CN103874549B - For the equipment of clean electronic package device - Google Patents
For the equipment of clean electronic package device Download PDFInfo
- Publication number
- CN103874549B CN103874549B CN201280043523.3A CN201280043523A CN103874549B CN 103874549 B CN103874549 B CN 103874549B CN 201280043523 A CN201280043523 A CN 201280043523A CN 103874549 B CN103874549 B CN 103874549B
- Authority
- CN
- China
- Prior art keywords
- brush
- electronic package
- contact
- package device
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000000712 assembly Effects 0.000 claims abstract description 10
- 238000000429 assembly Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 16
- 239000000428 dust Substances 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- RSMUVYRMZCOLBH-UHFFFAOYSA-N metsulfuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)NC1=NC(C)=NC(OC)=N1 RSMUVYRMZCOLBH-UHFFFAOYSA-N 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B17/00—Accessories for brushes
- A46B17/02—Devices for holding brushes in use
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B5/00—Brush bodies; Handles integral with brushware
- A46B5/0004—Additional brush head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/54—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B2200/00—Brushes characterized by their functions, uses or applications
- A46B2200/30—Brushes for cleaning or polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of assembly for clean electronic package device, it comprises the brush with brush unit, the driver of mobile described brush, outstanding contact and air extractor.The invention further relates to a kind of electronic package device being provided with this cleaning assemblies, and a kind of method of clean electronic package device.
Description
Technical field
The present invention relates to a kind of assembly for clean electronic package device as described in the preamble according to claim 1, and relate to a kind of packaging system being furnished with this cleaning assemblies.The invention still further relates to a kind of method utilizing brush to carry out the contact side in the mould portion of clean electronic package device.
Background technology
When manufacturing electronic component, more specifically when manufacturing semiconductor, they completely or partially encapsulate with encapsulating material usually.Here encapsulating material is normally made up of heat-curable epoxy resin or the resin that comprises filler.In encapsulation process, by the semiconductor card that is installed on carrier (such as lead frame or wiring board) between mould portion, after blocking, just can define die cavity to encapsulate at component ambient like this.Then liquid encapsulating material is introduced in these die cavitys, after its at least partly solidification, mould portion is moved apart, and removes the carrier of the electronic component with encapsulation.When the new production cycle starts, the residual encapsulating material particle removed in mould portion is very important, because these particles may destroy the controlled encapsulation of electronic component.According to prior art, under the Light Condition opened, come clean mould portion with brush for this purpose.
Japan Patent JP-A-58025922 discloses a kind of metal pattern for sealing resin is cleaned in utilization method with the cleaning unit of rotating brush.This cleaning unit is provided with housing, and this housing can utilize mid seal to be leaned and place in mould portion to be cleaned, thus the formation hollow unit that combines.Suction pump is connected to hollow unit, to discharge the burr scraped from mould portion by rotating brush.
Summary of the invention
The present invention is a kind of improvement cleaning equipment and the method that its object provides electronic package device.
The present invention provides a kind of assembly for clean electronic package device according to claim 1 for this purpose.In a specific embodiment modification, brush unit described here is formed by bristle.The residue itself using brush unit to come in clean mould portion is known.Utilize brush unit can remove loose (dust) particle, also can remove the attachment retained material in mould portion.Because the present invention now provided with a kind of contact, brush can be only clean object and move along it, thus outstanding brush unit relative to each other moves, and the particle be therefore clipped between brush unit (bristle) can more easily be released.Brush unit can be launched partly in its relative movement, thus the space between brush unit increases partly.Particularly can like this from brush release particles (dust) near contact.Exactly be provided with pump orifice in this position exactly now, (dust) particle of release can be sucked away by this pump orifice.The advantage of the couple positioned opposite pump orifice of outstanding contact be both sides release (dust) particle can be sucked away thus, therefore prevent from brush pollutant undesirable lateral dispersion danger.(dust) particle is moved to/is discharged to known location by aspirator.Therefore can remove (dust) particle on brush, these particles are particularly made up of the residue of (solidification) encapsulating material, but also may comprise the material from other sources (such as carrier).The clean meeting of brush makes the brush of follow-up clean operation sweep efficiency raising; Cleaner brush can improve the cleaning action of brush, therefore makes the contact side in mould portion cleaner, and improves the quality level of the electronic component of encapsulation.
In order to limit wearing and tearing and good cleaning action can be realized when not damaging the contact side in mould portion, bristle can be made of plastics.And reaching minimum 200 DEG C by heat resisting temperature here, bristle made by the material preferably reaching 250 DEG C or 300 DEG C is desirable.Such as, a kind of suitable material is plastics PEEK.
In another embodiment variant, outstanding contact is elongated shape.This embodiment makes likely to make brush along contact displacement (such as moving linearly) in a straightforward manner.Outstanding contact can also take various forms according to the mode comprising multiple neighboring edge.Alternatively outstanding contact is provided with pattern profile edge, such as, in corrugated contour edge.Outstanding contact also can be made up of the sheet material (sheet material of such as boring a hole) being provided with opening, therefore, it is possible to improve the suction of releasable material.
In a specific embodiment modification, brush is elongated shape, with the relatively large surf zone making it can carry out the contact side in clean mould portion thus by means of only the motion of limited number of times.And this elongate brush is advantageously removable in longitudinal direction relative to outstanding contact, thus contact can have limited size, and wherein pump orifice also can have limited length.Brush preferably mechanically or is automatically shifted, and driver can be made up of motor here.Alternately, furthermore it is possible that brush laterally can be shifted relative to outstanding contact.
In another embodiment variant, brush is provided with at least one air supply opening.From brush blow gas in the process that brush is shifted along contact, can realize improving the clean of brush further, and the control of the air-flow that (dust) particle of release is discharged can be improved further.This makes clean result improve further.The another kind of formation selected can not freely to be scattered but the mode being directed to pump orifice arranges one or more air knife from (dust) particle of brush release for making.Here particularly advantageously air knife partially or even wholly limits a space, and this spatial joins is to pump orifice, and brush can move along contact within this space.The particle of release therefore through pump orifice by fully (or substantially fully) discharge.
In order to simplify (dust) particle further to controllably from brush release, this assembly also can be provided with ionization device.Ionization device can increase negative electrical charge and the positive charge of equivalent usually to brush, thus such as the insulator such as PVC, teflon can repid discharge.Can be prevented by ionization or at least reduce brush by undesirably or not controllably electrostatic charging.
Present invention also offers a kind of packaging system according to claim 10, cleaning assemblies according to the present invention is integrated in this packaging system.In order to limit the cleaned necessary motion of brush, outstanding contact is located in packaging system by the mode outside the contact surface that contact can be made to protrude from one of them mould portion.Packaging system also can be provided with multiple outstanding contact, therefore to shorten or otherwise to simplify brush the needing path advancing to contact.Here the elongated outstanding contact of multiple different orientation can also be selected.
In addition, present invention also offers a kind of method for clean electronic package device as claimed in claim 13.
By repeatedly carrying out this process, brush usually can be more clean well than being transferred only situation once along outstanding contact.Therefore can select at treatment step B) process in carry brush off and on along outstanding contact.In order to not extend the total cycle time of encapsulation process, preferably brush near the contact side to be cleaned in the mould portion of packaging system time and/or perform treatment step B when removing brush from the clean contact side in the mould portion of packaging system) and C).In the production cycle that therefore just brush cleaning can be incorporated into electronic package, make like this total cycle time of encapsulation operation not (or hardly) by the impact of extra clean process.This is by cleaning brush outside critical path or at least ensure that cleaning brush does not extend the critical path limiting production cycle length and realizes.
Accompanying drawing explanation
The present invention is further illustrated by based on the non-limiting exemplary embodiment shown in the following drawings.Here:
Fig. 1 is the perspective view of the part according to electronic package device of the present invention;
Fig. 2 is the top view of the alternate embodiment modification of a part according to electronic package device of the present invention;
Fig. 3 is the perspective view according to cleaning assemblies of the present invention in the process that brush is cleaned;
Fig. 4 shows the cross section according to the alternate embodiment modification of cleaning assemblies of the present invention in the process that brush is cleaned; And
Fig. 5 is the perspective view with the outstanding contact of pump orifice taken various forms.
Detailed description of the invention
Fig. 1 shows a part for the electronic package device 1 being provided with cleaning assemblies 2.The shown part of packaging system 1 is provided with lower mold portion 3, and this lower mold portion is assembled by the permanent mould part 5 of commutative mould part 4 and this commutative mould part 4 of clamping.Also show a part for post 6, upper mold portion (not shown here) can be directed to lower mold portion 3 along these posts.Illustrate that die cavity 7, running channel 8 and plunger housing 9 are recessed in commutative mould part 4 further.Liquid encapsulating material can from plunger housing 9 through running channel 8(together also known as making encapsulating material conveying device) be delivered to die cavity 7.In the upside (that side towards upper mold portion) of lower permanent mould part 5, two outstanding contacts 10 protrude from the top of contact surface 11.Outstanding contact 10 is sucked mouth 12 and surrounds, and the dirt of release can be sucked away through pump orifice.
The rear side of lower mold portion 3 shows two brush unit 13 in FIG, and this unit defines partial encapsulation device 1 equally.Brush unit 13 is provided with two brushes 14 with bristle 15.By motor 16 drive spindle 17, thus die cavity 7, running channel 8 and/or plunger housing 9 can clean down by the brush 14 of (open position at packaging system 1) brush unit 13.Then, when the rear side of lower mold portion 3 retracted by brush 15, brush 14 is at least one times through outstanding contact 10, thus bristle 15 is locally moved apart, the result at least some particle be clipped between bristle 15 can be released with after be sucked away through pump orifice 12.Also can carry brush 14 off and on along outstanding contact 10 in addition, so that therefore, it is possible to cleaning brush 14 better.Such as, can these brushes clean just in time return brush 14 after cleaning of mould portion 3 after, although other clean orders one or more also can be selected.
Fig. 2 is the top view of lower mold portion 20, and the lower mold portion 3 shown in this lower mold portion and Fig. 1 is assembled by the permanent mould part 22 of commutative mould part 21 and this commutative mould part 21 of clamping similarly.Be also shown in post 23 equally.Die cavity 7, the running channel 8 of recessed commutative mould part 21 indicate the label identical with Fig. 1 with plunger housing 9.Compare with the embodiment variant shown in Fig. 1, lower mold portion 20 is provided with two elongated outstanding contacts 24,25 now, and the two is all surrounded by the pump orifice 26,27 of different orientation.This provide more cleaning brush to select, thus clean result can be optimized better and therefore optimize required time.
Fig. 3 is the perspective view of the brush 30 having bristle 31 definitely at brush along outstanding contact 32 in the situation be transferred according to the longitudinal direction of arrow P 1.Clearly show that bristle 31 is moved in the position contacted with outstanding contact 32 to separate.Outlet 33 is positioned at the either side of outstanding contact 32, and surrounding air is sucked away through outlet 33 together with the dirt of release.Also be provided with channel system 34 in brush 30, shown in broken lines here, upside has opening 35, and gas can be blown in opening 35 along arrow P 2.Therefore the gas be blown into can be blown between bristle 31, therefore to support the clean of brush 30 further.Can expect only improving this blower system further in the mode of the position blow gas of outstanding contact 32.Here schematically show, driver 36 is positioned at the upside of brush, is shifted for making brush 30.Different from described here, outstanding contact 32 certainly also can be made to be shifted relative to brush 30, to obtain identical effect (this is brush 30 and the relative mutual displacement of outstanding contact 32 after all) thus.
The cross section of a cleaning assemblies part shown in Fig. 4 shows the outstanding contact 41 of either side with pump orifice 42, and gas is sucked away along arrow P 3 through pump orifice 42.What be positioned at outstanding contact 41 either side (larger than the distance of pump orifice 42) in addition is two blow guns 43, and blow gun can be utilized to produce air knife along arrow P 4 direction.Therefore the dirt discharged owing to contacting with outstanding contact 41 is prevented to scatter in undesirable direction.
Fig. 5 shows outstanding contact 50, and this contact takes various forms and plate portion 52,53,54 restriction given prominence to by three parallel arrangements and relative to plane 51.Here surface 51 preferably with the contact surface in the mould portion that will clean in line, or be positioned at the At The Height similar at least more or less to the contact side in this mould portion that will clean.Plate portion 52,53, is provided with two suction seams 55,56 between 54, (dust) particle can sew through suction and siphon away.
Claims (16)
1., for an equipment for clean electronic package device, comprising:
Electronic package device (1), and
Cleaning assemblies (2), comprising:
-be provided with the brush (13,14,30) of some brush unit (15,31),
-driver (16,17,36) for making described brush (13,14,30) be shifted relative to described electronic package device (1),
-outstanding contact (10,24,25,32,41,50), and
-be provided with the aspirator of at least one pump orifice (12,26,27,33,42,55,56) be positioned near described outstanding contact (10,24,25,32,41,50),
Wherein said driver (16,17,36) is suitable for along described outstanding contact (10,24,25,32,41,50) described brush (13,14 is moved, 30), like this by described outstanding contact (10,24,25,32,41,50) the described brush unit (15,31) of giving prominence to relative to each other is shifted;
It is characterized in that, described outstanding contact (10,24,25,32,41,50) described electronic package device (1) is connected in, and described pump orifice (12,26,27,33,42,55,56) described outstanding contact (10,24,25 is located at, 32,41,50) opposite side.
2. equipment as claimed in claim 1, is characterized in that described brush unit (15,31) is for bristle (31).
3. equipment as claimed in claim 2, is characterized in that described bristle (31) is made of plastics.
4. the equipment as described in above claim 1 or 2, is characterized in that described outstanding contact (10,24,25,32,41,50) is elongated shape.
5. the equipment as described in above claim 1 or 2, is characterized in that described outstanding contact (10,24,25,32,41,50) takes various forms (52,53,54).
6. the equipment as described in above claim 1 or 2, is characterized in that described brush (13,14,30) is in elongated shape and relative to described outstanding contact (10,24,25,32,41,50) longitudinally removable.
7. the equipment as described in above claim 1 or 2, is characterized in that described driver (16,17,36) comprises at least one motor (16).
8. the equipment as described in above claim 1 or 2, is characterized in that described brush (13,14,30) is provided with at least one air supply opening (34,35).
9. the equipment as described in above claim 1 or 2, is characterized in that described cleaning assemblies (2) also can be provided with ionization device.
10. comprise an equipment for electronic package device (1), this equipment is provided with the cleaning assemblies described in above any one claim, and wherein said electronic package device (1) is provided with:
-at least two mould portions (3,20), it relative to each other can be shifted and be suitable for engaging the electronic component that will encapsulate; And
-encapsulating material conveying device (8,9), its be connected to by described mould portion (3,20) limit and sealing electronic parts to carry out the die cavity (7) encapsulated.
11. equipment comprising electronic package device (1) as claimed in claim 10, it is characterized in that described outstanding contact (10,24,25,32,41,50) mould portion (3 described in one of them is protruded from, 20) outside contact surface (11,51).
12. equipment comprising the electronic package device (1) according to claim 10 or 11, is characterized in that described electronic package device (1) comprises multiple outstanding contact (10,24,25,32,41,50).
13. 1 kinds, for the method for clean electronic package device (1), comprise following treatment step:
A) contact side in the mould portion (3,20) of clean described electronic package device (1) is carried out by brush (13,14,30) relative shift,
B) make described brush (13,14,30) contact connection in the outstanding contact (10 of described electronic package device (1), 24,25,32,41,50) and make described brush (13,14,30) relative to described outstanding contact (10,24,25,32,41,50) mobile, make the brush unit (15 of described brush (13,14,30) like this, 31) by described contact (10,24,25,32,41,50) to touch and described brush unit (15,31) is relative to each other shifted, and
C) at least performing treatment step B) time siphon away described outstanding contact (10,24,25,32,41,50) surrounding air of opposite side, make like this to discharge air in the position of described brush unit (15,31) displaced from one another.
14. methods as claimed in claim 13, is characterized in that at treatment step B) process in carry described brush (13,14,30) off and on along described outstanding contact (10,24,25,32,41,50).
15. methods as described in claim 13 or 14, it is characterized in that at described brush (13,14,30) when the contact side to be cleaned in the mould portion (3,20) of described electronic package device (1), described treatment step B is performed) and C).
16. methods as described in claim 13 or 14, it is characterized in that in the mould portion (3 from described electronic package device (1), 20) clean contact side removes described brush (13,14,30) described treatment step B is performed while) and C).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2007110A NL2007110C2 (en) | 2011-07-14 | 2011-07-14 | DEVICE FOR CLEANING AN ENCLOSURE DEVICE FOR ELECTRONIC COMPONENTS. |
| NL2007110 | 2011-07-14 | ||
| PCT/NL2012/050500 WO2013009180A1 (en) | 2011-07-14 | 2012-07-12 | Device for cleaning an encapsulating device for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874549A CN103874549A (en) | 2014-06-18 |
| CN103874549B true CN103874549B (en) | 2015-11-25 |
Family
ID=46639653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043523.3A Active CN103874549B (en) | 2011-07-14 | 2012-07-12 | For the equipment of clean electronic package device |
Country Status (7)
| Country | Link |
|---|---|
| KR (1) | KR102032866B1 (en) |
| CN (1) | CN103874549B (en) |
| MY (1) | MY166565A (en) |
| NL (1) | NL2007110C2 (en) |
| SG (1) | SG2014002612A (en) |
| TW (1) | TWI565534B (en) |
| WO (1) | WO2013009180A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9333540B2 (en) | 2012-08-30 | 2016-05-10 | Norilla Llc | Devices and methods for dispensing fluids and wiping surfaces |
| WO2015042463A2 (en) | 2013-09-20 | 2015-03-26 | Norilla Llc | Devices and methods for dispensing fluids and wiping surfaces |
| DE102013109858A1 (en) * | 2013-09-09 | 2015-03-12 | Dieffenbacher GmbH Maschinen- und Anlagenbau | Method and device for cleaning a tool in the course of the production of molded parts |
| USD739987S1 (en) | 2013-09-11 | 2015-09-29 | Norilla Llc | Surface cleaning device |
| TWI648106B (en) * | 2017-08-31 | 2019-01-21 | 鴻勁精密股份有限公司 | Conveying device with cleaning unit and test classification device thereof |
| CN107598103A (en) * | 2017-11-17 | 2018-01-19 | 洛阳华世耐磨材料制造有限公司 | A kind of assisted casting device of casting mould |
| CN108189288B (en) * | 2018-03-01 | 2024-04-16 | 日荣半导体(上海)有限公司 | Sweep template and sweep mould equipment |
| CN111070528A (en) * | 2019-12-12 | 2020-04-28 | 永豪光电（中国）有限公司 | Die pressing and conveying mechanism for spherical lens |
| CN112845207B (en) * | 2020-12-23 | 2022-03-18 | 海南红塔卷烟有限责任公司 | Labeling machine for upper and lower surfaces of non-standard paper box |
| CN113276383A (en) * | 2021-07-21 | 2021-08-20 | 潍坊柯汇新材料科技有限公司 | Forming machine for producing degradable polyethylene plastic artware |
| CN114308832B (en) * | 2022-01-04 | 2023-03-28 | 中建科工集团有限公司 | Rust removal device |
| CN115245928B (en) * | 2022-06-27 | 2023-06-09 | 浙江避泰电气科技有限公司 | Aluminum spraying dust removing device and process in resistor disc production |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB189405299A (en) * | 1894-03-14 | 1894-09-15 | William Rockliffe | Improvements in the Construction of Brushes for Preparing Metals for Electro-plating and for other like Cleansing Purposes. |
| CN1488448A (en) * | 2002-07-23 | 2004-04-14 | 美商戴尔贝斯空气动力公司 | Pressure washing machine |
| JP5825922B2 (en) * | 2011-08-11 | 2015-12-02 | ポリプラスチックス株式会社 | Polyacetal resin composition and method for producing the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825922B2 (en) * | 1975-08-18 | 1983-05-31 | ザ．バブコツク．アンド．ウイルコツクス．カンパニ− | Forced circulation fluid heating device |
| JPS5825922Y2 (en) * | 1978-04-15 | 1983-06-04 | 松下電工株式会社 | hair curler curl pipe |
| JPS5825922A (en) * | 1981-08-11 | 1983-02-16 | Toshiba Corp | Cleaning method of metal mold for sealing resin |
| JPS58191120A (en) * | 1982-04-30 | 1983-11-08 | Michio Osada | Cleaning method of face of mold for resin molding and brush member for cleaning |
| JPS58191120U (en) * | 1982-06-10 | 1983-12-19 | 株式会社クボタ | Screw conveyor device |
| JPH01105708A (en) * | 1987-10-19 | 1989-04-24 | Mitsubishi Electric Corp | Mold assembly |
| US6200504B1 (en) * | 1994-05-09 | 2001-03-13 | Fico B.V. | Method for encapsulating with plastic a lead frame with chips |
| JP3122370B2 (en) * | 1996-05-29 | 2001-01-09 | 株式会社伸興 | Dust removal device |
| JPH11179737A (en) * | 1997-12-25 | 1999-07-06 | Tsukuba Seiko Kk | Apparatus for cleaning surface of mold |
| JP2000117750A (en) * | 1998-10-12 | 2000-04-25 | Matsushita Electric Ind Co Ltd | Apparatus for cleaning mold for resin molding and method for cleaning it |
| DE19955066C2 (en) * | 1999-11-15 | 2002-01-24 | Wandres Micro Cleaning | Method and device for removing contaminants from surfaces |
| TW200920503A (en) * | 2007-11-06 | 2009-05-16 | King Yuan Electronics Co Ltd | Chip dust cleaning device |
-
2011
- 2011-07-14 NL NL2007110A patent/NL2007110C2/en active
-
2012
- 2012-07-12 MY MYPI2014000091A patent/MY166565A/en unknown
- 2012-07-12 CN CN201280043523.3A patent/CN103874549B/en active Active
- 2012-07-12 SG SG2014002612A patent/SG2014002612A/en unknown
- 2012-07-12 WO PCT/NL2012/050500 patent/WO2013009180A1/en active Application Filing
- 2012-07-12 KR KR1020147003102A patent/KR102032866B1/en active IP Right Grant
- 2012-07-13 TW TW101125255A patent/TWI565534B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB189405299A (en) * | 1894-03-14 | 1894-09-15 | William Rockliffe | Improvements in the Construction of Brushes for Preparing Metals for Electro-plating and for other like Cleansing Purposes. |
| CN1488448A (en) * | 2002-07-23 | 2004-04-14 | 美商戴尔贝斯空气动力公司 | Pressure washing machine |
| JP5825922B2 (en) * | 2011-08-11 | 2015-12-02 | ポリプラスチックス株式会社 | Polyacetal resin composition and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI565534B (en) | 2017-01-11 |
| KR20140059190A (en) | 2014-05-15 |
| MY166565A (en) | 2018-07-16 |
| NL2007110C2 (en) | 2013-01-15 |
| KR102032866B1 (en) | 2019-11-08 |
| TW201313335A (en) | 2013-04-01 |
| CN103874549A (en) | 2014-06-18 |
| SG2014002612A (en) | 2014-04-28 |
| WO2013009180A1 (en) | 2013-01-17 |
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