CN103858526A - Circuit board and method for forming a circuit on a PCB - Google Patents
Circuit board and method for forming a circuit on a PCB Download PDFInfo
- Publication number
- CN103858526A CN103858526A CN201380003210.XA CN201380003210A CN103858526A CN 103858526 A CN103858526 A CN 103858526A CN 201380003210 A CN201380003210 A CN 201380003210A CN 103858526 A CN103858526 A CN 103858526A
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- differential lines
- line
- shielding conductor
- shielding
- symmetry
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims description 108
- 239000000758 substrate Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit board and a circuit design method are provided. A first shielded line is disposed between two parallel differential lines. The first shielded is an electric line in parallel with the differential lines and disposed on the symmetrical line of the two differential lines. Also a second shielded line and a third shielded line which are parallel each other are added. The second shielded line is symmetrical with the third shielded line relatively to the symmetric axis of the differential lines. A fourth shielded line is added, which is in vertical connection with the first shielded line, the second shielded line and the third shielded line. The fourth shielded line is symmetrical with the symmetric line of the two differential lines. External radiation of the differential lines is reduced through the shielded line structure.
Description
Technical field
The present invention relates to circuit field, be particularly to a kind of line electricity magnetic disturbance technology that reduces.
Background technology
Along with the development of the communication technology, the operating rate of chip increases sharply, and the electromagnetic radiation meeting therefore producing causes electromagnetic interference to other electronic equipments.The high frequency that for example a lot of electronic products can be all 6GHz, 10.3125GHz in speed produces obvious electromagnetic radiation.The reason that produces these electromagnetic interference is: propagate by PCB cabling from chip conducted noise out, then propagate into all kinds of high speed connectors (such as back panel connector, hard disk connector), these connectors are all the antenna that radianting capacity is stronger conventionally, they can radiate conducted noise, and other devices or equipment are caused to electromagnetic interference.
In order to meet the requirement of Electro Magnetic Compatibility (Electro Magnetic Compatibility, EMC) certification, in prior art, adopt the mode of complete machine shielding.Complete machine shielding refers at equipment outer wrapping metal shell, the electrostatic screening effect that relies on physical structure to form come shielding high-speed connector to external radiation.But under high frequency situations, even if also having obvious electromagnetic interference, very little hole seam leaks out.And equipment cannot be ensured hermetic, for example, in order to meet heat radiation requirement, can on cabinet, hold ventilation hole, therefore the way effect of complete machine shielding is limited.
How a kind of new departure that reduces differential lines electromagnetic interference is provided, and is urgent problem.
Summary of the invention
The embodiment of the present invention provides a kind of a kind of method that forms circuit on wiring board and PCB substrate, can shield the radiation of differential line.
First aspect, the embodiment of the present invention provides a kind of wiring board, is laid with two parallel differential lines, has the first shielding conductor between differential lines, and described the first shielding conductor is the conductor wire parallel with differential lines, and is positioned on the line of symmetry of two differential lines.
In the possible implementation of the first of first aspect, between two differential lines, also comprise: secondary shielding line, parallel with described the first shielding conductor; The 3rd shielding conductor, with the line of symmetry symmetry of described secondary shielding line with respect to two differential lines; And the 4th shielding conductor, with described the first shielding conductor, described secondary shielding line and the described the 3rd shielding conductor is vertical is connected, and described the 4th shielding conductor is with respect to the line of symmetry symmetry of two articles of differential lines.
In the possible implementation of the second of first aspect, between two differential lines, also comprise: additional structure, described additional structure is connected with at least one shielding conductor in described wiring board, and with respect to the line of symmetry symmetry of two differential lines.
In the third possible implementation of first aspect, the length of the first shielding conductor is differential lines noise signal wavelength described in 1/4th.
Second aspect, the embodiment of the present invention provides a kind of method that forms circuit on PCB substrate, and described substrate comprises dielectric layer and conductive layer, comprises step: on conductive layer, form photosensitive material; Photosensitive material is carried out to part exposure, unexposed part forms line pattern, described line pattern comprises the first shielding conductor figure and two differential lines figures, article two, differential lines figure is parallel to each other, the first shielding conductor figure is between two described differential lines figures, described the first shielding conductor figure is parallel with described differential lines figure, and described first shields and be positioned on the line of symmetry of two differential lines figures; On line pattern, forming cannot etched protective layer; Etch away logicalnot circuit visuals and form circuit, have two parallel differential lines on described circuit, have the first shielding conductor between differential lines, described the first shielding conductor is the wire parallel with described differential lines, and is positioned on the line of symmetry of two differential lines.
In the possible implementation of the first of second aspect, between two described differential lines figures, also comprise: secondary shielding line graph, with described secondary shielding line parallel; The 3rd shielding conductor figure, with described secondary shielding line parallel, described secondary shielding line graph and described the 3rd shielding conductor figure are with respect to the line of symmetry symmetry of two articles of described differential lines; The 4th shielding conductor figure, with described the first shielding conductor figure, described secondary shielding line graph and the described the 3rd shielding conductor figure is vertical is connected, and described the 4th shielding conductor graph line is with respect to the line of symmetry symmetry of two articles of described differential lines figures; Accordingly, described circuit comprises secondary shielding line, the 3rd shielding conductor and the 3rd shielding conductor.
In the possible implementation of the second of second aspect, also comprise additional structure figure, additional structure figure is connected with at least one shielding conductor figure in described line pattern, and with respect to the line of symmetry symmetry of two described differential lines figures; Accordingly, in described circuit, also comprise additional structure.
In the third possible implementation of second aspect, described the first shielding conductor is the integral multiple of differential lines noise signal wavelength described in 1/4th.
Apply implementation method of the present invention, can reduce the external electromagnetic interference of differential lines.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Figure 1A is circuit embodiment schematic diagram of the present invention;
Figure 1B is circuit embodiment schematic diagram of the present invention;
Fig. 2 is circuit embodiment schematic diagram of the present invention;
Fig. 3 A is circuit embodiment schematic diagram of the present invention;
Fig. 3 B is circuit embodiment schematic diagram of the present invention;
Fig. 4 is the embodiment of the method flow chart that the present invention forms circuit on PCB substrate.
Embodiment
For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, the every other embodiment obtaining, belongs to the scope of protection of the invention.
Differential signal, some also claims differential wave, with two just the same, opposite polarity holding wire transmission of one line data, rely on two signal line level differences carry out the judgement of signal.Keep the parallel of two differential lines in when wiring, guarantee two signal line that can be larger consistent.Certainly, in practical engineering application, absolute parallel cannot accomplishing, distance between centers of tracks substantially remains unchanged and also meets the requirement of the embodiment of the present invention, for example between two differential lines or the angle of a certain section of two differential lines be no more than 5 °.Two differential lines of same group, one can be called P line, and other one can be called N line, axial symmetry between differential lines, the line of symmetry of differential lines is also referred to as axis.Differential lines is also referred to as differential signal line.
Owing to thering is coupling between two differential lines of same group, in the time that the external world exists noise jamming, be to be almost coupled on two lines, and the recipient of signal is only concerned about the difference of two signals, so extraneous common-mode noise can be cancelled simultaneously.
Differential lines can be to a certain degree inhibition EMI because the polarity of two signal line is contrary, they can cancel out each other to extraradial electromagnetic field.But under actual conditions, still there is a small amount of radiation product, especially, in the time that signal frequency is higher, externally have obvious radiation.In the embodiment of the present invention, shielding construction can be a shielding conductor, or the combination of many shielding conductors, or the combination of shielding conductor and additional structure, shields the noise of differential signal by shielding construction, suppresses EMI, reduces extraradial generation.The material of the shielding conductor mentioned in the embodiment of the present invention, shielding construction, additional structure is all the material of conduction, for example, use copper as material.
Complete machine shield technology of the prior art has shortcomings, can affect shield effectiveness on the one hand because of inevasible gap, through hole; On the other hand, metal shell has increased the volume and weight of equipment; Moreover, expend more metal material, also cause the raising of cost, and be unfavorable for environmental protection.
Figure 1A is an embodiment of a kind of circuit of the present invention.As shown in Figure 1, wire 11a and wire 11b form one group of differential lines, are provided with the first shielding conductor 21 between differential lines.In the embodiment of the present invention, shielding conductor does not comprise the situation that shielding conductor is connected with differential lines between differential lines.
On the first shielding conductor 21, can there is the via hole 22 of ground connection.
Figure 1B is another one embodiment of the present invention, a certain section of an a pair of differential lines part in other words, can expand the distance between differential lines.Can lay more easily so the various shielding conductors including the first shielding conductor.This way is applicable equally to other embodiment.Increase mode for example, the differential lines of of can stretching, also can two all stretches, and the mode of Figure 1B is that two differential lines all stretch.
Referring to Fig. 2, be another embodiment of the present invention, the present embodiment, on the basis of the first shielding conductor 21, has increased secondary shielding line 31, the 3rd shielding conductor 32 and the 3rd shielding conductor 33.Wherein secondary shielding line 31 is parallel with the first shielding conductor 21, and the 3rd shielding conductor 32 is parallel with the first shielding conductor 21.The 3rd shielding conductor is vertically connected with the first shielding conductor 21, secondary shielding line 31 and the 3rd shielding conductor 32.Also the line of symmetry symmetry with respect to differential lines between secondary shielding line 31 and the 3rd shielding conductor 32.
In this embodiment, the size of each shielding conductor can be shorter than the first two embodiment, and for example the length of each shielding conductor can be than the little order of magnitude of 1/4 λ.Between the first shielding conductor 31 and differential lines 11a and between secondary shielding line 32 and differential lines 11b, be equivalent to form electric capacity.And the first shielding conductor 21 and the 4th shielding conductor 33 are equivalent to inductance.In these four shielding conductors, the length of every shielding conductor, different and different according to noise frequency, its concrete numerical value can obtain according to emulation, in the time that the resonance frequency of shielding conductor is identical or close with the frequency of differential lines noise, can suppress noise.Same, on the first shielding conductor 21, can there is no ground connection via hole, also can there is the via hole 22 of one or more ground connection.
In embodiments of the present invention, can on the basis of above-described embodiment, increase one or more additional structure structure, newly-increased additional structure is with respect to the line of symmetry symmetry of differential lines, and is connected with original shielding conductor structure.Additional structure can have via hole also can there is no via hole, and via hole is with respect to the line of symmetry symmetry of differential lines.For example Fig. 3 A is another embodiment of the present invention, and this embodiment is to have increased shielding conductor 34 with respect to the difference of a upper embodiment.Fig. 3 B compares with Fig. 3 A, and distinctive points is that shielding conductor 34 has become shielding conductor 35.Shielding conductor 34 and shielding conductor 35 all belong to additional structure, and its common ground is the line of symmetry symmetry with respect to differential lines.If keep former shielding conductor constant, increased additional structure after resonance frequency change, need again emulation determine new resonance frequency.
The embodiment of the present invention also provides a kind of method that forms circuit, can on PCB substrate, form the above-mentioned circuit that comprises shielding construction, and substrate comprises dielectric layer and conductive layer.The concrete structure of shielding conductor is referring to previous embodiment.Referring to Fig. 5.
The method that the present embodiment forms circuit comprises the following steps: S1. forms photosensitive material on conductive layer; S2. photosensitive material is carried out to part exposure, unexposed part forms line pattern, the shape of line pattern is identical with the circuit that hope is made, line pattern comprises shielding conductor figure and one group of differential lines figure, article two, differential lines figure is parallel to each other, between differential lines figure, include shielding conductor figure, described shielding conductor figure is the line segment parallel with differential lines figure, and is positioned on the line of symmetry of two differential lines figures; S3. on line pattern, forming cannot etched protective layer; S4. etch away logicalnot circuit visuals and form circuit, have two parallel differential lines on described circuit, have the first shielding conductor between differential lines, described the first shielding conductor is the line segment parallel with differential lines, and is positioned on the line of symmetry of two differential lines.The length of the first shielding conductor can be 1/4 noise wavelength.
Embodiment at circuit is known, except the first shielding conductor, shielding construction between differential lines can be also the combination of many shielding conductors, the for example combination of the first shielding conductor, secondary shielding line, the 3rd shielding conductor and the 4th shielding conductor, the resonance frequency of the shielding construction being combined to form of many shielding conductors is identical with differential signal noise frequency.Outside shielding construction, can also comprise additional structure.
The method of above-mentioned formation circuit can be completed by a kind of device, and this device comprises CPU and computer-readable medium, and CPU can carry out the program in internal memory, thereby completes the step of the method that forms circuit.
The all or part of step that realizes the embodiment of the method for above-mentioned formation circuit can complete by the relevant hardware of program command, aforesaid program can be stored in a computer read/write memory medium, this program, in the time carrying out, is carried out the step that comprises said method embodiment; And aforesaid storage medium comprises: various media that can be program code stored such as ROM, RAM, magnetic disc or CDs.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit.With reference to previous embodiment, the present invention is had been described in detail, the technical scheme that can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a wiring board, is laid with two parallel differential lines, it is characterized in that:
Between differential lines, have the first shielding conductor, described the first shielding conductor is the conductor wire parallel with differential lines, and is positioned on the line of symmetry of two differential lines.
2. wiring board as claimed in claim 1, is characterized in that, between described two differential lines, also comprises:
Secondary shielding line, parallel with described the first shielding conductor;
The 3rd shielding conductor, with the line of symmetry symmetry of described secondary shielding line with respect to two differential lines;
The 4th shielding conductor, with described the first shielding conductor, described secondary shielding line and the described the 3rd shielding conductor is vertical is connected, and described the 4th shielding conductor is with respect to the line of symmetry symmetry of two articles of differential lines.
3. wiring board as claimed in claim 1 or 2, is characterized in that, between described two differential lines, also comprises:
At least one via hole, described via hole is positioned on described the first shielding conductor.
4. the wiring board as described in claim 1,2 or 3, is characterized in that, between described two differential lines, also comprises:
Additional structure, described additional structure is connected with at least one shielding conductor in described wiring board, and with respect to the line of symmetry symmetry of two differential lines.
5. wiring board as claimed in claim 1, its feature exists:
The length of described the first shielding conductor is differential lines noise signal wavelength described in 1/4th.
6. wiring board as claimed in claim 1, its feature exists:
The length of described the first shielding conductor is the integral multiple of differential lines noise signal wavelength described in 1/4th.
7. a method that forms circuit on PCB substrate, described substrate comprises dielectric layer and conductive layer, it is characterized in that:
On conductive layer, form photosensitive material;
Photosensitive material is carried out to part exposure, unexposed part forms line pattern, described line pattern comprises the first shielding conductor figure and two differential lines figures, article two, differential lines figure is parallel to each other, the first shielding conductor figure is between two described differential lines figures, described the first shielding conductor figure is parallel with described differential lines figure, and described first shields and be positioned on the line of symmetry of two differential lines figures;
On line pattern, forming cannot etched protective layer;
Etch away logicalnot circuit visuals and form circuit, have two parallel differential lines on described circuit, have the first shielding conductor between differential lines, described the first shielding conductor is the wire parallel with described differential lines, and is positioned on the line of symmetry of two differential lines.
8. the method that forms circuit on PCB substrate as claimed in claim 7, is characterized in that, between two described differential lines figures, also comprises:
Secondary shielding line graph, with described secondary shielding line parallel;
The 3rd shielding conductor figure, with described secondary shielding line parallel, described secondary shielding line graph and described the 3rd shielding conductor figure are with respect to the line of symmetry symmetry of two articles of described differential lines;
The 4th shielding conductor figure, with described the first shielding conductor figure, described secondary shielding line graph and the described the 3rd shielding conductor figure is vertical is connected, and described the 4th shielding conductor graph line is with respect to the line of symmetry symmetry of two articles of described differential lines figures;
Accordingly, described circuit comprises secondary shielding line, the 3rd shielding conductor and the 3rd shielding conductor.
9. the method that forms as claimed in claim 7 or 8 circuit on PCB substrate, is characterized in that, between two described differential lines figures, also comprises:
Additional structure figure, is connected with at least one shielding conductor figure in described line pattern, and with respect to the line of symmetry symmetry of two described differential lines figures;
Accordingly, in described circuit, also comprise additional structure.
10. the method that forms circuit on PCB substrate as claimed in claim 7, its feature exists:
Described the first shielding conductor is the integral multiple of differential lines noise signal wavelength described in 1/4th.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2013/076158 WO2014186966A1 (en) | 2013-05-23 | 2013-05-23 | Circuit board and method for forming circuit on pcb |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103858526A true CN103858526A (en) | 2014-06-11 |
| CN103858526B CN103858526B (en) | 2017-02-08 |
Family
ID=50864364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380003210.XA Active CN103858526B (en) | 2013-05-23 | 2013-05-23 | Circuit board and method for forming a circuit on a PCB |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103858526B (en) |
| WO (1) | WO2014186966A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995776A (en) * | 2017-12-14 | 2018-05-04 | 武汉电信器件有限公司 | A kind of circuit board and crosstalk eliminating method for being used to shield crosstalk |
| CN108076580A (en) * | 2016-11-15 | 2018-05-25 | 中兴通讯股份有限公司 | The method and device of crosstalk between a kind of isolation signals via |
| CN113727513A (en) * | 2021-07-27 | 2021-11-30 | 平头哥(上海)半导体技术有限公司 | Package substrate, printed circuit board, package device, and electronic apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7084245B2 (en) * | 2018-08-02 | 2022-06-14 | 日本ルメンタム株式会社 | Printed circuit boards, optical modules, and optical transmission equipment |
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| CN101472385A (en) * | 2007-12-26 | 2009-07-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| EP2268110A1 (en) * | 2009-06-10 | 2010-12-29 | HTC Corporation | Flexible printed circuit and fabrication method thereof |
| CN102369581A (en) * | 2009-03-30 | 2012-03-07 | 松下电器产业株式会社 | Flexible cable and transmission system |
| CN102711362A (en) * | 2011-03-28 | 2012-10-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| US20130049878A1 (en) * | 2011-08-31 | 2013-02-28 | Chung Yuan Christian University | Differential mode transmission lines with weak coupling structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4835188B2 (en) * | 2006-02-16 | 2011-12-14 | 日本電気株式会社 | Multilayer printed circuit board |
| CN101932188B (en) * | 2009-06-18 | 2013-05-08 | 宏达国际电子股份有限公司 | Flexible printed circuit board and composition method thereof |
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2013
- 2013-05-23 WO PCT/CN2013/076158 patent/WO2014186966A1/en active Application Filing
- 2013-05-23 CN CN201380003210.XA patent/CN103858526B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472385A (en) * | 2007-12-26 | 2009-07-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102369581A (en) * | 2009-03-30 | 2012-03-07 | 松下电器产业株式会社 | Flexible cable and transmission system |
| EP2268110A1 (en) * | 2009-06-10 | 2010-12-29 | HTC Corporation | Flexible printed circuit and fabrication method thereof |
| CN102711362A (en) * | 2011-03-28 | 2012-10-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| US20130049878A1 (en) * | 2011-08-31 | 2013-02-28 | Chung Yuan Christian University | Differential mode transmission lines with weak coupling structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108076580A (en) * | 2016-11-15 | 2018-05-25 | 中兴通讯股份有限公司 | The method and device of crosstalk between a kind of isolation signals via |
| CN108076580B (en) * | 2016-11-15 | 2021-01-22 | 中兴通讯股份有限公司 | Method and device for isolating crosstalk between signal via holes |
| CN107995776A (en) * | 2017-12-14 | 2018-05-04 | 武汉电信器件有限公司 | A kind of circuit board and crosstalk eliminating method for being used to shield crosstalk |
| CN113727513A (en) * | 2021-07-27 | 2021-11-30 | 平头哥(上海)半导体技术有限公司 | Package substrate, printed circuit board, package device, and electronic apparatus |
| CN113727513B (en) * | 2021-07-27 | 2024-01-09 | 平头哥(上海)半导体技术有限公司 | Package substrate, printed circuit board, package device, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014186966A1 (en) | 2014-11-27 |
| CN103858526B (en) | 2017-02-08 |
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Effective date of registration: 20211223 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: xFusion Digital Technologies Co., Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |