CN103856583A - Seamless mobile phone - Google Patents

Seamless mobile phone Download PDF

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Publication number
CN103856583A
CN103856583A CN201210494760.3A CN201210494760A CN103856583A CN 103856583 A CN103856583 A CN 103856583A CN 201210494760 A CN201210494760 A CN 201210494760A CN 103856583 A CN103856583 A CN 103856583A
Authority
CN
China
Prior art keywords
mobile phone
piece
face
shell
drain pan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210494760.3A
Other languages
Chinese (zh)
Inventor
林天能
吴铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amgoo Telecom Shenzhen Co ltd
Original Assignee
Amgoo Telecom Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amgoo Telecom Shenzhen Co ltd filed Critical Amgoo Telecom Shenzhen Co ltd
Priority to CN201210494760.3A priority Critical patent/CN103856583A/en
Publication of CN103856583A publication Critical patent/CN103856583A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a seamless mobile phone which comprises a bottom shell, a surface shell and a mainboard assembly fixedly installed between the bottom shell and the surface shell. The bottom shell and the surface shell are welded through ultrasonic waves and ultrasonic welding spots are formed. According to the seamless mobile phone provided by the invention the bottom shell and the surface shell are seamlessly welded through ultrasonic waves, and the surface of the shell is sprayed to cover split lines generated by ultrasonic welding processing. An SIM (Subscriber Identity Module) card and a T card are installed from a lateral face, so that the shape of the mobile phone is smooth. Meanwhile, the material cost is reduced and the assembly flow is greatly simplified, so that the integral shape is simple and decent, and strong in shape plasticity.

Description

A kind of seamless mobile phone
Technical field
The invention belongs to mobile communication terminal, what be specifically related to is a kind of seamless mobile phone, particularly a kind of by mobile phone drain pan and face-piece by the integrally welded seamless mobile phone of ultrasonic seamless.
Background technology
Current handset structure be substantially all have mobile telephone surface shell, drain pan and be arranged on mobile telephone surface shell and drain pan between the formation such as mainboard assembly, display screen, battery, battery cover.The mobile phone of this structure is in the time of assembling, first need display screen, mainboard assembly, battery, battery cover to install successively from the top down, and then face-piece and drain pan are fixedly installed togather by screw etc., it exists assembling complicated, long, the problem such as efficiency is lower consuming time, and make the material that different housing units need to be more, its cost of manufacture is higher.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of seamless mobile phone, assemble and face-piece, drain pan combination need to be installed, complicated, the consuming time length of existing assembling, the problem that efficiency is lower and cost of manufacture is higher to solve current mobile phone.
The object of the invention is to be achieved through the following technical solutions.
A kind of seamless mobile phone, comprise drain pan (1), face-piece (2) and be fixedly mounted on drain pan (1) and face-piece (2) between mainboard assembly (4), between described drain pan (1) and face-piece (2), be connected together by supersonic welding, and be formed with ultrasonic wave solder joint (3).
Preferably, between described mainboard assembly (4) and face-piece (2), display screen (5) is also installed.
Preferably, on described face-piece (2), be also provided with the touch conducting film (6) bonding with display screen (5).
Preferably, on described drain pan (1), be also provided with sim card slot (101) and TF draw-in groove (102), and sim card slot (101) and TF draw-in groove (102) are by plug (103) sealing.
The present invention compared with prior art, beneficial effect is: seamless mobile phone provided by the invention, face-piece and drain pan are welded together by ultrasonic seamless, and hide by clamp surface of shell being sprayed to produce after will excusing from death ripple welding processing, and SIM card of the present invention and T card install from the side, thus make mobile phone profile become more smooth, the present invention has simultaneously reduced material cost, greatly simplified assembling flow path, made overall appearance more simply generous, apparent plasticity is stronger.
Brief description of the drawings
Fig. 1 is the perspective view of the seamless mobile phone of the present invention.
Fig. 2 is the seamless mobile phone structure of the present invention schematic diagram.
Fig. 3 is the package assembly schematic diagram of the seamless mobile phone of the present invention.
Identifier declaration in figure: drain pan 1, sim card slot 101, TF draw-in groove 102, plug 103, face-piece 2, ultrasonic wave solder joint 3, mainboard assembly 4, display screen 5, touch conducting film 6.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to shown in Fig. 1, Fig. 2, Fig. 3, Fig. 1 is the perspective view of the seamless mobile phone of the present invention; Fig. 2 is the seamless mobile phone structure of the present invention schematic diagram; Fig. 3 is the package assembly schematic diagram of the seamless mobile phone of the present invention.The present invention is to provide a kind of seamless mobile phone, be mainly used in solving in current mobile phone package assembly, face-piece and drain pan need to be fixedly installed togather by screw etc., and existing assembling is complicated, length consuming time, the problem that efficiency is lower and cost of manufacture is higher.
Seamless mobile phone of the present invention, include comprise drain pan 1, face-piece 2 and be fixedly mounted on drain pan 1 and face-piece 2 between mainboard assembly 4, between described drain pan 1 and face-piece 2, be connected together by supersonic welding, and be formed with ultrasonic wave solder joint 3; Between described mainboard assembly 4 and face-piece 2, display screen 5 is also installed; On face-piece 2, be also provided with the touch conducting film 6 bonding with display screen 5.
Back side bottom at drain pan 1 is also provided with a sim card slot 101 and a TF draw-in groove 102, and sim card slot 101 and TF draw-in groove 102 seal by plug 103, correspondingly in TF draw-in groove 102, inserts TF card, can be connected with mainboard assembly 4; The corresponding SIM card of inserting from sim card slot 101 is also corresponding to be connected with mainboard assembly 4.
The present invention realizes the face-piece of mobile phone and drain pan together with seamless welding by ultrasonic wave, and hides by clamp surface of shell being sprayed to be produced after will excusing from death ripple welding processing, thereby has ensured that product design is more smooth attractive in appearance.And SIM card of the present invention and T card install from mobile phone bottom sides, make mobile phone profile form one, the present invention has reduced material cost, has greatly simplified assembling flow path, makes overall appearance more simply generous, and apparent plasticity is stronger.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.

Claims (4)

1. a seamless mobile phone, it is characterized in that comprising drain pan (1), face-piece (2) and be fixedly mounted on drain pan (1) and face-piece (2) between mainboard assembly (4), between described drain pan (1) and face-piece (2), be connected together by supersonic welding, and be formed with ultrasonic wave solder joint (3).
2. seamless mobile phone according to claim 1, is characterized in that, between described mainboard assembly (4) and face-piece (2), display screen (5) is also installed.
3. seamless mobile phone according to claim 2, is characterized in that being also provided with on described face-piece (2) the touch conducting film (6) bonding with display screen (5).
4. seamless mobile phone according to claim 1, it is characterized in that being also provided with on described drain pan (1) sim card slot (101) and TF draw-in groove (102), and sim card slot (101) and TF draw-in groove (102) are by plug (103) sealing.
CN201210494760.3A 2012-11-28 2012-11-28 Seamless mobile phone Pending CN103856583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210494760.3A CN103856583A (en) 2012-11-28 2012-11-28 Seamless mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210494760.3A CN103856583A (en) 2012-11-28 2012-11-28 Seamless mobile phone

Publications (1)

Publication Number Publication Date
CN103856583A true CN103856583A (en) 2014-06-11

Family

ID=50863785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210494760.3A Pending CN103856583A (en) 2012-11-28 2012-11-28 Seamless mobile phone

Country Status (1)

Country Link
CN (1) CN103856583A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1332908A (en) * 1998-12-30 2002-01-23 艾利森公司 Simple enclosure for electronic components
WO2003073729A1 (en) * 2002-02-21 2003-09-04 Siemens Aktiengesellschaft Housing or housing part and method for producing a housing or housing part, and tool for carrying out said method
CN101480022A (en) * 2006-06-29 2009-07-08 摩托罗拉公司 Fascia assembly for a portable electronic device
CN202889434U (en) * 2012-11-28 2013-04-17 安谷通信技术(深圳)有限公司 Seamless mobile phone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1332908A (en) * 1998-12-30 2002-01-23 艾利森公司 Simple enclosure for electronic components
WO2003073729A1 (en) * 2002-02-21 2003-09-04 Siemens Aktiengesellschaft Housing or housing part and method for producing a housing or housing part, and tool for carrying out said method
CN101480022A (en) * 2006-06-29 2009-07-08 摩托罗拉公司 Fascia assembly for a portable electronic device
CN202889434U (en) * 2012-11-28 2013-04-17 安谷通信技术(深圳)有限公司 Seamless mobile phone

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Application publication date: 20140611