CN103881105B - A kind of preparation method of modified epoxy and application - Google Patents
A kind of preparation method of modified epoxy and application Download PDFInfo
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- CN103881105B CN103881105B CN201410031096.8A CN201410031096A CN103881105B CN 103881105 B CN103881105 B CN 103881105B CN 201410031096 A CN201410031096 A CN 201410031096A CN 103881105 B CN103881105 B CN 103881105B
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Abstract
The present invention relates to field of organic polymer compound, for solving modifying epoxy resin by organosilicon, there is thermotolerance and flexible problem simultaneously, the present invention proposes a kind of preparation method of modified epoxy, described preparation method is following steps: (1) boron nitride modified organic silicone resin, (2) modified epoxy, the modified epoxy adopting the method to prepare has excellent resistance toheat and snappiness.
Description
Technical field
The present invention relates to field of organic polymer compound, be specifically related to a kind of preparation method and application of modified epoxy.
Background technology
There is in silicone resin-Si-O-Si-structure, demonstrate the performances such as excellent weathering resistance, thermotolerance, anti-stain characteristic and chemical stability.But also there are some defects because of self chemical constitution in silicone resin class coating: solidification value is high, set time is long, poor solvent resistance, with the sticking power of base material is strong, physical strength is low, cost is more high.In addition silicone resin Si-O key polarity is large, under electrophilic reagent or nucleophilic reagent are attacked, is easy to the fracture that key occurs, thus organosilicon to the stability of pharmaceutical chemicals not as good as organic fluorine superpolymer.People also find pure organosilicon coating physical strength, sticking power and hot water resistance and bad, and in order to overcome these shortcomings, the resins such as conventional epoxy, alkyd, polyester carry out modification to it.
At present, utilize inorganic materials to carry out modified organic silicone resin both at home and abroad more, then utilize modified silicone resin and other resin compounded to prepare composite resin, to improve resin property.It is wherein the effective way improving resin resistance toheat with boron modified organic silicone resin.After boron modification silicone resin, because boron atom enters in molecular backbone, and the B-O key bond energy 561KJ/mol formed is more much higher than the bond energy 452KJ/mol of Si-O key.Therefore modified silicone resin main chain more firmly and not easy fracture, thus improve its heat resistance.
There are unique epoxy group(ing) and the activity such as hydroxyl, ehter bond group and polar group in epoxy resin, thus there is very excellent performance.Its excellent properties is mainly reflected in: 1. adhesiveproperties is good; 2. mechanical property is high; 8. cure shrinkage is little; 4. good manufacturability; 5. good stability; 6. some special epoxy resin thermotolerance is also very high.But pure epoxy resin, due to self chemical property and textural defect, makes it in use there will be a lot of problems: after solidification crisp, the shock-resistance of matter and stress cracking ability poor etc.
Silicone resin after epoxide modified has the advantage of both epoxy resin and polysiloxane, adhesiveproperties, media-resistant, water-fast and resistance to weathering can all increase, and amine curing agent can be adopted to solidify, the solidification value of silicone resin reduces greatly, even can realize self-vulcanizing, can at-60 DEG C ~ 400 DEG C life-time service.But the Chinese patent as CN103254568A discloses a kind of silicon boron modification paradigmatic structure material and preparation method thereof, silicon boron is carried out modification to paradigmatic structure material surface by this invention, then be configured to dual-component coating with solidifying agent, there is the excellent performance such as heat-resisting, anti-corrosion, fire-retardant.But add the objectionable impuritiess such as decabromodiphenyl oxide in aforesaid method, do not meet RoHS instruction; Dual-component coating can cause construction inconvenience.Chinese patent as CN103131298A discloses a kind of Flame Retardant Powder Coatings containing hydration zinc borate, and the powder coating that hydration zinc borate, vibrin, bisphenol A type epoxy resin, color stuffing etc. are made is had the advantages such as easy to use, nontoxic, weathering resistance is strong by this invention.But in aforesaid method, in order to improve the fire-retardant of coating and resistance toheat, with the addition of a large amount of fillers, causing the snappiness of the coating prepared to decline.
Summary of the invention
Cannot have thermotolerance and flexible problem for solving modifying epoxy resin by organosilicon, the present invention proposes a kind of preparation method of modified epoxy, the modified epoxy adopting the method to prepare has excellent resistance toheat and snappiness simultaneously.
The invention allows for the application of modified epoxy of the present invention on the high temperature resistant low surface energy coatings of preparation, this coating has excellent resistance toheat and snappiness.
The present invention is real by the following technical programs: a kind of preparation method of modifying epoxy resin by organosilicon, and described preparation method is following steps:
(1) boron nitride modified organic silicone resin: silane monomer is poured in container and then add distilled water and boron nitride, stirring reaction 2 ~ 5 hours, stop stirring, be cooled to 60 ~ 80 DEG C then to distill, again organic solvent is poured in container, obtained boron nitride modified organic silicone resin after stirring;
As preferably, silane monomer is selected from several mixtures in methyltrimethoxy silane, Union carbide A-162, dimethyldimethoxysil,ne, dimethyldiethoxysilane, phenyltrimethoxysila,e, phenyl triethoxysilane, dimethoxydiphenylsilane, diphenyl diethoxy silane.
As preferably, boron nitride is selected from ammonia borine or aminoboranes.More preferably, aminoboranes is selected from one or more in amido two chloroborane, dimethylamine borane, N, N-diisopropyl ethyl amine borine, N, N-dihydroxyl amido dichlorosilane.The multi-functional introducing such as boron nitride makes modified silicone resin intramolecule can present tight build network structure, thus adds high thermal resistance and the physical strength of silicone resin.
As preferably, the weight percent of each component is silane monomer 50 ~ 80%, distilled water 10 ~ 30%, boron nitride 3 ~ 12%, organic solvent 3 ~ 25%, and each component sum is 100%.
(2) modified epoxy: epoxy resin is put into beaker, heating makes epoxy resin melt, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin prepared by step (1), then the epoxy resin after silanol, thawing is poured in the container of boron nitride modified organic silicone resin and add organic solvent after mixing, adjustment vessel temp to 150 ~ 165 DEG C, obtain a kind of modified epoxy after sustained reaction 1 ~ 6h.
Step (1) is selected from one or more in toluene, dimethylbenzene, butanols, isopropylcarbinol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene, 1-Methoxy-2-propyl acetate, dipropylene glycol methyl ether acetate and dipropylene acetic ester with the organic solvent in step (2).
As preferably, the mass ratio of epoxy resin and boron nitride modified organic silicone resin is 0.3 ~ 1.2:1, the consumption of dimethylbenzene is for making the consoluet amount of boron nitride modified organic silicone resin, the mass ratio of silanol and boron nitride modified organic silicone resin is 0.1 ~ 0.3:1, and the mass ratio of organic solvent and boron nitride modified organic silicone resin is 0.2 ~ 0.6:1.
As preferably, described epoxy resin is selected from E-44, E-54, E-51, E-42, E-31, E-21 a kind of.
The application of modified epoxy prepared by preparation method on coating of a kind of modified epoxy of the present invention.Described coating is mixed by following component, and the weight percent of each component is:
Modified epoxy 60 ~ 80%,
Pigment and filler 10 ~ 20%,
High boiling solvent 5 ~ 20%;
Each component sum is 100%, wherein the weight ratio of pigment and filler is 7:1 ~ 1:3, and high boiling solvent is selected from one or more in divalent ester mixture, ethylene glycol ether acetate, butyl acetic ester, isobutyl isobutyrate, propionic acid-3-ether ethyl ester and methyl isoamyl ketone.
Described pigment is the high-temperature resisting pigment that this area is commonly used, and can be the inorganic high-temperature resistant such as carbon black, iron oxide red pigment, also can be the organic high temperature-resistant pigment such as phthalocyanine blue.
Described filler is the high temperature resistant filler that this area is commonly used, and can be silicon-dioxide and silicon carbide.
Coating of the present invention can also contain auxiliary agent.Auxiliary agent is the organosilicon auxiliary agent that this area is commonly used, and plays the effects such as levelling, froth breaking, pigment wetting, viscosity adjustment.Those skilled in the art can according to requiring kind and the consumption of determining auxiliary agent.Auxiliary agent of the present invention can have silicone oil, organic silicon modified by polyether auxiliary agent, KH-550, KH-560 etc.Organic silicon modified by polyether auxiliary agent of the present invention is the conventional organic silicon modified by polyether auxiliary agent in this area, can the CoatOSil series polyether modified organic silicon auxiliary agent of Shi Maitu new high-tech material company limited.The weight percent of auxiliary dosage is 1 ~ 5%.
In described coating, other auxiliary agents such as flow agent, viscosity modifier and dispersion agent can also be contained.
The preparation method of coating of the present invention is the preparation method that this area is commonly used, and is mixed to get by modified epoxy, pigment, filler, organosilicon auxiliary agent and high boiling solvent.
Compared with prior art, the invention has the beneficial effects as follows:
(1) when preparing silicone resin, adding boron nitride and reacting, the resistance toheat of silicone resin can be improved.
(2) base epoxy resin contains abundant hydroxyl, can react with the alkoxyl group on silicone intermediate and hydroxyl, improves the resistance toheat of epoxy resin.
(3) add silanol while modification, resistance toheat and the snappiness of resin can be improved.
Embodiment
Below by embodiment, the present invention is described in further detail.Raw materials used all commercially available in embodiment, wherein, described silanol is the KR220L that company of SHIN-ETSU HANTOTAI produces.KR220L is solid kind silanol, and weight-average molecular weight is probably 850, and hydroxy radical content is 3 ~ 5w%.
Embodiment 1
(1) boron nitride modified organic silicone resin
By silane monomer: methyltrimethoxy silane: 3.72g, dimethyldimethoxysil,ne: 2.4g, phenyltrimethoxysila,e: 1.99g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.64g, amido two chloroborane: 0.5g, starts agitator.React 3 hours.Stop stirring, distill after being cooled to 78 DEG C, lower boiling small molecules is steamed.By organic solvent dimethylbenzene 2g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
20g epoxy resin E-51 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 4g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 150 DEG C of heating flask.Sustained reaction 5h, stops heating, and stop stirring, discharging obtains modified epoxy 1.
Application examples 1
Modified epoxy: modified epoxy 160g prepared by embodiment 1;
Pigment and filler: carbon black 20g; Silica 1 0g;
Auxiliary agent: 9% isocaprylic acid zinc 4.5g; KH-5602.5g; Silicone oil
1g,
High boiling solvent: divalent ester mixture (DBE) 10g; Ethylene glycol ether acetate (CAC): 5g.
Modified epoxy 1, auxiliary agent, pigment and filler, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 1.
Embodiment 2
(1) boron nitride modified organic silicone resin
By silane monomer: dimethyldimethoxysil,ne: 6g, phenyltrimethoxysila,e: 1.99g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.64g, amido two chloroborane 0.8g, starts agitator.React 5 hours.Stop stirring, distill after being cooled to 60 DEG C, lower boiling small molecules is steamed.By organic solvent toluene 3g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
20g epoxy resin E-44 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 6g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 155 DEG C of heating flask.Sustained reaction 4h, stops heating, and stop stirring, discharging obtains modified epoxy 2.
Application examples 2
Modified epoxy: modified epoxy 100g prepared by embodiment 2;
Pigment and filler: phthalocyanine blue 20g; Silicon-dioxide 20g;
Auxiliary agent: CoatOSil70014g; Silicone oil
6g; KH-5602.5g;
High boiling solvent: butyl acetic ester (DBA) 5g; Ethylene glycol ether acetate (CAC) 5g.
Modified epoxy, auxiliary agent, pigment and filler, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 2.
Embodiment 3
(1) boron nitride modified organic silicone resin
By silane monomer: Union carbide A-162: 3.56g, dimethyldiethoxysilane: 2.96g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.64g, dimethylamine borane 1.1g, starts agitator.React 4 hours.Stop stirring, distill after being cooled to 80 DEG C, lower boiling small molecules is steamed.By organic solvent butanols 1.8g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
Epoxy resin 6g is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 4g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 160 DEG C of heating flask.Sustained reaction 3h, stops heating, and stop stirring, discharging obtains modified epoxy 3.
Application examples 3
Modified epoxy: modified epoxy 120g prepared by embodiment 3;
Pigment and filler: silicon carbide 10g; Silica 1 0g; Titanium dioxide 20g;
Auxiliary agent: CoatOSil35004g; Silicone oil
4g; KH-5603g;
High boiling solvent: propionic acid-3-ether ethyl ester (EEP) 10g; Divalent ester mixture (DBE) 10g.
Pigment and filler, modified epoxy 3, auxiliary agent, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 3.
Embodiment 4
(1) boron nitride modified organic silicone resin
By silane monomer: Union carbide A-162: 3.56g, dimethyldimethoxysil,ne: 2.4g, phenyltrimethoxysila,e: 2.97g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.83g, dimethylamine borane 0.9g, starts agitator.React 3 hours.Stop stirring, distill after being cooled to 70 DEG C, lower boiling small molecules is steamed, by organic solvent isopropylcarbinol 3g, pours in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
12g epoxy resin E-21 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 3g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 165 DEG C of heating flask.Sustained reaction 2h, stops heating, and stop stirring, discharging obtains modified epoxy 4.
Application examples 4
Modified epoxy: modified epoxy 140g prepared by embodiment 4;
Pigment and filler: carbon black 20g; Silica 1 4g;
Auxiliary agent: CoatOSil35004g; CoatOSil76502g; KH-5603g;
High boiling solvent: methyl isoamyl ketone (MIAK) 5g; Isobutyl isobutyrate 10g.
Pigment and filler, modified epoxy, auxiliary agent, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 4.
Embodiment 5
(1) boron nitride modified organic silicone resin
By silane monomer: methyltrimethoxy silane: 2.72g, dimethyldimethoxysil,ne: 2.4g, phenyl triethoxysilane: 4.8g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 2.02g, ammonia borine 1.0g, starts agitator.React 4 hours.Stop stirring, distill after being cooled to 80 DEG C, lower boiling small molecules is steamed.By organic solvent propylene glycol 3g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
18g epoxy resin E-31 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 3g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 165 DEG C of heating flask.Sustained reaction 1h, stops heating, and stop stirring, discharging obtains modified epoxy 5.
Application examples 5
Modified epoxy: modified epoxy 120g prepared by embodiment 5;
Pigment and filler: carbon black 20g; Silicon-dioxide 5g; Titanium dioxide 5g;
Auxiliary agent: CoatOSil35004g; CoatOSil75102g; Silicone oil
4g; KH-5602.4g;
High boiling solvent: divalent ester mixture (DBE) 12g.
Pigment and filler, modified epoxy, auxiliary agent, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 5.
Embodiment 6
(1) boron nitride modified organic silicone resin
By silane monomer: methyltrimethoxy silane: 2.72g, dimethyldiethoxysilane: 2.22g, phenyltrimethoxysila,e: 1.99g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.51g, N, N-diisopropyl ethyl amine borine 0.72g, starts agitator.React 5 hours.Stop stirring, distill after being cooled to 60 DEG C, lower boiling small molecules is steamed.By organic solvent methyl ether 3g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
24g epoxy resin E-42 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 3g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 150 DEG C of heating flask.Sustained reaction 6h, stops heating, and stop stirring, discharging obtains modified epoxy 6.
Application examples 6
Modified epoxy: modified epoxy 160g prepared by embodiment 6;
Pigment and filler: phthalocyanine blue 20g; Silicon-dioxide 5g; Titanium dioxide 5g;
Auxiliary agent: CoatOSil35004g; Silicone oil
4g; KH-5602g;
High boiling solvent: divalent ester mixture (DBE) 20g; Isobutyl isobutyrate 10g.
Pigment and filler, modified epoxy, auxiliary agent, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 6.
Embodiment 7
(1) boron nitride modified organic silicone resin
By silane monomer: methyltrimethoxy silane: 2.72g, dimethyldimethoxysil,ne: 3.0g, phenyltrimethoxysila,e: 1.99g mixes, pour in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly add distilled water 1.76g, N, N-dihydroxyl amido dichlorosilane 0.85g, starts agitator.React 3 hours.Stop stirring, distill after being cooled to 70 DEG C, lower boiling small molecules is steamed.By organic solvent 1-Methoxy-2-propyl acetate 3g, pour in four-hole bottle, in emulsion form after mix and blend, obtain boron nitride modified organic silicone resin.
(2) modified epoxy
24g epoxy resin E-54 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then boron nitride modified organic silicone resin, silanol 6g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, the temperature to 155 DEG C of heating flask.Sustained reaction 5h, stops heating, and stop stirring, discharging obtains modified epoxy 7.
Application examples 7
Modified epoxy: modified epoxy 150g prepared by embodiment 7;
Pigment and filler: carbon black 10g; Silicon-dioxide 5g; Titanium dioxide 5g;
Auxiliary agent: CoatOSil35005g; Silicone oil
5g; KH-5602g;
High boiling solvent: divalent ester mixture (DBE) 10g.
Pigment and filler, modified epoxy, auxiliary agent, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating 7.
Comparative example 1
(1) modified organic silicone resin
By silane monomer: methyltrimethoxy silane: 2.72g, dimethyldimethoxysil,ne: 2.4g, phenyltrimethoxysila,e: 1.99g mixes, and pours in the four-hole boiling flask that prolong, agitator, thermometer, feed hopper are housed and then slowly adds distilled water 1.64g, start agitator.React 3 hours.Stop stirring, distill after being cooled to 78 DEG C, lower boiling small molecules is steamed.By organic solvent dimethylbenzene 3g, pour in four-hole bottle, in emulsion form after mix and blend, obtain modified organic silicone resin.
(2) modified epoxy
20g epoxy resin E-51 is poured in beaker, being placed in 40 DEG C of heating makes epoxy resin melt completely, seal for subsequent use, dimethylbenzene is added in modified organic silicone resin 20g prepared by step (1), resin is dissolved completely, then modified organic silicone resin, silanol 2g, epoxy resin are added organic solvent 8g after mixing in four-hole boiling flask, temperature to 150 ~ 165 DEG C of heating flask.Sustained reaction 5h, stops heating, and stop stirring, discharging obtains modified epoxy.
Application examples 8
Modified epoxy: modified epoxy 120g prepared by comparative example 1;
Pigment and filler: carbon black 20g; Silica 1 5g;
Auxiliary agent: silicone oil
5g; KH-5603g
High boiling solvent: divalent ester mixture (DBE) 20g.
Modified epoxy, auxiliary agent, pigment and filler, high boiling solvent are mixed, adds grinding machine for grinding to required particle diameter, obtain coating.
Test case
Thermogravimetic analysis (TGA): utilize thermal gravimetric analyzer to test, under high pure nitrogen atmosphere, temperature rise rate 10 DEG C/min.
Resistance toheat is analyzed: apply through epoxide modified resin in treated test piece, be placed in retort furnace and continue the 3h that is heated at 500 DEG C, observes the phenomenon whether coating surface has variable color, ftractures, comes off.
Sticking power is tested: test according to GB/T9286-1998.
The mensuration of paint film shock strength: test according to GB/T1732-93.
Paint film flexibility is tested: test according to GB/T1731-93.
(1) modifying epoxy resin by organosilicon film property test performance is as shown in table 1
Table 1:
(2) modifying epoxy resin by organosilicon coating film performance test performance is as shown in table 2
Table 2:
Claims (5)
1. a preparation method for modified epoxy, is characterized in that, described preparation method is following steps:
(1) boron nitride modified organic silicone resin: silane monomer is poured in container and then add distilled water and boron nitride, stirring reaction 2 ~ 5 hours, stops stirring, is cooled to 60 ~ 80 DEG C and then distills, again organic solvent is poured in container, obtained boron nitride modified organic silicone resin after stirring;
Silane monomer is selected from several mixtures in methyltrimethoxy silane, Union carbide A-162, dimethyldimethoxysil,ne, dimethyldiethoxysilane, phenyltrimethoxysila,e, phenyl triethoxysilane, dimethoxydiphenylsilane, diphenyl diethoxy silane;
(2) modified epoxy: epoxy resin is put into beaker, heating makes epoxy resin melt, seal for subsequent use, dimethylbenzene is added in boron nitride modified organic silicone resin prepared by step (1), then silanol, epoxy resin are poured in the container of boron nitride modified organic silicone resin and added organic solvent after mixing, adjustment vessel temp to 150 ~ 165 DEG C, obtain a kind of modified epoxy after sustained reaction 1 ~ 6h;
Described boron nitride is selected from ammonia borine or aminoboranes.
2. the preparation method of a kind of modified epoxy according to claim 1, it is characterized in that, step (1) is selected from one or more in toluene, dimethylbenzene, butanols, isopropylcarbinol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene, 1-Methoxy-2-propyl acetate, dipropylene glycol methyl ether acetate and dipropylene acetic ester with the organic solvent in step (2).
3. the preparation method of a kind of modified epoxy according to claim 1, is characterized in that, aminoboranes is selected from one or more in amido two chloroborane, dimethylamine borane, N, N-diisopropyl ethyl amine borine, N, N-dihydroxyl amido dichlorosilane.
4. the preparation method of a kind of modified epoxy according to any one of claim 1 to 3, is characterized in that, in step (1), the weight percent of each component is silane monomer 50 ~ 80%, distilled water 10 ~ 30%, boron nitride 3 ~ 12%, organic solvent 3 ~ 25%, each component sum is 100%.
5. the preparation method of a kind of modified epoxy according to claim 1 or 2 or 3, it is characterized in that, the mass ratio of step (2) epoxy resin and boron nitride modified organic silicone resin is 0.3 ~ 1.2:1, the consumption of dimethylbenzene is for making the consoluet amount of boron nitride modified organic silicone resin, the mass ratio of silanol and boron nitride modified organic silicone resin is 0.1 ~ 0.3:1, and the mass ratio of organic solvent and boron nitride modified organic silicone resin is 0.2 ~ 0.6:1.
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