CN103882484B - High-speed tin plating plating solution - Google Patents
High-speed tin plating plating solution Download PDFInfo
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- CN103882484B CN103882484B CN201410135617.4A CN201410135617A CN103882484B CN 103882484 B CN103882484 B CN 103882484B CN 201410135617 A CN201410135617 A CN 201410135617A CN 103882484 B CN103882484 B CN 103882484B
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- 238000007747 plating Methods 0.000 title claims abstract description 83
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 46
- -1 iron ion Chemical class 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000001117 sulphuric acid Substances 0.000 claims abstract description 7
- 235000011149 sulphuric acid Nutrition 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 6
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims abstract description 6
- 239000013530 defoamer Substances 0.000 claims abstract description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 12
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- 235000006708 antioxidants Nutrition 0.000 claims description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920005604 random copolymer Polymers 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- 125000005233 alkylalcohol group Chemical group 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 24
- 238000000576 coating method Methods 0.000 abstract description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 description 31
- 239000000654 additive Substances 0.000 description 21
- 230000000996 additive effect Effects 0.000 description 20
- 239000005028 tinplate Substances 0.000 description 19
- 238000012360 testing method Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 7
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 6
- 238000010183 spectrum analysis Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- 238000013019 agitation Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010960 cold rolled steel Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229940098779 methanesulfonic acid Drugs 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229940044654 phenolsulfonic acid Drugs 0.000 description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical group O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- OUMYCZNNPRRSLG-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-trien-5-amine Chemical compound NC1=CC=CC2=C1O2 OUMYCZNNPRRSLG-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000680 avirulence Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The invention discloses a kind of high-speed tin plating plating solution, described plating solution includes following composition: 5-100g/L tin methane sulfonate, 10-100mL/L pyrovinic acid, 0.1-20ml/L sulphuric acid, 0.1-200mg/L defoamer, 0.1-50g/L carefully brilliant agent, 0.01-20g/L walk agent, 0.1-40g/L antioxidant.The plating solution dispersion of the present invention and covering power are excellent, it is possible to meet every technology requirement of high speed tin plating production line, can reduce tin coating weight (≈ 0.7g/m further simultaneously2) to economize on resources, plating solution iron ion and chloride ion tolerance limit content best result be not up to 20g/L, 1000ppm in addition.The plating solution that the present invention obtains is than the bath stability of non-refinement crystalline substance agent, and plating solution uses, placement still can obtain good coating after several weeks.
Description
Technical field
The invention belongs to the technical field of electrochemical deposition of metal and alloy, relate to a kind of high-speed tin plating plating solution.
Background technology
High-speed tin plating is widely used in sheet material, wire rod and electronics finishing, for electrolytic tinplate (being commonly called as tinplate), it is a kind of functional material, have that intensity height, weldability be good, corrosion-resistant and the feature such as avirulence, the long-term main packaging material as food industry, and it is widely used in medicine, light industry, automobile and other industries, it is one of most popular steel product.
The smooth electroplating technology of fluorine Loews that existing electrotinning technique adopts phenolsulfonic acid (PSA) to be master mostly, the plating line of this technique accounts for the 65.7% of world's electrotinned wire, but containing the phenolic compound that toxicity is very big in PSA, and the treatment cost of waste liquor produced is also higher.This plating solution limiting current density is low, so that domestic unit actual motion speed is about 175m/min (unit design linear velocity is generally ~ 600m/min), production efficiency also has the very big rising space.Additive and plating solution performance thereof are required height by high-speed tin plating, and plated material to overcome parallel electric field, gas field, temperature field, flow field and concentration field effect, obtain high-quality coating in 10s.Additionally, domestic tin plating unit adopts block tin as soluble anode greatly, need to regularly shutting down replacing anode, production efficiency is low, and stannum mud volume production goes out many, and labor strength is big；The insoluble anode such as iridium dioxide and platinum plating is following application tendency.In production process, insoluble anode precipitates out active oxygen in a large number, and some tin plating additives are very easily aging.Therefore the additive of high speed tin plating and plating solution thereof are just seemed particularly urgent.
CN101922026A discloses a kind of pyrovinic acid system Asia matte pure tin electroplating additive and plating solution thereof, its additive contains the disagreeableness heterocycle compound of environment and aminated compounds, in addition this plating solution is possibly together with the organic solvent of 100-150g/L, in high-speed motion strong convection, organic solvent volatilizees rapidly, stannum mud amount controls not good, plating solution very easily lost efficacy, and improved production cost, also to workshop environment.CN1570219 discloses electroplating composition and electro-plating method, and its compositions contains thiourea and aminated compounds, and decomposes releases nitrogen, sulfur oxide, is unfavorable for that operator's is healthy.CN1733977A discloses a kind of tin plating additive and preparation method thereof, and its additive contains polyoxyethylene aniline ether, LOMAR PWA EINECS 246-676-2 etc. to the disagreeableness chemical substance of environment.
US7517443B2 discloses a kind of electrotinning plating solution, is mainly composed of the additive of sulfamic acid stannum, sulphuric acid and the oxirane containing N and propylene oxide block copolymer；Consider conduct hydrolysis and the stable required strong acid condition of stannous ion of sulfamic acid, also need further checking for high-speed tin plating.USRE39476E discloses a kind of tin bath solution composition, wherein contains polyoxyalkylene alcohol homopolymer and oxirane and epoxy propane copolymer composition, and plating solution also needs to optimize in foaming and defoaming capacity；In this patent, antioxidant only has one or more of catechol, resorcinol and hydroquinone simultaneously, it is impossible to effectively suppress the grey black that soft-melting process brings to tin-plated product.
Summary of the invention
Offer one is provided and can be used for high-speed tin plating plating solution, be intended, primarily, to improve plating solution performance, improve quality of coating, and meet high speed electrodeposition requirement；And optimize High Speed Tin Plating Technology by this approach, reduce original product consumption, reduce production cost, and realize the production domesticization of high-speed tin plating additive and plating solution thereof simultaneously.
It is an object of the invention to be achieved through the following technical solutions:
A kind of for high-speed tin plating plating solution, including following composition: tin methane sulfonate 5-100g/L, pyrovinic acid 10-100mL/L, sulphuric acid 0.1-20ml/L, additive: 0.1-200mg/L defoamer, 10-50g/L carefully brilliant agent, 0.01-20g/L walk agent, 0.1-40g/L antioxidant.
In the present invention, described defoamer is a compounds of polyoxyethylene oxypropylene glycerol, and molecular weight is at 500-15000.
In the present invention, described one or more the mixture that thin brilliant agent is formaldehyde, oxirane and epoxy propane copolymer.It is preferably the block copolymer of formaldehyde, oxirane and expoxy propane and the mixture of random copolymer one, two or three arbitrary proportion.
In the present invention, described thin brilliant agent block polymer is MOx-EOy、POx-EOy、MOx-EOy-MOz、EOx-MOy-EOz、MOx-EOy-POz、EOx-MOy-POz、EOx-POy-MOz、POx-EOy-POz、EOx-POy-EOzAnd random copolymer is MOmEOnPOt.Wherein, MO to be methoxyl group, EO be ethyoxyl, PO are propoxyl group；X, y, z is the degree of polymerization of MO, EO, PO of block copolymer, x, y, z, m, n and t range for 1-60.
In the present invention, described thin brilliant agent EO mass content is at 5-90%, and polymer molecular weight is between 2000-10000, and density is at 1.10 ± 0.10g/cm3, cloud point is at 55-95 DEG C.
In the present invention, the described agent that walks is for a kind of alkyl alcohol ethoxylates, it is possible to increase plating solution limiting current density value.Its structural formula is R-O-(CH2CH2O) n-H, R are the branched hydrocarbyl of saturated C7 ~ 13, and n is within 60-280.
In the present invention, described antioxidant is any two kinds in hydroquinone, catechol, resorcinol, ascorbic acid, malic acid, citric acid, tartaric acid, with 1:0.1-5 mixed in molar ratio.
The present invention, compared to prior art, has a characteristic that
1, high-speed tin plating additive provided by the invention is without anions and canons and amphoteric surfactant, polyformaldehyde and poly(ethylene oxide) and the homopolymer of poly(propylene oxide), aldehydes, heterocycle compound, aminated compounds, polyaminocarboxylic acid, sulfur aminoacid and any organic solvent.
2, the present invention configures water used by additive concentrating liquid and plating solution is deionized water, electrical conductivity < 20 μ S/cm；Gained coating is canescence Asia light coating.
3, the plating solution operating temperature of additive of the present invention composition is interval at 10-70 DEG C；Under high-speed condition, the plating solution limiting current density containing additive of the present invention can reach 60-120A/dm2。
4, additive of the present invention forms plating solution dispersion and covering power are excellent, it is possible to meet every technology requirement of high speed tin plating production line, can reduce tin coating weight (≈ 0.7g/m further simultaneously2) to economize on resources, plating solution iron ion and chloride ion tolerance limit content best result be not up to 20g/L, 1000ppm in addition.
5, when the plating solution energy on-line velocity of additive of the present invention composition is 0-800m/min, it is thus achieved that crystallization is careful, covers uniform coating.
6, the additive of the present invention and the plating solution of composition thereof do not contain nonbiodegradable substance and to the disagreeableness chemicals of environment, and sewage disposal is simple, meets environmental requirement, is worth promoting the use of in high speed tin plating industry.
7, the plating solution that the present invention obtains is than the bath stability of non-refinement crystalline substance agent, and plating solution uses, placement still can obtain good coating after several weeks.
Accompanying drawing explanation
Fig. 1 is embodiment 1 Hull cell sample photo, and experiment condition is 45 DEG C, 2A, and 2min, without convection agitation；
Fig. 2 is embodiment 2 Hull cell sample photo, and experiment condition is 45 DEG C, 2A, and 2min, without convection agitation；
Fig. 3 is embodiment 3 Hull cell sample photo, and experiment condition is 45 DEG C, 2A, and 2min, without convection agitation；
Fig. 4 is that embodiment 1 is at 15.0A/dm2The 0.7g/m obtained under different current density condition2Tin plate SEM photograph；
Fig. 5 is that embodiment 1 is at 15.0A/dm2The 0.7g/m obtained2Coating tin plate SEM photograph local energy spectrum analysis (spectrogram 2)；
Fig. 6 is that embodiment 1 is at 15.0A/dm2The 0.7g/m obtained2Coating tin plate SEM photograph local energy spectrum analysis (spectrogram 3)；
Fig. 7 is that embodiment 1 is at 6.75A/dm2The 1.1g/m obtained under condition2Tin plate SEM photograph；
Fig. 8 is that embodiment 1 is at 15.0A/dm2The 1.1g/m obtained under condition2Tin plate SEM photograph；
Fig. 9 is that embodiment 1 is at 24.75A/dm2The 1.1g/m obtained under condition2Tin plate SEM photograph；
Figure 10 is that embodiment 1 is at 15.0A/dm2The 1.1g/m obtained2Coating tin plate SEM photograph local energy spectrum analysis (spectrogram 3)；
Figure 11 is that embodiment 1 is at 15.0A/dm2The 1.1g/m obtained2Coating tin plate SEM photograph local energy spectrum analysis (spectrogram 4)；
Figure 12 is that embodiment 1 is at 15.0A/dm2The 1.1g/m obtained under condition26000 times of SEM photograph of tin plate；
Figure 13 is that embodiment 2 is at 15.0A/dm2The 1.1g/m obtained under condition26000 times of SEM photograph of tin plate；
Figure 14 is that embodiment 3 is at 15.0A/dm2The 1.1g/m obtained under condition26000 times of SEM photograph of tin plate.
Detailed description of the invention
Below in conjunction with embodiment, technical scheme being further described, plating solution composition and process conditions can be adjusted according to product demand.Every technical solution of the present invention modified or equivalent replaces, without deviating from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
Embodiment 1
Tin methane sulfonate 45g/L
Methanesulfonic acid 45ml/L
Sulphuric acid 10ml/L
Polyoxyethylene oxypropylene glycerol (molecular weight 4000) 0.1mg/L
MO15-EO21-PO3010g/L
Capryl alcohol polyoxyethylene ether (molecular weight 8000) 0.6g/L
Hydroquinone+malic acid 15g/L
Temperature 45 C
Embodiment 2
Tin methane sulfonate 15g/L
Methanesulfonic acid 30ml/L
Sulphuric acid 10ml/L
Polyoxyethylene oxypropylene glycerol (molecular weight 8000) 0.1mg/L
PO10-EO42-PO1030g/L
Capryl alcohol polyoxyethylene ether (molecular weight 2000) 0.01g/L
Hydroquinone+malic acid 10g/L
Temperature 25 DEG C
Embodiment 3
Tin methane sulfonate 75g/L
Methanesulfonic acid 100ml/L
Sulphuric acid 15ml/L
Polyoxyethylene oxypropylene glycerol (molecular weight 12000) 0.1mg/L
EO30-PO3015g/L
Capryl alcohol polyoxyethylene ether (molecular weight 8000) 15g/L
Hydroquinone+tartaric acid 20g/L
Temperature 45 C
Plating solution performance is tested
1) Hull groove test piece test.Testing with 267mL plating solution, test piece adopts the long 100mm of cold-rolled steel sheet, is highly 70mm.Experiment condition is 45 DEG C, 2A, and 2min, without convection agitation.After sample plating, taking-up deionized water is cleaned and is dried up, and measures coating scorch region width, and embodiment 1,2,3 formula Hull test piece photo is referring to Fig. 1-3, and in a static condition, limiting current density is up to 8.5A/dm for this plating solution2, and occur without defective coating in whole electric current density district, it is possible to meet existing tin plating technique.
2) covering power test.Using endoporus method, test specimen adopts internal diameter to be 10mm, the long copper pipe for 50mm, uses pore to be facing perpendicularly to positive plate during plating, and the mouth of pipe is from anode 100mm, with 0.5A/dm2Cathode-current density plating 5min after pipe negative electrode is taken out, clean and dry up, cut vertically, measure pore coating and plate into the degree of depth, evaluate covering power.
Using the copper pipe that the plating solution that the additive of embodiment 1 formula is made into is plated to find after cutting open, copper pipe endoporus all goes up tin metal, illustrates that the plating solution covering power that the additive formulations that embodiment 1 provides is made into is good.
3) dispersibility test.Measure by far and near cathode method, coating bath transparent organic glass rectangular channel (inner chamber is of a size of 150mm × 50mm × 70mm), five sulculuses are opened uniformly for inserting negative electrode in the both sides of groove, negative electrode adopts thickness to be the cold-rolled steel sheet of 0.17mm, it is of a size of 5.5mm × 110mm, inactive face insulating tape seals, and uses the orificed anode with negative electrode same size, it is simple to plating solution flow of the electrolyte.Test current density is 1.0A/dm2, in the middle of two negative electrode test pieces, put into anode, remote negative electrode with and the distance ratio of nearly negative electrode and anode for 2:1, taking out negative electrode after electroplating 10min at 45 DEG C cleans up, and weighs the increment depositing metal on negative electrode remote, near, is calculated as follows the dispersibility of plating solution.
,
In formula: T dispersibility, %；
The distance ratio of the remote negative electrode of K and nearly negative electrode and anode；
The metal quality deposited on the nearly negative electrode of m1, g；
The metal quality deposited on the remote negative electrode of m2, g.
Additive 3 covering powers of test that embodiment 1 provides, data are table 1 such as:
TableParallel 3 the dispersibility test results of embodiment 1
Coating performance is tested
The cold-rolled steel sheet adopting temper rolling technology is object of study, and its surface does not only exist rolling lines, but also there is rolling pit, and high-speed tin plating additive and plating solution performance thereof are required high by this.Fig. 4-6 is that embodiment 1 is at 15.0A/dm2The 0.7g/m obtained under current density condition2Tin plate SEM photograph and SEM photograph local energy spectrum analysis data.Found that: plating solution is at 15.0A/dm2Under condition, 0.7g/m2Thin stannum amount tin plate sheet tin rolling direction and pit portion tin atom percentage ratio respectively 25.44%, 35.88%, the tin coating weight of pit is higher than rolling stricture of vagina place, and plating solution has certain leveling ability, is conducive to further thinning tin coating weight, saves tin resource.
Fig. 8-11 is the 1.1g/m that embodiment 1 obtains under different current density condition respectively2Tin plate SEM photograph and at 15.0A/dm2The 1.1g/m obtained2Coating tin plate SEM photograph local energy spectrum analysis data.Found that: under three kinds of current density condition, coating uniform and delicate, without dew plating, stannum crystal grain is careful.15.0A/dm2The 1.1g/m obtained under condition2Tin plate sheet tin rolling direction and pit portion tin atom percentage ratio respectively 62.25%, Sn62.17%, relatively 0.7g/m2Coating content has obvious rising, and pit and the tin atom percentage difference rolling lines place reduce further, and thickness is uniform.Therefore deducing that, the plating solution performance that embodiment 1 provides is excellent, and coating uniform and delicate is suitable to high speed electrodeposition process of tin.
Figure 12-14 is that embodiment 1,2,3 is at 15.0A/dm2The 1.1g/m obtained under condition26000 times of SEM photograph of tin plate；According to electromicroscopic photograph it can be seen that plated crystal tactical rule is uniform, zero defect.
Claims (6)
1. one kind is used for high-speed tin plating plating solution, it is characterized in that described plating solution includes following composition: 5-100g/L tin methane sulfonate, 10-100mL/L pyrovinic acid, 0.1-20ml/L sulphuric acid, 0.1-200mg/L defoamer, 10-50g/L carefully brilliant agent, 0.01-20g/L walk agent, 0.1-40g/L antioxidant, and described defoamer is polyoxyethylene oxypropylene glycerol；Described thin brilliant agent is MOx-EOy、POx-EOy、MOx-EOy-MOz、EOx-MOy-EOz、MOx-EOy-POz、EOx-MOy-POz、EOx-POy-MOzOr POx-EOy-POz, wherein MO to be methoxyl group, EO be ethyoxyl, PO are propoxyl group；X, y, z is the degree of polymerization of MO, EO, PO of block copolymer；X, y, z range for 1-60；The described agent that walks is alkyl alcohol ethoxylates.
2. according to claim 1 for high-speed tin plating plating solution, it is characterised in that the molecular weight of described polyoxyethylene oxypropylene glycerol is 500-15000.
3. according to claim 1 for high-speed tin plating plating solution, it is characterised in that described thin brilliant agent is MOmEOnPOtRandom copolymer, wherein MO to be methoxyl group, EO be ethyoxyl, PO are propoxyl group, and m, n, t are the unit number of MO, EO, PO of random copolymer, m, n and t range for 1-60.
4. according to claim 1 or 3 for high-speed tin plating plating solution, it is characterised in that described thin brilliant agent EO mass content is at 5-90%, and polymer molecular weight is between 2000-10000, and density is at 1.10 ± 0.10g/cm3, cloud point is at 55-95 DEG C.
5. according to claim 1 for high-speed tin plating plating solution, it is characterised in that described in the agent structural formula that walks be R-O-(CH2CH2O) n-H, R are the branched hydrocarbyl of saturated C7 ~ 13, and n is within 60-280.
6. according to claim 1 for high-speed tin plating plating solution, it is characterised in that described antioxidant is any two kinds in hydroquinone, catechol, resorcinol, ascorbic acid, malic acid, citric acid, tartaric acid.
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| CN104060308B (en) * | 2014-06-30 | 2016-09-14 | 句容市博远电子有限公司 | A kind of Pure Tin Plating Process liquid reducing dew copper phenomenon and application thereof |
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105609729B (en) * | 2015-12-30 | 2018-02-13 | 湖南永盛新材料股份有限公司 | A kind of aluminium/copper/CNTs tin/graphite sandwich construction lithium ion battery negative material and preparation method thereof |
| CN105755512B (en) * | 2016-03-04 | 2018-01-05 | 昆山艾森半导体材料有限公司 | A kind of tin methane sulfonate antioxidant and preparation method thereof and application method |
| CN107502927B (en) * | 2017-07-24 | 2019-07-02 | 奎克化学（中国）有限公司 | A kind of methanesulfonate tin deposit solution |
| CN109267024B (en) * | 2018-11-02 | 2020-11-20 | 常德力元新材料有限责任公司 | Preparation method of foam tin material |
| CN110512241B (en) * | 2019-09-29 | 2021-05-14 | 粤海中粤浦项(秦皇岛)马口铁工业有限公司 | Electrotinning solution with good deep plating capability and electroplating method thereof |
| CN110923758B (en) * | 2019-12-30 | 2023-10-27 | 东莞市斯坦得电子材料有限公司 | High-buffering stability copper plating solution for PCB electroplating and preparation method thereof |
| CN112538643B (en) * | 2020-11-17 | 2022-05-13 | 珠海松柏科技有限公司 | High-speed tin plating additive and tin plating solution |
| CN115110126A (en) * | 2022-06-14 | 2022-09-27 | 铜陵蔚屹新材料有限公司 | Tin plating solution for tin plate of methanesulfonic acid system |
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