CN103898565A - Plating solution for electroplating nickel on surface of shell of magnesium alloy notebook computer - Google Patents

Plating solution for electroplating nickel on surface of shell of magnesium alloy notebook computer Download PDF

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Publication number
CN103898565A
CN103898565A CN201310218952.6A CN201310218952A CN103898565A CN 103898565 A CN103898565 A CN 103898565A CN 201310218952 A CN201310218952 A CN 201310218952A CN 103898565 A CN103898565 A CN 103898565A
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China
Prior art keywords
magnesium alloy
plating solution
notebook computer
butynediol
trisodium citrate
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Pending
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CN201310218952.6A
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Chinese (zh)
Inventor
钱永清
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WUXI XISHAN DISTRICT EHU TOWN DANGKOU QINGDANG METAL PRODUCT FACTORY
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WUXI XISHAN DISTRICT EHU TOWN DANGKOU QINGDANG METAL PRODUCT FACTORY
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Priority to CN201310218952.6A priority Critical patent/CN103898565A/en
Publication of CN103898565A publication Critical patent/CN103898565A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a plating solution for electroplating nickel on the surface of a shell of a magnesium alloy notebook computer. The plating solution consists of 210-220g/L of nickel sulfate, 15-25g/L of nickel chloride, 52-56g/L of boric acid, 20-26g/L of potassium sulfate, 0.5-1.5g/L of sodium dodecyl sulfate, 8-12g/L of trisodium citrate, 36-40g/L of anhydrous sodium acetate, 30-40mg/L of butynediol ethoxide, 3-4g/L of propionic acid and the balance of water.

Description

A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath
Technical field
The present invention relates to electroplating technology field, relate in particular to a kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath.
Background technology
Magnesium alloy has that proportion is little, damping performance good, has compared with high specific strength, specific rigidity with than Young's modulus and heat conductivity, capability of electromagnetic shielding etc. preferably, and the shell that is suitable for use as notebook computer is made.But magnesium alloy chemical activity is high, and electropotential is low, surface film oxide is loose, causes barrier propterty low, has restricted the application and development of magnesium alloy.Cause thus the concern of people to magnesium alloy part surface corrosion and protection, carry out a large amount of research at aspects such as Mg alloy surface anodic oxidation, chemical conversion film, organic coating, coating surfaces, particularly adopt that method for electroplating nickel is low as a kind of cost, technique is simple, the surface coating technique of easy handling, has become the important research direction of people to magnesium alloy surface protective.
Generally to pass through pretreatment process to electroplating nickel on surface of magnesium alloy, to avoid the corrosion of matrix in bath solution.The pre-treatment of electronickelling at present mainly contains two kinds of processing methodes, the one, immersion plating zinc-cyanide copper plating process; The 2nd, repeatedly immersion plating zinc-electro-galvanizing-copper plating process.The former has adopted poisonous prussiate, can produce severe contamination to ecotope; The latter's electroplate liquid poor stability, pyrophosphate copper plating process parameter control is strict, and quality of coating stability is very responsive to it, for operator makes troubles.After pre-treatment completes, carry out nickel plating with fluoroborate or sulfamate plating solution again, avoid adopting the quality problems such as the corrosion to matrix that vitriol cheap, that technique is simple, easy to operate (watt plating solution) nickel plating brings and coating crystallization be thick.
Under the pressure of increasingly serious resources and environment protection; carrying out the researchs of magnesium metallic substance and anti-corrosion method thereof is one of urgent task of world's Sustainable development; although obtaining interim progress aspect magnesium alloy protection in recent years; and be applied in certain field, but still there is no to form the method that can replace traditional magnesium alloy plating completely.Therefore the electroplating technology that, hope can be developed a kind of environmental protection meets the production requirement of modern clean energy-saving.
Summary of the invention
The object of the invention is to propose a kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, by the adjustment to electronickelling bath composition, do not adopt poisonous, pollute high component, make plating technic Environmental Safety, and the corrosion-resistant height of coating of preparation, appearance looks elegant, matrix and binding force of cladding material are high.
For reaching this object, the present invention by the following technical solutions:
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 210-220g/L, nickelous chloride 15-25g/L, boric acid 52-56g/L, potassium sulfate 20-26g/L, sodium laurylsulfonate 0.5-1.5g/L, trisodium citrate 8-12g/L, anhydrous sodium acetate 36-40g/L, ethoxyquin butynediol 30-40mg/L, propionic acid 3-4g/L, surplus is water.
Preferably, described plating solution consists of: single nickel salt 213-217g/L, nickelous chloride 18-22g/L, boric acid 53-55g/L, potassium sulfate 21-25g/L, sodium laurylsulfonate 0.8-1.2g/L, trisodium citrate 9-11g/L, anhydrous sodium acetate 37-39g/L, ethoxyquin butynediol 33-37mg/L, propionic acid 3.3-3.7g/L, surplus is water.
Most preferably, described plating solution consists of: single nickel salt 215g/L, nickelous chloride 20g/L, boric acid 54g/L, potassium sulfate 23g/L, sodium laurylsulfonate 1.0g/L, trisodium citrate 10g/L, anhydrous sodium acetate 38g/L, ethoxyquin butynediol 35mg/L, propionic acid 3.5g/L, surplus is water.
The present invention has advantages of:
The present invention is by the selection to each electronickelling plating solution and the adjustment of content, make plating solution performance stable, make to process each time and all obtained good technique effect, for subsequent technique is laid a good foundation, the chromium coating bonding force of final preparation is strong, and metallic coating, coating film thickness is even, solidity to corrosion is high.Whole plating process does not adopt prussiate, and the fluorochemical amount ratio prior art of selecting is few, therefore, and this plating technic environmental protection.
Embodiment
Embodiment mono-
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 210g/L, nickelous chloride 25g/L, boric acid 52g/L, potassium sulfate 26g/L, sodium laurylsulfonate 0.5g/L, trisodium citrate 12g/L, anhydrous sodium acetate 36g/L, ethoxyquin butynediol 40mg/L, propionic acid 3g/L, surplus is water.
Embodiment bis-
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 220g/L, nickelous chloride 15g/L, boric acid 56g/L, potassium sulfate 20g/L, sodium laurylsulfonate 1.5g/L, trisodium citrate 8g/L, anhydrous sodium acetate 40g/L, ethoxyquin butynediol 30mg/L, propionic acid 4g/L, surplus is water.
Embodiment tri-
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 213g/L, nickelous chloride 22g/L, boric acid 53g/L, potassium sulfate 25g/L, sodium laurylsulfonate 0.8g/L, trisodium citrate 11g/L, anhydrous sodium acetate 37g/L, ethoxyquin butynediol 37mg/L, propionic acid 3.3g/L, surplus is water.
Embodiment tetra-
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 217g/L, nickelous chloride 18g/L, boric acid 55g/L, potassium sulfate 21g/L, sodium laurylsulfonate 1.2g/L, trisodium citrate 9g/L, anhydrous sodium acetate 39g/L, ethoxyquin butynediol 33mg/L, propionic acid 3.7g/L, surplus is water.
Embodiment five
A kind of at magnesium alloy notebook computer casing electroplating surface nickel plating bath, described plating solution consists of: single nickel salt 215g/L, nickelous chloride 20g/L, boric acid 54g/L, potassium sulfate 23g/L, sodium laurylsulfonate 1.0g/L, trisodium citrate 10g/L, anhydrous sodium acetate 38g/L, ethoxyquin butynediol 35mg/L, propionic acid 3.5g/L, surplus is water.

Claims (3)

1. one kind at magnesium alloy notebook computer casing electroplating surface nickel plating bath, it is characterized in that, described plating solution consists of: single nickel salt 210-220g/L, nickelous chloride 15-25g/L, boric acid 52-56g/L, potassium sulfate 20-26g/L, sodium laurylsulfonate 0.5-1.5g/L, trisodium citrate 8-12g/L, anhydrous sodium acetate 36-40g/L, ethoxyquin butynediol 30-40mg/L, propionic acid 3-4g/L, surplus is water.
2. one as claimed in claim 1 is at magnesium alloy notebook computer casing electroplating surface nickel plating bath, it is characterized in that, described plating solution consists of: single nickel salt 213-217g/L, nickelous chloride 18-22g/L, boric acid 53-55g/L, potassium sulfate 21-25g/L, sodium laurylsulfonate 0.8-1.2g/L, trisodium citrate 9-11g/L, anhydrous sodium acetate 37-39g/L, ethoxyquin butynediol 33-37mg/L, propionic acid 3.3-3.7g/L, surplus is water.
3. one as claimed in claim 2 is at magnesium alloy notebook computer casing electroplating surface nickel plating bath, it is characterized in that, described plating solution consists of: single nickel salt 215g/L, nickelous chloride 20g/L, boric acid 54g/L, potassium sulfate 23g/L, sodium laurylsulfonate 1.0g/L, trisodium citrate 10g/L, anhydrous sodium acetate 38g/L, ethoxyquin butynediol 35mg/L, propionic acid 3.5g/L, surplus is water.
CN201310218952.6A 2013-06-04 2013-06-04 Plating solution for electroplating nickel on surface of shell of magnesium alloy notebook computer Pending CN103898565A (en)

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CN201310218952.6A CN103898565A (en) 2013-06-04 2013-06-04 Plating solution for electroplating nickel on surface of shell of magnesium alloy notebook computer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106929887A (en) * 2017-05-03 2017-07-07 上海电力学院 A kind of nickel graphene oxide composite plating solution and its preparation method and application

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728720A (en) * 1953-03-09 1955-12-27 Dow Chemical Co Method of producing an electroplate of nickel on magnesium and the magnesium-base alloys
US2998360A (en) * 1959-03-02 1961-08-29 Seymour Mfg Company High-level nickel plating
CN101054700A (en) * 2007-02-09 2007-10-17 上海大学 Method of directly electrodepositing zinc-nickel alloy on magnesium alloy surface
CN101173356A (en) * 2006-10-31 2008-05-07 佛山市顺德区汉达精密电子科技有限公司 Surface treating method for magnesium alloy
CN101435098A (en) * 2007-11-13 2009-05-20 沈阳工业大学 Cyanideless nickel layer electroplating method for magnesium alloy surface
CN101525711A (en) * 2009-04-22 2009-09-09 东南大学 Magnesium alloy with zinc and nickel compound plating layers and preparation method thereof
CN101560662A (en) * 2009-04-15 2009-10-21 李远发 Method for performing neutral electronickelling following magnesium alloy chemical nickeling
CN101280445B (en) * 2008-05-16 2011-08-24 广州杰赛科技股份有限公司 Electroplating process for surface of magnesium alloy motorcycle hub

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728720A (en) * 1953-03-09 1955-12-27 Dow Chemical Co Method of producing an electroplate of nickel on magnesium and the magnesium-base alloys
US2998360A (en) * 1959-03-02 1961-08-29 Seymour Mfg Company High-level nickel plating
CN101173356A (en) * 2006-10-31 2008-05-07 佛山市顺德区汉达精密电子科技有限公司 Surface treating method for magnesium alloy
CN101054700A (en) * 2007-02-09 2007-10-17 上海大学 Method of directly electrodepositing zinc-nickel alloy on magnesium alloy surface
CN101435098A (en) * 2007-11-13 2009-05-20 沈阳工业大学 Cyanideless nickel layer electroplating method for magnesium alloy surface
CN101280445B (en) * 2008-05-16 2011-08-24 广州杰赛科技股份有限公司 Electroplating process for surface of magnesium alloy motorcycle hub
CN101560662A (en) * 2009-04-15 2009-10-21 李远发 Method for performing neutral electronickelling following magnesium alloy chemical nickeling
CN101525711A (en) * 2009-04-22 2009-09-09 东南大学 Magnesium alloy with zinc and nickel compound plating layers and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106929887A (en) * 2017-05-03 2017-07-07 上海电力学院 A kind of nickel graphene oxide composite plating solution and its preparation method and application

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