CN103811630A - LED (Light Emitting Diode) package structure and lamp using same - Google Patents
LED (Light Emitting Diode) package structure and lamp using same Download PDFInfo
- Publication number
- CN103811630A CN103811630A CN201210465511.1A CN201210465511A CN103811630A CN 103811630 A CN103811630 A CN 103811630A CN 201210465511 A CN201210465511 A CN 201210465511A CN 103811630 A CN103811630 A CN 103811630A
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- led
- led chip
- encapsulating structure
- transparency cover
- light
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- 238000004519 manufacturing process Methods 0.000 description 4
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
An LED (Light Emitting Diode) package structure comprises an LED chip and a transparent cover which is arranged in the light emitting direction of the LED chip; the transparent cover and the LED chip are arranged in an interval mode; color temperature of the emergent light of the LED chip is basically identical to that of the emergent light of the lamp and accordingly the requirement for basically unchanged lamp specified color temperature is achieved due to the fact that a gap which is formed between the transparent cover and the LED chip can be filled with gas or be vacuum. The invention also provides a lamp using the LED package structure.
Description
Technical field
The present invention relates to a kind of LED encapsulation technology, particularly a kind of light fixture of controlling the LED encapsulating structure of colour temperature variation and using this LED encapsulating structure.
Background technology
Along with the extensive use of class point-source of light and point-source of light, particularly LED light-emitting component is in the extensive use in guidance lighting and general lighting field, and the optical application that lighting field need to be based on this type of light source, to realizing the breakthrough of illumination application.Just current present situation, soft belt type LED lamp and waterproof encapsulating LED lamp are just applied more and more widely.
Existing soft belt type LED lamp and waterproof encapsulating LED lamp, when after encapsulating water on LED chip, the colour temperature of LED lamp there will be rising situation.The LED chip that excites yellow fluorescent powder pattern take blue chip is example, LED chip comprises substrate, be arranged at the blue chip on substrate, yellow fluorescent powder and button are located at lens on blue chip, after blue chip energising, send blue light, the blue-light excited yellow fluorescent powder of a part sends gold-tinted, after the gold-tinted inspiring and another part blue light mixed light through the refraction of lens surface once and the white light of outgoing formation different-colour.According to the ratio of different gold-tinted and blue light, form the white light of different-colour, when blue light ratio is large, colour temperature is high, is colder light; When gold-tinted ratio is large, colour temperature is low, is partially warm light.On LED chip after encapsulating, the glue solidifies forms cover layer, because the refractive index of glue is greater than the refractive index of air, so increased the critical angle of blue light generation total reflection on interface after encapsulating, in the light that causes sending, the ratio of blue ray increases, thereby routinely must be somebody's turn to do the soft belt LED lamp that formed by LED chip envelope filling and the colour temperature of waterproof encapsulating LED lamp raises.Other LED chip, the white LED lamp being composited as red, green, blue monochromatic LED, or the white LED lamp being formed by ultraviolet excitation, the phenomenon that all there will be colour temperature to raise after mucilage sealing is filled with.As shown in Fig. 6 in Figure of description, to survey through overtesting the data that draw and also further illustrate traditional directly glue spots being enclosed on LED chip of employing, the colour temperature of LED lamp emergent ray there will be rising in various degree.
Summary of the invention
In view of this, be necessary to provide the constant LED encapsulating structure of a kind of colour temperature of LED lamp emergent ray and use the light fixture of this LED encapsulating structure, to overcome above-mentioned deficiency.
A kind of LED encapsulating structure, it comprises a LED chip.Described LED encapsulation also comprises a transparency cover on the light direction that is arranged on this LED chip, this transparency cover and the setting of described LED chip interval.
A kind of light fixture, comprises a circuit board, a LED encapsulating structure being arranged on described circuit board, and a lampshade that is arranged on LED encapsulating structure outside.Described LED encapsulating structure comprises a LED chip.Described LED encapsulating structure also comprises a transparency cover that is arranged on the light direction of this LED chip, and this transparency cover and described LED chip interval arrange.
Owing to having a gap between transparency cover and LED chip, this gap may be filled with gas or vacuum, thereby makes the colour temperature of emergent light of LED chip basic identical with the colour temperature from the emergent light of light fixture, and then reaches the substantially constant requirement of the specified colour temperature of light fixture.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiments of the invention are described, wherein:
Fig. 1 is the structural representation of a kind of light fixture that uses LED encapsulating structure provided by the invention.
Fig. 2 is that the light fixture of use LED encapsulating structure of Fig. 1 is along the generalized section of A-A line.
Fig. 3 is the sectional structure schematic diagram of the LED encapsulating structure in the light fixture of use LED encapsulating structure of Fig. 1.
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of the LED encapsulating structure in the light fixture of use LED encapsulating structure of Fig. 1.
Fig. 5 is the structural representation of a kind of transparency cover provided by the invention.
Fig. 6 is the test data figure that the colour temperature of the light fixture of use LED encapsulating structure of the present invention changes.
Fig. 7 is the test data figure that the soft colour temperature with lamp of the prior art changes.
Embodiment
Based on accompanying drawing, specific embodiments of the invention are further elaborated below.Should be appreciated that specific embodiment described herein is only as embodiment, the protection range being not intended to limit the present invention.
Refer to Fig. 1 and Fig. 2, its structural representation that is a kind of light fixture 100 that uses LED encapsulating structure provided by the invention.Described light fixture 100 comprises that 10, one of circuit boards are arranged on the LED encapsulating structure 20 on this circuit board 10, and a lampshade 30 that is arranged on LED encapsulating structure 20 outsides.Described circuit board 10 is electrically connected with LED encapsulating structure 20, power to this LED encapsulating structure 20.In the present embodiment, described light fixture 100 is a kind of soft band light fixture, and described circuit board 10, lampshade 30 are all made up of flexible material.Can expect, this light fixture 100 also comprises the end cap that is arranged on axial two ends, and other parts such as plug wire post, because of its by those skilled in the art known, therefore do not indicate.
Described circuit board 10 can be printed circuit board (PCB) (Printed Circuit Board, PCB), is provided with circuit or other electronic component on it, if diode, triode etc. are to supply with LED encapsulating structure 20 specified electric current or control signal.In the time that this light fixture 100 is soft band lamp, this circuit board 10 can be flexible PCB.Described circuit board 10 and operation principle thereof are known by those skilled in the art, do not repeat them here.
As shown in Figures 2 to 4, described LED encapsulating structure 20 comprises a basalis 21, a LED chip 22 being arranged on this basalis 21, article one, for being electrically connected the wire 23 of described basalis 21 and LED chip 22, one is located at the frame support 25 in described basalis 21, LED chip 22 and wire 23 outsides, a fluorescent powder colloid coating layer 24 being filled on LED chip 22 light directions, and a lid is located on LED chip 22 light directions and is arranged on the transparency cover 26 on support 25.
The substrate that described basalis 21 is carrying LED chip 22, its material can be has conductivity or the Heat Conduction Material without conductivity, be specifically as follows metal material, as silver, copper, copper alloy, Kufil, aluminium, aluminium alloy or there is gold or the metal material of silvering; Or ceramic material, for example aluminium oxide, aluminium nitride and diamond coating film; Or composite material, carbon nanotube, printed circuit board (PCB) or organic polymer material etc., in addition, also can be chosen in these basalis 21 electroplating surface one highly reflective materials as reflector, this highly reflective material can be silver, gold or its group forming.In the present embodiment, described basalis 21 is made for metal material, and has two, connects respectively positive pole and the negative pole of LED chip 22.In order to combine closely with support 25 and to improve its firmness, this basalis 21 can be made wedge.
Described LED chip 22 arranges on ground basalis 21, in the present embodiment, described LED chip 22 be arranged on two basalises 21 wherein one upper, and another piece connects on another piece of described LED chip 22 and basalis 21 by a wire 23.Described LED chip 22 can be a blue-light-emitting wafer, and it can be made up of the polynary complex chemical compound of carborundum (SiC) or three or five families, such as nitrogen indium gallium (InGaN) and gallium nitride (GaN) etc.LED chip 22 can utilize traditional die bond processing procedure to be attached on basalis 21, and the positive and negative electrode of this LED chip 22 all can be in the upper surface of this LED chip 22 or upper and lower surface.
Described wire 23 can be made by general conductive material, certainly for manufacturing process or other factor, this wire 23 also can gold, silver etc. noble metal make.
Described fluorescent powder colloid coating layer 24 is the outsides that are coated on LED chip 22, and its material can be the organic resin material of high index of refraction, and as polyurethane, its refractive index is to be greater than 1.40 for better.Wherein, fluorescent powder colloid coating layer 24 is for fluorescent material light powder and organic resin material is mixing cured forms, can adjust according to need different viscosities and volume, forming a cross section by naturally surface tension and cohesive force is circular-arc lenticular body, and its circular arc side has a fluorescent powder colloid coating layer, fluorescent material (for example yellow fluorescent powder) is distributed in this fluorescent powder colloid coating layer, LED chip 22 is positioned at the diameter side of this fluorescent powder colloid coating layer 24, like this, can excite yellow fluorescent powder to produce gold-tinted by blue light with yellow fluorescent powder collocation blue light reflective semiconductor element 22, this gold-tinted produces the white light of high uniformity again with remaining blue light.Certainly can expect, LED encapsulating structure 20 also may not use this fluorescent powder colloid coating layer 24 in certain situation.
Described support 25 is compressing by mould, it is made up of non-conductive material, as resin, pottery etc., in actual manufacture process, should be first on the basalis 21 that is provided with LED chip 22, to be pressed into a frame support 25, and then fill fluorescent powder colloid coating layer 24.In the present embodiment, the structure after only it being manufactured describes.Described support 25 comprises that 251, one of frameworks are arranged on the reflecting slant 252 on framework 251 madial walls, and a light-emitting window 253.Described reflecting slant 251 reflects to light-emitting window 253 for light LED chip 22 being mapped on this face, to increase the light extraction efficiency of LED encapsulating structure 20.The height along light direction of described support 25 is greater than the gross thickness of described basalis 21 and fluorescent powder colloid coating layer 24.Corresponding, in the time that LED encapsulating structure 20 does not comprise fluorescent powder colloid coating layer 24, the height along light direction of this support 25 is greater than the gross thickness of described basalis 21 and LED chip 22.As for the height along light direction of described support 25 higher than described basalis 21 and the gross thickness of fluorescent powder colloid coating layer 24 or higher than described basalis 21 amount with the gross thickness of LED chip 22, can set as required, as factors such as the power of LED chip 22.
Described transparency cover 26 is made up of transparent material, and lid is located in the framework 251 of described support 25.Due to, the height along light direction of described support 25 is greater than the gross thickness of described basalis 21 and fluorescent powder colloid coating layer 24, therefore, this transparency cover 26 arranges with fluorescent powder colloid coating layer 24 intervals, thereby is separated out certain gap between between transparency cover 26 and fluorescent powder colloid coating layer 24.In like manner, in the time that LED encapsulating structure 20 does not comprise fluorescent powder colloid coating layer 24, between described transparency cover 26 and LED chip 22, certain gap will be separated out.In this gap, can fill air, also can, for certain object, as protection LED chip 22, be filled with inert gas, certainly can expect, in this gap, can also be evacuated.Described transparency cover 26 can also be made the structure of lens, as shown in Figure 5, thereby the light of outgoing is adjusted, to reach the light distribution requirements of wanting.In the time that this transparency cover 26 is the lensed structure of a tool, these lens are arranged between lampshade 30 and transparency cover 26.Owing to when described lampshade 30 being flexible material while making, it will be made by encapsulating mode, and therefore, described transparency cover 26 should be prepared by exotic material.
Described lampshade 30 is located at the outside of circuit board 10, and is arranged on the light direction of LED chip 22, to protect the elements such as described circuit board 10, LED encapsulating structure 20.In the time that light fixture 100 is soft band lamp, this lampshade 30 is made up of flexible material, as resin.
As shown in Figure 6, the test data figure of the light fixture of its use LED encapsulating structure that is the embodiment of the present invention.Due between transparency cover 26 and LED chip 22 or transparency cover 26 and be loaded with between the LED chip 22 of fluorescent powder colloid coating layer 24 and there is a gap, this gap is filled with gas or vacuum, thereby makes the colour temperature of emergent light of LED chip basic identical with the colour temperature from the emergent light of light fixture 100.It should be noted that, the light fixture that adopts LED encapsulating structure 20 of the present invention to make, its colour temperature is basic identical, and do not mean that LED colour temperature is identical with the colour temperature of undressed front LED chip, and refer to the variation of the colour temperature of utilizing the light fixture 100 that this LED encapsulating structure 20 makes, within the specified excursion of product regulation, the quality of various manufacturing equipments simultaneously, as the quality of adhesive injection device, manufacturing process, as encapsulating flow velocity, and machining accuracy etc. all can have influence on the colour temperature of LED lamp, therefore the colour temperature of LED lamp being controlled within the scope that vision is difficult for discovering is all acceptable.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all interior done any modifications in the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included in protection scope of the present invention in.
Claims (10)
1. a LED encapsulating structure, it comprises a LED chip, it is characterized in that: described LED encapsulation also comprises a transparency cover on the light direction that is arranged on this LED chip, this transparency cover and the setting of described LED chip interval.
2. LED as claimed in claim 1 encapsulation, is characterized in that: between described transparency cover and LED chip, be to be filled with air or inert gas or to be vacuum.
3. LED encapsulating structure as claimed in claim 1, is characterized in that: described LED encapsulating structure also comprises that one deck is arranged on the fluorescent powder colloid coating layer between LED chip and transparency cover, and this fluorescent powder colloid coating layer and transparency cover interval arrange.
4. LED encapsulating structure as claimed in claim 3, is characterized in that: described fluorescent powder colloid coating layer is arranged on the light direction of LED chip and is close to setting with LED chip.
5. LED encapsulating structure as claimed in claim 1, is characterized in that: described transparency cover comprises at least one lens.
6. LED encapsulating structure as claimed in claim 1, is characterized in that: described LED encapsulating structure also comprises a support that is set in LED chip, and described transparency cover is arranged on this support.
7. a light fixture, comprise a circuit board, a LED encapsulating structure being arranged on described circuit board, an and lampshade that is arranged on LED encapsulating structure outside, described LED encapsulating structure comprises a LED chip, it is characterized in that: described LED encapsulating structure also comprises a transparency cover that is arranged on the light direction of this LED chip, this transparency cover and described LED chip interval arrange.
8. light fixture as claimed in claim 7, is characterized in that: described circuit board is flexible PCB, and described lampshade is flexible lampshade.
9. light fixture as claimed in claim 7, is characterized in that: on the light direction of described LED encapsulating structure, be provided with lens, these lens are arranged between lampshade and transparency cover.
10. light fixture as claimed in claim 7, is characterized in that: described transparency cover is made up of exotic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210465511.1A CN103811630A (en) | 2012-11-03 | 2012-11-03 | LED (Light Emitting Diode) package structure and lamp using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210465511.1A CN103811630A (en) | 2012-11-03 | 2012-11-03 | LED (Light Emitting Diode) package structure and lamp using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103811630A true CN103811630A (en) | 2014-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210465511.1A Pending CN103811630A (en) | 2012-11-03 | 2012-11-03 | LED (Light Emitting Diode) package structure and lamp using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103811630A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465540A (en) * | 2014-12-22 | 2015-03-25 | 永新电子常熟有限公司 | Electronic chip with good stability |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100155768A1 (en) * | 2008-03-25 | 2010-06-24 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and cavity in post |
| EP2287932A2 (en) * | 2009-08-21 | 2011-02-23 | Stanley Electric Co., Ltd. | LED lighting apparatus |
| CN202303220U (en) * | 2011-11-10 | 2012-07-04 | 何栋琳 | Patched light emitting diode (LED) flexible lamp strip |
| CN102720976A (en) * | 2012-05-30 | 2012-10-10 | 深圳市日上光电有限公司 | LED soft light rope |
| CN203085634U (en) * | 2012-11-03 | 2013-07-24 | 林万炯 | LED package structure and lamp using LED package structure |
-
2012
- 2012-11-03 CN CN201210465511.1A patent/CN103811630A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100155768A1 (en) * | 2008-03-25 | 2010-06-24 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and cavity in post |
| EP2287932A2 (en) * | 2009-08-21 | 2011-02-23 | Stanley Electric Co., Ltd. | LED lighting apparatus |
| CN202303220U (en) * | 2011-11-10 | 2012-07-04 | 何栋琳 | Patched light emitting diode (LED) flexible lamp strip |
| CN102720976A (en) * | 2012-05-30 | 2012-10-10 | 深圳市日上光电有限公司 | LED soft light rope |
| CN203085634U (en) * | 2012-11-03 | 2013-07-24 | 林万炯 | LED package structure and lamp using LED package structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465540A (en) * | 2014-12-22 | 2015-03-25 | 永新电子常熟有限公司 | Electronic chip with good stability |
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Application publication date: 20140521 |