CN103871928A - Semiconductor device and heater thereof - Google Patents
Semiconductor device and heater thereof Download PDFInfo
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- CN103871928A CN103871928A CN201210544030.XA CN201210544030A CN103871928A CN 103871928 A CN103871928 A CN 103871928A CN 201210544030 A CN201210544030 A CN 201210544030A CN 103871928 A CN103871928 A CN 103871928A
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- lower cover
- upper cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
The invention discloses a heater used for a semiconductor device. The heater includes an upper cover plate, a lower cover plate, a connection assembly, a heating wire and a back-blowing air-intake component; an air supplying through hole is formed in the upper cover plate; the connection assembly is connected with the lower surface of the lower cover plate; the connection assembly is used for positioning the upper cover plate, the lower cover plate and the connection assembly itself in a vacuum reaction chamber of the semiconductor devices; a cavity is defined between the upper surface of the lower cover plate and the lower surface of the upper cover plate; an electrical lead of the heating wire is in sealing with the connection assembly; and the back-blowing air-intake component passes through the connection assembly and the lower cover plate sequentially and is connected with the air supplying through hole in a sealing manner. According to the heater used in the semiconductor device of the invention, the heating wire is positioned in a vacuum environment, such that the heating wire no longer directly exchanges heat with atmosphere, and therefore, heat loss can be reduced, and heating efficiency can be improved. In addition, the invention also discloses a semiconductor device.
Description
Technical field
The present invention relates to semiconductor equipment and manufacture field, particularly relate to the heater of a kind of semiconductor equipment and this semiconductor equipment.
Background technology
In semiconductor equipment, a lot of technical processs need to heat, and the form of heater mainly can be divided into two kinds, and one is radiant type heating, and another is Resistant heating; Radiant type mode of heating has that the rate of heat addition is fast, efficiency high, but often the uniformity of heating is bad; Resistance heater can well solve homogeneity question, meanwhile, for improving its rate of heat addition and efficiency, tends to introduce the back of the body and blows, by this gas by heat from heater evenly, be delivered to and add thermal target fast.
Between each parts of high temperature heater (HTH) of the prior art, adopting the mode of welding to realize is tightly connected, but because heater structure is limit, weld seam between its parts tends to long, for ensureing that the situation to exitting in reaction chamber does not appear in weld seam while use in a vacuum, technological requirement to welding is higher, and cost is high.
And the heater strip of high temperature heater (HTH) of the prior art in atmospheric side heating, because heater strip directly contacts with atmosphere, can be taken away part heating power by the conduction and convection of air conventionally, causes heater efficiency not high.In addition, because heater adopts integral solder moulding, in the time of part parts, particularly heater strip or transducer damage, cause heater to lose use value completely, increased cost, caused waste.
Summary of the invention
The present invention is intended to one of solve the problems of the technologies described above at least to a certain extent.For this reason, one object of the present invention is to propose a kind of heater of the high temperature stainless steel taking resistance wire as thermal source using in a vacuum, and this heater has advantages of that the efficiency of heating surface is high, low cost of manufacture and easy to maintenance.
Another object of the present invention is to propose a kind of semiconductor equipment with above-mentioned heater.
According to the heater for semiconductor equipment of first aspect present invention embodiment, described heater comprises: upper cover plate, lower cover, coupling assembling, heater strip and back of the body blowing air inlet component, wherein: described upper cover plate has for vent hole; Described coupling assembling is connected with the lower surface of described lower cover, and described coupling assembling is for being placed in self described upper cover plate and lower cover and described coupling assembling in the vacuum chamber of semiconductor equipment;
Described lower cover stacks and is connected with described upper cover plate, between the upper surface of described lower cover and the lower surface of described upper cover plate, limits cavity; Described heater strip is located in cavity, and the electrical lead wire of described heater strip extends outside vacuum chamber through described lower cover and described coupling assembling, and seals between the electrical lead wire of described heater strip and described coupling assembling; Described back of the body blowing air inlet component is arranged on outside vacuum chamber, described back of the body blowing air inlet component is through described coupling assembling and lower cover, the upper end of described back of the body blowing air inlet component is connected for vent hole hermetically with described, back of the body blowing is supplied to the upper surface of described upper cover plate, between described back of the body blowing air inlet component and described coupling assembling, be tightly connected.
For the heater of semiconductor equipment, the space at heater strip place is communicated with vacuum chamber according to an embodiment of the invention, and heater strip is arranged in vacuum environment, and thus, heater strip no longer carries out heat exchange with atmosphere, has reduced thermal loss, improves the efficiency of heating surface.Meanwhile, due to upper cover plate, lower cover and coupling assembling, to be all positioned at vacuum reaction chamber indoor, between cover plate and lower cover, needn't adopt the connected mode of sealing between lower cover and coupling assembling, reduced difficulty of processing and production cost.In addition, change heater strip and be more prone to, for convenience detach and maintenance.
According to one embodiment of present invention, described back of the body blowing air inlet component and the welding of described upper cover plate.
According to one embodiment of present invention, the upper surface of described lower cover is provided with groove, and groove is to form described cavity described in described upper cover plate capping.
According to one embodiment of present invention, described upper cover plate and described lower cover are bolted.
According to one embodiment of present invention, described upper cover plate is provided with pin-and-hole, and described lower cover is provided with the lower pin-and-hole corresponding with described upper pin-and-hole, in described upper pin-and-hole and described lower pin-and-hole, is provided with alignment pin.
According to one embodiment of present invention, the heater of described semiconductor equipment also comprises: temperature sensor, described temperature sensor is located in described cavity, for detection of the temperature of described upper cover plate, the electrical lead wire of described temperature sensor extends outside vacuum chamber through described lower cover and described coupling assembling, and seal welding between the electrical lead wire of described temperature sensor and described coupling assembling.
According to one embodiment of present invention, described coupling assembling comprises: joint sleeve, and the upper end of described joint sleeve is connected with the lower surface of described lower cover; And flange, described flange is connected with the lower end of described joint sleeve, between described flange and described heater strip and the electrical lead wire of described temperature sensor, between sealing and described flange and described back of the body blowing air inlet component, seals.
According to one embodiment of present invention, between described joint sleeve and described lower cover and intermittently welding between described joint sleeve and described flange.
According to one embodiment of present invention, described lower cover has central through hole, the 3rd fairlead that described flange has the first fairlead passing for described back of the body blowing air inlet component, the second fairlead passing for the electrical lead wire of described heater strip sensor and passes for the electrical lead wire of described temperature sensor.
According to one embodiment of present invention, described upper cover plate, lower cover and described coupling assembling are made by stainless steel material.
According to one embodiment of present invention, be formed with the air bleed slot radially extending along described upper cover plate on the upper surface of described upper cover plate, described air bleed slot is connected for vent hole with described.
According to one embodiment of present invention, described air bleed slot is multiple, and described multiple air bleed slots are circumferentially spaced apart along described upper cover plate.
According to one embodiment of present invention, described lower cover is provided with the through hole being communicated with described cavity, and described cavity is communicated with the vacuum chamber of described semiconductor equipment.
Comprise according to the semiconductor equipment of the embodiment of the present invention: vacuum reaction chamber; And heater, described heater is the heater of above-mentioned semiconductor equipment, described in wherein said heater, vacuum reaction chamber connects, the electrical lead wire of wherein said heater strip and described back of the body blowing air inlet component extend from described vacuum reaction chamber is indoor, and described through hole is communicated with the inside of described cavity and described vacuum reaction chamber.
According to the semiconductor equipment of the embodiment of the present invention, it has heater, and the space at the heater strip place of heater is communicated with vacuum chamber, be that heater strip is arranged in vacuum environment, thus, heater strip no longer carries out heat exchange with atmosphere, reduce thermal loss, improved the efficiency of heating surface.Meanwhile, due to upper cover plate, lower cover and coupling assembling, to be all positioned at vacuum reaction chamber indoor, between cover plate and lower cover, needn't adopt the mode of being tightly connected between lower cover and coupling assembling, reduced difficulty of processing and production cost.In addition, change heater strip and be more prone to, for convenience detach and maintenance.
Additional aspect of the present invention and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Brief description of the drawings
Above-mentioned and/or additional aspect of the present invention and advantage accompanying drawing below combination is understood becoming the description of embodiment obviously and easily, wherein:
Fig. 1 is the structural representation of the heater for semiconductor equipment according to an embodiment of the invention;
Fig. 2 is the vertical view of the upper cover plate of the heater for semiconductor equipment according to an embodiment of the invention;
Fig. 3 is the vertical view of the flange of the heater for semiconductor equipment according to an embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Be exemplary below by the embodiment being described with reference to the drawings, be intended to for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of instructions such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of device or the element of instruction or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as instruction or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be also electrical connection; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be above-mentioned term concrete meaning in the present invention.
In the present invention, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but by the other feature contact between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is less than Second Characteristic.
Describe according to the heater for semiconductor equipment of the embodiment of the present invention below with reference to accompanying drawing.
As depicted in figs. 1 and 2, comprise according to the heater 100 for semiconductor equipment of the embodiment of the present invention: upper cover plate 10, lower cover 20, coupling assembling 30, heater strip 40 and back of the body blowing air inlet component 50.
Particularly, upper cover plate 10 can have for vent hole 11, back of the body blowing air inlet component 50 is by providing back of the body blowing to the upper surface of upper cover plate 10 for vent hole 11, with at upper cover plate 10 and be located at and produce mobile back of the body blowing between the pallet (not shown) above upper cover plate 10, with uniform heat, improve the heating effect to pallet.
As illustrated in fig. 1 and 2, in a preferred embodiment of the invention, on the upper surface of upper cover plate 10, be formed with air bleed slot 19, air bleed slot 19 is connected with supplying vent hole 11, air bleed slot 19 is along the radially extension of upper cover plate 10, and more preferably, air bleed slot 19 is multiple, multiple air bleed slots 19 are arranged along the circumferential interval of upper cover plate 10, thereby are further improved the uniformity to pallet heating.
Coupling assembling 30 is connected with the lower surface of lower cover 20, coupling assembling 30 is for by indoor at the vacuum reaction chamber of semiconductor equipment to upper cover plate 10 and lower cover 20 and coupling assembling 30 self poisonings, be the inlet side V shown in Fig. 1, wherein with inlet side mutually isolate for atmospheric side A.
Back of the body blowing air inlet component 50 is arranged on outside vacuum chamber, can pass successively coupling assembling 30 and lower cover 20, the upper end of back of the body blowing air inlet component 50 is connected hermetically with supplying vent hole 11, back of the body blowing is supplied to the upper surface of upper cover plate 10, between back of the body blowing air inlet component 50 and coupling assembling 30, be tightly connected.In other words, it is outdoor that back of the body blowing air inlet component 50 parts are positioned at vacuum reaction chamber, another part of back of the body blowing air inlet component 50 is once connected with supplying vent hole 11 with lower cover 20 and its upper end hermetically through coupling assembling 30, back of the body blowing is supplied to the upper surface of upper cover plate 10, between back of the body blowing air inlet component 50 and coupling assembling 30, be tightly connected, thereby avoid air to enter vacuum chamber.
According to the heater 100 for semiconductor equipment of the embodiment of the present invention, heater strip 4 is positioned at the cavity 60 being communicated with the vacuum chamber of semiconductor equipment, is arranged in thus vacuum environment, and heater strip 40 no longer carries out heat exchange with atmosphere, reduce thermal loss, improved the efficiency of heating surface.Meanwhile, due to upper cover plate 10, lower cover 20 and coupling assembling 30, to be all positioned at vacuum reaction chamber indoor, between cover plate 10 and lower cover 20, between lower cover 20 and coupling assembling 30, without the employing mode that is tightly connected, reduced manufacture difficulty and production cost.In addition, change heater strip 40 and be more prone to, for convenience detach and maintenance.
According to one embodiment of present invention, back of the body blowing air inlet component 50 welds with upper cover plate 10, and more specifically, weld with supplying vent hole 11 upper end of back of the body blowing air inlet component 50.Thus, processing is simple, and can ensure the air-tightness of the junction of carrying on the back blowing air inlet component 50 and upper cover plate 10.Upper cover plate 10, lower cover 20 and coupling assembling 30 can be made by stainless steel material.
As shown in Figure 1, in some embodiments of the invention, the upper surface of lower cover 20 is provided with groove 21, and upper cover plate 10 capping grooves 21 are to form cavity 60.The shape of groove 21 can be circular.For example, upper cover plate 10 can be circular, and circular groove 21 is concentric with upper cover plate 10.
Due to upper cover plate 10 and lower cover 20, to be all in vacuum reaction chamber indoor, therefore between upper cover plate 10 and lower cover 20 without being tightly connected, reduced manufacture difficulty and cost, for example upper cover plate 10 can be connected by bolt 70 with lower cover 20.Thus, can be so that installation and removal.
Alternatively, on upper cover plate 10, can be provided with pin-and-hole 101, lower cover 20 is provided with the lower pin-and-hole 201 corresponding with upper pin-and-hole 101, in upper pin-and-hole 101 and lower pin-and-hole 201, is provided with alignment pin 80.Thus, in the time of assembling upper cover plate 10 and lower cover 20, can conveniently upper cover plate 10 be positioned on lower cover 20, improve installation effectiveness.
As shown in figures 1 and 3, according to one embodiment of present invention, heater 100 also comprises temperature sensor 90, temperature sensor 90 can be located in cavity 60, for detection of the temperature of upper cover plate 10, it is outdoor that the electrical lead wire 91 of temperature sensor 90 extends vacuum reaction chamber through lower cover 20 and coupling assembling 30, and be tightly connected between the electrical lead wire 91 of temperature sensor 90 and coupling assembling 30, for example, weld hermetically.Thus, the electrical lead wire of temperature sensor 90 can be positioned to the indoor part of vacuum reaction chamber isolates airtightly with the part that is positioned at vacuum reaction chamber outside atmosphere side.
As shown in figures 1 and 3, according to one embodiment of present invention, coupling assembling 30 comprises joint sleeve 31 and flange 32.
Particularly, the upper end of joint sleeve 31 can be connected with the lower surface of lower cover 20.Flange 32 is connected with the lower end of joint sleeve 31, sealing between sealing and flange 32 and back of the body blowing air inlet component 50 between flange 32 and heater strip 40 and the electrical lead wire of temperature sensor 90.
Further, due to coupling assembling 30 and lower cover 20, to be all positioned at vacuum reaction chamber indoor, between joint sleeve 31 and lower cover 20 and between joint sleeve 31 and flange 32, can intermittently weld, and without carrying out seal welding, reduced manufacture difficulty and cost.
As shown in Figure 1, alternatively, lower cover 20 can have central through hole 29, central through hole 29 is suitable for carrying on the back the electrical lead wire 41 of blowing air inlet component 50, heater strip 40 and the electrical lead wire 91 of temperature sensor 90 passes, correspondingly, the 3rd fairlead 323 that flange 32 has the first fairlead 321 passing for back of the body blowing air inlet component 50, the second fairlead 322 passing for the electrical lead wire 41 of heater strip 40 and passes for the electrical lead wire 91 of temperature sensor 90.Thus, the conveniently setting to back of the body blowing air inlet component 50, heater strip 40 and temperature sensor 90.
As shown in Figure 3, temperature sensor 90 is preferably two, passes respectively from two electrical lead wires 91, and one of them can, for for subsequent use, after a temperature sensor 90 lost efficacy, can use another thermometric.
Describe according to the semiconductor equipment of the embodiment of the present invention below with reference to accompanying drawing.
Semiconductor equipment comprises the inlet side V in vacuum reaction chamber 200(Fig. 1 according to an embodiment of the invention) and heater.Described heater can be according to above-described embodiment describe at heater 100.
Particularly, heater 100 can be connected with vacuum reaction chamber 200, and the electrical lead wire of heater strip 40 and back of the body blowing air inlet component 50 extend in vacuum reaction chamber 200, and through hole 11 is communicated with the inside of cavity 60 and vacuum reaction chamber 200.
According to the semiconductor equipment of the embodiment of the present invention, the heater strip 4 of heater 100 is located in the cavity 60 that vacuum reaction chamber 200 is communicated with, thereby is arranged in vacuum environment, thus, heater strip 40 no longer carries out heat exchange with atmosphere, has reduced thermal loss, improves the efficiency of heating surface.Simultaneously, because upper cover plate 10, lower cover 20 and coupling assembling 30 are all positioned at vacuum reaction chamber 200, between cover plate 10 and lower cover 20, between lower cover 20 and coupling assembling 30, needn't adopt the connected mode of sealing (for example welding), reduced difficulty of processing and production cost.In addition, change heater strip 40 and be more prone to, for convenience detach and maintenance.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment within the scope of the invention in the situation that not departing from principle of the present invention and aim, amendment, replacement and modification.
Claims (14)
1. a heater for semiconductor equipment, is characterized in that, described heater comprises: upper cover plate, lower cover, coupling assembling, heater strip and back of the body blowing air inlet component, wherein:
Described upper cover plate has for vent hole;
Described coupling assembling is connected with the lower surface of described lower cover, and described coupling assembling is for being placed in self described upper cover plate and lower cover and described coupling assembling in the vacuum chamber of semiconductor equipment;
Described lower cover stacks and is connected with described upper cover plate, between the upper surface of described lower cover and the lower surface of described upper cover plate, limits cavity;
Described heater strip is located in cavity, and the electrical lead wire of described heater strip extends outside vacuum chamber through described lower cover and described coupling assembling, and seals between the electrical lead wire of described heater strip and described coupling assembling;
Described back of the body blowing air inlet component is arranged on outside vacuum chamber, described back of the body blowing air inlet component is through described coupling assembling and lower cover, the upper end of described back of the body blowing air inlet component is connected for vent hole hermetically with described, back of the body blowing is supplied to the upper surface of described upper cover plate, between described back of the body blowing air inlet component and described coupling assembling, be tightly connected.
2. the heater of semiconductor equipment according to claim 1, is characterized in that, described back of the body blowing air inlet component and the welding of described upper cover plate.
3. the heater of semiconductor equipment according to claim 1, is characterized in that, the upper surface of described lower cover is provided with groove, and groove is to form described cavity described in described upper cover plate capping.
4. the heater of semiconductor equipment according to claim 1, is characterized in that, described upper cover plate and described lower cover are bolted.
5. the heater of semiconductor equipment according to claim 1, is characterized in that, described upper cover plate is provided with pin-and-hole, and described lower cover is provided with the lower pin-and-hole corresponding with described upper pin-and-hole, in described upper pin-and-hole and described lower pin-and-hole, is provided with alignment pin.
6. the heater of semiconductor equipment according to claim 1, is characterized in that, described heater, also comprises:
Temperature sensor, described temperature sensor is located in described cavity, for detection of the temperature of described upper cover plate, the electrical lead wire of described temperature sensor extends outside vacuum chamber through described lower cover and described coupling assembling, and seal welding between the electrical lead wire of described temperature sensor and described coupling assembling.
7. the heater of semiconductor equipment according to claim 6, is characterized in that, described coupling assembling comprises:
Joint sleeve, the upper end of described joint sleeve is connected with the lower surface of described lower cover; With
Flange, described flange is connected with the lower end of described joint sleeve, between described flange and described heater strip and the electrical lead wire of described temperature sensor, between sealing and described flange and described back of the body blowing air inlet component, seals.
8. the heater of semiconductor equipment according to claim 6, is characterized in that, between described joint sleeve and described lower cover and between described joint sleeve and described flange, intermittently welds.
9. the heater of semiconductor equipment according to claim 6, it is characterized in that, described lower cover has central through hole, the 3rd fairlead that described flange has the first fairlead passing for described back of the body blowing air inlet component, the second fairlead passing for the electrical lead wire of described heater strip sensor and passes for the electrical lead wire of described temperature sensor.
10. the heater of semiconductor equipment according to claim 1, is characterized in that, described upper cover plate, lower cover and described coupling assembling are made by stainless steel material.
The heater of 11. semiconductor equipments according to claim 1, is characterized in that, is formed with the air bleed slot radially extending along described upper cover plate on the upper surface of described upper cover plate, and described air bleed slot is connected for vent hole with described.
The heater of 12. semiconductor equipments according to claim 11, is characterized in that, described air bleed slot is multiple, and described multiple air bleed slots are circumferentially spaced apart along described upper cover plate.
The heater of 13. semiconductor equipments according to claim 1, is characterized in that, described lower cover is provided with the through hole being communicated with described cavity, and described cavity is communicated with the vacuum chamber of described semiconductor equipment.
14. 1 kinds of semiconductor equipments, is characterized in that, comprising:
Vacuum reaction chamber; With
Heater, described heater is according to the heater of the semiconductor equipment described in any one in claim 1-13, described in wherein said heater, vacuum reaction chamber connects, the electrical lead wire of wherein said heater strip and described back of the body blowing air inlet component extend from described vacuum reaction chamber is indoor, and described through hole is communicated with the inside of described cavity and described vacuum reaction chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544030.XA CN103871928B (en) | 2012-12-14 | 2012-12-14 | Semiconductor device and heater thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544030.XA CN103871928B (en) | 2012-12-14 | 2012-12-14 | Semiconductor device and heater thereof |
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| Publication Number | Publication Date |
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| CN103871928A true CN103871928A (en) | 2014-06-18 |
| CN103871928B CN103871928B (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210544030.XA Active CN103871928B (en) | 2012-12-14 | 2012-12-14 | Semiconductor device and heater thereof |
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| CN (1) | CN103871928B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405787A (en) * | 2014-09-11 | 2016-03-16 | 沈阳芯源微电子设备有限公司 | Semiconductor hot plate structure capable of forming sealed chamber |
| CN105702610A (en) * | 2014-11-26 | 2016-06-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer carrying device |
| CN114318304A (en) * | 2021-12-27 | 2022-04-12 | 拓荆科技股份有限公司 | Heating plate structure |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030166305A1 (en) * | 2002-03-04 | 2003-09-04 | Tokyo Electron Limited | Substrate heating method, substrate heating system, and applying developing system |
| EP1359610A1 (en) * | 2000-12-28 | 2003-11-05 | Tokyo Electron Limited | Substrate heating device and method of purging the device |
| CN1924709A (en) * | 2005-08-31 | 2007-03-07 | 东京毅力科创株式会社 | Heating apparatus, and coating and developing apparatus |
| EP1845754A1 (en) * | 2006-04-13 | 2007-10-17 | Shin-Etsu Chemical Co., Ltd. | Heating element |
| CN101510512A (en) * | 2008-02-13 | 2009-08-19 | 佳能安内华工程股份有限公司 | Heating apparatus, heating method, and semiconductor device manufcaturing method |
| CN102077338A (en) * | 2008-06-24 | 2011-05-25 | 应用材料股份有限公司 | Pedestal heater for low temperature pecvd application |
| CN102685945A (en) * | 2011-03-17 | 2012-09-19 | 中国科学院微电子研究所 | Heater |
-
2012
- 2012-12-14 CN CN201210544030.XA patent/CN103871928B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1359610A1 (en) * | 2000-12-28 | 2003-11-05 | Tokyo Electron Limited | Substrate heating device and method of purging the device |
| US20030166305A1 (en) * | 2002-03-04 | 2003-09-04 | Tokyo Electron Limited | Substrate heating method, substrate heating system, and applying developing system |
| CN1924709A (en) * | 2005-08-31 | 2007-03-07 | 东京毅力科创株式会社 | Heating apparatus, and coating and developing apparatus |
| EP1845754A1 (en) * | 2006-04-13 | 2007-10-17 | Shin-Etsu Chemical Co., Ltd. | Heating element |
| CN101510512A (en) * | 2008-02-13 | 2009-08-19 | 佳能安内华工程股份有限公司 | Heating apparatus, heating method, and semiconductor device manufcaturing method |
| CN102077338A (en) * | 2008-06-24 | 2011-05-25 | 应用材料股份有限公司 | Pedestal heater for low temperature pecvd application |
| CN102685945A (en) * | 2011-03-17 | 2012-09-19 | 中国科学院微电子研究所 | Heater |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405787A (en) * | 2014-09-11 | 2016-03-16 | 沈阳芯源微电子设备有限公司 | Semiconductor hot plate structure capable of forming sealed chamber |
| CN105405787B (en) * | 2014-09-11 | 2018-02-06 | 沈阳芯源微电子设备有限公司 | A kind of semiconductor heat dish structure that can form airtight chamber |
| CN105702610A (en) * | 2014-11-26 | 2016-06-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer carrying device |
| CN105702610B (en) * | 2014-11-26 | 2019-01-18 | 北京北方华创微电子装备有限公司 | Chip bearing apparatus |
| CN114318304A (en) * | 2021-12-27 | 2022-04-12 | 拓荆科技股份有限公司 | Heating plate structure |
| CN114318304B (en) * | 2021-12-27 | 2023-11-24 | 拓荆科技股份有限公司 | Heating plate structure |
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| Publication number | Publication date |
|---|---|
| CN103871928B (en) | 2017-02-08 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |