CN103840060A - LED support and LED - Google Patents
LED support and LED Download PDFInfo
- Publication number
- CN103840060A CN103840060A CN201210488660.XA CN201210488660A CN103840060A CN 103840060 A CN103840060 A CN 103840060A CN 201210488660 A CN201210488660 A CN 201210488660A CN 103840060 A CN103840060 A CN 103840060A
- Authority
- CN
- China
- Prior art keywords
- led
- ground
- chip unit
- led support
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000005498 polishing Methods 0.000 abstract description 5
- 238000002834 transmittance Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 5
- 238000009499 grossing Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- 239000011049 pearl Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED support and an LED. The LED support comprises a substrate and a base which is moulded through a die. The substrate and the base are molded into one piece. A chip unit is packaged on the substrate and is arranged inside the base. The inner wall of the base is provided with a reflection surface for reflecting light rays emitted from the chip unit. The reflection surface is moulded through a die. The substrate is provided with a heat dissipation layer for dissipating the heat from the chip unit. By smoothing and polishing the die for base moulding, the inner wall of the base is allowed to reach a smooth mirror surface effect, so that the light rays emitted from the chip unit can be reflected favorably, the light transmittance of the light rays emitted from the chip unit can be kept for a long time, and the advantages of large light-emitting area and angle are achieved; adding heat-dissipation aluminum sheets or fans to the substrate is avoided, and heat is dissipated through a heat dissipation layer in a thermal transmission manner; the heat dissipation effect is good; the service life of the LED is prolonged; the cost of the heat-dissipation aluminum sheets or the fans is saved on the premise of saving space utilization rate; and a simplification effect is achieved.
Description
Technical field
The present invention relates to LED technology, relate in particular to a kind of LED support and LED.
Background technology
LED support is for packaging LED chips unit, this LED support is mainly the chip unit below 0.5W for power, singlely at least needs to encapsulate the lamp pearl of 20, chip sends, it is for reflecting the amboceptor of the light emitted line of chip, can be As time goes on, light transmittance reduces gradually, and darkness deepens to make LED; And chip sends and simultaneously can produce a large amount of heats, and LED support product trends towards the more and more less change of volume now, under these circumstances, traditional LED support can be installed radiating aluminium sheet or fan on rack body, so that the heat energy that chip unit was produced is fallen apart in ambient air; And in order, for the installation of more lamp pearl and radiating aluminium sheet or fan installation, to make LED support structural design larger.
Summary of the invention
The object of the invention is to overcome the defect of prior art, a kind of LED support is provided, its compact conformation, can keep light transmittance, thermal diffusivity good.
The present invention is achieved in that a kind of LED support, be applied to chip unit encapsulation, described LED support comprises ground and the pedestal by mold injection molding, described ground and described pedestal are one-body molded, described chip unit is encapsulated on described ground and is positioned at described pedestal, the inwall of described pedestal is provided with can be for the reflecting surface of described chip unit emitted light reflection, and described reflecting surface is by mould molding, and described ground has a heat dissipating layer for described chip unit heat radiation.
Further, described ground comprises ground front and a ground reverse side, and the bottom surface of described pedestal contacts with described ground is positive, and described heat dissipating layer is located at described ground reverse side.
Further, described heat dissipating layer is the coat of metal, and the described coat of metal is at least one deck, and its thickness is 10-100 micron.
Further, described ground is copper sheet, and it is provided with most conductive pins, and described conductive pin at least comprises an anodal conductive pin and a negative pole conductive pin of mutually insulated, and described conductive pin comprises a chemical deposit and an electrodeposited coating.
Further, described pedestal comprises the body part that manifests described ground and the insulated part that is positioned at described ground, described body part cross section is trapezoidal, and described insulated part separates described ground so that described ground is formed for two electrodes that are connected with described chip unit.
Further, described pedestal is high temperature resistant radiating insulating material.
The present invention also provides a kind of LED, and it comprises above-mentioned LED support, and described LED also comprises the chip unit of being located on described ground.
Described chip unit comprises at least two LED chips.
Between described at least two LED chips by being connected in parallel.
Between described at least two LED chips by being connected in series.
The invention provides a kind of LED support and LED, described LED support comprises ground and the pedestal by mold injection molding, the inwall of described pedestal is provided with can be for the reflecting surface of described chip unit emitted light reflection, described reflecting surface is by mould molding, level and smooth by the Mold polishing to for described pedestal moulding, carry out polishing, to make the inwall of described pedestal reach level and smooth mirror effect, be conducive to reflect the light that described chip sends, the light transmittance of holding core blade unit emitted light for a long time, has advantages of that light-emitting area and angle are large; Compared with prior art, single of this LED support product can be below bonding power 0.5W chip unit, singlely produce at least 20 lamp pearls, want many more than 40% than its luminous quantity of LED support product (LED support below earner power 0.5W) (number) using in the market; Described ground has a heat dissipating layer for described chip unit heat radiation, exempt and on described ground, set up radiating aluminium sheet or fan, directly dispel the heat in the mode of heat transmission by heat dissipating layer, good heat dissipation effect, extend the LED life-span, the cost of having saved radiating aluminium sheet or fan under the prerequisite of saving space availability ratio, has simplification effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The LED support vertical view that Fig. 1 provides for the embodiment of the present invention;
The LED vertical view that Fig. 2 provides for the embodiment of the present invention;
The LED support cutaway view that Fig. 3 provides for the embodiment of the present invention;
The LED cutaway view that Fig. 4 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
As Fig. 1-Fig. 4, the embodiment of the present invention provides a kind of LED support 11, being applied to chip unit 12 encapsulates, described LED support 11 is for conduction and support described chip unit 12, described chip unit 12 specifically illustrates with the chip of its power 0.5W, described LED support 11 comprises ground 111 and by the pedestal 112 of mold injection molding, described ground 111 is for conduction, to realize described chip unit 12 conductings, described ground 111 and described pedestal 112 are one-body molded, and by first described ground 111 being seated in mould, then on described ground 111, injecting glue, with pedestal described in moulding 112, is made simply, and the LED support 11 of institute's moulding is unified, described chip unit 12 is encapsulated on described ground 111 and is positioned at described pedestal 112, the inwall of described pedestal 112 is provided with can be for the reflecting surface 1121 of described chip unit 12 emitted light reflections, described reflecting surface 1121 is by mould molding, by to level and smooth for the Mold polishing of described pedestal 112 moulding, carry out polishing, to make the inwall of described pedestal 112 reach level and smooth mirror effect, be conducive to reflect the light that described chip unit 12 sends, the light transmittance of holding core blade unit 12 emitted lights for a long time, have advantages of that light-emitting area and angle are large, described ground 111 has a heat dissipating layer 1111 dispelling the heat for described chip unit 12.Exempt on described ground 111 and set up radiating aluminium sheet or fan, directly dispel the heat in the mode of heat transmission by described heat dissipating layer 1111, good heat dissipation effect, has extended life-span of LED1, the cost of having saved radiating aluminium sheet or fan under the prerequisite of saving space availability ratio, has simplification effect; Simultaneously, single of this LED support 11 product can be below bonding power 0.5W chip unit, singlely produce at least 20 lamp pearls, want many more than 40% than its luminous quantity of LED support product (LED support below earner power 0.5W) (number) using in the market.
In concrete application, described ground 111 comprises a ground positive 1112 and a ground reverse side 1113, described ground 111 adopts a kind of metal material punching press to make, the copper sheet that a kind of model of the concrete employing of the present embodiment is C194, its punch forming, there is high strength, high conduction, high-termal conductivity, the good characteristics such as good weldability, wettability, plastic packaging, non-oxidizability, processing forming.The bottom surface of described pedestal 112 contacts with described ground positive 1112, has avoided occurring gap between described pedestal 112 and described ground 111 that good airproof performance has guaranteed the compactedness of LED support 11 structural entity; Described heat dissipating layer 1111 is located at described ground reverse side 1113.Specifically, described heat dissipating layer 1111 is the coat of metal, and the described coat of metal is at least one deck, also can be multilayer, the thickness of one deck be 10-100 micron, and concrete employing of the described coat of metal plated one deck silver on described ground reverse side 1113, it is relatively low that it has price, the good advantage of heat-conducting effect; Specifically manufacture method is, on described ground reverse side 1113, first plates one deck nickel, and it has anticorrosive property, and in atmosphere, chemistry is relatively more stable, not easy to change, just oxidized more than 600 ℃, can be not dissolved in solution yet, and the corrosion stability of nickel is stronger than copper; And then described ground reverse side 1113 plated surface one deck silver after nickel plating, can reduce resistance, avoid getting rusty, prevent that the oxidation of copper layer from reducing electric conductivity.Copper sheet is easily oxidized, and by reducing oxidation after silver-plated processing, improves oxidation resistance, also can increase solderability, easily welding.
As shown in Figure 1, Figure 2, further, be provided with most conductive pins 1114 in described ground 111, described conductive pin 1114 at least comprises an anodal conductive pin 1115 and a negative pole conductive pin 1116 of mutually insulated, and described conductive pin 1114 comprises a chemical deposit (not shown) and an electrodeposited coating (not shown).Described chemical deposit adopts the method for chemical plating to make, and described electrodeposited coating adopts electric plating method to make.
As Fig. 3, Fig. 4, further, described pedestal 112 comprises the body part 1122 that manifests described ground 111 and the insulated part 1123 that is positioned at described ground 111, particularly, described pedestal 112 is high temperature resistant radiating insulating material, concrete a kind of polyphthalamide (being called for short PPA) resin that adopts, by pedestal described in injection mo(u)lding 112, it is good, high temperature resistant that this PPA plastics have good insulating, optically focused, reflecting effect; It should be noted that, described body part 1122 cross sections are trapezoidal, are convenient to optically focused, go out with the light reflection that described chip unit 12 is sent of maximum angle; Described insulated part 1123 separates described ground 111 so that described ground 111 is formed for two electrodes that are connected with described chip unit 12, described two electrodes are above-mentioned anodal conductive pin 1115 and negative pole conductive pin 1116, are convenient to and extraneous power turn-on.
As Fig. 2, Fig. 4; the present invention also provides a kind of LED1; comprise above-mentioned LED support 11; described LED1 also comprises the chip unit 12 of being located on described ground 111; described chip unit 12 comprises at least two LED chips; between described at least two LED chips by being connected in parallel, also can be by being connected in series, be all the scope that the present invention protects.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a LED support, be applied to chip unit encapsulation, it is characterized in that, described LED support comprises ground and the pedestal by mold injection molding, described ground and described pedestal are one-body molded, and described chip unit is encapsulated on described ground and is positioned at described pedestal, and the inwall of described pedestal is provided with can be for the reflecting surface of described chip unit emitted light reflection, described reflecting surface is by mould molding, and described ground has a heat dissipating layer for described chip unit heat radiation.
2. LED support as claimed in claim 1, is characterized in that: described ground comprises ground front and a ground reverse side, and the bottom surface of described pedestal contacts with described ground is positive, and described heat dissipating layer is located at described ground reverse side.
3. LED support as claimed in claim 2, is characterized in that: described heat dissipating layer is the coat of metal, and the described coat of metal is at least one deck, and its thickness is 10-100 micron.
4. LED support as claimed in claim 1, it is characterized in that: described ground is copper sheet, it is provided with most conductive pins, and described conductive pin at least comprises an anodal conductive pin and a negative pole conductive pin of mutually insulated, and described conductive pin comprises a chemical deposit and an electrodeposited coating.
5. LED support as claimed in claim 1, it is characterized in that: described pedestal comprises the body part that manifests described ground and the insulated part that is positioned at described ground, described body part cross section is trapezoidal, and described insulated part separates described ground so that described ground is formed for two electrodes that are connected with described chip unit.
6. LED support as claimed in claim 5, is characterized in that: described pedestal is high temperature resistant radiating insulating material.
7. a LED, is characterized in that, comprises LED support as described in claim 1-6 any one, also comprises the chip unit of being located on described ground.
8. LED as claimed in claim 1, is characterized in that: described chip unit comprises at least two LED chips.
9. LED as claimed in claim 8, is characterized in that: between described at least two LED chips by being connected in parallel.
10. LED as claimed in claim 8, is characterized in that: between described at least two LED chips by being connected in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210488660.XA CN103840060A (en) | 2012-11-26 | 2012-11-26 | LED support and LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210488660.XA CN103840060A (en) | 2012-11-26 | 2012-11-26 | LED support and LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103840060A true CN103840060A (en) | 2014-06-04 |
Family
ID=50803364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210488660.XA Pending CN103840060A (en) | 2012-11-26 | 2012-11-26 | LED support and LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103840060A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN108963045A (en) * | 2017-05-19 | 2018-12-07 | 东莞昶通精密五金有限公司 | A kind of white light LEDs bracket of high reliability |
| CN109161944A (en) * | 2018-08-02 | 2019-01-08 | 深圳市源磊科技有限公司 | A kind of LED support electro-plating method and LED support |
| CN110864233A (en) * | 2019-11-25 | 2020-03-06 | 广东鑫特美科技有限公司 | LED lamp bead |
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| CN101132038A (en) * | 2006-08-25 | 2008-02-27 | 必奇股份有限公司 | Seat structure of LED |
| CN101614326A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light emitting diode |
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| CN201985170U (en) * | 2011-03-25 | 2011-09-21 | 深圳市长盈精密技术股份有限公司 | LED heat radiation type support with big light output angle |
| US20110256646A1 (en) * | 2010-04-16 | 2011-10-20 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing led package and substrate thereof |
| CN102332523A (en) * | 2010-07-13 | 2012-01-25 | 比亚迪股份有限公司 | Light-emitting diode (LED) support and production process thereof |
| CN202178292U (en) * | 2011-06-22 | 2012-03-28 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) support and LED |
| CN202196807U (en) * | 2011-07-21 | 2012-04-18 | 南京中电熊猫液晶显示科技有限公司 | LED support and LED light source using the LED support |
-
2012
- 2012-11-26 CN CN201210488660.XA patent/CN103840060A/en active Pending
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| CN101043061A (en) * | 2006-03-23 | 2007-09-26 | 财团法人工业技术研究院 | Illuminator packaging structural capable of preventing electrostatic damaged and manufacturing method therefor |
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| CN101614326A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light emitting diode |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN108963045A (en) * | 2017-05-19 | 2018-12-07 | 东莞昶通精密五金有限公司 | A kind of white light LEDs bracket of high reliability |
| CN109161944A (en) * | 2018-08-02 | 2019-01-08 | 深圳市源磊科技有限公司 | A kind of LED support electro-plating method and LED support |
| CN110864233A (en) * | 2019-11-25 | 2020-03-06 | 广东鑫特美科技有限公司 | LED lamp bead |
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Application publication date: 20140604 |
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