CN103825570B - Cavity for acquiring terahertz waves based on avalanche diode high-order frequency doubling - Google Patents
Cavity for acquiring terahertz waves based on avalanche diode high-order frequency doubling Download PDFInfo
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- CN103825570B CN103825570B CN201410028807.6A CN201410028807A CN103825570B CN 103825570 B CN103825570 B CN 103825570B CN 201410028807 A CN201410028807 A CN 201410028807A CN 103825570 B CN103825570 B CN 103825570B
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- avalanche diode
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CN201410028807.6A CN103825570B (en) | 2014-01-22 | 2014-01-22 | Cavity for acquiring terahertz waves based on avalanche diode high-order frequency doubling |
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CN201410028807.6A CN103825570B (en) | 2014-01-22 | 2014-01-22 | Cavity for acquiring terahertz waves based on avalanche diode high-order frequency doubling |
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CN103825570A CN103825570A (en) | 2014-05-28 |
CN103825570B true CN103825570B (en) | 2017-01-11 |
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CN201410028807.6A Expired - Fee Related CN103825570B (en) | 2014-01-22 | 2014-01-22 | Cavity for acquiring terahertz waves based on avalanche diode high-order frequency doubling |
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Families Citing this family (2)
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CN105720921A (en) * | 2016-01-27 | 2016-06-29 | 西安电子工程研究所 | High-order frequency multiplier based on IMPATT (Impact Avalanche and Transit Time) diode |
CN109283448B (en) * | 2018-10-08 | 2021-01-05 | 北方电子研究院安徽有限公司 | Avalanche diode high-frequency tuning device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103500867A (en) * | 2013-09-26 | 2014-01-08 | 西安空间无线电技术研究所 | Frequency-adjustable and power-tunable terahertz avalanche oscillator |
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US6600387B2 (en) * | 2001-04-17 | 2003-07-29 | Channel Master Llc | Multi-port multi-band transceiver interface assembly |
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CN103500867A (en) * | 2013-09-26 | 2014-01-08 | 西安空间无线电技术研究所 | Frequency-adjustable and power-tunable terahertz avalanche oscillator |
Non-Patent Citations (1)
Title |
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Photosensitivity Analysis of Gallium Nitride and Silicon Carbide Terahertz IMPATT Oscillators: Comparison of Theoretical Reliability and Study on Experimental Feasibility;Moumita Mukherjee 等;《Device and Materials Reliability, IEEE Transactions on》;20081031;第611页第III节-第618页 * |
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Inventor after: Zhao Jiaqi Inventor after: Zhu Zhongbo Inventor after: Wang Chun Inventor after: Xu Kuiwen Inventor after: Zhang Bin Inventor after: Ran Lixin Inventor before: Zhao Jiaqi Inventor before: Zhu Zhongbo Inventor before: Xu Kuiwen Inventor before: Zhang Bin Inventor before: Ran Lixin |
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Granted publication date: 20170111 Termination date: 20200122 |