CN103876775B - 超声探头的阵元连接元件及其超声探头及超声成像*** - Google Patents
超声探头的阵元连接元件及其超声探头及超声成像*** Download PDFInfo
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- CN103876775B CN103876775B CN201210555257.4A CN201210555257A CN103876775B CN 103876775 B CN103876775 B CN 103876775B CN 201210555257 A CN201210555257 A CN 201210555257A CN 103876775 B CN103876775 B CN 103876775B
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- 239000000523 sample Substances 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 claims description 52
- 230000000712 assembly Effects 0.000 claims description 20
- 238000000429 assembly Methods 0.000 claims description 20
- 238000002604 ultrasonography Methods 0.000 claims description 6
- 210000000746 body region Anatomy 0.000 abstract 1
- 230000008054 signal transmission Effects 0.000 description 16
- 239000000306 component Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 230000001413 cellular effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004899 motility Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/13—Tomography
- A61B8/14—Echo-tomography
- A61B8/145—Echo-tomography characterised by scanning multiple planes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/56—Details of data transmission or power supply
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medical Informatics (AREA)
- Surgery (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Public Health (AREA)
- Molecular Biology (AREA)
- Physics & Mathematics (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Gynecology & Obstetrics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
Claims (7)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210555257.4A CN103876775B (zh) | 2012-12-20 | 2012-12-20 | 超声探头的阵元连接元件及其超声探头及超声成像*** |
PCT/CN2013/081908 WO2014094445A1 (zh) | 2012-12-20 | 2013-08-20 | 超声探头及其阵元连接元件及超声成像*** |
US14/744,799 US10123776B2 (en) | 2012-12-20 | 2015-06-19 | Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof |
US16/188,583 US10561399B2 (en) | 2012-12-20 | 2018-11-13 | Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210555257.4A CN103876775B (zh) | 2012-12-20 | 2012-12-20 | 超声探头的阵元连接元件及其超声探头及超声成像*** |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103876775A CN103876775A (zh) | 2014-06-25 |
CN103876775B true CN103876775B (zh) | 2016-02-03 |
Family
ID=50946134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210555257.4A Active CN103876775B (zh) | 2012-12-20 | 2012-12-20 | 超声探头的阵元连接元件及其超声探头及超声成像*** |
Country Status (3)
Country | Link |
---|---|
US (2) | US10123776B2 (zh) |
CN (1) | CN103876775B (zh) |
WO (1) | WO2014094445A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106333708B (zh) * | 2016-08-22 | 2019-09-13 | 深圳开立生物医疗科技股份有限公司 | 一种柔性电路板、经食道探头和经食道探头制备方法 |
CN108811360B (zh) * | 2017-04-27 | 2020-11-13 | 深圳市理邦精密仪器股份有限公司 | 换能器晶片阵元的焊接方法以及声头 |
CN111067564B (zh) * | 2018-10-19 | 2024-03-19 | 深圳迈瑞生物医疗电子股份有限公司 | 超声面阵探头的背衬块、超声面阵探头及超声诊断成像设备 |
CN113176577A (zh) * | 2021-03-29 | 2021-07-27 | 中科听海(苏州)电子科技有限责任公司 | 一种新型多波束声学成像方法与*** |
Citations (4)
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CN101005729A (zh) * | 2005-12-22 | 2007-07-25 | 通用电气公司 | 转换器组件的互连结构 |
CN101103927A (zh) * | 2006-07-12 | 2008-01-16 | 株式会社东芝 | 两维阵列型超声波探头 |
CN101278843A (zh) * | 2007-04-02 | 2008-10-08 | 富士胶片株式会社 | 超声波探头及其制造方法 |
CN101965232A (zh) * | 2008-01-09 | 2011-02-02 | 海浪科技有限公司 | 多频带声学换能器阵列 |
Family Cites Families (20)
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US4890268A (en) * | 1988-12-27 | 1989-12-26 | General Electric Company | Two-dimensional phased array of ultrasonic transducers |
US5744898A (en) * | 1992-05-14 | 1998-04-28 | Duke University | Ultrasound transducer array with transmitter/receiver integrated circuitry |
US5410205A (en) * | 1993-02-11 | 1995-04-25 | Hewlett-Packard Company | Ultrasonic transducer having two or more resonance frequencies |
US5329498A (en) * | 1993-05-17 | 1994-07-12 | Hewlett-Packard Company | Signal conditioning and interconnection for an acoustic transducer |
US5559388A (en) * | 1995-03-03 | 1996-09-24 | General Electric Company | High density interconnect for an ultrasonic phased array and method for making |
JP3345580B2 (ja) * | 1998-03-05 | 2002-11-18 | 株式会社東芝 | 超音波プローブの製造方法 |
JP4408974B2 (ja) * | 1998-12-09 | 2010-02-03 | 株式会社東芝 | 超音波トランスジューサ及びその製造方法 |
WO2001021072A1 (fr) * | 1999-09-17 | 2001-03-29 | Hitachi Medical Corporation | Sonde a ultrasons et appareil de diagnostic a ultrasons la contenant |
US6625854B1 (en) * | 1999-11-23 | 2003-09-30 | Koninklijke Philips Electronics N.V. | Ultrasonic transducer backing assembly and methods for making same |
US7288069B2 (en) * | 2000-02-07 | 2007-10-30 | Kabushiki Kaisha Toshiba | Ultrasonic probe and method of manufacturing the same |
JP3939652B2 (ja) * | 2000-11-15 | 2007-07-04 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 多次元超音波トランスデューサアレイ |
JP3857170B2 (ja) * | 2002-03-29 | 2006-12-13 | 日本電波工業株式会社 | 超音波探触子 |
JP4801989B2 (ja) * | 2005-12-22 | 2011-10-26 | 株式会社東芝 | 超音波プローブ |
CN101536545B (zh) * | 2006-11-08 | 2013-02-06 | 松下电器产业株式会社 | 超声波探头 |
US7791252B2 (en) * | 2007-01-30 | 2010-09-07 | General Electric Company | Ultrasound probe assembly and method of fabrication |
JP2009060501A (ja) * | 2007-09-03 | 2009-03-19 | Fujifilm Corp | バッキング材、超音波探触子、超音波内視鏡、超音波診断装置、及び、超音波内視鏡装置 |
EP2444166A1 (en) * | 2009-09-15 | 2012-04-25 | Fujifilm Corporation | Ultrasonic transducer, ultrasonic probe and producing method |
JP5738671B2 (ja) * | 2011-05-18 | 2015-06-24 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法 |
KR101995867B1 (ko) * | 2012-07-12 | 2019-10-01 | 삼성전자주식회사 | 곡면프레임을 포함하는 트랜스듀서 모듈, 상기 트랜스듀서 모듈을 포함하는 초음파 프로브 및 상기 곡면프레임을 제조하는 방법 |
KR102185362B1 (ko) * | 2013-10-08 | 2020-12-02 | 삼성전자주식회사 | 초음파 프로브 및 이를 포함한 의료 장치 |
-
2012
- 2012-12-20 CN CN201210555257.4A patent/CN103876775B/zh active Active
-
2013
- 2013-08-20 WO PCT/CN2013/081908 patent/WO2014094445A1/zh active Application Filing
-
2015
- 2015-06-19 US US14/744,799 patent/US10123776B2/en active Active
-
2018
- 2018-11-13 US US16/188,583 patent/US10561399B2/en active Active
Patent Citations (4)
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CN101005729A (zh) * | 2005-12-22 | 2007-07-25 | 通用电气公司 | 转换器组件的互连结构 |
CN101103927A (zh) * | 2006-07-12 | 2008-01-16 | 株式会社东芝 | 两维阵列型超声波探头 |
CN101278843A (zh) * | 2007-04-02 | 2008-10-08 | 富士胶片株式会社 | 超声波探头及其制造方法 |
CN101965232A (zh) * | 2008-01-09 | 2011-02-02 | 海浪科技有限公司 | 多频带声学换能器阵列 |
Also Published As
Publication number | Publication date |
---|---|
WO2014094445A1 (zh) | 2014-06-26 |
US10123776B2 (en) | 2018-11-13 |
CN103876775A (zh) | 2014-06-25 |
US10561399B2 (en) | 2020-02-18 |
US20190254628A1 (en) | 2019-08-22 |
US20150282785A1 (en) | 2015-10-08 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180517 Address after: 518057 the 1-4 floor of MINDRAY building, science and technology south twelve Road, Nanshan District high tech Industrial Park, Shenzhen, Guangdong. Co-patentee after: SHENZHEN MINDRAY SCIENTIFIC Co.,Ltd. Patentee after: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. Address before: 518057 the 1-4 floor of MINDRAY building, science and technology south twelve Road, Nanshan District high tech Industrial Park, Shenzhen, Guangdong. Patentee before: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20140625 Assignee: Shenzhen Mindray Animal Medical Technology Co.,Ltd. Assignor: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. Contract record no.: X2022440020009 Denomination of invention: Array element connecting element of ultrasonic probe, ultrasonic probe and ultrasonic imaging system Granted publication date: 20160203 License type: Common License Record date: 20220804 |
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EE01 | Entry into force of recordation of patent licensing contract |