CN103866355A - Cyanide-free silver-electroplating solution and electroplating method thereof - Google Patents
Cyanide-free silver-electroplating solution and electroplating method thereof Download PDFInfo
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- CN103866355A CN103866355A CN201410131938.7A CN201410131938A CN103866355A CN 103866355 A CN103866355 A CN 103866355A CN 201410131938 A CN201410131938 A CN 201410131938A CN 103866355 A CN103866355 A CN 103866355A
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Abstract
The invention discloses a cyanide-free silver-electroplating solution mainly prepared from silver nitrate, sodium thiosulfate, anhydrous sodium sulfite, ammonium acetate, potassium acetate, boric acid, nicotinic acid and deionized water. The electroplating solution disclosed by the invention contains no extremely toxic substances in components and is prepared according to a cyanide-free formula so as to reduce environment hazards. The electroplating solution contains the simply and easily obtained components so as to be relatively low in cost. The electroplating solution is relatively good in stability and free of phenomena such as sedimentation, discoloration and the like after being placed for a long term; in addition, the electroplating effect of the electroplating solution placed for a long term is same as that of a new prepared electroplating solution. The electroplating solution is also relatively good in dispersing power and throwing power, relatively wide in allowed current density range and capable of obtaining a silver electroplating layer with favorable performance within the allowed current density range. The obtained silver electroplating layer is consistent in smoothness, fine and dense in crystal, relatively strong in binding force with a matrix, smooth and bright in appearance, free of discoloration after being placed in the air for a long term, and excellent in discoloration resistance.
Description
Technical field
The present invention relates to electroplating chemical technical field, in particular to a kind of non-cyanide silver electroplating solution and electro-plating method thereof.
Background technology
Silvering has good electroconductibility, low contact potential and high reflectance, is therefore used widely in fields such as electrical equipment, electronics, communication equipment and instrument manufactures.Silver plating solution majority is taking prussiate system as main at present, and serious harm ecotope, is just progressively replaced by non-cyanide silver coating.Non-cyanide silver electroplating solution carries out complexing with the ion and the silver ions that do not contain cyanogen, is deposited and is obtained coating by electrochemical reaction.But the problems such as the poor stability of current used non-cyanide silver coating system ubiquity plating solution, the stress of silvered film current density range large, poor with the associativity of substrate, that allow is narrow, thereby non-cyanide silver coating is not widely used in electrosilvering industry.The cyanideless electro-plating liquid that the present invention adopts, can effectively address the above problem, and has good silver-plated effect, can be used as silver-jacketed wire and is applied on silicon cell.
Summary of the invention
The object of the invention is to overcome the above problem that prior art exists, a kind of non-cyanide silver electroplating solution and electro-plating method thereof are provided, solve the technical problem that existing non-cyanide silver electroplating system bath stability is poor, current density range is narrow.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
A kind of non-cyanide silver electroplating solution, mainly formulated by Silver Nitrate, Sulfothiorine, sodium sulphite anhydrous 99.3, ammonium acetate, Potassium ethanoate, boric acid, nicotinic acid and deionized water.
Preferably, described Silver Nitrate is 40-50 g/L, and Sulfothiorine is 200-260 g/L, sodium sulphite anhydrous 99.3 is 80-100 g/L, and ammonium acetate is 20-40 g/L, and Potassium ethanoate is 20-40 g/L, boric acid is 15-35 g/L, and nicotinic acid is 1-3 g/L, and all the other are deionized water.
Further, the pH value of described solution is between 5-6.
Preferably, the scope that cathode current density allows when described solution plating is 0.1-1.4A/dm
2.
An electro-plating method for non-cyanide silver electroplating solution, comprises the following steps:
The non-cyanide silver electroplating solution that step 1) is formulated as follows: Silver Nitrate, Sulfothiorine, sodium sulphite anhydrous 99.3, ammonium acetate, Potassium ethanoate, boric acid, nicotinic acid and deionized water;
Step 2) plating piece to be plated is dry after alkaline degreasing, pickling, washing successively;
The non-cyanide silver electroplating solution that step 3) configures described step 1 packs in plating tank, using silver plate as anode, the plating piece to be plated of processing using described step 2 is as negative electrode, between anode, negative electrode, apply galvanic current, at ambient temperature, plating solution adopts magnetic agitation, in the time that thickness of coating reaches requirement, then use washed with de-ionized water surface dry afterwards, complete plating.
Preferably, in the non-cyanide silver electroplating solution that step 1 is prepared, described Silver Nitrate is 40-50 g/L, Sulfothiorine is 200-260 g/L, and sodium sulphite anhydrous 99.3 is 80-100 g/L, and ammonium acetate is 20-40 g/L, Potassium ethanoate is 20-40 g/L, boric acid is 15-35 g/L, and nicotinic acid is 1-3 g/L, and all the other are deionized water.
The pH value of the non-cyanide silver electroplating solution that further, described step 1 is prepared is between 5-6.
Preferably, the scope that cathode current density allows when the plating of solution described in step 2 is 0.1-1.4A/dm
2.
The invention has the beneficial effects as follows:
In solution composition of the present invention, do not contain highly toxic substance, for without cyanogen formula, reduced the harm to environment.Solution composition is simple and easy to get, and cost is lower.Bath stability is better, does not occur the phenomenons such as precipitation, variable color after being long placed in; And the plating effect of the plating solution after being long placed in is identical with new preparation plating solution.The dispersive ability of plating solution and covering power are also better, and the current density range of permission is wider, and all can obtain well behaved silvering in allowed current density range.Institute's coating that obtains is smoothly consistent, and crystallization is fine and closely woven, has stronger bonding force with matrix; Deposit appearance smooth, be long placed in air in there is not variable color, anti-discoloration excellence.
Embodiment
Embodiment 1:
The formula of non-cyanide silver electroplating solution consists of: Silver Nitrate 40 g/L, Sulfothiorine 230 g/L, sodium sulphite anhydrous 99.3 80 g/L, ammonium acetate 30 g/L, Potassium ethanoate 30 g/L, boric acid 20 g/L, nicotinic acid 1 g/L.The pH value of plating solution is 5-6.
Using silver plate (purity is as 99.99%) as anode, taking plating piece to be plated as negative electrode, under room temperature condition, between anode, negative electrode, apply galvanic current, control cathode current density is 0.1-1.4A/dm
2.Plating solution adopts magnetic agitation, and then plating 5-30min uses washed with de-ionized water surface dry afterwards, completes plating.
Embodiment 2:
The formula of non-cyanide silver electroplating solution consists of: Silver Nitrate 50 g/L, Sulfothiorine 260 g/L, sodium sulphite anhydrous 99.3 90 g/L, ammonium acetate 40 g/L, Potassium ethanoate 40 g/L, boric acid 30 g/L, nicotinic acid 2 g/L.The pH value of plating solution is 5-6.
Using silver plate (purity is as 99.99%) as anode, taking plating piece to be plated as negative electrode, under room temperature condition, between anode, negative electrode, apply galvanic current, control cathode current density is 0.1-1.4A/dm
2.Plating solution adopts magnetic agitation, and then plating 5-30min uses washed with de-ionized water surface dry afterwards, completes plating.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a non-cyanide silver electroplating solution, is characterized in that: mainly formulated by Silver Nitrate, Sulfothiorine, sodium sulphite anhydrous 99.3, ammonium acetate, Potassium ethanoate, boric acid, nicotinic acid and deionized water.
2. non-cyanide silver electroplating solution according to claim 1, is characterized in that:
Described Silver Nitrate is 40-50 g/L, and Sulfothiorine is 200-260 g/L, and sodium sulphite anhydrous 99.3 is 80-100 g/L, and ammonium acetate is 20-40 g/L, and Potassium ethanoate is 20-40 g/L, and boric acid is 15-35 g/L, and nicotinic acid is 1-3 g/L, and all the other are deionized water.
3. non-cyanide silver electroplating solution according to claim 1, is characterized in that: the pH value of described solution is between 5-6.
4. non-cyanide silver electroplating solution according to claim 1, is characterized in that: the scope that when described solution plating, cathode current density allows is 0.1-1.4A/dm
2.
5. an electro-plating method for non-cyanide silver electroplating solution, is characterized in that, comprises the following steps:
The non-cyanide silver electroplating solution that step 1) is formulated as follows: Silver Nitrate, Sulfothiorine, sodium sulphite anhydrous 99.3, ammonium acetate, Potassium ethanoate, boric acid, nicotinic acid and deionized water;
Step 2) plating piece to be plated is dry after alkaline degreasing, pickling, washing successively;
The non-cyanide silver electroplating solution that step 3) configures described step 1 packs in plating tank, using silver plate as anode, the plating piece to be plated of processing using described step 2 is as negative electrode, between anode, negative electrode, apply galvanic current, at ambient temperature, plating solution adopts magnetic agitation, in the time that thickness of coating reaches requirement, then use washed with de-ionized water surface dry afterwards, complete plating.
6. the electro-plating method of non-cyanide silver electroplating solution according to claim 5, is characterized in that:
In the non-cyanide silver electroplating solution that step 1 is prepared, described Silver Nitrate is 40-50 g/L, Sulfothiorine is 200-260 g/L, sodium sulphite anhydrous 99.3 is 80-100 g/L, ammonium acetate is 20-40 g/L, and Potassium ethanoate is 20-40 g/L, and boric acid is 15-35 g/L, nicotinic acid is 1-3 g/L, and all the other are deionized water.
7. non-cyanide silver electroplating solution according to claim 5, is characterized in that: the pH value of the non-cyanide silver electroplating solution that described step 1 is prepared is between 5-6.
8. non-cyanide silver electroplating solution according to claim 5, is characterized in that: the scope that when plating of solution described in step 2, cathode current density allows is 0.1-1.4A/dm
2.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410131938.7A CN103866355A (en) | 2014-04-03 | 2014-04-03 | Cyanide-free silver-electroplating solution and electroplating method thereof |
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| CN201410131938.7A CN103866355A (en) | 2014-04-03 | 2014-04-03 | Cyanide-free silver-electroplating solution and electroplating method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111763967A (en) * | 2020-05-18 | 2020-10-13 | 中北大学 | Preparation method of copper-silver composite bonding wire |
| CN114752973A (en) * | 2022-05-13 | 2022-07-15 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
| US3984292A (en) * | 1974-03-01 | 1976-10-05 | Schering Aktiengesellschaft | Cyanide free bath for electrodeposition of silver |
| JPS527335A (en) * | 1975-07-09 | 1977-01-20 | Hitachi Ltd | Silverrelectroplating method |
| CN101760768A (en) * | 2010-01-20 | 2010-06-30 | 河南科技大学 | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method |
| CN103046091A (en) * | 2013-01-09 | 2013-04-17 | 西安交通大学 | Plating solution and plating method of cyanide-free plating silver |
| CN103173815A (en) * | 2011-12-23 | 2013-06-26 | 李振萍 | Non-cyanide electrosilvering process |
-
2014
- 2014-04-03 CN CN201410131938.7A patent/CN103866355A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
| US3984292A (en) * | 1974-03-01 | 1976-10-05 | Schering Aktiengesellschaft | Cyanide free bath for electrodeposition of silver |
| JPS527335A (en) * | 1975-07-09 | 1977-01-20 | Hitachi Ltd | Silverrelectroplating method |
| CN101760768A (en) * | 2010-01-20 | 2010-06-30 | 河南科技大学 | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method |
| CN103173815A (en) * | 2011-12-23 | 2013-06-26 | 李振萍 | Non-cyanide electrosilvering process |
| CN103046091A (en) * | 2013-01-09 | 2013-04-17 | 西安交通大学 | Plating solution and plating method of cyanide-free plating silver |
Non-Patent Citations (1)
| Title |
|---|
| 张庆等: "无氰镀银技术发展及研究现状", 《电镀与精饰》, vol. 29, no. 5, 30 September 2007 (2007-09-30), pages 12 - 16 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111763967A (en) * | 2020-05-18 | 2020-10-13 | 中北大学 | Preparation method of copper-silver composite bonding wire |
| CN114752973A (en) * | 2022-05-13 | 2022-07-15 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
| CN114752973B (en) * | 2022-05-13 | 2023-12-22 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
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