CN103887376A - Light emitting diode module manufacturing method - Google Patents
Light emitting diode module manufacturing method Download PDFInfo
- Publication number
- CN103887376A CN103887376A CN201210565006.4A CN201210565006A CN103887376A CN 103887376 A CN103887376 A CN 103887376A CN 201210565006 A CN201210565006 A CN 201210565006A CN 103887376 A CN103887376 A CN 103887376A
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- Prior art keywords
- lens
- emitting diode
- chip mounter
- image sensor
- light emitting
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 238000003384 imaging method Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 30
- 229920000297 Rayon Polymers 0.000 claims description 23
- 238000007689 inspection Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 6
- 230000001070 adhesive effect Effects 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 4
- 230000001795 light effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a light emitting diode module manufacturing method. The method comprises the following steps: a surface mount machine which is provided with a CCD image sensor and a suction mouth is provided, and a strip-shaped circuit board on which a plurality of light emitting diodes are arranged at intervals is arranged in the surface mount machine; a plurality of lenses on which optical identification parts are formed are provided for enabling the CCD image sensor of the surface mount machine for imaging identification; an adhesive region is provided inside the surface mount machine, adhesive is applied to the adhesive region, and the suction mouth of the surface mount machine is used for sucking the lenses and carrying the lenses to the adhesive region for taking adhesive; the suction mouth is used for sucking the lenses to be away from the adhesive region and the CCD image sensor of the surface mount machine is used for imaging and identifying the lenses so as to check the relative positions of the lenses; and the surface mount technology of the surface mount machine is used for positioning and mounting the lens corresponding on the light emitting diodes and thus the lenses are fixed on the circuit board. Compared with the prior art, the light emitting diode module manufacturing method is accurate in positioning, effective and high in production efficiency.
Description
Technical field
The present invention relates to semiconductor light emitting field, relate in particular to a kind of manufacture method of light emitting diode module.
Background technology
Light-emitting diode (light emitting diode, LED) as a kind of light emitting source efficiently, there is the various features such as environmental protection, power saving, life-span length and applied to widely various fields, at present light-emitting diode is applied to the trend that has become industry in backlight module.Existing backlight module is in manufacturing process, can be first using the above substrate as the LED of light source as carrying of a circuit board (PCB), then on PCB, with SMT (Surface Mount Technology) chip mounter, LED assembly paster is got on, complete the installation of LED on circuit board by melting the techniques such as scolding tin, above LED, cover a diffusion sheet and carry out uniform light simultaneously.For further uniform light, can be first on each LED correspondence install an optical lens (Lens) additional, then solidify, then complete diffusion sheet assembling.
But LED just seems more important with coordinating of optical lens in this case, will cause bright dipping inhomogeneous if there is the assembling off normal of the two, may there is inhomogeneous bright blanking bar phenomenon in follow-up backlight module at work.
Summary of the invention
In view of this, be necessary to provide a kind of light emitting diode module that can guarantee manufacturing to go out the preferably manufacture method of light emitting diode module of light effect.
A kind of manufacture method of light emitting diode module, comprise the following steps: preparation process, chip mounter is provided, described chip mounter has ccd image sensor and suction nozzle, provide again strip circuit panel assembly in chip mounter, on described circuit board, be arranged at intervals with some light-emitting diodes; Prepare lens step, some lens are provided, on each lens, be formed with optical identification portion, for the ccd image sensor imaging identification of described chip mounter; Lens are stained with glue step, and viscose glue region is provided in described chip mounter, are coated with viscose glue described being stained with in glue region, utilize the suction nozzle absorption lens of chip mounter and carry lens to viscose glue region to pick described viscose glue; Check step, utilize suction nozzle to draw lens straps from described viscose glue region, utilize the ccd image sensor imaging identification lens of chip mounter, to check the relative position of lens; Device lens step, the paster technique that utilizes described chip mounter is by corresponding described lens positioner on each light-emitting diode, and fixed lens is on described circuit board.
Compared with prior art, in the manufacture method of light emitting diode module of the present invention, on lens, form patterned optical identification part, for the ccd image sensor identification of described chip mounter, in chip mounter, complete lens pick the paster technique that recycles described chip mounter after viscose glue by corresponding described lens positioner on each light-emitting diode, registration, effective, production efficiency is high, and the light emitting diode module of simultaneously guaranteeing manufacturing has and preferably goes out light effect.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the light emitting diode module of one embodiment of the invention.
Fig. 2 is element schematic diagram in the step S101 of manufacture method of light emitting diode module shown in Fig. 1.
Fig. 3 is element schematic diagram in the step S103 of manufacture method of light emitting diode module shown in Fig. 1.
Fig. 4 is element schematic diagram in the step S104 of manufacture method of light emitting diode module shown in Fig. 1.
Fig. 5 is element schematic diagram in the step S105 of manufacture method of light emitting diode module shown in Fig. 1.
Fig. 6 is the elevational schematic view of lens shown in Fig. 3.
Main element symbol description
| |
10 |
| Light- |
20 |
| |
30 |
| |
301 |
| Exiting |
302 |
| |
303 |
| |
304 |
| |
32 |
| |
100 |
| |
102 |
| |
104 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1 to Fig. 5, the manufacture method of the light emitting diode module of one embodiment of the invention, it comprises the following steps:
Preparation process S101, one chip mounter 100 is provided, described chip mounter 100 possesses CCD(Charge-Coupled Device) imageing sensor 102 and suction nozzle 104, provide again at least one bar shaped circuit board 10 to be installed in chip mounter 100, on described circuit board 10, be arranged at intervals with some light-emitting diodes 20;
Prepare lens step S102, some lens 30 are provided, on each lens 30, form at least one patterned optical identification part 32, identify for the ccd image sensor 102 of described chip mounter 100;
Lens are stained with glue step S103, and a viscose glue region 40 is provided in described chip mounter 100, are coated with viscose glue 50 described being stained with in glue region 40, utilize the suction nozzle 104 of chip mounter 100 to draw lens 30 and carry lens 30 to viscose glue region 40 and pick described viscose glue 50;
Check step S104, utilize suction nozzle 104 to draw lens 30 and take away described viscose glue region 40, utilize the ccd image sensor 102 imaging identification lens 30 of chip mounter 100, to check the relative position of lens 30;
Device lens step S105, the paster technique that utilizes described chip mounter 100 is by the corresponding positioner of described lens 30 on each light-emitting diode 20, and fixed lens 30 is on described circuit board 10.
Particularly, the paster technique flow process of described chip mounter 100 comprises: first described circuit board 10 is transferred to fixed position by conveyer and is fixed by clamping plate mechanism, the suction nozzle 104 of chip mounter 100 moves to circuit board 10 datum mark tops, by ccd image sensor 102, datum mark on circuit board 10 is taken a picture, determine the coordinate system of circuit board 10, when the suction nozzle 104 of chip mounter 100 is drawn after lens 30, by ccd image sensor 102,32 imagings of optical identification portion are identified, determine the coordinate system of element, and be that digital information form is through storage by results conversion, coding, amplify, arrange and analyze, feed back to again control unit, by control unit execution, suction nozzle 104 is drawn to lens 30 and navigate to precalculated position on circuit board 10, finally complete paster operation.
In addition, in described inspection step S104, because described viscose glue 50 is colloid, described ccd image sensor 102 is to 30 imagings whens identification of lens, and the optical identification portion 32 of described lens 30 can be identified, and viscose glue 50 on lens 30 bottoms also can be identified.Particularly, exist the position GTG brightness of described viscose glue 50 low in image, the position that there is no viscose glue 50 is that GTG brightness is high.Like this, in described inspection step S104, can check whether lens 30 complete lens and be stained with glue step S103 simultaneously.
Described lens 30 are one-body molded by the good transparent material of optical property, as PMMA or PC plastics.The corresponding lid of each lens 30 is placed on a light-emitting diode 20.Described lens 30 levels adhere on described circuit board 10.
Referring to Fig. 6, described lens 30 comprise incidence surface 301, the exiting surface 302 being oppositely arranged with incidence surface 301 and the side wall surface 303 that is connected this incidence surface 301 and exiting surface 302.Described lens 30 are offered the corresponding accommodating described light-emitting diode 20 of a storage tank 304 in the central region of its bottom surface.Described exiting surface 302 is located at incidence surface 301 tops, and described incidence surface 301 is directly located on light-emitting diode 20.Described optical identification portion 32 is formed on the incidence surface 301 of described lens 30.Described ccd image sensor 102 arranges with described viscose glue region 40 is contiguous, is convenient to ccd image sensor 102 and carries out imaging identification in inspection step S104.
Understandably, the quantity of the optical identification portion 32 of described lens 30 can be multiple, like this, can realize to lens 30 position make refinement adjustment, and then obtain optimized locating effect.In the present embodiment, the optical identification portion 32 of described lens 30 is three, and even, interval arranges mutually.
In addition, because the pattern dimension of the optical identification portion 32 of described lens 30 is roughly in 0.1mm left and right, the resolution requirement of the ccd image sensor 102 to chip mounter 100 is higher, and shared like this operation duration is longer.And the size of described lens 30 is roughly in 3mm left and right.Like this, in the manufacture method of light emitting diode module of the present invention, in described chip mounter 100, can there be two ccd image sensors 102 by device, one of them ccd image sensor 102 resolution is lower, position by the gabarit of identifying whole lens 30, and another one ccd image sensor 102 resolution are higher, can carry out rear location by the optical identification portion 32 of identification lens 30, like this, described device lens step S105 comprises pre-determined bit lens step and whole positioning lens step, the resolution ccd image sensor 102 that utilizes described chip mounter 100 in pre-determined bit lens step by paster technique by described lens 30 corresponding intruments on each light-emitting diode 20, carry out again whole positioning lens step, the high resolution CCD imageing sensor 102 that recycles described chip mounter 100 is accurately located described lens 30 by paster technique, and fixed lens 30 is on described circuit board 10.Thereby guaranteeing, under the prerequisite of registration, can to save operation duration, enhance productivity.
Compared with prior art, in the manufacture method of light emitting diode module of the present invention, on lens 30, form the optical identification portion 32 of patterning, for the ccd image sensor 102 imaging identifications of described chip mounter 100, in chip mounter 100, complete paster technique that lens 30 pick the described chip mounter 100 of the rear recycling of viscose glue 50 by the corresponding positioner of described lens 30 on each light-emitting diode 20, registration, effective, production efficiency is high, and the light emitting diode module of simultaneously guaranteeing manufacturing has and preferably goes out light effect.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a manufacture method for light emitting diode module, comprises the following steps:
Preparation process, provides chip mounter, and described chip mounter has ccd image sensor and suction nozzle, then provides strip circuit panel assembly in chip mounter, is arranged at intervals with some light-emitting diodes on described circuit board;
Prepare lens step, some lens are provided, on each lens, be formed with optical identification portion, for the ccd image sensor imaging identification of described chip mounter;
Lens are stained with glue step, and viscose glue region is provided in described chip mounter, are coated with viscose glue described being stained with in glue region, utilize the suction nozzle absorption lens of chip mounter and carry lens to viscose glue region to pick described viscose glue;
Check step, utilize suction nozzle to draw lens straps from described viscose glue region, utilize the ccd image sensor imaging identification lens of chip mounter, to check the relative position of lens;
Device lens step, the paster technique that utilizes described chip mounter is by corresponding described lens positioner on each light-emitting diode, and fixed lens is on described circuit board.
2. the manufacture method of light emitting diode module as claimed in claim 1, is characterized in that: described lens comprise incidence surface, the exiting surface being oppositely arranged with incidence surface and the side wall surface that is connected this incidence surface and exiting surface.
3. the manufacture method of light emitting diode module as claimed in claim 2, is characterized in that: described optical identification portion is formed on the incidence surface of described lens.
4. the manufacture method of light emitting diode module as claimed in claim 3, is characterized in that: described ccd image sensor and described viscose glue region adjacent arrange.
5. the manufacture method of light emitting diode module as claimed in claim 2, is characterized in that: described incidence surface is directly located on light-emitting diode, and described exiting surface is positioned at the top of incidence surface, and described exiting surface is the dome curved surface upwards arching upward.
6. the manufacture method of light emitting diode module as claimed in claim 1, is characterized in that: the quantity of described optical identification portion is multiple, and these optical identification portions mutually evenly, interval arranges.
7. the manufacture method of light emitting diode module as claimed in claim 1, is characterized in that: in described inspection step, utilize the ccd image sensor imaging of described chip mounter to identify described lens simultaneously and whether complete described inspection step.
8. the manufacture method of light emitting diode module as claimed in claim 1, it is characterized in that: described chip mounter also has another ccd image sensor, described device lens step is divided into pre-determined bit lens step and whole positioning lens step, this another ccd image sensor that utilizes described chip mounter in pre-determined bit lens step by paster technique by corresponding described lens positioner on each light-emitting diode, carry out again whole positioning lens step, this ccd image sensor that recycles described chip mounter is finally located described lens by paster technique, and fixed lens is on described circuit board.
9. the manufacture method of light emitting diode module as claimed in claim 8, is characterized in that: described another ccd image sensor in resolution lower than described ccd image sensor.
10. the manufacture method of light emitting diode module as claimed in any one of claims 1-9 wherein, it is characterized in that: the paster technique flow process of described chip mounter comprises: first described circuit board is transferred to fixed position by the conveyer of chip mounter and is fixed by clamping plate mechanism, the suction nozzle of chip mounter moves to circuit board top, by ccd image sensor, circuit board is taken a picture, determine the coordinate system of circuit board, then, the suction nozzle of chip mounter is drawn lens, by ccd image sensor, the imaging of optical identification portion is identified, determine the coordinate system of lens, and be that digital information form is through storage by results conversion, coding, amplify, arrange and analyze, feed back to again control unit, carried out suction nozzle and lens position to precalculated position on circuit board by control unit, finally complete paster operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210565006.4A CN103887376A (en) | 2012-12-24 | 2012-12-24 | Light emitting diode module manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210565006.4A CN103887376A (en) | 2012-12-24 | 2012-12-24 | Light emitting diode module manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103887376A true CN103887376A (en) | 2014-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210565006.4A Pending CN103887376A (en) | 2012-12-24 | 2012-12-24 | Light emitting diode module manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103887376A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104566254A (en) * | 2015-01-29 | 2015-04-29 | 佛山市三目照明电器有限公司 | Production method for installing light-transmitting cover on LED lamp |
| CN108119788A (en) * | 2016-11-29 | 2018-06-05 | 卡尔蔡司工业测量技术有限公司 | For producing the method and apparatus of lighting device |
| WO2024066528A1 (en) * | 2022-09-28 | 2024-04-04 | 惠州视维新技术有限公司 | Lens, backlight module, display device, and method for manufacturing backlight module |
-
2012
- 2012-12-24 CN CN201210565006.4A patent/CN103887376A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104566254A (en) * | 2015-01-29 | 2015-04-29 | 佛山市三目照明电器有限公司 | Production method for installing light-transmitting cover on LED lamp |
| CN108119788A (en) * | 2016-11-29 | 2018-06-05 | 卡尔蔡司工业测量技术有限公司 | For producing the method and apparatus of lighting device |
| DE102016223710B4 (en) * | 2016-11-29 | 2021-01-14 | Carl Zeiss Industrielle Messtechnik Gmbh | Method and device for producing a lighting device |
| WO2024066528A1 (en) * | 2022-09-28 | 2024-04-04 | 惠州视维新技术有限公司 | Lens, backlight module, display device, and method for manufacturing backlight module |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140625 |