.
5. the implementation method of the novel millimeter wave surface-mount type package casing based on LTCC Technology as claimed in claim 1, is characterized in that the method comprises the steps:
1) after, burn the technology mode that metallised conductors layer burns after by gluing and realize, there is weldability;
2) transmit by the microstrip line millimeter wave frequency band signal of realizing through walls inside and outside of cavity;
3) interconnection of chip metallised conductors floor burnt after outside solid matter hole and chamber by Qiang Neigongshao die bonding district;
4) adopt 850 ℃ of common burning porcelain techniques of conventional low temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410113959.6A CN103904038A (en) | 2014-03-25 | 2014-03-25 | Millimeter wave surface mounting type encapsulating outer shell based on low-temperature co-fired ceramic technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410113959.6A CN103904038A (en) | 2014-03-25 | 2014-03-25 | Millimeter wave surface mounting type encapsulating outer shell based on low-temperature co-fired ceramic technology |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635958B2 (en) * | 2001-12-03 | 2003-10-21 | Dover Capital Formation Group | Surface mount ceramic package |
| CN101621146A (en) * | 2009-08-11 | 2010-01-06 | 南京理工大学 | L wave band miniature duplexer |
| CN102496763A (en) * | 2011-12-09 | 2012-06-13 | 电子科技大学 | Wideband multi-channel substrate integrated waveguide power divider adopting novel high-isolation technology |
| US20130189935A1 (en) * | 2012-01-24 | 2013-07-25 | E I Du Pont De Nemours And Company | LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SYSTEM IN A PACKAGE (SiP) CONFIGURATIONS FOR MICROWAVE/MILLIMETER WAVE PACKAGING APPLICATIONS |
| CN103426830A (en) * | 2013-07-15 | 2013-12-04 | 中国电子科技集团公司第五十五研究所 | Flip-chip-bonded surface-mount shell structure based on low temperature co-fired ceramics |
-
2014
- 2014-03-25 CN CN201410113959.6A patent/CN103904038A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635958B2 (en) * | 2001-12-03 | 2003-10-21 | Dover Capital Formation Group | Surface mount ceramic package |
| CN101621146A (en) * | 2009-08-11 | 2010-01-06 | 南京理工大学 | L wave band miniature duplexer |
| CN102496763A (en) * | 2011-12-09 | 2012-06-13 | 电子科技大学 | Wideband multi-channel substrate integrated waveguide power divider adopting novel high-isolation technology |
| US20130189935A1 (en) * | 2012-01-24 | 2013-07-25 | E I Du Pont De Nemours And Company | LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SYSTEM IN A PACKAGE (SiP) CONFIGURATIONS FOR MICROWAVE/MILLIMETER WAVE PACKAGING APPLICATIONS |
| CN103426830A (en) * | 2013-07-15 | 2013-12-04 | 中国电子科技集团公司第五十五研究所 | Flip-chip-bonded surface-mount shell structure based on low temperature co-fired ceramics |
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Application publication date: 20140702 |