CN103885143B - The assembly that chip array and parallel optical fibre are coupled and aligned and its preparation method - Google Patents
The assembly that chip array and parallel optical fibre are coupled and aligned and its preparation method Download PDFInfo
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- CN103885143B CN103885143B CN201410150872.6A CN201410150872A CN103885143B CN 103885143 B CN103885143 B CN 103885143B CN 201410150872 A CN201410150872 A CN 201410150872A CN 103885143 B CN103885143 B CN 103885143B
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Abstract
The present invention discloses a kind of chip array and parallel optical fibre is coupled and aligned assembly and its preparation method, this assembly comprises chip array, substrate, parallel optical fibre and circuit card, on the photoelectric conversion surface of chip array, gap-forming has some photoelectric conversion regions, substrate is formed and the through hole that photoelectric conversion region size is mated mutually; Chip array side mounts substrate, makes the center of each photoelectric conversion region just right with the center of corresponding through hole; Substrate orientation is on circuit card, and chip array and other electronic components being connected needed on circuit card are electrically connected; In the bare fibre portion of the parallel optical fibre Zhong Mei road optical fiber through hole that to be inserted in substrate from the back of the body to the side of chip array corresponding. Unit construction of the present invention is simple, and cost of manufacture is low, by this assembly can be simple realize being coupled and aligned of chip array and parallel optical fibre, and alignment precision height, coupling efficiency height, is easy to realization, is applicable to the product of various employing parallel optical fibre technology.
Description
Technical field
The present invention relates to a kind of chip array and assembly that parallel optical fibre is coupled and aligned, specifically relate to the chip array of a kind of laser apparatus or photorectifier and assembly that parallel optical fibre is coupled and aligned and its preparation method.
Background technology
In order to adapt to people to the increase day by day of communication bandwidth requirements, increasing transmission capacity and reduce the most important thing that power consumption is fiber optic communication field, parallel optical technology is thus growing. The product of parallel optical technology is utilized to mainly contain QSFP optical module, thunder and lightning (Thunderbolt) cable and light active HDMI cable etc. at present. The main feature of parallel optical technology has multi-path laser diode or photorectifier alignment multi-channel optical fibre in an independent device or module. Therefore, how being directed at multi-path laser diode or photorectifier by multi-channel optical fibre, this just relates to the method being coupled and aligned simultaneously.
A kind of chip array is disclosed and traditional method that parallel optical fibre is coupled and aligned: multi-channel optical fibre utilizes V-type grain or MPO/MT to insert core and is processed into parallel optical fibre 3 such as Fig. 6, the lens arra 6 that is first coupled and aligned by parallel optical fibre is fixed, again parallel optical fibre and lens arra are fixed on multidimensional adjustment rack, by repeatedly regulating adjustment rack, observe VCSEL(vertical cavity surface emitting laser simultaneously) luminous power or PD(photorectifier) size of photoelectric current, lens arra 6 and chip array 1(VCSEL chip array or PD chip array could be realized) be coupled and aligned.
General VCSEL and PD chip array spacing between any two is 250 μm, spacing trueness error is about 0.2 μm, the each road laser wanting to be launched parallel by VCSEL chip array is coupled and aligned in every bar optical fiber uniformly, and then the laser in every bar optical fiber is coupled in PD chip array uniformly, this needs the trueness error of lens arra and parallel optical fibre must control within 1 μm, so the technical requirements preparing lens arra and parallel optical fibre is higher, same cost also remains high.But also need by repeatedly regulating adjustment rack to observe the luminous power of VCSEL and PD photoelectric current realizes being coupled and aligned simultaneously, complex process and consuming time longer.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention proposes a kind of chip array and parallel optical fibre is coupled and aligned assembly and its preparation method, this unit construction is simple, cost of manufacture is low, by this assembly can be simple realize being coupled and aligned of chip array and parallel optical fibre, and alignment precision height, coupling efficiency height, it is easy to realize, it is applicable to the product of various employing parallel optical fibre technology.
The technical scheme of the present invention is achieved in that
The assembly that a kind of chip array and parallel optical fibre are coupled and aligned, comprise a chip array, a substrate, a parallel optical fibre and a circuit card, on the photoelectric conversion surface of described chip array, gap-forming has some photoelectric conversion regions, each photoelectric conversion region corresponding, described substrate is formed and the through hole that described photoelectric conversion region size is mated mutually; The side that described chip array has a photoelectric conversion surface mounts the side of described substrate, makes the center of each photoelectric conversion region just right with the center of corresponding through hole; Described substrate orientation is on described circuit card, and described chip array and other electronic components being connected needed on described circuit card are electrically connected; Each through hole corresponding, described parallel optical fibre is provided with the optical fiber that a road has bare fibre portion, in the bare fibre portion of the every road optical fiber through hole that to be inserted in described substrate from the back of the body to the side of described chip array corresponding.
As a further improvement on the present invention, on the photoelectric conversion surface of described chip array, gap-forming has four described photoelectric conversion regions, and the through hole of each photoelectric conversion region and correspondence is circle.
As a further improvement on the present invention, described chip array is the one in VCSEL chip array and PD chip array, and when described chip array is VCSEL chip array, described photoelectric conversion region is the luminous zone of VCSEL chip array; When described chip array is PD chip array, described photoelectric conversion region is the photosensitive district of PD chip array.
As a further improvement on the present invention, on the photoelectric conversion surface of described chip array, gap-forming has some chip pads; Each chip pad corresponding, described substrate side is formed with a substrate pads, and the substrate pads that each chip pad of described chip array is corresponding with on described substrate welds together.
As a further improvement on the present invention, described substrate is formed the gold thread figure corresponding with the circuitous pattern of other electronic components connected required on described circuit card, described gold thread figure is electrically connected with described circuitous pattern, and described gold thread figure is electrically connected with described chip array.
As a further improvement on the present invention, the material of described substrate is the one in monocrystalline silicon piece and ceramic plate, and the material of described substrate pads is gold-tin alloy.
As a further improvement on the present invention, the mode that described gold thread figure is electrically connected with described circuitous pattern be conductive resin fix, gold tinsolder weld and gold thread bonding in one.
As a further improvement on the present invention, bigger than the external diameter of described bare fibre 2 microns to 9 microns of the internal diameter of described through hole.
As a further improvement on the present invention, being separately provided with one for supporting the fixed block of described parallel optical fibre, described fixed block is positioned at the described substrate back of the body to the side of described chip array, and every road optical fiber of described parallel optical fibre is fixedly arranged on described fixed block.
A preparation method for the assembly that chip array and parallel optical fibre are coupled and aligned, comprises the steps:
A) preparing a chip array, on the photoelectric conversion surface of this chip array, gap-forming has some circular photoelectric conversion regions, and on the photoelectric conversion surface of this chip array, gap-forming has some chip pads;
B) prepare a circuit card, this circuit card is formed the circuitous pattern of other electronic components of required connection;
C) preparing a substrate, each photoelectric conversion region in corresponding step a), etches the circular through hole mated mutually with photoelectric conversion region size on the substrate; Each chip pad in corresponding step a), produces substrate pads; Circuitous pattern in corresponding step b), produces gold thread figure on the substrate;
D) by the high precision die bonder substrate pads that to be welded on substrate by the chip pad alignment of chip array corresponding, make the photoelectric conversion region of each on chip array just to through hole corresponding on substrate, the center of circle of each photoelectric conversion region is directed at the center of circle of corresponding through hole, and by deviation of the alignment precision controlling at micron order or submicron order;
E) chip array step d) formed and the molectron of substrate mount on circuit card, the gold thread figure electrical connection making the circuitous pattern on circuit card corresponding with on substrate;
F) parallel optical fibre is prepared, each through hole corresponding, this parallel optical fibre is provided with a road optical fiber, and every road optical fiber stripping crust of parallel optical fibre is exposed bare fibre, the through hole corresponding to the side of chip array insertion substrate from the back of the body by bare fibre, then be fixed with glue;
G) at the substrate back of the body, one fixed block is set to the side of chip array, and every road optical fiber glue of parallel optical fibre is fixed on this fixed block.
The invention has the beneficial effects as follows: the assembly that the present invention provides a kind of chip array and parallel optical fibre to be coupled and aligned and its preparation method, by being formed with the circular through hole that the photoelectric conversion region size with chip array is mated mutually on substrate, chip array is mounted on substrate, being refilled by substrate is set on circuit card, and make the center of circle of photoelectric conversion region just right with the center of circle of corresponding through hole, chip array and other electronic components electrical connection being connected required on circuit card; In the bare fibre portion of the every road optical fiber through hole that to be inserted in substrate from the back of the body to the side of chip array corresponding, the present invention simple can realize being coupled and aligned of chip array and parallel optical fibre, and alignment precision height, coupling efficiency height, it is easy to realize, it is applicable to the product of various employing parallel optical fibre technology. Comparing existing parallel optical fibre coupling alignment method, the assembly that chip array of the present invention and parallel optical fibre are coupled and aligned has that structure is simple, and cost of manufacture is low, and be coupled and aligned the multiple advantage such as short consuming time. Preferably, on the photoelectric conversion surface of chip array, gap-forming has four photoelectric conversion regions, and the through hole of each photoelectric conversion region and correspondence is circle. Like this, due to each corresponding circular through hole in circular photoelectric conversion region, the corresponding road optical fiber of circular through hole, therefore, to be formed with four circular through holes on substrate, parallel optical fibre will have four road optical fiber, namely can realize being coupled and aligned of four road parallel optical fibres and chip array. Preferably, chip array is the one in VCSEL chip array and PD chip array, and when chip array is VCSEL chip array, photoelectric conversion region is the luminous zone of VCSEL chip array; When chip array is PD chip array, photoelectric conversion region is the photosensitive district of PD chip array.Like this, being coupled and aligned of parallel optical fibre and VCSEL chip array and PD chip array can be realized, when specifically implementing, realize the conversion of photoelectricity at receiving end by PD chip array and being coupled and aligned of parallel optical fibre, realize the conversion of electric light at sending end by VCSEL chip array and being coupled and aligned of parallel optical fibre. Preferably, by arranging corresponding pad on chip array and substrate, then being directed at accurately by the chip pad of chip array by high precision die bonder (Diebonder) is welded in substrate pads corresponding to substrate, the side that the photoelectric conversion surface of chip array is mounted substrate can be reached, and make each photoelectric conversion region and corresponding through hole just to object. When specifically implementing, due to the accuracy limitations of die bonder, the center of circle essentially concentric of the through hole that the center of circle of some photoelectric conversion regions of chip array is corresponding with on substrate, deviation precision controlling is at micron order (even submicron order). Preferably, semiconductor fabrication process can be adopted, by techniques such as magnetron sputtering, graphical photoetching, dry method wet etching and plating thickenings, substrate makes the gold thread figure needed for product, a substrate pads corresponding on every bar gold thread one end electrical connection substrate in gold thread figure, due to a chip pad on the corresponding chip array of each substrate pads, therefore, it may be achieved chip array with on circuit card needed for the electrical connection of other electronic components that is connected. Preferably, by the sticky conductive resin of substrate and circuit card joining place, or plant ball bonding at substrate and circuit card joining place and connect; Or at substrate and circuit card joining place preparation gold silk weldering ball, the circuit of substrate and the electrical connection of the circuit of circuit card can be realized. Preferably, bigger than the external diameter of bare fibre 2 microns to 9 microns of the internal diameter of through hole, so that making optical fiber wear on substrate in corresponding through hole smoothly, through hole internal diameter cross little bare fibre cannot wear smoothly into, the excessive bare fibre of through hole internal diameter can cause coupling efficiency inconsistent after wearing. The fibre core external diameter of multimode parallel optical fibre can being coupled as required during concrete enforcement and the diameter in chip array photoelectric conversion region (luminous zone of VCSEL chip array or the photosensitive district of PD chip array, be referred to as photoelectric conversion region in the present invention) specifically determine diameter and the tolerance of through hole. Owing to bare fibre is easy to break, it is possible to by establishing a fixed block below optical fiber, optical fiber and fixed block one are reinstated the fixing method of glue and solves.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram;
Fig. 2 is another viewing angle constructions schematic diagram of the present invention;
Fig. 3 is chips array structural representation of the present invention;
Fig. 4 a is board structure schematic diagram in the present invention;
Fig. 4 b is another viewing angle constructions schematic diagram of substrate in the present invention;
Fig. 5 is substrate and chip array assembly structure schematic diagram in the present invention;
Fig. 6 is that in prior art, parallel optical fibre is coupled with chip array schematic diagram.
By reference to the accompanying drawings, make the following instructions:
1 chip array 11 photoelectric conversion surface
12 photoelectric conversion region 13 chip pads
2 substrate 21 through holes
22 substrate pads 23 gold thread figures
3 parallel optical fibre 31 optical fiber
311 bare fibre portion 4 circuit cards
41 circuitous pattern 5 fixed blocks
6 lens arras
Embodiment
As depicted in figs. 1 and 2, the assembly that a kind of chip array and parallel optical fibre are coupled and aligned, comprise chip array 1, substrate 2, parallel optical fibre 3 and a circuit card 4, on the photoelectric conversion surface 11 of described chip array, gap-forming has some photoelectric conversion regions 12, each photoelectric conversion region corresponding, described substrate is formed and the through hole 21 that described photoelectric conversion region size is mated mutually;The side that described chip array has a photoelectric conversion surface mounts the side of described substrate, makes the center of each photoelectric conversion region just right with the center of corresponding through hole; Described substrate orientation is on described circuit card, and described chip array and other electronic components being connected needed on described circuit card are electrically connected; Each through hole corresponding, described parallel optical fibre is provided with the optical fiber 31 that a road has bare fibre portion 311, in the bare fibre portion of the every road optical fiber through hole that to be inserted in described substrate from the back of the body to the side of described chip array corresponding. Based on said structure, being coupled and aligned of what the present invention can be simple realize chip array and parallel optical fibre, and alignment precision height, coupling efficiency height, is easy to realize, is applicable to the product of various employing parallel optical fibre technology. Comparing existing parallel optical fibre coupling alignment method, the assembly that chip array of the present invention and parallel optical fibre are coupled and aligned has that structure is simple, and cost of manufacture is low, and be coupled and aligned the multiple advantage such as short consuming time.
Preferably, on the photoelectric conversion surface of described chip array, gap-forming has four described photoelectric conversion regions, and the through hole of each photoelectric conversion region and correspondence is circle. Like this, due to each corresponding circular through hole in circular photoelectric conversion region, the corresponding road optical fiber of circular through hole, therefore, to be formed with four circular through holes on substrate, parallel optical fibre will have four road optical fiber, namely can realize being coupled and aligned of four road parallel optical fibres and chip array.
Preferably, described chip array is the one in VCSEL chip array and PD chip array, and when described chip array is VCSEL chip array, described photoelectric conversion region is the luminous zone of VCSEL chip array; When described chip array is PD chip array, described photoelectric conversion region is the photosensitive district of PD chip array. Like this, being coupled and aligned of parallel optical fibre and VCSEL chip array and PD chip array can be realized, when specifically implementing, realize the conversion of photoelectricity at receiving end by PD chip array and being coupled and aligned of parallel optical fibre, realize the conversion of electric light at sending end by VCSEL chip array and being coupled and aligned of parallel optical fibre.
Preferably, on the photoelectric conversion surface of described chip array, gap-forming has some chip pads 13; Each chip pad corresponding, described substrate side is formed with a substrate pads 22, and the substrate pads that each chip pad of described chip array is corresponding with on described substrate welds together. Like this, by arranging corresponding pad on chip array and substrate, then being directed at accurately by the chip pad of chip array by high precision die bonder (Diebonder) is welded in substrate pads corresponding to substrate, the side that the photoelectric conversion surface of chip array is mounted substrate can be reached, and make each photoelectric conversion region and corresponding through hole just to object. When specifically implementing, due to the accuracy limitations of die bonder, the center of circle essentially concentric of the through hole that the center of circle of some photoelectric conversion regions of chip array is corresponding with on substrate, deviation precision controlling is at micron order (even submicron order).
Preferably, described substrate being formed with the gold thread figure 23 corresponding with the circuitous pattern 41 of other electronic components connected required on described circuit card, described gold thread figure is electrically connected with described circuitous pattern, and described gold thread figure is electrically connected with described chip array. When specifically implementing, semiconductor fabrication process can be adopted, by techniques such as magnetron sputtering, graphical photoetching, dry method wet etching and plating thickenings, substrate makes the gold thread figure needed for product, a substrate pads corresponding on every bar gold thread one end electrical connection substrate in gold thread figure, due to a chip pad on the corresponding chip array of each substrate pads, therefore, it may be achieved chip array with on circuit card needed for the electrical connection of other electronic components that is connected.
Preferably, the material of described substrate is the one in monocrystalline silicon piece and ceramic plate, and the material of described substrate pads is gold-tin alloy.
Preferably, the mode that described gold thread figure is electrically connected with described circuitous pattern be conductive resin fix, gold tinsolder weld and gold thread bonding in one. When specifically implementing, by the sticky conductive resin of substrate and circuit card joining place, or plant ball bonding at the golden tin of substrate and circuit card joining place and connect; Or at substrate and circuit card joining place preparation gold silk weldering ball, the circuit of substrate and the electrical connection of the circuit of circuit card can be realized.
Preferably, bigger than the external diameter of described bare fibre 2 microns to 9 microns of the internal diameter of described through hole. So that making optical fiber wear on substrate in corresponding through hole smoothly, through hole internal diameter cross little bare fibre cannot wear smoothly into, the excessive bare fibre of through hole internal diameter can cause coupling efficiency inconsistent after wearing. The fibre core external diameter of multimode parallel optical fibre can being coupled as required during concrete enforcement and the diameter in chip array photoelectric conversion region (luminous zone of VCSEL chip array or the photosensitive district of PD chip array, be referred to as photoelectric conversion region in the present invention) specifically determine diameter and the tolerance of through hole.
Preferably, being separately provided with one for supporting the fixed block 5 of described parallel optical fibre, described fixed block is positioned at the described substrate back of the body to the side of described chip array, and every road optical fiber of described parallel optical fibre is fixedly arranged on described fixed block. Owing to bare fibre is easy to break, it is possible to by establishing a fixed block below optical fiber, optical fiber and fixed block one are reinstated the fixing method of glue and solves.
A preparation method for the assembly that chip array and parallel optical fibre are coupled and aligned, comprises the steps:
A) preparing a chip array, on the photoelectric conversion surface of this chip array, gap-forming has some circular photoelectric conversion regions, and on the photoelectric conversion surface of this chip array, gap-forming has some chip pads;
B) prepare a circuit card, this circuit card is formed the circuitous pattern of other electronic components of required connection;
C) preparing a substrate, each photoelectric conversion region in corresponding step a), etches the circular through hole mated mutually with photoelectric conversion region size on the substrate; Each chip pad in corresponding step a), produces substrate pads; Circuitous pattern in corresponding step b), produces gold thread figure on the substrate;
D) by the high precision die bonder substrate pads that to be welded on substrate by the chip pad alignment of chip array corresponding, make the photoelectric conversion region of each on chip array just to through hole corresponding on substrate, the center of circle of each photoelectric conversion region is directed at the center of circle of corresponding through hole, and by deviation of the alignment precision controlling at micron order or submicron order;
E) chip array step d) formed and the molectron of substrate mount on circuit card, the gold thread figure electrical connection making the circuitous pattern on circuit card corresponding with on substrate;
F) parallel optical fibre is prepared, each through hole corresponding, this parallel optical fibre is provided with a road optical fiber, and every road optical fiber stripping crust of parallel optical fibre is exposed bare fibre, the through hole corresponding to the side of chip array insertion substrate from the back of the body by bare fibre, then be fixed with glue;
G) at the substrate back of the body, one fixed block is set to the side of chip array, and every road optical fiber glue of parallel optical fibre is fixed on this fixed block.
It is coupled as example with PD chip array and multidiameter delay optical fiber below, and carrys out the technical scheme that the present invention is described further by reference to the accompanying drawings:
It is illustrated in figure 3 PD chip array 1, the diameter of the photoelectric conversion region (photosensitive district) 12 of PD chip array 1 is 60 μm, spacing between photoelectric conversion region is 250 μm, in figure, oblique thick stick filling part is the chip pad 13 of PD chip array, being mainly used in upside-down mounting to be welded and fixed, segment chip pad is used for gold thread bonding to reach electric object in succession.
As shown in Figs. 4a and 4b is substrate, and material is monocrystalline silicon piece or ceramic plate (aluminum oxide, aluminium nitride, beryllium oxide etc.). Adopt semiconductor fabrication process, by techniques such as magnetron sputtering, graphical photoetching, dry method wet etching and plating thickenings, substrate makes the gold thread figure 23 needed for product, and on relevant position, produce the substrate pads 22 of gold-tin alloy, to be welded and fixed with the chip pad of PD chip array, etch 4 circular through holes 21 simultaneously, it is convenient to follow-up optical fiber and is coupled and aligned.
As shown in Figure 5, by high precision die bonder (Diebonder), the chip pad 13 of PD chip array 1 is directed in the substrate pads 22 of substrate 2 correspondence being welded to PD chip array accurately, after welding, the center of circle in 4 photosensitive districts of PD chip array and four circular hole essentially concentrics of substrate, deviation precision controlling is at micron order (even submicron order).
As depicted in figs. 1 and 2, the molectron of PD chip array 1 complete for above-mentioned welding and substrate 2 is mounted on the circuit card 4 of assembly or modules and other products, PD chip array is electrically connected with other electronic components (such as photoelectricity chip etc.) needing on circuit card to be connected. The method that gold thread figure on the substrate of PD chip array and the circuitous pattern on circuit card are electrically connected has multiple: 1, substrate and the sticky conductive resin of circuit card joining place; 2, substrate and circuit card joining place are planted ball bonding and are connect; 3, substrate and circuit card joining place preparation gold silk weldering ball.
As depicted in figs. 1 and 2, over parallel optical fibre 3 Zhong Mei road, Xu Jiang tetra-road optical fiber 31 is shelled, skin exposes bare fibre portion, and bare fibre portion is cut into parallel the same length (it is even possible that fiber end face is carried out milled processed), then by the circular through hole on the substrate of four bare fibre portions, road insertion PD chip arrays, then fix with glue and can automatically realize being coupled and aligned of four road parallel optical fibres and PD chip array. Owing to bare fibre is easy to break, it is possible to establish a fixed block 5 below parallel optical fibre, parallel optical fibre and fixed block one are reinstated the fixing method of glue and solves.
Above embodiment is with reference to accompanying drawing, to a preferred embodiment of the present invention will be described in detail. The technician of this area by carrying out various formal amendment or change to above-described embodiment, but when not deviating from the essence of the present invention, all drops within protection scope of the present invention.
Claims (9)
1. the assembly that a chip array and parallel optical fibre are coupled and aligned, it is characterized in that: comprise a chip array (1), a substrate (2), a parallel optical fibre (3) and a circuit card (4), the upper gap-forming of the photoelectric conversion surface (11) of described chip array has some photoelectric conversion regions (12), each photoelectric conversion region corresponding, described substrate is formed the through hole (21) mated mutually with described photoelectric conversion region size; The side that described chip array has a photoelectric conversion surface mounts the side of described substrate, makes the center of each photoelectric conversion region just right with the center of corresponding through hole; Described substrate orientation is on described circuit card, and described chip array and other electronic components being connected needed on described circuit card are electrically connected; Each through hole corresponding, described parallel optical fibre is provided with the optical fiber (31) that a road has bare fibre portion (311), in the bare fibre portion of the every road optical fiber through hole that to be inserted in described substrate from the back of the body to the side of described chip array corresponding; On the photoelectric conversion surface of described chip array, gap-forming has some chip pads (13);Each chip pad corresponding, described substrate side is formed with a substrate pads (22), and the substrate pads that each chip pad of described chip array is corresponding with on described substrate is welded together by high precision die bonder alignment.
2. the assembly that chip array according to claim 1 and parallel optical fibre are coupled and aligned, it is characterised in that: on the photoelectric conversion surface of described chip array, gap-forming has four described photoelectric conversion regions, and the through hole of each photoelectric conversion region and correspondence is circle.
3. the assembly that chip array according to claim 2 and parallel optical fibre are coupled and aligned, it is characterized in that: described chip array is the one in VCSEL chip array and PD chip array, when described chip array is VCSEL chip array, described photoelectric conversion region is the luminous zone of VCSEL chip array; When described chip array is PD chip array, described photoelectric conversion region is the photosensitive district of PD chip array.
4. the assembly that chip array according to claim 1 and parallel optical fibre are coupled and aligned, it is characterized in that: described substrate is formed the gold thread figure (23) corresponding with the circuitous pattern (41) of other electronic components connected required on described circuit card, described gold thread figure is electrically connected with described circuitous pattern, and described gold thread figure is electrically connected with described chip array.
5. the assembly that chip array according to claim 4 and parallel optical fibre are coupled and aligned, it is characterised in that: the material of described substrate is the one in monocrystalline silicon piece and ceramic plate, and the material of described substrate pads is gold-tin alloy.
6. the assembly that chip array according to claim 4 and parallel optical fibre are coupled and aligned, it is characterised in that: the mode that described gold thread figure is electrically connected with described circuitous pattern be conductive resin fix, gold tinsolder weld and gold thread bonding in one.
7. the assembly that chip array according to the arbitrary item of claim 1 to 6 and parallel optical fibre are coupled and aligned, it is characterised in that: bigger than the external diameter of described bare fibre 2 microns to 9 microns of the internal diameter of described through hole.
8. the assembly that chip array according to claim 7 and parallel optical fibre are coupled and aligned, it is characterized in that: be separately provided with one for supporting the fixed block (5) of described parallel optical fibre, described fixed block is positioned at the described substrate back of the body to the side of described chip array, and every road optical fiber of described parallel optical fibre is fixedly arranged on described fixed block.
9. the preparation method of the assembly that a chip array and parallel optical fibre are coupled and aligned, it is characterised in that: comprise the steps:
A) preparing a chip array, on the photoelectric conversion surface of this chip array, gap-forming has some circular photoelectric conversion regions, and on the photoelectric conversion surface of this chip array, gap-forming has some chip pads;
B) prepare a circuit card, this circuit card is formed the circuitous pattern of other electronic components of required connection;
C) prepare a substrate, corresponding step a) in each photoelectric conversion region, etch the circular through hole mated mutually with photoelectric conversion region size on the substrate; Corresponding step a) in each chip pad, produce substrate pads; Corresponding step b) in circuitous pattern, produce gold thread figure on the substrate;
D) by the high precision die bonder substrate pads that to be welded on substrate by the chip pad alignment of chip array corresponding, make the photoelectric conversion region of each on chip array just to through hole corresponding on substrate, the center of circle of each photoelectric conversion region is directed at the center of circle of corresponding through hole, and by deviation of the alignment precision controlling at micron order or submicron order;
E) by steps d) molectron of the chip array that formed and substrate mounts on circuit card, the gold thread figure electrical connection making the circuitous pattern on circuit card corresponding with on substrate;
F) parallel optical fibre is prepared, each through hole corresponding, this parallel optical fibre is provided with a road optical fiber, and every road optical fiber stripping crust of parallel optical fibre is exposed bare fibre, the through hole corresponding to the side of chip array insertion substrate from the back of the body by bare fibre, then be fixed with glue;
G) at the substrate back of the body, one fixed block is set to the side of chip array, and every road optical fiber glue of parallel optical fibre is fixed on this fixed block.
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| US20170123159A1 (en) * | 2015-10-28 | 2017-05-04 | Dritan Celo | Alignment system for optical coupling assembly |
| CN107968907B (en) * | 2017-12-13 | 2020-06-02 | 武汉电信器件有限公司 | Device and method for mounting lens array and PD array |
| CN110018711B (en) * | 2019-04-12 | 2023-05-09 | 南京吉相传感成像技术研究院有限公司 | Photoelectric computing array and self-alignment method thereof |
| CN111897062B (en) * | 2020-07-28 | 2022-03-08 | 武汉电信器件有限公司 | Optical path coupling method and device and storage medium |
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