CN103898480A - Device and method of continuously vacuum-plating waterproof membrane on electronic device - Google Patents
Device and method of continuously vacuum-plating waterproof membrane on electronic device Download PDFInfo
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- CN103898480A CN103898480A CN201410113096.2A CN201410113096A CN103898480A CN 103898480 A CN103898480 A CN 103898480A CN 201410113096 A CN201410113096 A CN 201410113096A CN 103898480 A CN103898480 A CN 103898480A
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Abstract
The invention relates to the field of preparing of vacuum coatings and particularly relates to a device and method of continuously vacuum-plating a waterproof membrane. The device of continuously vacuum-plating the waterproof membrane on an electronic device comprises a first low vacuum chamber, a plasma glow cleaning chamber, a waterproof membrane settling chamber, a fluoride settling chamber and a second low vacuum chamber which are sequentially connected. The method of vacuum-plating the waterproof membrane by means of the device mainly comprises the following step of driving the electronic device to work in the chambers to vacuum-plate the waterproof membrane through a chain. As the chain is provided with a plurality of manufacturing tool baskets for loading the electronic device, continuous membrane plating production can be realized, so that the production efficiency is improved, the vacuumizing time, the loading time and the material heating time are shortened, the energy source is saved, and the quality of the products is uniform. The plated waterproof membrane is compact, strong in binding force and high in membrane hardness, so that the waterproof membrane is suitable for industrial production.
Description
Technical field
The present invention relates to vacuum plating and make field, relate in particular to a kind of device and method of Vacuum Deposition waterproof membrane.
Background technology
Along with being widely used of electronic product, people require also more and more higher to the water resistance of electronic product, what current electronic product often adopted is to adopt the mode of chemical vapour deposition parylene film to carry out Vacuum Deposition waterproof membrane, its concrete steps are: first, pulverous polyphenylene ethyl is placed in to evaporator room, and is heated to 150 ℃ so that the vaporization of pulverous polyphenylene ethyl; Then, polyphenylene ethyl gas is sent to cracking room, and is heated to 650 ℃ to carry out cracking; Afterwards, polyphenylene ethyl monomer after cracking is transmitted to sediment chamber, and be deposited on and need carry out on the electronic installation of Vacuum Deposition waterproof membrane.
Traditional vacuum plating waterproof membrane device, be all that " a kind of poly-to dimethyl benzene depositing system " of 201110035066.0 announcements is similar with the patent No., its system comprises the generating tube, a cracking tube, a purifying air reservoir, a deposition chamber, a condensing engine and the vacuum pump that link successively each other.This is poly-to dimethyl benzene depositing system, be intermittent type but not continous way plated film, thereby this kind equipment has following shortcoming: 1) pumpdown time, charging holding time and material are longer heat-up time; 2) each cycle filming parameter is difficult to guarantee that unanimously quality product is uneven; 3) cracking room and evaporator room have oxidation and pollution to a certain degree after exposing atmosphere to the open air, affect film quality; 4) poor with the bonding force of base material.
Summary of the invention
For overcoming the defect having in above-mentioned prior art, the object of the present invention is to provide a kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation, use this device to carry out Vacuum Deposition waterproof membrane to electronic installation long-time continuous, but not intermittent plated film, thereby can save Production Time, improve operating power, make the quality of product unified mutually, be applicable to suitability for industrialized production, and the waterproof membrane densification being plated to, bonding force is strong, and waterproof effect is stronger, and has super-hydrophobic effect.
For overcoming the defect having in above-mentioned prior art, the object of the present invention is to provide a kind of method of carrying out continuously Vacuum Deposition waterproof membrane on electronic installation, utilize the method can realize expeditiously Vacuum Deposition waterproof membrane, and the waterproof membrane quality being plated to is good, waterproof membrane and base material can be combined closely, the quality of waterproof membrane is unified, and has super-hydrophobic effect.
For achieving the above object, the technical solution adopted in the present invention is:
A kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation, comprise the first low vacuum chamber, plasma aura purge chamber, waterproof membrane sediment chamber, fluorochemical sediment chamber and the second low vacuum chamber that link successively each other, above-mentioned each indoor chain for transmission electronic installation that is provided with, chain is provided with most for installing the fixture basket of electronic installation, and above-mentioned each indoor vacuum pumping pump group that is all connected with, described waterproof membrane is also connected with subcooling condenser in sediment chamber.
According to said structure, the both sides of described the first low vacuum chamber, plasma aura purge chamber, waterproof membrane sediment chamber, fluorochemical sediment chamber, the second low vacuum chamber are equipped with flap valve.
According to said structure, the quantity of described waterproof membrane sediment chamber is 1 ~ 6.
According to said structure, described waterproof membrane sediment chamber is polyphenylene ethyl sediment chamber.
A method of carrying out continuously Vacuum Deposition waterproof membrane on electronic installation, comprises the following steps:
(1) electronic installation is arranged on fixture basket, again fixture basket is placed on chain, open the flap valve in the first low vacuum chamber outside, bring fixture basket into first low vacuum chamber by chain gear afterwards, close again the flap valve in the first low vacuum chamber outside, the vacuum pumping pump of opening the first low vacuum chamber vacuumizes, and makes the first low vacuum chamber reach the pressure of 50torr;
(2) open the flap valve between the first low vacuum chamber and plasma aura purge chamber, by chain, fixture basket is transferred to plasma aura purge chamber from the first low vacuum chamber, close again the flap valve between the first low vacuum chamber and plasma aura purge chamber, the vacuum pumping pump of opening afterwards plasma aura purge chamber vacuumizes, make plasma aura purge chamber reach the pressure of 1torr, then start plasma aura and clean;
(3) open the flap valve between plasma brightness purge chamber and waterproof membrane sediment chamber, by chain, fixture basket is transferred to waterproof membrane sediment chamber from plasma aura purge chamber again, then close the flap valve between plasma brightness purge chamber and waterproof membrane sediment chamber, vacuum pumping pump and the cryogenic condensation chamber of opening waterproof membrane sediment chamber start to vacuumize, make waterproof membrane sediment chamber reach the pressure of 0.1torr, start afterwards the electronic installation plating waterproof membrane in fixture basket;
(4) open the flap valve between waterproof membrane sediment chamber and fluorochemical sediment chamber, by chain, fixture basket is transferred to fluorochemical sediment chamber from waterproof membrane sediment chamber, then close the flap valve between waterproof membrane sediment chamber and fluorochemical sediment chamber, the vacuum pumping pump of opening in fluorochemical sediment chamber vacuumizes, make fluorochemical sediment chamber reach the pressure of 1torr, then start the electronic installation on fixture basket to carry out chemical vapour deposition fluoride films;
(5) open the flap valve between fluorochemical sediment chamber and the second low vacuum chamber, by chain by fixture basket from fluorochemical sediment chamber to the second low vacuum chamber, close again the flap valve between fluorochemical sediment chamber and the second low vacuum chamber, then the second vacuum chamber is exitted, make the second low vacuum chamber reach normal pressure, then open the flap valve that the second low vacuum chamber connects outside, take fixture basket out of second low vacuum chamber by chain gear, complete plated film.
Compared with conventional art, beneficial effect of the present invention is:
Can be on electronic installation successive sedimentation waterproof membrane, production efficiency is improved, thereby saved the pumpdown time, charge time and material heat-up time, save the energy, and can make the quality of product unified, be applicable to suitability for industrialized production, and the waterproof membrane densification being plated to, bonding force is strong, and outermost layer is fluoridized silicon fiml and had ultra-hydrophobicity, makes product have stronger waterproof effect.
Below in conjunction with drawings and the specific embodiments, the present invention is further illustrated:
accompanying drawing explanation:
Fig. 1 is the structural representation of the present invention's preferred embodiment.
embodiment:
As shown in Figure 1, the present invention is about a kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation, this device includes the first low vacuum chamber 1 linking successively each other, plasma aura purge chamber 2, waterproof membrane sediment chamber 3, fluorochemical sediment chamber 4 and the second low vacuum chamber 5, above-mentioned each indoor chain 100 for transmission electronic installation that is provided with, chain 100 is provided with most for installing the fixture basket (not drawing in the drawings) of electronic installation, the both sides of each chamber are equipped with the flap valve that can open and close, and the first low vacuum chamber 1, plasma aura purge chamber 2, waterproof membrane sediment chamber 3, fluorochemical sediment chamber 4 and the second low vacuum chamber 5 are all connected with a vacuum pumping pump, described each vacuum pumping pump is connected with each chamber by a valve, in waterproof membrane sediment chamber 3, be also connected with a subcooling condenser 9, in the time that the flap valve of each chamber cuts out, vacuum pumping pump can vacuumize each chamber.
The quantity of described waterproof membrane sediment chamber 3 is 1 ~ 6, as a preferred embodiment of the present invention, as shown in Figure 1, in the present embodiment, waterproof membrane sediment chamber 3 includes the first waterproof membrane sediment chamber 31, the second waterproof membrane sediment chamber 32 and the 3rd waterproof membrane sediment chamber 33 that connect successively, and described the first waterproof membrane sediment chamber 31, the second waterproof membrane sediment chamber 32 are all connected with subcooling condenser 9, vacuum pumping pump 73 with the 3rd waterproof membrane sediment chamber 33.In the present embodiment, described waterproof membrane sediment chamber 3 is polyphenylene ethyl sediment chamber.
As shown in Figure 1, described the first low vacuum chamber 1 outside is provided with a flap valve 61, on the first low vacuum chamber 1, be connected with vacuum pumping pump 71, between the first low vacuum chamber 1 and plasma aura purge chamber 2, be provided with flap valve 62, in plasma aura purge chamber 2, be connected with vacuum pumping pump 72, between described plasma aura purge chamber 2 and waterproof membrane sediment chamber 3, be provided with flap valve 63, in waterproof membrane sediment chamber 3, be connected with vacuum pumping pump 73 and subcooling condenser 9, between described waterproof membrane sediment chamber 3 and fluorochemical sediment chamber 4, be provided with flap valve 64, in fluorochemical sediment chamber 4, be connected with vacuum pumping pump 74, between described fluorochemical sediment chamber 4 and the second low vacuum chamber 5, be provided with flap valve 65, on the second low vacuum chamber 5, be connected with vacuum pumping pump 75, described the second low vacuum chamber 5 is separated by with the external world by a flap valve 66.
Described first low vacuum chamber 1 place's the second low vacuum chamber 5 is interior in low vacuum state; Described plasma aura purge chamber 2 can carry out the cleaning of plasma aura to electronic installation, and then makes surface of electronic device cleaner, to strengthen the bonding force of electronic installation and waterproof membrane; Described waterproof membrane sediment chamber 3 can carry out chemical vapour deposition parylene film to electronic installation, because waterproof membrane sediment chamber 3 can be multiplely, is also provided with multiple fixture baskets of depositing electronic installation, thereby can carries out continuous coating production on chain 100; Described fluorochemical sediment chamber 4 can carry out electroless plating fluoride films to electronic installation, to increase the stability of waterproof membrane, improves the quality of waterproof membrane.
The present invention, also about a kind of method of carrying out continuously Vacuum Deposition waterproof membrane on electronic installation, comprises the following steps:
(1) electronic installation is arranged on fixture basket, again fixture basket is placed on chain 100, open flap valve 61, by chain 100 transmissions, fixture basket is brought in the first low vacuum chamber 1 afterwards, close again flap valve 61, the vacuum pumping pump 71 of opening the first low vacuum chamber 1 vacuumizes, and makes the first low vacuum chamber 1 reach the pressure of 50torr;
(2) open flap valve 62, by chain 100, fixture basket is transferred to plasma aura purge chamber 2 from the first low vacuum chamber 1, close again flap valve 62, the vacuum pumping pump 72 of opening afterwards plasma aura purge chamber 2 vacuumizes, in the time that plasma aura purge chamber 2 reaches the pressure of 1torr, then start electronic installation to carry out the cleaning of plasma aura;
(3) open flap valve 63, by chain 100, fixture basket is transferred to waterproof membrane sediment chamber 3 from plasma aura purge chamber 2 again, then flap valve 63, vacuum pumping pump 73 and the cryogenic condensation chamber 9 of opening waterproof membrane sediment chamber 3 start to vacuumize, make waterproof membrane sediment chamber 3 reach the pressure of 0.1torr, start afterwards the electronic installation plating waterproof membrane in fixture basket, because waterproof membrane sediment chamber 3 in the present embodiment includes the first waterproof membrane sediment chamber 31, the second waterproof membrane sediment chamber 32 and the 3rd waterproof membrane sediment chamber 33, thereby can carry out plated film to three electronic installations simultaneously, increase work efficiency, saving resource,
(4) open flap valve 64, by chain 100, fixture basket is transferred in fluorochemical sediment chamber 4 from waterproof membrane sediment chamber 3, then close flap valve 64, the vacuum pumping pump 74 of opening in fluorochemical sediment chamber 4 vacuumizes, make fluorochemical sediment chamber 4 reach the pressure of 1torr, then start the electronic installation on fixture basket to carry out chemical vapour deposition fluoride films;
(5) open flap valve 65, by chain 100 by fixture basket from fluorochemical sediment chamber 4 to second low vacuum chambers 5, close again flap valve 65, then the second vacuum chamber 5 is exitted, make the second low vacuum chamber 5 reach normal pressure, then open flap valve 66, take fixture basket out of second low vacuum chamber 5 by chain gear, complete plated film.
In the process of above-mentioned making waterproof membrane, because waterproof membrane sediment chamber 3 remains on the vacuum state of 0.1 ~ 1torr always, thereby the cracking room being connected with waterproof membrane sediment chamber 3 and the also vacuum state in 0.1 ~ 1torr of evaporator room, thereby can not expose the oxidized pollution of atmosphere to the open air, thereby the better quality of waterproof membrane.
The present invention can be on electronic installation successive sedimentation waterproof membrane, production efficiency is improved, saved the pumpdown time, charge time and material heat-up time, save the energy, and can make the quality of product unified, be applicable to suitability for industrialized production, and the waterproof membrane densification being plated to, bonding force is strong, and outermost layer is fluoridized silicon fiml and had ultra-hydrophobicity, makes product have stronger waterproof effect.
Claims (5)
1. one kind is carried out continuously the device of Vacuum Deposition waterproof membrane on electronic installation, it is characterized in that: comprise the first low vacuum chamber, plasma aura purge chamber, waterproof membrane sediment chamber, fluorochemical sediment chamber and the second low vacuum chamber that link successively each other, above-mentioned each indoor chain for transmission electronic installation that is provided with, chain is provided with most for installing the fixture basket of electronic installation, and above-mentioned each indoor vacuum pumping pump group that is all connected with, described waterproof membrane is also connected with subcooling condenser in sediment chamber.
2. a kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation according to claim 1, is characterized in that: the both sides of described the first low vacuum chamber, plasma aura purge chamber, waterproof membrane sediment chamber, fluorochemical sediment chamber, the second low vacuum chamber are equipped with flap valve.
3. a kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation according to claim 1, is characterized in that: the quantity of described waterproof membrane sediment chamber is 1 ~ 6.
4. according to a kind of device that carries out continuously Vacuum Deposition waterproof membrane on electronic installation described in claim 1 or 3, it is characterized in that: described waterproof membrane sediment chamber is polyphenylene ethyl sediment chamber.
5. the method for carrying out continuously Vacuum Deposition waterproof membrane by device described in claim 1 ~ 4 on electronic installation, is characterized in that: comprise the following steps:
(1) electronic installation is arranged on fixture basket, again fixture basket is placed on chain, open the flap valve in the first low vacuum chamber outside, bring fixture basket into first low vacuum chamber by chain gear afterwards, close again the flap valve in the first low vacuum chamber outside, the vacuum pumping pump of opening the first low vacuum chamber vacuumizes, and makes the first low vacuum chamber reach the pressure of 50torr;
(2) open the flap valve between the first low vacuum chamber and plasma aura purge chamber, by chain, fixture basket is transferred to plasma aura purge chamber from the first low vacuum chamber, close again the flap valve between the first low vacuum chamber and plasma aura purge chamber, the vacuum pumping pump of opening afterwards plasma aura purge chamber vacuumizes, make plasma aura purge chamber reach the pressure of 1torr, then start plasma aura and clean;
(3) open the flap valve between plasma brightness purge chamber and waterproof membrane sediment chamber, by chain, fixture basket is transferred to waterproof membrane sediment chamber from plasma aura purge chamber again, then close the flap valve between plasma brightness purge chamber and waterproof membrane sediment chamber, vacuum pumping pump and the cryogenic condensation chamber of opening waterproof membrane sediment chamber start to vacuumize, make waterproof membrane sediment chamber reach the pressure of 0.1torr, start afterwards the electronic installation plating waterproof membrane in fixture basket;
(4) open the flap valve between waterproof membrane sediment chamber and fluorochemical sediment chamber, by chain, fixture basket is transferred to fluorochemical sediment chamber from waterproof membrane sediment chamber, then close the flap valve between waterproof membrane sediment chamber and fluorochemical sediment chamber, the vacuum pumping pump of opening in fluorochemical sediment chamber vacuumizes, make fluorochemical sediment chamber reach the pressure of 1torr, then start the electronic installation on fixture basket to carry out chemical vapour deposition fluoride films;
(5) open the flap valve between fluorochemical sediment chamber and the second low vacuum chamber, by chain by fixture basket from fluorochemical sediment chamber to the second low vacuum chamber, close again the flap valve between fluorochemical sediment chamber and the second low vacuum chamber, then the second vacuum chamber is exitted, make the second low vacuum chamber reach normal pressure, then open the flap valve that the second low vacuum chamber connects outside, take fixture basket out of second low vacuum chamber by chain gear, complete plated film.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104213095A (en) * | 2014-09-25 | 2014-12-17 | 昆山彰盛奈米科技有限公司 | Continuous coating device for coating layer on surface of cable and method thereof |
CN105568234A (en) * | 2016-01-28 | 2016-05-11 | 信利(惠州)智能显示有限公司 | Continuous coating device |
CN107694851A (en) * | 2017-11-13 | 2018-02-16 | 苏州新智机电工业有限公司 | Online high-efficiency energy-saving vacuum operating system |
CN111364041A (en) * | 2020-03-30 | 2020-07-03 | 北京猎户星空科技有限公司 | Electronic wire connecting terminal film coating waterproof process |
CN114481094A (en) * | 2022-01-27 | 2022-05-13 | 瑞昌鼎新半导体工业有限公司 | Sealing element coating equipment and coating method thereof |
CN114855142A (en) * | 2022-04-18 | 2022-08-05 | 电子科技大学 | Parylene material with low surface energy and preparation method thereof |
CN115449772A (en) * | 2022-08-22 | 2022-12-09 | 秦皇岛精和智能装备有限公司 | Coating protection process and equipment suitable for black box |
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CN101603170A (en) * | 2009-07-21 | 2009-12-16 | 黄益新 | A kind of method that is coated with poly-to the dimethyl benzene film on the led chip surface |
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WO2000005000A1 (en) * | 1998-07-24 | 2000-02-03 | The Secretary Of State For Defence | Surface coatings |
CN1317057A (en) * | 1998-09-07 | 2001-10-10 | 宝洁公司 | Super hydrophobic coated substrates |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104213095A (en) * | 2014-09-25 | 2014-12-17 | 昆山彰盛奈米科技有限公司 | Continuous coating device for coating layer on surface of cable and method thereof |
CN104213095B (en) * | 2014-09-25 | 2017-08-25 | 昆山彰盛奈米科技有限公司 | Cable surface coating continuous coating apparatus and method |
CN105568234A (en) * | 2016-01-28 | 2016-05-11 | 信利(惠州)智能显示有限公司 | Continuous coating device |
CN107694851A (en) * | 2017-11-13 | 2018-02-16 | 苏州新智机电工业有限公司 | Online high-efficiency energy-saving vacuum operating system |
CN111364041A (en) * | 2020-03-30 | 2020-07-03 | 北京猎户星空科技有限公司 | Electronic wire connecting terminal film coating waterproof process |
CN114481094A (en) * | 2022-01-27 | 2022-05-13 | 瑞昌鼎新半导体工业有限公司 | Sealing element coating equipment and coating method thereof |
CN114855142A (en) * | 2022-04-18 | 2022-08-05 | 电子科技大学 | Parylene material with low surface energy and preparation method thereof |
CN115449772A (en) * | 2022-08-22 | 2022-12-09 | 秦皇岛精和智能装备有限公司 | Coating protection process and equipment suitable for black box |
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