CN103834348A - Organic silicon pressure sensitive adhesive - Google Patents
Organic silicon pressure sensitive adhesive Download PDFInfo
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- CN103834348A CN103834348A CN201410066081.5A CN201410066081A CN103834348A CN 103834348 A CN103834348 A CN 103834348A CN 201410066081 A CN201410066081 A CN 201410066081A CN 103834348 A CN103834348 A CN 103834348A
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- organic silicon
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- sensitive adhesive
- adhesive
- silicon pressure
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Abstract
The invention discloses an organic silicon pressure sensitive adhesive which is prepared by reacting the following substances in percentage by mass: 45-50% of organic silicon adhesive, 2-4% of hydroxyl polysiloxane, 2-5% of stannous octoate, 2-3% of isopropyl tri(dodecylbenzene phenylsulfonyl) titanate, 0.5-5% of alkynol, 15-30% of tackifying resin and 15-25% of azo-compound foaming agent, wherein the azo-compound foaming agent is any one of azodicarbonamide, azodiisobutyronitrile, azo-dioctyl phthalate diisopropyl ester, azo-dioctyl phthalate diethyl ester, diazo-aminobenzene or azo-dibarium formate; the hydroxyl polysiloxane is alpha,omega-dyhydroxy polysiloxane; the tackifying resin is a MQ resin. The structural size of the micro pore structure of the organic silicon adhesive can be adjusted, the micro pores can be arranged densely or sparsely, and the problem that the conventional organic silicon adhesive is not smooth in gas discharge is solved.
Description
Technical field
The present invention relates to a kind of organic silicon pressure-sensitive adhesive, belong to adhesive material technical field.
Background technology
The sizing of organic silicon adhesive is the siloxanes by one or more line styles, ring-type or branched chain type, under catalyst action, and the line style of the high molecule mass making by reactions such as balance, addition or condensations or cross-linking type siloxanes composition.Organic silicon adhesive mainly contains rubber-type and resin type two classes.The features such as that organic silicon adhesive has is high temperature resistant, clinging power stable, persistence is good, are widely used in the every field such as aviation, navigation, spaceship, rocket-powered missile, nuclear power, electronic apparatus industry.Along with organic silicon adhesive is the progressively expansion of the range of application of adhesive tape, all trades and professions are that the quality of adhesive tape and the application of properties have proposed new requirement to organic silicon adhesive.The adhesive surface of many irregular and different treatment technique, making organic silicon adhesive is that the application of adhesive tape is by simply changing to special use.The preparation technology that general organic silicon adhesive is adhesive tape is the surface that organic silicon adhesive is coated on to adhesive band base (as various films, paper etc.).Organic silicon adhesive is that a large purposes of adhesive tape is to make protective membrane, for the protection of the surface of the materials such as transport or the glass of use procedure, sheet metal, plastic plate, makes its surface avoid contact stain(ing) or polishing scratch scratches.In the time that organic silicon adhesive is adhesive tape protective membrane protection electronic product surface, because these surfaces can apply some water-miscible paints, the chemical substances such as gloss oil, in general technology, there is chemical substance solvent on these surfaces, small molecules etc. are residual, be that protective membrane is when being fitted in surface and protecting with existing organic silicon adhesive, due to the smooth consolidation of organic silicon adhesive layer, between protected surface and organic silicon adhesive, there is no exhaust-duct, when volatilizing, residual small-molecule substance can not discharge, when long-time use, there will be aberration, circle prints, the bad phenomenon such as peculiar smell, this is because the super planarization of silica gel, cannot breathe freely and cause.
Summary of the invention
The invention provides a kind of organic silicon pressure-sensitive adhesive, in order to prepare organic silicon adhesive protective membrane, object is to solve the not smooth problem of existing organic silicon adhesive exhaust.
For achieving the above object, the technical solution used in the present invention is: a kind of organic silicon pressure-sensitive adhesive, and described organic silicon adhesive is made after reaction by the material of following quality percentage composition:
Organic silicon adhesive 45 ~ 50%;
Hydroxyl polysiloxane 2 ~ 4%;
Stannous octoate 2 ~ 5%;
Sec.-propyl three (dodecyl benzene sulfonyl) titanic acid ester 2-3%;
Alkynol 0.5 ~ 5%;
Tackifying resin 15 ~ 30%;
Azo-compound whipping agent 15 ~ 25%.
In technique scheme, further improved technical scheme is as follows:
1, in such scheme, described azo-compound whipping agent be in Cellmic C 121, Diisopropyl azodicarboxylate, diisopropyl azodiformate, diethyl azodiformate, two azoaminobenzenes or Barium azodicarboxylate any one.
2,, in such scheme, described hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
3, in such scheme, described alkynol is propiolic alcohol, methylbutynol, methylparafynol, l-hexyn-3-ol, 3,6-dimethyl-4-octyne-3, the one in 6-glycol.
4, in such scheme, described tackifying resin is MQ resin, and a kind of silicone resin that MQ resin is made up of simple function group Si-O unit (M unit) and four-functional group Si-O unit (SiQZ is called for short Q unit), has the tight globe of bilayer structure.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
Organic silicon pressure-sensitive adhesive of the present invention, has realized general organic silicon adhesive has been transformed into the microporous type organic silicon adhesive with microvoid structure, makes organic silicon adhesive have venting quality, adsorptivity, and micropore is hollow simultaneously, has the micromolecular function of absorption.The microvoid structure size of organic silicon adhesive can regulate, micropore arranged evenly can be tightly can pine, can be according to final requirement, decide the structure of micropore and the size of viscosity.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of organic silicon pressure-sensitive adhesive, described organic silicon adhesive is made after reaction by the material of following quality percentage composition:
Organic silicon adhesive 50%;
Hydroxyl polysiloxane 3%;
Stannous octoate 3%;
Sec.-propyl three (dodecyl benzene sulfonyl) titanic acid ester 2%;
Alkynol 2%;
Tackifying resin 20%;
Diisopropyl azodicarboxylate 20%.
Above-mentioned hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
Above-mentioned tackifying resin is MQ resin.
Above-mentioned alkynol is propiolic alcohol.
Preparation method:
The first step, chooses a kind of organic silicon adhesive, adds other auxiliary agent as hydroxyl polysiloxane 3%; Stannous octoate 3%; Sec.-propyl three (dodecyl benzene sulfonyl) titanic acid ester 2%; Alkynol 2%; Tackifying resin 20%; Diisopropyl azodicarboxylates 20% etc., add in order one by one, stir.
Second step, according to the kind of whipping agent, select suitable temperature, the solidification value >100 degree of general silica gel, be chosen in the whipping agent of 100 degree with interior foaming, oven temperature arranges as follows: 50,80,100,120,140,140,70, and between 50 ~ 80 degree, be first solvent flashing, between 85 degree and 100 degree, foam, between 120-180, carry out solidifying of silica gel.The type of foaming can obtain perforate according to the difference of whipping agent, can be also the microporous type organic silicon adhesive of closed pore.Thereby make microporous type organic silicon adhesive there is good permeability.
Through measuring: the pore diameter range of micropore is distributed as 1nm ~ 5cm.Pore density is highdensity, is more than or equal to 45 kg/m
3.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (5)
1. an organic silicon pressure-sensitive adhesive, is characterized in that: described organic silicon adhesive is made after reaction by the material of following quality percentage composition:
Organic silicon adhesive 45 ~ 50%;
Hydroxyl polysiloxane 2 ~ 4%;
Stannous octoate 2 ~ 5%;
Sec.-propyl three (dodecyl benzene sulfonyl) titanic acid ester 2-3%;
Alkynol 0.5 ~ 5%;
Tackifying resin 15 ~ 30%;
Azo-compound whipping agent 15 ~ 25%.
2. organic silicon pressure-sensitive adhesive according to claim 1, is characterized in that: described azo-compound whipping agent be in Cellmic C 121, Diisopropyl azodicarboxylate, diisopropyl azodiformate, diethyl azodiformate, two azoaminobenzenes or Barium azodicarboxylate any one.
3. organic silicon pressure-sensitive adhesive according to claim 1, is characterized in that: described hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
4. organic silicon pressure-sensitive adhesive according to claim 1, is characterized in that: described tackifying resin is MQ resin.
5. organic silicon pressure-sensitive adhesive according to claim 1, is characterized in that: described alkynol is propiolic alcohol, methylbutynol, methylparafynol, l-hexyn-3-ol, 3,6-dimethyl-4-octyne-3, the one in 6-glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410066081.5A CN103834348A (en) | 2012-07-09 | 2012-07-09 | Organic silicon pressure sensitive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410066081.5A CN103834348A (en) | 2012-07-09 | 2012-07-09 | Organic silicon pressure sensitive adhesive |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234767.1A Division CN102757757B (en) | 2012-07-09 | 2012-07-09 | Micropore-type organic silicone adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103834348A true CN103834348A (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410066081.5A Pending CN103834348A (en) | 2012-07-09 | 2012-07-09 | Organic silicon pressure sensitive adhesive |
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| CN (1) | CN103834348A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104387961A (en) * | 2014-12-08 | 2015-03-04 | 江苏诺飞新材料科技有限公司 | Organic silicon pressure-sensitive surface coating |
| CN106497489A (en) * | 2016-10-26 | 2017-03-15 | 沈阳万合胶业股份有限公司 | A kind of porous type pressure sensitive adhesive and preparation method thereof |
| CN109467717A (en) * | 2018-09-14 | 2019-03-15 | 张家港康得新光电材料有限公司 | A kind of silica gel and its preparation method and application |
| CN109523842A (en) * | 2018-11-01 | 2019-03-26 | 苏州泛普科技股份有限公司 | Highly sensitive touch-control blackboard |
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| CN1417260A (en) * | 2002-12-04 | 2003-05-14 | 刘淑芬 | Solid silica gel |
| EP1954743A1 (en) * | 2005-12-01 | 2008-08-13 | Wacker Chemie AG | Ionically and/or organometallically functionalized silicone polymers crosslinkable to high-strength elastomers |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104387961A (en) * | 2014-12-08 | 2015-03-04 | 江苏诺飞新材料科技有限公司 | Organic silicon pressure-sensitive surface coating |
| CN106497489A (en) * | 2016-10-26 | 2017-03-15 | 沈阳万合胶业股份有限公司 | A kind of porous type pressure sensitive adhesive and preparation method thereof |
| CN109467717A (en) * | 2018-09-14 | 2019-03-15 | 张家港康得新光电材料有限公司 | A kind of silica gel and its preparation method and application |
| CN109523842A (en) * | 2018-11-01 | 2019-03-26 | 苏州泛普科技股份有限公司 | Highly sensitive touch-control blackboard |
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Application publication date: 20140604 |