CN103856857A - Electronic device - Google Patents
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- CN103856857A CN103856857A CN201310524575.9A CN201310524575A CN103856857A CN 103856857 A CN103856857 A CN 103856857A CN 201310524575 A CN201310524575 A CN 201310524575A CN 103856857 A CN103856857 A CN 103856857A
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- Prior art keywords
- conduit
- microphone
- sound
- cavity
- sound hole
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Abstract
An electronic device is provided. The electronic device includes a case, a sound insulation structure, a first microphone and a second microphone. The case includes a first acoustic opening and a second acoustic opening. The sound insulation structure comprises a first duct and a second duct, the first duct is connected to the first acoustic opening, and the second duct is connected to the second acoustic opening. The first microphone is connected to the first duct. The second microphone is connected to the second duct. The effective distances of the multiple microphones can be increased via ducts in different directions.
Description
Technical field
The present invention relates to a sound-insulating structure, as conduit, be inserted in an electronic installation and there are multiple sound holes in its housing and be located between the microphone array of this case of electronic device inside; The shell design that simultaneously also relates to a kind of microphone array coordinates this sound-insulating structure to think that this electronic installation provides best airtight and phase matched.
Background technology
Use on the market the microphone array of two or more microphones general gradually.Owing to receiving more sound information, it needs to provide more microphone to separate effect.CMOS-MEMS (CMOS (Complementary Metal Oxide Semiconductor)-micro electronmechanical) technology can be implemented in microphone array one one chip and single encapsulation and be integrated into size and pin in single MEMS (micro electronmechanical) microphone.In this situation, the distance at two microphone element centers can be less than 2 millimeters in this shell.But for small array microphone (SAM) acoustic processing application, the sound hole spacing of apparatus surface is greater than 5 millimeters.The present invention is in order to extend the distance between two voice entries of two microphone cases, to the larger distance between two sound holes of device case, by being inserted in sound-insulating structure therebetween.
Summary of the invention
The electronic installation that the present invention provides for wish solves the problem of known technology, has two sound holes on its housing.
One sound-insulating structure, has the conduit of two extensions.
Each conduit has two sound ports.The first sound port of the first conduit connects this first sound hole, and its second sound port connects the first voice entry to the microphone diaphragm in shell.
The first sound port of the second conduit connects this second sound hole, and its second sound port connects the second voice entry to the microphone diaphragm in shell.
Application embodiments of the invention, the coverage of this microphone can increase by the conduit of different directions.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the stereogram that shows the electronic installation of the embodiment of the present invention;
Fig. 2 is the cutaway view that shows the electronic installation of the embodiment of the present invention;
Fig. 3 is the electronic installation that shows another embodiment of the present invention;
Fig. 4 is the electronic installation that shows another embodiment of the present invention, and wherein, surface-mounted integrated circuit is located among housing;
Fig. 5 is the electronic installation that shows another embodiment of the present invention, and wherein, the first conduit and second conduit of sound-insulating structure extend parallel to each other;
Fig. 6 is a modified example of another enforcement of the present invention;
Fig. 7 A, 7B are the electronic installations that shows another embodiment of the present invention, wherein, extend conduit and are inserted in removably among the perforation of housing;
Fig. 8 is a variation that shows Fig. 6.
Main element symbol description:
10,10 '～case of electronic device
11～the first sound holes
12～the second sound holes
13～fitting portion
14～perforation
16～upper surface
17～side surface
20,20 ', 20 ' '～sound-insulating structure
21,21 ', 21 ' '～first conduit
211,212～sound port
216,217～convex hole
22,22 ', 22 ' '～second conduit
221,222～sound port
226,227～convex hole
30～microphone case
31～the first cavitys
32～the second cavitys
33～recess
41～the first thin grams of wind vibrating diaphragms
42～the second thin grams of wind vibrating diaphragms
50～printed circuit board (PCB)
51 ,～the first sound hole
52～the second sound holes
60～surface-mounted integrated circuit
61～separation structure
Embodiment
Fig. 1, Fig. 2 are the electronic installations 1 that shows one embodiment of the invention, comprise a case of electronic device 10, a sound-insulating structure 20, a microphone case 30, one first microphone diaphragm 41, a second microphone vibrating diaphragm 42 and a printed circuit board (PCB) 50.This first microphone diaphragm 41 and this second microphone vibrating diaphragm 42 are located among this shell 30, and are electrically connected printed circuit board (PCB) 50.Case of electronic device 10 comprises one first sound hole 11, one second sound hole 12 and a fitting portion 13.This sound-insulating structure 20 is embedded in this fitting portion 13, this sound-insulating structure 20 comprises one first conduit 21 and one second conduit 22, this first conduit 21 connects this first sound hole 11 and one first microphone voice entrance, and this second conduit 22 connects this second sound hole 12 and a second microphone voice entry.With reference to Fig. 2, this first microphone diaphragm 41 and this second microphone vibrating diaphragm 42 are located among this housing 30, and wherein this first voice entry connects this first conduit 21, and this second voice entry connects this second conduit 22.
In an embodiment of the present invention, this first and second microphone can see through MEMS technology be integrated in a small array microphone (SAM).
This sound-insulating structure 20 is embedded in this fitting portion 13 (Fig. 1) removably, or is inserted in a perforation 14 (Fig. 7 A, Fig. 7 B) of housing 10 ', by rubber or plastic cement sound-insulating structure, to be connected with housing 10 closely.Therefore, the air-tightness of sound channel can be raised.Shell 30 can be metal, plastic material or CMOS-MESM encapsulation, and this housing 10 can be plastic cement or metal material.
With reference to Fig. 1, this first conduit 21 has a sound port 211 and a sound port 212, and this second conduit 22 has a sound port 221 and a sound port 222.One convex hole 216 is around this sound port 211.One convex hole 226 is around this sound port 221.One convex hole 217 is around this sound port 212.One convex hole 227 is around this sound port 222.The convex hole that is surrounded on sound port can more improve the airtight effect of sound passage.
In this embodiment, this housing 10 has a upper surface 16, and this first sound hole 11 and this second sound hole 12 are formed at this upper surface 16.
With reference to Fig. 3, among a variation, this housing 10 comprises a upper surface 16 and a side surface 17, and this upper surface 16 is perpendicular to this side surface 17, and this first sound hole 11 is formed at this upper surface 16, and this second sound hole 12 is formed at this side surface 17.
With reference to Fig. 1, Fig. 2, this microphone case 30 comprises one first cavity 31, one second cavity 32 and a recess 33, this first cavity 31 and this second cavity 32 in this microphone case 30 are separated by this recess 33, within this first microphone 41 is located at this first cavity 31, within this second microphone 42 is located at this second cavity 32.
With reference to Fig. 4, it is to show a variation of the present invention, wherein, one surface-mounted integrated circuit 60 is located among this shell 30, wherein, this surface-mounted integrated circuit 60 comprises that a separation structure 61 protrudes thereon, and this this recess 33 of separation structure 61 butts is to separate (sound insulation) this first cavity 31 and this second cavity 32.Within one printed circuit board (PCB) 50 is located at this shell 30, wherein, this surface-mounted integrated circuit 60 is located on this printed circuit board (PCB) 50.
According to one embodiment of the invention, the sound port of the plurality of conduit, compared to the sound hole of housing, can have larger or equal size, has thought and has obtained sufficient acoustic energy.With reference to Fig. 2, Fig. 3, application embodiments of the invention, microphone coverage d can pass through conduit and this housing of different directions, and increases to D.For example, in one embodiment, the length of shell channel can be 4 millimeters, and the height of this sound-insulating structure can be 1～2 millimeter, and the thickness of this shell can be 0.2 millimeter.
This electronic installation can be proficiency machine, flat board or other portable electronic devices.This electronic installation can be also TV, computer or other electronic installations.
Fig. 5 shows a variation of the present invention, and wherein, this of this sound-insulating structure 20 ' the first conduit 21 ' and this second conduit 22 ' can have a square-section.In one embodiment, a noise insulation block can be located between this first conduit 21 ' and this second conduit 22 ', to improve soundproof effect.
Fig. 6 shows a variation of the present invention, wherein, this sound-insulating structure 20 ' ' this first conduit 21 ' ' and this second conduit 22 ' ' extend with parallel mode each other.
Fig. 8 is the another variation of Fig. 6 embodiment, and wherein, this printed circuit board (PCB) 50 comprises one first sound hole 51 and one second sound hole 52, this first conduit 21 ' ' connect this first sound hole 51, this second conduit 22 ' ' connects this second sound hole 52.
Although the present invention discloses as above with concrete preferred embodiment, so it is not in order to limit the present invention, any affiliated those of ordinary skills, but do a little change and retouching, and do not depart from the spirit and scope of the present invention.
Claims (21)
1. an electronic installation, comprising:
Housing, comprises the first sound hole and the second sound hole;
Sound-insulating structure, wherein, this sound-insulating structure comprises the first conduit and the second conduit, and this first conduit is connected to this first sound hole, and this second conduit is connected to this second sound hole;
The first microphone, connects this first conduit; And
Second microphone, connects this second conduit.
2. electronic installation as claimed in claim 1, wherein, this electronic installation also comprises printed circuit board (PCB), this first microphone and this second microphone are located on this printed circuit board (PCB).
3. electronic installation as claimed in claim 1, wherein, this sound-insulating structure is chimeric this housing removably.
4. electronic installation as claimed in claim 1, wherein, this sound-insulating structure and this housing are positioned at surface.
5. electronic installation as claimed in claim 1, it also comprises microphone case, this microphone case comprises the first cavity and the second cavity, this first conduit is communicated with this first sound hole and this first cavity, this second conduit is communicated with this second sound hole and this second cavity, within this first microphone is located at this first cavity, within this second microphone is located at this second cavity.
6. electronic installation as claimed in claim 5, wherein, this sound-insulating structure also comprises a wall, is shaped between this first cavity and this second cavity, to separate this first microphone and this second microphone.
7. electronic installation as claimed in claim 1, wherein, this first conduit has the first entrance and the first outlet, and this second conduit has the second entrance and the second outlet, and this sound-insulating structure comprises that multiple convex holes are separately around this first entrance and this second entrance.
8. electronic installation as claimed in claim 1, wherein, this first conduit has the first entrance and the first outlet, and this second conduit has the second entrance and the second outlet, multiple elastomeric materials are used to provide airtight effect, and neighbouring right requires the convex hole described in the 7th.
9. electronic installation as claimed in claim 1, wherein, this first conduit has the first entrance and the first outlet, and this second conduit has the second entrance and the second outlet, and this sound-insulating structure comprises that multiple convex holes are separately around this first outlet and this second outlet.
10. electronic installation as claimed in claim 1, wherein, this housing comprises the first shell channel and the second shell channel, and this first shell channel is communicated with this first sound hole and this first conduit, and this second shell channel is communicated with this second sound hole and this second conduit.
11. electronic installations as claimed in claim 10, wherein, this housing comprises a upper surface, this first sound hole and this second sound hole are formed at this upper surface.
12. electronic installations as claimed in claim 10, wherein, this housing comprises a upper surface and a side surface, and this upper surface is perpendicular to this side surface, and this first sound hole is formed at this upper surface, and this second sound hole is formed at this side surface.
13. electronic installations as claimed in claim 1, it also comprises a microphone case, wherein, this first microphone and this second microphone are located among this shell.
14. electronic installations as claimed in claim 13, wherein, this microphone case comprises the first cavity, the second cavity and recess, this first cavity and this second cavity in this microphone case are separated by this recess, within this first microphone is located at this first cavity, within this second microphone is located at this second cavity.
15. electronic installations as claimed in claim 14, it also comprises a surface-mounted integrated circuit, is located among this shell, wherein, this surface-mounted integrated circuit comprises that a separation structure protrudes thereon, and this this recess of separation structure butt is to separate this first cavity and this second cavity.
16. electronic installations as claimed in claim 15, wherein, this integrated circuit and this first microphone and this second microphone see through CMOS (Complementary Metal Oxide Semiconductor)-micro-electromechanical technology and integrate.
17. electronic installations as claimed in claim 15, it also comprises a printed circuit board (PCB), is located under this shell, wherein, this surface-mounted integrated circuit is located on this printed circuit board (PCB).
18. electronic installations as claimed in claim 14, wherein, this shell does not have recess, but has partition wall among this shell.
19. electronic installations as claimed in claim 1, it also comprises two shells, and each microphone is positioned among each shell separately, and the plurality of shell is put together closely.
20. 1 kinds of electronic installations, comprising:
Elasticity sound-insulating structure, wherein, this sound-insulating structure comprises the first conduit and the second conduit;
The first microphone, is communicated with this first conduit; And
Second microphone, is communicated with this second conduit.
21. electronic installations as claimed in claim 20, it also comprises a printed circuit board (PCB), and wherein, this printed circuit board (PCB) comprises the first sound hole and the second sound hole, and this first conduit connects this first sound hole, and this second conduit connects this second sound hole.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261734035P | 2012-12-06 | 2012-12-06 | |
| US61/734,035 | 2012-12-06 | ||
| US13/834,658 | 2013-03-15 | ||
| US13/834,658 US9357292B2 (en) | 2012-12-06 | 2013-03-15 | Implementation of microphone array housing receiving sound via guide tube |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103856857A true CN103856857A (en) | 2014-06-11 |
| CN103856857B CN103856857B (en) | 2018-01-05 |
Family
ID=50863989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310524575.9A Active CN103856857B (en) | 2012-12-06 | 2013-10-30 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103856857B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105939502A (en) * | 2015-03-05 | 2016-09-14 | 奥迪康有限公司 | Microphone inlet for hearing aid |
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| CN107820147A (en) * | 2016-09-12 | 2018-03-20 | 美商富迪科技股份有限公司 | The control method of microphone apparatus and microphone apparatus |
| CN109413521A (en) * | 2017-08-18 | 2019-03-01 | 丁绍杰 | Mobile phone real-time phonetic translates bi-directional microphones |
| WO2023046178A1 (en) * | 2021-09-27 | 2023-03-30 | 北京罗克维尔斯科技有限公司 | In-vehicle microphone and vehicle |
Citations (6)
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|---|---|---|---|---|
| US6151399A (en) * | 1996-12-31 | 2000-11-21 | Etymotic Research, Inc. | Directional microphone system providing for ease of assembly and disassembly |
| CN101014205A (en) * | 2005-12-02 | 2007-08-08 | 美商富迪科技股份有限公司 | Electronic device |
| US20080069389A1 (en) * | 2006-09-14 | 2008-03-20 | Fortemedia, Inc. | Microphone array in housing |
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
| DE102011087963A1 (en) * | 2010-12-14 | 2012-06-14 | Robert Bosch Gmbh | Microphone package, has housing cover connected with housing bottom by connection material that has low hardening temperature and/or requires short time for curing than another connection material connecting cover with microphone chip |
| CN102740211A (en) * | 2011-04-13 | 2012-10-17 | 奥迪康有限公司 | Hearing device with two or more microphones |
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2013
- 2013-10-30 CN CN201310524575.9A patent/CN103856857B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6151399A (en) * | 1996-12-31 | 2000-11-21 | Etymotic Research, Inc. | Directional microphone system providing for ease of assembly and disassembly |
| CN101014205A (en) * | 2005-12-02 | 2007-08-08 | 美商富迪科技股份有限公司 | Electronic device |
| US20080069389A1 (en) * | 2006-09-14 | 2008-03-20 | Fortemedia, Inc. | Microphone array in housing |
| DE102011087963A1 (en) * | 2010-12-14 | 2012-06-14 | Robert Bosch Gmbh | Microphone package, has housing cover connected with housing bottom by connection material that has low hardening temperature and/or requires short time for curing than another connection material connecting cover with microphone chip |
| CN201947427U (en) * | 2010-12-28 | 2011-08-24 | 歌尔声学股份有限公司 | Electronic product |
| CN102740211A (en) * | 2011-04-13 | 2012-10-17 | 奥迪康有限公司 | Hearing device with two or more microphones |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105939502A (en) * | 2015-03-05 | 2016-09-14 | 奥迪康有限公司 | Microphone inlet for hearing aid |
| CN105939502B (en) * | 2015-03-05 | 2020-07-17 | 奥迪康有限公司 | Microphone inlet for hearing aid |
| CN107820147A (en) * | 2016-09-12 | 2018-03-20 | 美商富迪科技股份有限公司 | The control method of microphone apparatus and microphone apparatus |
| CN107820147B (en) * | 2016-09-12 | 2019-07-16 | 美商富迪科技股份有限公司 | The control method of microphone apparatus and microphone apparatus |
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| CN109413521A (en) * | 2017-08-18 | 2019-03-01 | 丁绍杰 | Mobile phone real-time phonetic translates bi-directional microphones |
| WO2023046178A1 (en) * | 2021-09-27 | 2023-03-30 | 北京罗克维尔斯科技有限公司 | In-vehicle microphone and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103856857B (en) | 2018-01-05 |
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