CN103820828A - Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer - Google Patents

Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer Download PDF

Info

Publication number
CN103820828A
CN103820828A CN201410041180.8A CN201410041180A CN103820828A CN 103820828 A CN103820828 A CN 103820828A CN 201410041180 A CN201410041180 A CN 201410041180A CN 103820828 A CN103820828 A CN 103820828A
Authority
CN
China
Prior art keywords
copper
copper pipe
flt
copper coin
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410041180.8A
Other languages
Chinese (zh)
Inventor
张大吉
范维东
赵宗华
李鹏
王洪林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QINHUANGDAO SHOUGANG CHANGBAI MOULD CO Ltd
Original Assignee
QINHUANGDAO SHOUGANG CHANGBAI MOULD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QINHUANGDAO SHOUGANG CHANGBAI MOULD CO Ltd filed Critical QINHUANGDAO SHOUGANG CHANGBAI MOULD CO Ltd
Priority to CN201410041180.8A priority Critical patent/CN103820828A/en
Publication of CN103820828A publication Critical patent/CN103820828A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a nanometer Ni-Co-B coating technology for a copper plate/copper tube of a continuous casting crystallizer. The nanometer Ni-Co-B coating technology comprises the following steps: grinding, removing oil, washing with water, clamping, removing ionized water, activating, electroplating and washing with water. The coating has higherhardness and strong anti-corrosion capability, the electroplating deposition rate is high, and the coating is lustrous, bright, colorful, smooth and mirror-like, and is free of cracks. Besides, the depth capability and the coverage capability of the solution are stronger. Compared with chromium plating, the depth capability is 17.5 times of the traditional chromium plating, and the coverage capability is 3.2 times of the traditional chromium plating. The pollution to environments is smaller, and the treatment technology of waste water, waste liquid and waste gas is simple.

Description

The nanometer Ni-Co-B plating process of continuous casting crystallizer copper plate/copper pipe
Technical field
The invention belongs to electroplating technology, spy relates to a kind of nanometer Ni-Co-B plating process of continuous casting crystallizer copper plate/copper pipe.
Background technology
Be applied to its technique of the comparatively common electrolytic coating of continuous caster crystallizer copperplate/copper pipe continuous casting is in the past: Ni-Co alloy layer, Cr coating, Ni-Fe coating, Ni-Co alloy layer+Cr coating etc.Each copper coin/pipe producer is basic identical for the technological process of production of crystallizer copper pipe coating, and the key distinction is on electroplating technology formula slightly different.Except Ni-Fe coating range of application is more limited, other three kinds of coating all obtain extensive space.In using, continuous caster is most widely used with Cr coating, take the steel transportation amount of Ni-Co alloy layer+Cr coating as optimum.But also there is certain deficiency in above two kinds of electroplating technologies:
Cr coating low production cost, simple to operate, process stabilizing, so should be the most extensive, Ni-Co alloy layer+Cr coating is due to the difference of coating structure, the wear resisting property of copper pipe entirety is promoted, and steel transportation amount is also for the highest, but the maximum shortcoming of above two kinds of coating is exactly all to have used Cr 6+electroplating technology, Cr 6+be the strict emphasis blowdown thing of controlling of China, its emission request management intensity is constantly strengthened, due to the pressure from environment aspect, hexavalent chromium plating process application is day by day narrow.
Summary of the invention
In view of above-mentioned present situation, the invention provides a kind of nanometer Ni-Co-B plating process of continuous casting crystallizer copper plate/copper pipe.Making the main component of its nanometer Ni-Co-B electroplating technology is Ni 2+and Co 2+, these two kinds of ions are compared with Cr 6+the impact that compares environment is smaller, is not the pollutent of the strict discharge of controlling of country, and environmental protection pressure is little.The wear resistance of coating is strong, and the steel transportation amount of crystallizer copper pipe is high.
Processing step of the present invention is as follows:
1, configuration tank liquor:
(1) get single nickel salt: 180-230g/L, nickelous chloride: 40-45 g/L, rose vitriol: 45-55 g/L, boric acid: No. 4, No. 3, No. 2, No. 1,45-50 g/L, FLT-6 MU: 50-100ml/L, FLT-6 MU: 30-80ml/L, FLT-6 MU: 19-25ml/L, FLT-6 MU: 20-30ml/L;
(2) add the deionized water of cumulative volume 1/3, be heated to 60-70 ℃;
(3) boric acid that takes formula ratio first dissolves;
(4) getting respectively rose vitriol, single nickel salt and nickelous chloride is dissolved in groove;
(5) fully stir with 1-3ml/l hydrogen peroxide, then add potassium permanganate, static 4-8 hour, adds 1-2g/l gac and stirs static filtration, and energising maintains current density at 0.1-0.15 ampere/square decimeter 8-12 hour;
(6) No. MU2, No. 1, FLT-6 that adds FLT-6 MU, is stirred to solution Clear & Transparent;
(7) continue to stir, in stirring, add No. 3, the water-reducible FLT-6 MU of deionization, No. MU4, FLT-6 with 5 times, then add deionized water to prescribed volume, adjust plating solution potential of hydrogen between 3.8-5.5, obtain plating solution for subsequent use;
2, polishing: polishing mode is to use 280# and 400# silicon carbide paper successively polish copper coin/copper pipe R angle and four sides, makes it spill matrix surface, removes surface film oxide and greasy dirt;
3, oil removing: use acid degreasing fluid, oil removing at ambient temperature, till presenting moisture film to the flushing of matrix surface water;
4, washing: rinse out the impurity of copper coin/copper pipe surface, avoid polluting tank liquor;
5, be installed: the copper coin/copper pipe after cleaning is installed to and is electroplated on workstation, the titanium anode that nickel button is housed is put into copper coin/copper pipe, recycling clamp is fixed anode, and the distance between anode and copper coin/copper pipe is controlled between 20mm;
6, deionized water: other harmful ions that rinse out copper coin/copper pipe surface;
7, activation: with salt acid soak copper coin/copper pipe 1-2 minute, remove the zone of oxidation of copper coin/copper pipe surface, activation matrix surface, increases the bonding force between copper coin/copper pipe and coating;
8, electroplate: utilize submersible pump plating solution to be imported from coating bath to copper coin/copper pipe, after copper coin/copper pipe is filled plating solution, connect wire, firing current is electroplated;
Electric current given: by the area of electroplating copper coin/copper pipe, then according to the current density of 2-10A/ square decimeter, calculate given electric current;
9 washings: electroplate after finishing copper coin/copper pipe is unloaded, rinse out the residual plating solution of copper coin/copper pipe surface with tap water, obtain nanometer: ni-Co-Bcopper coin/the copper pipe of coating.
The effect that nanometer Ni-Co-B plating process of the present invention has is:
1, there is higher hardness and resistance to corrosion.Coating hardness is about 720HV, can reach 900HV through heat treatment hardness.
2, electroplating deposition speed is fast.The fastest sedimentation rate can reach 40mm/h, and sedimentation velocity is 2 times of chromium plating.
3, coating bright in color, bright-coloured, level and smooth, is mirror-like, there is no crackle.
4, coating internal stress is smaller, has good bonding force with matrix surface.
5, degree of depth ability and the covering power of solution are more intense, and it is 17.5 times that degree of depth ability is compared in its chromium plating, and covering power is 3.2 times.
6, current efficiency, higher than 96%, is 4 times of chromium plating efficiency.
7, environmental pollution is smaller, and waste water, waste liquid, waste gas treatment process are simple.
Embodiment
Below in conjunction with processing method, the invention will be further described.
Embodiments of the invention, take 150x150 model crystallizer copper pipe as example: the steel transportation amount of plating Cr layer copper pipe is 3500-4000 ton, the steel transportation amount of Ni-Co alloy layer+Cr coating copper pipe is 4000-4500 ton, and the steel transportation amount of nanometer Ni-Co-B coating copper pipe is 6000-7000 ton.
1, configuration tank liquor:
(1) first measure the size of coating bath, length, calculate the cubic capacity of coating bath, get single nickel salt: 180g/L, nickelous chloride: 40 g/L, rose vitriol: No. 4, No. 3, No. 2, No. 1,45 g/L, boric acid: 45g/L, FLT-6 MU: 50ml/L, FLT-6 MU: 30ml/L, FLT-6 MU: 19ml/L, FLT-6 MU: 20ml/L, calculates each material and join groove addition;
(2) first add the deionized water of cumulative volume 1/3, reheat 60-70 ℃;
(3) boric acid that takes formula ratio first dissolves;
(4) taking respectively rose vitriol, single nickel salt and nickelous chloride is dissolved in groove;
(5) fully stir with 1-3ml/l hydrogen peroxide, then add potassium permanganate, static 4-8 hour, adds 1-2g/l gac and stirs static filtration, and energising maintains current density at 0.1-0.15 ampere/square decimeter 8-12 hour;
(6) add No. 1, FLT-6 MU, No. MU2, the FLT-6 of regulation, be stirred to solution clear, transparent;
(7) continue to stir, No. MU4, No. 3, FLT-6 that add FLT-6 MU in the stirring deionized water dilution of 5 times (first with), then be added into prescribed volume with deionized water, adjustment plating solution potential of hydrogen is between 3.8-5.5;
2, polishing: polishing mode is to use 280# and 400# silicon carbide paper successively polish copper pipe R angle and four sides, makes it spill matrix surface, removes surface film oxide and greasy dirt;
3, oil removing: use acid degreasing fluid, manual oil removing at ambient temperature, presents moisture film until matrix surface water rinses;
4, washing: rinse out dust and the impurity of copper pipe surface, avoid polluting tank liquor;
5, be installed: the copper pipe after cleaning is installed to and is electroplated on workstation, the titanium anode that nickel button is housed is put into copper pipe, recycling clamp is fixed anode, and the distance between anode and copper pipe is controlled between 20mm;
6, deionized water: utilize submersible pump that deionized water is imported in copper pipe and rinses out the residual hydrochloric acid of copper pipe surface, avoiding entering tank liquor affects bath pH value, after flushing finishes bleeds off deionized water, avoids polluting tank liquor;
7, activation: with salt acid soak matrix 1-2 minute, remove the zone of oxidation of matrix surface, activation matrix surface, increases the bonding force between matrix and coating;
8, electroplate: utilize submersible pump plating solution to be imported from coating bath to copper pipe, after copper pipe is filled plating solution, connect wire, firing current is electroplated;
Electric current given: first calculate the area (square decimeter) of electroplating copper pipe, then according to the current density of 2-10A/ square decimeter, calculate given electric current, given electric current=copper pipe area * current density;
9 washings: electroplate after finishing copper pipe is unloaded, rinse out the residual plating solution of copper pipe surface with tap water, be adsorbed on copper pipe surface after avoiding plating solution dry, affect copper pipe visual appearance.
Electroplating technological parameter:
Working parameter Scope
Single nickel salt 180-230g/L
Nickelous chloride 40-45 g/L
Rose vitriol 45-55 g/L
Boric acid 45-50 g/L
No. 1, FLT-6 MU 50-100ml/L
No. 2, FLT-6 MU 30-80ml/L
No. 3, FLT-6 MU 19-25ml/L
No. 4, FLT-6 MU 20-30ml/L
Current density A/dm 2-10A
pH 3.8-5.5(4.8)
Temperature 50-58℃
Anode material Pure nickel
Anode and negative electrode ratio 1.5-5.0:1.0
Working fluid alr mode Movable cathode stirs or plating solution circulation stirs
Working fluid purification style 5 microns of filter cores (density)
Pump and groove Polyvinyl chloride polystyrene
Bath maintenance and control:
1, potential of hydrogen regulates
Control the potential of hydrogen of solution with 50% ammoniacal liquor (analytical pure) or 10% sulfuric acid (analytical pure), while adding these reagent, must very slowly and stablize, avoid the unexpected increase and decrease of local potential of hydrogen.
2, adding of additive:
Add an additive according to every 200AH.The concrete additional amount of each additive is as following table:
Additive title Additional amount (200AH)
No. 1, FLT-6 MU 600ml
No. 2, FLT-6 MU 600-620ml
No. 3, FLT-6 MU 600ml
No. 4, FLT-6 MU 600ml

Claims (1)

1. a nanometer Ni-Co-B plating process for continuous casting crystallizer copper plate/copper pipe, its processing step is as follows:
1) configuration tank liquor:
(1) get single nickel salt: 180-230g/L, nickelous chloride: 40-45 g/L, rose vitriol: 45-55 g/L, boric acid: No. 4, No. 3, No. 2, No. 1,45-50 g/L, FLT-6 MU: 50-100ml/L, FLT-6 MU: 30-80ml/L, FLT-6 MU: 19-25ml/L, FLT-6 MU: 20-30ml/L;
(2) add the deionized water of cumulative volume 1/3, be heated to 60-70 ℃;
(3) boric acid that takes formula ratio first dissolves;
(4) getting respectively rose vitriol, single nickel salt and nickelous chloride is dissolved in groove;
(5) fully stir with 1-3ml/l hydrogen peroxide, then add potassium permanganate, static 4-8 hour, adds 1-2g/l gac and stirs static filtration, and energising maintains current density at 0.1-0.15 ampere/square decimeter 8-12 hour;
(6) No. MU2, No. 1, FLT-6 that adds FLT-6 MU, is stirred to solution clear;
(7) continue to stir, in stirring, add No. 3, the water-reducible FLT-6 MU of deionization, No. MU4, FLT-6 with 5 times, then add deionized water to prescribed volume, adjust plating solution potential of hydrogen between 3.8-5.5, obtain plating solution for subsequent use;
2) polishing: polishing mode is to use 280# and 400# silicon carbide paper successively polish copper coin/copper pipe R angle and four sides, makes it spill matrix surface, removes surface film oxide and greasy dirt;
3) oil removing: use acid degreasing fluid, oil removing at ambient temperature, till presenting moisture film to the flushing of matrix surface water;
4) washing: rinse out the impurity of copper coin/copper pipe surface, avoid polluting tank liquor;
5) be installed: the copper coin/copper pipe after cleaning is installed to and is electroplated on workstation, the titanium anode that nickel button is housed is put into copper coin/copper pipe, recycling clamp is fixed anode, and the distance between anode and copper coin/copper pipe is controlled between 20mm;
6) deionized water: other harmful ions that rinse out copper coin/copper pipe surface;
7) activation: with salt acid soak copper coin/copper pipe 1-2 minute, remove the zone of oxidation of copper coin/copper pipe surface, activation matrix surface, increases the bonding force between copper coin/copper pipe and coating;
8) electroplate: utilize submersible pump plating solution to be imported from coating bath to copper coin/copper pipe, after copper coin/copper pipe is filled plating solution, connect wire, firing current is electroplated;
Electric current given: by the area of electroplating copper coin/copper pipe, then according to the current density of 2-10A/ square decimeter, calculate given electric current;
9) washing: electroplate after finishing copper coin/copper pipe is unloaded, rinse out the residual plating solution of copper coin/copper pipe surface with tap water, obtain the copper coin/copper pipe of nanometer Ni-Co-B coating.
CN201410041180.8A 2014-01-28 2014-01-28 Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer Pending CN103820828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410041180.8A CN103820828A (en) 2014-01-28 2014-01-28 Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410041180.8A CN103820828A (en) 2014-01-28 2014-01-28 Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer

Publications (1)

Publication Number Publication Date
CN103820828A true CN103820828A (en) 2014-05-28

Family

ID=50756106

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410041180.8A Pending CN103820828A (en) 2014-01-28 2014-01-28 Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer

Country Status (1)

Country Link
CN (1) CN103820828A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107604397A (en) * 2017-10-30 2018-01-19 西峡龙成特种材料有限公司 The electro-plating method of continuous casting crystallizer copper plate deposit N i Co B alloy layers
CN109604126A (en) * 2018-10-31 2019-04-12 博罗县东明化工有限公司 Aluminium alloy sprays pre-treating method
CN111074308A (en) * 2019-12-30 2020-04-28 福建南平南孚电池有限公司 Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939449A (en) * 1982-08-26 1984-03-03 Kawasaki Steel Corp Casting mold for continuous casting of iron and steel
US5213907A (en) * 1990-10-09 1993-05-25 Diamond Technologies Company Nickel-cobalt-boron-alloy deposited on a substrate
CN1384226A (en) * 2001-08-02 2002-12-11 西峡龙成冶材集团有限公司 Ni-Co alloy electroplating process for copper plate working surface of continuously casting crystallizer
CN1454735A (en) * 2003-04-30 2003-11-12 陈小飞 Method of manufacturing crystallizer of square or rectangular billet copper tube
CN1465753A (en) * 2002-06-25 2004-01-07 首钢总公司 Electroplating method for internal surface of crystallizer
CN2825657Y (en) * 2005-08-13 2006-10-11 烟台首钢东星(集团)公司 Titanium anode basket for electroplating in the internal wall of copper tube used in mould
KR20080101342A (en) * 2007-05-17 2008-11-21 주식회사 엘막 Using high frequence pluse of electrolytic plating method of ni-co-b for heat resistance hardness and high conductivity
CN101724874A (en) * 2008-10-17 2010-06-09 上海宝钢设备检修有限公司 Surface repairing method for thin-strip continuous casting crystallizing roller or casting blank continuous casting crystallizer
CN102352522A (en) * 2011-10-31 2012-02-15 哈尔滨工业大学 Electric deposition preparation method of Ni-Co-B alloy substituted hard chromium plating
CN102433577A (en) * 2011-12-26 2012-05-02 无锡海普斯新材料科技有限公司 Rare earth-nickel-cobalt-boron multi-element alloy anticorrosion and wear-resistant plating, electroplating liquid and preparation method of electroplating liquid
CN202347118U (en) * 2011-11-15 2012-07-25 大连经济技术开发区大山表面处理有限公司 Titanium anode for electroplating nickel alloy of crystallizer copper tube
CN102773434A (en) * 2012-08-01 2012-11-14 西峡龙成特种材料有限公司 Nanocomposite electroplating layer copper plate of continuous casting crystallizer and preparation process of nanocomposite electroplating layer copper plate
CN103233251A (en) * 2013-04-24 2013-08-07 秦皇岛首钢长白结晶器有限责任公司 Method for electroforming Co-Ni alloy coating on copper plate for continuous casting crystallizer

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939449A (en) * 1982-08-26 1984-03-03 Kawasaki Steel Corp Casting mold for continuous casting of iron and steel
US5213907A (en) * 1990-10-09 1993-05-25 Diamond Technologies Company Nickel-cobalt-boron-alloy deposited on a substrate
CN1384226A (en) * 2001-08-02 2002-12-11 西峡龙成冶材集团有限公司 Ni-Co alloy electroplating process for copper plate working surface of continuously casting crystallizer
CN1465753A (en) * 2002-06-25 2004-01-07 首钢总公司 Electroplating method for internal surface of crystallizer
CN1454735A (en) * 2003-04-30 2003-11-12 陈小飞 Method of manufacturing crystallizer of square or rectangular billet copper tube
CN2825657Y (en) * 2005-08-13 2006-10-11 烟台首钢东星(集团)公司 Titanium anode basket for electroplating in the internal wall of copper tube used in mould
KR20080101342A (en) * 2007-05-17 2008-11-21 주식회사 엘막 Using high frequence pluse of electrolytic plating method of ni-co-b for heat resistance hardness and high conductivity
CN101724874A (en) * 2008-10-17 2010-06-09 上海宝钢设备检修有限公司 Surface repairing method for thin-strip continuous casting crystallizing roller or casting blank continuous casting crystallizer
CN102352522A (en) * 2011-10-31 2012-02-15 哈尔滨工业大学 Electric deposition preparation method of Ni-Co-B alloy substituted hard chromium plating
CN202347118U (en) * 2011-11-15 2012-07-25 大连经济技术开发区大山表面处理有限公司 Titanium anode for electroplating nickel alloy of crystallizer copper tube
CN102433577A (en) * 2011-12-26 2012-05-02 无锡海普斯新材料科技有限公司 Rare earth-nickel-cobalt-boron multi-element alloy anticorrosion and wear-resistant plating, electroplating liquid and preparation method of electroplating liquid
CN102773434A (en) * 2012-08-01 2012-11-14 西峡龙成特种材料有限公司 Nanocomposite electroplating layer copper plate of continuous casting crystallizer and preparation process of nanocomposite electroplating layer copper plate
CN103233251A (en) * 2013-04-24 2013-08-07 秦皇岛首钢长白结晶器有限责任公司 Method for electroforming Co-Ni alloy coating on copper plate for continuous casting crystallizer

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
刘仁志: "《电镀添加剂技术问答》", 28 February 2009, 化学工业出版社 *
崔 莹等: "电沉积 Ni­Co­B 纳米晶合金代硬铬镀层", 《中国有色金属学报》 *
崔 莹等: "电沉积 Ni­Co­B 纳米晶合金代硬铬镀层", 《中国有色金属学报》, vol. 22, no. 11, 30 November 2012 (2012-11-30), pages 3113 - 3122 *
谢无极: "《电镀工程师手册》", 30 June 2011, 化学工业出版社, article "电镀生产管理", pages: 801-803 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107604397A (en) * 2017-10-30 2018-01-19 西峡龙成特种材料有限公司 The electro-plating method of continuous casting crystallizer copper plate deposit N i Co B alloy layers
CN107604397B (en) * 2017-10-30 2019-02-15 西峡龙成特种材料有限公司 The electro-plating method of continuous casting crystallizer copper plate deposit N i-Co-B alloy layer
CN109604126A (en) * 2018-10-31 2019-04-12 博罗县东明化工有限公司 Aluminium alloy sprays pre-treating method
CN111074308A (en) * 2019-12-30 2020-04-28 福建南平南孚电池有限公司 Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell
CN111074308B (en) * 2019-12-30 2021-03-12 福建南平南孚电池有限公司 Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell

Similar Documents

Publication Publication Date Title
CN102242364B (en) Preparation method of ceramic film through chemical conversion and micro-arc oxidation of aluminum and aluminum alloy
CN102443825B (en) High-concentration chromium sulfate-ammonium fluoride trivalent chromium electroplating solution and preparation method thereof
CN108191107B (en) Recovery system and method for single nickel salt coloring and medium temperature hole sealing agent in aluminum processing
CN101498026B (en) Electrolytic solution for magnesium alloy anodicoxidation treatment and method for surface treatment of magnesium alloy
CN105386089A (en) Trivalent chromium hard chromium electroplating solution and application of trivalent chromium hard chromium electroplating solution in hard chromium electroplating
CN102677116B (en) Method for dipulse preplating non-cyanide alkaline copper on ferro matrix
CN101665959A (en) Trivalent chromium electroplating solution of sulfate system and electroplating method thereof
CN103255453A (en) Method for plating copper on stainless steel
CN103668369A (en) Electric plating method capable of improving anti-corrosion performance of metal element
CN103643278A (en) Micro-arc oxidation method of car part aluminum material
CN103726093B (en) A kind of environment-friendly type that adopts contains nickel electrolyte is prepared differential arc oxidation film layer method at Mg alloy surface
CN101476146A (en) Method for preparing black ceramic membrane by magnesium alloy differential arc oxidation
CN204918772U (en) A high corrosion resistance cadmium plating layer for aerospace spare part
CN103820828A (en) Nanometer Ni-Co-B coating technology for copper plate/copper tube of continuous casting crystallizer
CN103510130A (en) Trivalent hard chromium electroplating method
CN102383152A (en) Low-foam carrier brightening agent and using method thereof
CN102719864B (en) Method for preparing cerium-containing zinc coating
CN103757667A (en) Chrome plating additive and electroplating liquid thereof
CN101922027A (en) Cyanide-free alkaline copper plating solution and preparation method thereof
Zeng et al. A review of recent patents on trivalent chromium plating
CN106702464A (en) Electrolyte for preparing black ceramic film layer through micro-arc oxidation for magnesium alloy, and method
Naik et al. Electrodeposition of zinc from chloride solution
CN103572339B (en) A kind of method at surface of low-carbon steel electroplated Ni-Mn alloy
CN102560485B (en) Method for preparing hard protective film on magnesium alloy surface
CN103320838A (en) In-situ growth method of yellow ceramic coating on TC4 titanium alloy surface

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20140528

RJ01 Rejection of invention patent application after publication