CN103838442A - Capacitive screen and manufacturing method thereof - Google Patents
Capacitive screen and manufacturing method thereof Download PDFInfo
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- CN103838442A CN103838442A CN201210485955.1A CN201210485955A CN103838442A CN 103838442 A CN103838442 A CN 103838442A CN 201210485955 A CN201210485955 A CN 201210485955A CN 103838442 A CN103838442 A CN 103838442A
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- capacitance plate
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Abstract
The invention provides a manufacturing method of a capacitive screen and the capacitive screen. The manufacturing method mainly includes the steps that first, sheet glass is processed into toughened glass according to required shapes; second, a circuit pattern and a decorative layer are manufactured on a transparent conductive film, the conductive film comprises a substrate and a conductive layer arranged on one face of the substrate in a covering mode, the manufactured circuit pattern is a circuit pattern used for manufacturing a functional area of the capacitive screen on the conductive layer, and the manufactured decorative layer is located on the edge, opposite to the conductive layer, of the substrate; third, a flexible circuit board is connected to the circuit pattern in the semi-finished product obtained in the second step; fourth, the semi-finished product obtained in the third step is attached to the toughened glass through transparent optical cement, and the face where the decorative layer is located is attached to the toughened glass. With the manufacturing method of the capacitive screen, the manufacturing cost of the capacitive screen is low, and the yield is high.
Description
Technical field
The present invention relates to touch-screen field, relate in particular to a kind of capacitance plate and preparation method thereof.
Background technology
Along with the progress in epoch, it is increasingly extensive that personal digital assistant, mobile phone, Vehicular guidance system, flat computer etc. have the electronic product of touch-input function, and on the display screen of these products, be to be generally provided with touch panel, utilize finger or felt pen input message for user, and touch panel has multiple touching technique.Wherein, capacitance plate replaces touch screens gradually with its good performance.Capacitance plate is capacitive touch screen, and capacitive touch screen is particulate metal conductive materials that sticks layer of transparent at glass surface.In the time that finger touch is on metal level, the electric capacity of contact will change, and can determine touch location acquired information by measuring capacitance variations.
Especially GF capacitance plate of capacitance plate in prior art, conventionally formed by glass and the laminating of individual layer conducting film, concrete, first by the little sheet glass of large stretch of glass-cutting squarely (square), small pieces glass machinery processing (as grinding profiling, CNC etc.) obtains required profile, again small pieces chemically enhancing glass is obtained to small pieces tempered glasses, finally the decorative layer such as silk-screen Decorative frame and logo on small pieces tempered glass.In the one side with decorative layer of tempered glass, hot pressing is set again and has the conducting film of flexible circuit board (being FPC).Wherein, decorative layer is mainly the surrounding that is positioned at capacitance plate, shelter from the parts such as wire that some affected to the overall appearance of capacitance plate, thereby increase capacitance plate and place thereof electric terminal globality and improve the comfort that user uses.
But glass cost is higher.First, the cost of forming of glass processing and strengthening is higher; Secondly, the decorative layer forming at silk-screen on glass be prone to come off, the bad phenomenon such as pin hole, cause scrapping of expensive small pieces tempered glass with the bad of reason decorative layer, thereby reduced the yield of the capacitance plate of producing, and increased the cost of manufacture of capacitance plate.
Be understandable that, the statement of this part only provides background information related to the present invention, may form or not form so-called prior art.
Summary of the invention
Technical matters to be solved by this invention is the defect that yield is lower and cost is higher of the capacitance plate of making for prior art, and a kind of method for making that can improve the yield of capacitance plate and reduce the capacitance plate of its cost of manufacture is provided.
The technical solution adopted for the present invention to solve the technical problems is to provide a kind of method for making of capacitance plate, and it comprises the following steps: S10, be tempered glass by white glass according to required sharp processing; S20, on transparent conducting film, make circuitous pattern and make decorative layer, described conducting film comprises base material and is covered in the conductive layer in the one side of base material, described making circuitous pattern is the circuitous pattern of making the functional areas of capacitance plate on described conductive layer, and the decorative layer of making is at the edge of the one side relative with conductive layer of described base material; In S30, semi-manufacture that step S20 is obtained, on circuitous pattern, connect flexible circuit board; S40, the semi-manufacture that step S30 obtained by transparent optical cement fit on described tempered glass, and the face at decorative layer place and tempered glass laminating.
In the method for making of above-mentioned capacitance plate, described circuitous pattern comprise capacitance plate visible area circuit and be connected with described line electricity for capacitance plate and the extraneous contact conductor being electrically connected, and described contact conductor is positioned at the edge of described circuit.In the method for making of above-mentioned capacitance plate, be also included between step S20 and S30 and make contact conductor, described contact conductor is by electroplating or printing the edge that is arranged at circuit, and described contact conductor is connected with described flexible circuit board.
In the method for making of above-mentioned capacitance plate, described contact conductor is the silver slurry of printing.
In the method for making of above-mentioned capacitance plate, described making circuitous pattern forms by coiled material etching, and described making decorative layer forms by coiled material printing.
In the method for making of above-mentioned capacitance plate, described decorative layer is the ink layer of printing.
In the method for making of above-mentioned capacitance plate, before step S30, also comprise that the semi-manufacture that step S20 is made are by radium-shine cutting or the die-cut semi-manufacture that are divided into some fritters.
In the method for making of above-mentioned capacitance plate, be also included in step S40 and on conducting film, make protective seam afterwards, described protective seam all covers the one side relative with base material of conducting film.
In the method for making of above-mentioned capacitance plate, described transparent optical cement is pressure sensitive adhesive.
In the method for making of above-mentioned capacitance plate, the conductive material of described conductive layer is Nano Silver.
In order better to solve the problems of the technologies described above, the present invention also provides a kind of capacitance plate, it comprises: conducting film, tempered glass and transparent optical cement, described conducting film comprises base material and is arranged at the conductive layer of the circuitous pattern of the formation capacitance plate on base material, on described conducting film, the edge of the one side relative with conductive layer is provided with decorative layer, on described circuitous pattern, be connected with flexible circuit board, one side relative with conductive layer on conducting film fits on tempered glass by described transparent optical cement.In above-mentioned capacitance plate, also comprise the contact conductor being positioned on conductive layer, and described contact conductor is connected with described flexible circuit board.
In above-mentioned capacitance plate, also comprise protective seam, described protective seam all covers the one side relative with base material of conducting film.
The method for making of capacitance plate provided by the invention by connecting flexible circuit board on the film formed circuitous pattern of conduction, and the edge in the one side relative with conductive layer of base material arranges decorative layer, and the face at decorative layer place is fitted on tempered glass by transparent optical cement, therefore being set on the base material of conducting film, the operation of decorative layer simply and is not prone to the bad phenomenon of decorative layer, and then improve the yield of the capacitance plate of making, and on conducting film, making decorative layer compares and on white glass, makes decorative layer, it can avoid scrapping of a large amount of tempered glass, can reduce the cost of making capacitance plate, also yield and the efficiency of making capacitance plate have further been improved.
Brief description of the drawings
Fig. 1 is the process flow diagram of the method for making of capacitance plate provided by the invention;
Fig. 2 is the structural representation of capacitance plate in a preferred embodiment provided by the invention.
Embodiment
In order to make technical matters solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
In description of the invention, it will be appreciated that, term " longitudinally ", " laterally ", " on ", orientation or the position relationship of the instruction such as D score, 'fornt', 'back', " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward " be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, construct and operation with specific orientation, therefore can not be interpreted as limitation of the present invention.
The method for making of capacitance plate provided by the invention mainly arranges decorative layer by the edge of the base material at conducting film, then by the face at decorative layer place and tempered glass laminating, can improve the yield of capacitance plate and reduce its cost.
Shown in Figure 1, the method for making of capacitance plate provided by the invention is mainly as follows:
S10, be tempered glass 1 by white glass according to required sharp processing,, do not repeat them here for tempered glass is well known to those skilled in the art glass reinforced.
S20, on transparent conducting film, make circuitous pattern and make decorative layer.Conducting film comprises base material 3 and is covered in the conductive layer 6 on base material 3.Those skilled in the art know the conductive layer that conducting film is positioned in the one side of base material by base material and laminating or deposition or alternate manner conventionally and form.The circuitous pattern of producing the functional areas (being induction zone) of capacitance plate on conductive layer, can form circuitous pattern by conventional exposure, development and etched mode.Then make decorative layer 5 at the edge (being the nonconducting one side of conducting film) of the one side relative with conductive layer of base material.For example make the mark such as dark border and LOGO and block the parts at capacitance plate edge as decorative layer 5, and then the visible area for capacitance plate that allows user see, to improve the associative perception of product and to improve the comfortableness that user uses.
In S30, semi-manufacture that step S20 is obtained, on circuitous pattern, connect flexible circuit board 8.Flexible circuit board 8 for the circuit on capacitance plate is electrically connected with external circuitry, for example, is electrically connected the circuit on the display screen of mobile phone with the pcb board in mobile phone.Flexible circuit board preferably adopts the mode of hot pressing to fit.The common part of flexible circuit board is positioned on circuitous pattern, and a part stretches out away to connect the external world from circuitous pattern.Flexible circuit board can be arranged on circuitous pattern for modes such as laminating or bindings, so that it is electrically connected with circuitous pattern.
S40, the semi-manufacture that step S30 obtained by transparent optical cement 2 fit on described tempered glass, concrete, and the one side that is provided with decorative layer on conducting film is fitted with tempered glass.This laminating type is well known to those skilled in the art, and does not repeat them here.Complete the making of capacitance plate by said method, wherein, decorative layer is arranged on the edge of nonconducting of conducting film.Because ink or black photoresist etc. are stronger than the adhesion of glass at the adhesion of the plastic rubber substrate of conducting film, so the decorative layer adhering on conducting film is not prone to bad, it reduces the fraction defective of capacitance plate, and has further reduced the cost of manufacture of capacitance plate.
Circuitous pattern on capacitance plate need to be electrically connected with the external world, the wire forming due to the conductive layer of conducting film self with extraneous be electrically connected reliable and stable not, so preferably, circuitous pattern also comprises for capacitance plate and the extraneous contact conductor 7 being electrically connected, be the circuit of the circuitous pattern visible area that comprises capacitance plate and the contact conductor 7 being connected with described line electricity, and described contact conductor is positioned at the edge of circuit.The visible area of capacitance plate is well known to those skilled in the art.The common part of contact conductor is positioned on conductive layer, and a part stretches out to connect the external world from conductive layer.Preferably, produce above-mentioned circuit by printing, then contact conductor is set connecting before flexible circuit board by vacuum plating or the edge that is printed on conductive layer, when follow-up connection flexible circuit board, contact conductor is connected with flexible circuit board.So the circuit of the functional areas of capacitance plate can be by being connected of contact conductor and FPC, and then be connected with extraneous circuit by FPC, and this connected mode is reliable and stable.In order further to reduce the cost of making capacitance plate, contact conductor is preferably the silver slurry of printing.
In a preferred embodiment of the present invention, make circuitous pattern and make decorative layer all by coiled material processing procedure, such as coiled material etching, coiled material printing, coiled material exposure imaging etc.Can realize like this robotization processing in batches, and then improve the make efficiency of capacitance plate.Decorative layer can be the ink layer of printing, further to reduce the cost of making capacitance plate.For the capacitance plate that makes to produce can be applied in the electronic terminal product of variety classes and model, before step S30, also comprise that the semi-manufacture that step S20 is made are by radium-shine cutting or the die-cut semi-manufacture that are divided into some fritters.For better protection capacitance plate, reduce capacitance plate and be subject to and the impact of the electronic terminal product of its application, after step S40, make protective seam 4, described protective seam 4 all covers the one side relative with base material of conducting film.The part that to be protective seam be positioned at the base material on circuitous pattern, circuitous pattern side and flexible circuit board and contact conductor on conductive layer all covers.Protective seam mainly plays and makes that capacitance plate shape is in aggregates to be isolated from the outside, and the material of protective seam, for those skilled in the art know, does not repeat them here.Transparent optical cement is preferably pressure sensitive adhesive, and its cohesive is better and cost is lower.The conductive material of conducting film preferably adopts Nano Silver.Nano Silver can directly use, when it can avoid adopting ITO film, need to toast the processing procedure that carries out crystallization, and the bend resistance ability of the conducting film of Nano Silver formation is stronger, its suitable coiled material processing procedure that is applied to, it is not easily damaged in manufacturing process, can further improve the yield of capacitance plate.
Below in conjunction with the embodiment that makes capacitance plate, the method for making of capacitance plate of the present invention is roughly described below:
Embodiment mono-
First large stretch of glass-cutting is become to little sheet glass (square), small pieces glass machinery processing (as grinding profiling, CNC etc.) obtains required profile, then small pieces chemically enhancing glass is obtained to little tempered glass.The first upper transparent circuitous pattern of circuitous pattern of making in the front of nano-silver conductive film (being conducting surface), power on and plate out printed silver line to form contact conductor at conductive layer more simultaneously, then the edge at the nano-silver conductive film back side (nonconductive surface) coiled material printing ink layer with form decorative layer, then coiled material is cut into sheet (square), and by its radium-shine cutting or be die-cut into small pieces, last hot pressing FPC also makes FPC contact with contact conductor.Finally, the semi-manufacture that make are fitted on described tempered glass, and the face at decorative layer place and tempered glass laminating.Especially, nano-silver conductive film can directly use, and does not need to toast crystallization.The ink layer of decorating is realized coiled material printing, and the yield of capacitance plate and production efficiency are improved.The formation method of the circuit of described transparent contact conductor conduction is that industry is known, includes but not limited to that acid system etching, laser are dry carve etc.Described coiled material etching, includes but not limited to the etching of dry film exposure imaging-acid system, the etching of silk-screen-acid system etc., is preferably the etching of dry film exposure imaging-acid system.
Embodiment bis-
First large stretch of glass-cutting is become to little sheet glass (square), small pieces glass machinery processing (as grinding profiling, CNC etc.) obtains required profile, then small pieces chemically enhancing glass is obtained to small pieces tempered glass.First by ITO (tin indium oxide) conducting film coiled material baking crystallization, vacuum plating copper film on ito surface, by the etching of two-step approach coiled material, copper coating is formed to contact conductor, ITO layer is formed to electrically conducting transparent circuit, on large stretch of ITO conducting film, produce circuitous pattern and at the side of circuitous pattern printed edge silver line as contact conductor, then pass through coating-exposure imaging black photoresist as decorative layer at the edge printing ink layer at the back side of large stretch of ITO conducting film coiled material (being nonconducting one side) again, then by the radium-shine cutting of large stretch of ITO conducting film coiled material or be die-cut into small pieces required form, hot repressing FPC.Finally by transparent optical cement, semi-manufacture obtained above are fitted on tempered glass, and the face at decorative layer place and tempered glass laminating.
The present invention also provides a kind of capacitance plate, and it comprises: conducting film, tempered glass and transparent optical cement.Conducting film comprises base material and is arranged at the conductive layer on base material, the circuitous pattern that conductive layer is capacitance plate.The nonconducting edge of conducting film is provided with decorative layer, and (on conducting film, the edge of the one side relative with conductive layer is provided with decorative layer, also the back side that is base material arranges decorative layer), on conductive layer, be provided with flexible circuit board, capacitance plate makes its circuitous pattern be electrically connected with the parts outside capacitance plate by flexible circuit board.The one side relative with conductive layer on the conducting film base material place face of decorative layer (with) fits on tempered glass by transparent optical cement.
In order to improve capacitance plate and the extraneous electrical property being electrically connected, capacitance plate also comprises that described contact conductor is positioned on conductive layer, and described contact conductor is connected with described flexible circuit board for capacitance plate and the extraneous contact conductor being electrically connected.For better protection capacitance plate, reduce capacitance plate and be subject to and the impact of the electronic terminal product of its application, described capacitance plate also comprises protective seam,
Protective seam all covers the one side relative with base material of conducting film.
。The one side being positioned at due to decorative layer is connected with the edge of the nonconducting one side of conducting film, and the another side of decorative layer fits on tempered glass by transparent optical cement, therefore that the decorative layer on capacitance plate is not prone to is bad, it can reduce fraction defective and the cost of capacitance plate.
In sum, fraction defective and the cost of the method for making of capacitance plate provided by the invention and the capacitance plate making thereof are all lower, and its production efficiency is higher.
In description of the invention, unless otherwise prescribed and limit, it should be noted that, term " installation ", " being connected ", " connection " should be interpreted broadly, for example, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be to be directly connected, and also can indirectly be connected by intermediary, for the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (13)
1. a method for making for capacitance plate, is characterized in that, comprises the following steps:
S10, be tempered glass by white glass according to required sharp processing;
S20, on transparent conducting film, make circuitous pattern and make decorative layer, described conducting film comprises base material and is covered in the conductive layer in the one side of base material, described making circuitous pattern is the circuitous pattern of making the functional areas of capacitance plate on described conductive layer, and the decorative layer of making is at the edge of the one side relative with conductive layer of described base material;
In S30, semi-manufacture that step S20 is obtained, on circuitous pattern, connect flexible circuit board;
S40, the semi-manufacture that step S30 obtained by transparent optical cement fit on described tempered glass, and the face at decorative layer place and tempered glass laminating.
2. the method for making of capacitance plate as claimed in claim 1, it is characterized in that, described circuitous pattern comprise capacitance plate visible area circuit and be connected with described line electricity for capacitance plate and the extraneous contact conductor being electrically connected, and described contact conductor is positioned at the edge of described circuit.
3. the method for making of capacitance plate as claimed in claim 2, it is characterized in that, also be included between step S20 and S30 and make contact conductor, described contact conductor is by electroplating or printing the edge that is arranged at described circuit, and described contact conductor is connected with described flexible circuit board.
4. the method for making of capacitance plate as claimed in claim 3, is characterized in that, described contact conductor is the silver slurry of printing.
5. the method for making of the capacitance plate as described in claim 1 or 4, is characterized in that, described making circuitous pattern forms by coiled material etching, and described making decorative layer forms by coiled material printing.
6. the method for making of the capacitance plate as described in claim 1 or 4, is characterized in that, described decorative layer is the ink layer of printing.
7. the method for making of the capacitance plate as described in claim 1 or 4, is characterized in that, also comprises that the semi-manufacture that step S20 is made are by radium-shine cutting or the die-cut semi-manufacture that are divided into some fritters before step S30.
8. the method for making of capacitance plate as claimed in claim 4, is characterized in that, is also included in step S40 and on conducting film, makes protective seam afterwards, and described protective seam all covers the one side relative with base material of conducting film.
9. the method for making of capacitance plate as claimed in claim 1, is characterized in that, described transparent optical cement is pressure sensitive adhesive.
10. the method for making of the capacitance plate as described in claim 1 or 8, is characterized in that, the conductive material of described conductive layer is Nano Silver.
11. 1 kinds of capacitance plates, it is characterized in that, comprise: conducting film, tempered glass and transparent optical cement, described conducting film comprises base material and is arranged at the conductive layer of the circuitous pattern of the formation capacitance plate on base material, on described conducting film, the edge of the one side relative with conductive layer is provided with decorative layer, on described circuitous pattern, be connected with flexible circuit board, one side relative with conductive layer on conducting film fits on tempered glass by described transparent optical cement.
12. capacitance plates as claimed in claim 11, is characterized in that, also comprise the contact conductor being positioned on conductive layer, and described contact conductor is connected with described flexible circuit board.
13. capacitance plates as claimed in claim 12, is characterized in that, also comprise protective seam, and described protective seam all covers the one side relative with base material of conducting film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210485955.1A CN103838442A (en) | 2012-11-26 | 2012-11-26 | Capacitive screen and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210485955.1A CN103838442A (en) | 2012-11-26 | 2012-11-26 | Capacitive screen and manufacturing method thereof |
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| CN103838442A true CN103838442A (en) | 2014-06-04 |
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| CN201210485955.1A Pending CN103838442A (en) | 2012-11-26 | 2012-11-26 | Capacitive screen and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104881173A (en) * | 2015-06-03 | 2015-09-02 | 牧东光电（苏州）有限公司 | Touch panel structure and production technology thereof |
| CN105528962A (en) * | 2016-01-13 | 2016-04-27 | 江苏银晶光电科技发展有限公司 | Nano silver paste printed glass display screen and manufacturing process thereof |
| CN112192930A (en) * | 2020-09-30 | 2021-01-08 | 宜昌南玻显示器件有限公司 | Pretreatment process and device for preparing touch screen by taking film material as substrate |
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| CN102077155A (en) * | 2008-06-27 | 2011-05-25 | 世景有限公司 | Window panel integrated capacitive-type touch sensor and a fabrication method therefor |
| CN102331894A (en) * | 2011-09-27 | 2012-01-25 | 利信光学（苏州）有限公司 | Capacitive touch screen structure |
| JP2012107130A (en) * | 2010-11-18 | 2012-06-07 | Toray Advanced Film Co Ltd | Adhesive sheet and display device |
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| CN102077155A (en) * | 2008-06-27 | 2011-05-25 | 世景有限公司 | Window panel integrated capacitive-type touch sensor and a fabrication method therefor |
| CN101676845A (en) * | 2008-09-17 | 2010-03-24 | 苹果公司 | Method for transferring thin film to substrate |
| JP2012107130A (en) * | 2010-11-18 | 2012-06-07 | Toray Advanced Film Co Ltd | Adhesive sheet and display device |
| CN102331894A (en) * | 2011-09-27 | 2012-01-25 | 利信光学（苏州）有限公司 | Capacitive touch screen structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104881173A (en) * | 2015-06-03 | 2015-09-02 | 牧东光电（苏州）有限公司 | Touch panel structure and production technology thereof |
| CN105528962A (en) * | 2016-01-13 | 2016-04-27 | 江苏银晶光电科技发展有限公司 | Nano silver paste printed glass display screen and manufacturing process thereof |
| CN112192930A (en) * | 2020-09-30 | 2021-01-08 | 宜昌南玻显示器件有限公司 | Pretreatment process and device for preparing touch screen by taking film material as substrate |
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