CN103811367B - Product defects detection method - Google Patents
Product defects detection method Download PDFInfo
- Publication number
- CN103811367B CN103811367B CN201210442363.1A CN201210442363A CN103811367B CN 103811367 B CN103811367 B CN 103811367B CN 201210442363 A CN201210442363 A CN 201210442363A CN 103811367 B CN103811367 B CN 103811367B
- Authority
- CN
- China
- Prior art keywords
- product
- process apparatus
- detection
- detected
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention discloses a kind of product defects detection method, equipment corresponding for experienced with product for product processing procedure is associated, on existing detection method basis, bonding apparatus Determines certain product concrete enters the station inspection, to realize because of the lower defects detection of equipment impact, it is to avoid Product checking randomness, raising detection efficiency and ageing.
Description
Technical field
The present invention relates to field of manufacturing semiconductor devices, particularly relate to a kind of product defects detection method.
Background technology
Along with the raising of the reduction of device feature size and integrated level, product defects is increasing for the impact of product yield. For the defect condition of on-line monitoring product in process of production, in time causes of defects is tracked, analyzes and become more and more important with work such as improvement.
Existing defect inspection method flow process is as shown in Figure 1, the numbering of product is associated with its processing procedure experienced, and make product after the N number of fabrication steps of continuous print at detection website set in advance, arrange M the detecting step for different defects, and step is so that whether the product determining certain numbering concrete carries out detection scanning all to have one to judge before carrying out each defect detection procedure, it is said that in general, decide whether that numbering that the factor carrying out judging is this product and product are experienced processing procedure.
In the product of the existing defects produced at present, the defect source of 70% comes from process apparatus, and 25% from processing procedure reason, and clean room environment reason is about 5%. Therefore, when adopting above-mentioned product defects detection method, the apparatus factor passed owing to not accounting for product, cause defects detection randomness, efficiency low and the problem of poor in timeliness; First concrete shows themselves in that, detected product is probably derived from the equipment produced just or testability equipment, and for general defects detection, only formally produce the product needed detection that equipment produces, the product that testability equipment produces need not detect, and existing defect inspection method not can recognise that the type of production equipment, causes that the product that testability equipment produces is tested; Secondly, existing defect inspection method is used, within a period of time, certain equipment does not break down, its characteristic is stable, and the product through this process apparatus is all permitted within the scope of receipts in defect, but uses existing detection method, product through this process apparatus is likely to frequently detected, cause the waste of defects detection resource, and another extreme case is to be likely to be detected never scanning through the product of this process apparatus, causes missing inspection, so, process apparatus detection frequency is uncontrollable; Furthermore, when certain process apparatus breaks down, the characteristic of process apparatus changes, detection it is scanned in time through the product needed of this process apparatus after change, but use existing detection method then easily to occur detection postpone or omit, therefore the real-time status of process apparatus can not detect in time.
Summary of the invention
In view of problem of the prior art, the method that the invention provides the management of a kind of product defects, to solve, Product checking randomness in prior art, efficiency is low and the problem of poor in timeliness.
The technical solution used in the present invention is as follows: a kind of product defects detection method, including:
In advance product being numbered, and process apparatus is numbered, classifies, production code member is numbered by formation with corresponding process apparatus, the product information to be detected of the mutual mapping association of device class;
Select to need detected process apparatus classification according to product information to be detected, and determine whether the detection website that can use, when available detection website, then judge that product does not enter the station detection;
If there being available detection website, obtain process apparatus state in the scheduled time, and judge that whether process apparatus state is abnormal in the given time, and process apparatus does not detect whether the time exceedes the scheduled time, if process apparatus abnormal state or process apparatus do not detect the time exceedes the scheduled time, then according to product information to be detected abnormal state or process apparatus do not detected the time and exceed product corresponding to the process apparatus of the scheduled time and enter the station detection;
If it is determined that existence is without exception and does not detect the time process apparatus not less than the scheduled time, then determine whether the whether defective analysis result of process apparatus, if zero defect analyzes result, according to product information to be detected, zero defect analyzed product corresponding to the process apparatus of result and enter the station detection;
If defective analysis result, judging that the defect analysis result of process apparatus is whether within the scope of fair receipts, if analyzing result within the scope of fair receipts, the product corresponding to product information to be detected decision analysis result process apparatus within the scope of fair receipts does not enter the station detection;
If analyzing result outside fair receipts scope, enter the station analyzing result detection at the product corresponding to the extraneous process apparatus of fair receipts according to product information to be detected.
Further, described information to be detected also includes arranging detection precedence information from high to low according to different product by the time order and function of same process equipment.
Further, it is determined that the product of detection of entering the station successively enters the station detection according to the height of detection precedence information.
Further, described production code member includes product type, product batches and wafer numbering, and described device numbering includes board numbering, unit number and dash number.
Adopt in product defects detection method provided by the present invention, equipment corresponding for experienced with product for product processing procedure is associated, on existing detection method basis, bonding apparatus Determines certain product concrete enters the station inspection, to realize because of the lower defects detection of equipment impact, it is to avoid Product checking randomness, raising detection efficiency and ageing.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of product defects detection method of the present invention;
A kind of product defects detection method of Fig. 2 present invention carries out the schematic flow sheet judged based on equipment state.
Detailed description of the invention
Below in conjunction with accompanying drawing, principles of the invention and feature being described, example is served only for explaining the present invention, is not intended to limit the scope of the present invention.
As it is shown in figure 1, the invention provides a kind of product defects detection method, including:
In advance product being numbered, and process apparatus is numbered, classifies, production code member is numbered by formation with corresponding process apparatus, the product information to be detected of the mutual mapping association of device class;
Select to need detected process apparatus classification according to product information to be detected, and determine whether the detection website that can use, when available detection website, then judge that product does not enter the station detection;
If there being available detection website, obtain process apparatus state in the scheduled time, and judge that whether process apparatus state is abnormal in the given time, and process apparatus does not detect whether the time exceedes the scheduled time, if process apparatus abnormal state or process apparatus do not detect the time exceedes the scheduled time, then according to product information to be detected abnormal state or process apparatus do not detected the time and exceed product corresponding to the process apparatus of the scheduled time and enter the station detection;
If it is determined that existence is without exception and does not detect the time process apparatus not less than the scheduled time, then determine whether the whether defective analysis result of process apparatus, if zero defect analyzes result, according to product information to be detected, zero defect analyzed product corresponding to the process apparatus of result and enter the station detection;
If defective analysis result, judging that the defect analysis result of process apparatus is whether within the scope of fair receipts, if analyzing result within the scope of fair receipts, the product corresponding to product information to be detected decision analysis result process apparatus within the scope of fair receipts does not enter the station detection;
If analyzing result outside fair receipts scope, enter the station analyzing result detection at the product corresponding to the extraneous process apparatus of fair receipts according to product information to be detected.
As the preferred embodiment of the invention, it is described in detail below in conjunction with accompanying drawing 2.
In advance product and process apparatus are numbered, wherein, production code member can include multiple level, can be made up of product type, product batches and wafer numbering combination, same, device numbering can also include multiple level, as being made up of board numbering, unit number and dash number combination, and process apparatus is classified, as process apparatus being divided into normal production equipment and testability equipment; Form information to be detected, the numbering of process apparatus, the process apparatus classification that use in processing procedure production code member and this product experienced in information to be detected map, form the related information of product and process apparatus, as preferably, detection precedence information is farther included in information to be detected, wherein, detection precedence information is arrange priority from high to low according to different product by the time order and function of same process equipment, in other words, namely detection precedence information represents in the product by same process equipment, and time priority the earliest is the highest;
Status information of equipment according to process apparatus performs Pyatyi and judges as shown in Figure 2:
The first order judges: select to need detected process apparatus classification according to product information to be detected;
The second level judges: determine whether the detection website that can use, and when not available detection website, is then judged to detection of not entering the station;
Judge categorizing selection to need the process apparatus of detection by the first order and the second level, as classified according to above-mentioned process apparatus, the optional normal process apparatus produced, it is to avoid the randomness that prior art causes.
The third level judges: if the second level is judged as there is available detection website, judge that whether process apparatus state is abnormal in the given time, and process apparatus does not detect whether the time exceedes the scheduled time, if process apparatus abnormal state or time of not detecting exceed the scheduled time, then state is without exception and abnormal state or time of not detecting are exceeded product corresponding to the process apparatus of the scheduled time not less than the process apparatus of the scheduled time and enter the station detection by the time of not detecting;
The fourth stage judges: if existence is without exception and do not detect the time process apparatus not less than the scheduled time after the third level judges, the state that then determines whether is without exception and the time of not detecting is not less than the whether defective analysis result of the process apparatus of the scheduled time, if zero defect analyzes result, according to product information to be detected, zero defect is analyzed product corresponding to the process apparatus of result and enters the station detection;
Level V judges: if the fourth stage is judged as defective analysis result, judge that defect analysis result is whether within the scope of fair receipts, if analyzing result within the scope of fair receipts, the product corresponding to product information to be detected decision analysis result process apparatus within the scope of fair receipts does not enter the station detection; If analyzing result outside fair receipts scope, enter the station analyzing result detection at the product corresponding to the extraneous process apparatus of fair receipts according to product information to be detected.
Wherein, by the 3rd, 4th and level V judge, the control of the process apparatus detection frequency controlling in real time and being detected of process apparatus state can be realized, when the process apparatus of certain numbering occurs abnormal, then according to precedence information height, product corresponding for this process apparatus can successively be sent into measuring station point to detect, to realize real-time control, and, when not having process apparatus to occur abnormal, can determine to need to continue the process apparatus working stability of detection or certain numbering through the process apparatus of certain numbering according to existing defect analysis result, because of without detection, avoid the waste of detection resource.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within the scope of protection of the invention.
Claims (4)
1. a product defects detection method, including:
In advance product being numbered, and process apparatus is numbered, classifies, production code member is numbered by formation with corresponding process apparatus, the product information to be detected of the mutual mapping association of device class;
Select to need detected process apparatus classification according to product information to be detected, and determine whether the detection website that can use, when available detection website, then judge that product does not enter the station detection;
If there being available detection website, obtain process apparatus state in the scheduled time, and judge that whether process apparatus state is abnormal in the given time, and process apparatus does not detect whether the time exceedes the scheduled time, if process apparatus abnormal state or process apparatus do not detect the time exceedes the scheduled time, then according to product information to be detected abnormal state or process apparatus do not detected the time and exceed product corresponding to the process apparatus of the scheduled time and enter the station detection;
If it is determined that existence is without exception and does not detect the time process apparatus not less than the scheduled time, then determine whether the whether defective analysis result of process apparatus, if zero defect analyzes result, according to product information to be detected, zero defect analyzed product corresponding to the process apparatus of result and enter the station detection;
If defective analysis result, judging that the defect analysis result of process apparatus is whether within the scope of fair receipts, if analyzing result within the scope of fair receipts, the product corresponding to product information to be detected decision analysis result process apparatus within the scope of fair receipts does not enter the station detection;
If analyzing result outside fair receipts scope, enter the station analyzing result detection at the product corresponding to the extraneous process apparatus of fair receipts according to product information to be detected.
2. method according to claim 1, it is characterised in that described information to be detected also includes arranging detection precedence information from high to low according to different product by the time order and function of same process equipment.
3. method according to claim 2, it is characterised in that the product of the detection that judges to enter the station enters the station detection according to the height of detection precedence information.
4. the method according to any one of claims 1 to 3, it is characterised in that described production code member includes product type, product batches and wafer numbering, and described process apparatus numbering includes board numbering, unit number and dash number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210442363.1A CN103811367B (en) | 2012-11-07 | 2012-11-07 | Product defects detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210442363.1A CN103811367B (en) | 2012-11-07 | 2012-11-07 | Product defects detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103811367A CN103811367A (en) | 2014-05-21 |
| CN103811367B true CN103811367B (en) | 2016-06-15 |
Family
ID=50707958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210442363.1A Active CN103811367B (en) | 2012-11-07 | 2012-11-07 | Product defects detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103811367B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105631615B (en) * | 2016-03-28 | 2020-01-07 | 京东方（河北）移动显示技术有限公司 | Detection system and detection method |
| CN109977808B (en) * | 2019-03-11 | 2020-10-27 | 北京工业大学 | Wafer surface defect mode detection and analysis method |
| CN110907135A (en) * | 2019-11-14 | 2020-03-24 | 深圳市华星光电半导体显示技术有限公司 | Control method and device of manufacturing equipment |
| CN110940875B (en) * | 2019-11-20 | 2022-02-01 | 深圳市华星光电半导体显示技术有限公司 | Equipment abnormality detection method and device, storage medium and electronic equipment |
| CN113804244A (en) * | 2020-06-17 | 2021-12-17 | 鸿富锦精密电子(天津)有限公司 | Defect analysis method and device, electronic device and computer readable storage medium |
| CN113053786B (en) * | 2021-03-04 | 2023-04-07 | 长鑫存储技术有限公司 | Method and apparatus for processing out-of-control behavior in semiconductor process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295624A (en) * | 2007-04-24 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Defect detecting structure, and production method and detection method thereof |
| CN101295659A (en) * | 2007-04-29 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Method for detecting defect of semiconductor device |
| CN101872714A (en) * | 2009-04-24 | 2010-10-27 | 中芯国际集成电路制造(上海)有限公司 | On-line detection method and system for wafer |
| CN102269712A (en) * | 2010-06-04 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | Wafer defect detection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000137003A (en) * | 1998-10-30 | 2000-05-16 | Fujitsu Ltd | Pattern inspection method and its device |
-
2012
- 2012-11-07 CN CN201210442363.1A patent/CN103811367B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295624A (en) * | 2007-04-24 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Defect detecting structure, and production method and detection method thereof |
| CN101295659A (en) * | 2007-04-29 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Method for detecting defect of semiconductor device |
| CN101872714A (en) * | 2009-04-24 | 2010-10-27 | 中芯国际集成电路制造(上海)有限公司 | On-line detection method and system for wafer |
| CN102269712A (en) * | 2010-06-04 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | Wafer defect detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103811367A (en) | 2014-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103811367B (en) | Product defects detection method | |
| CN100520651C (en) | Method and appts. for fault detection of processing tool and control thereof using advanced process control framework | |
| US7260444B2 (en) | Real-time management systems and methods for manufacturing management and yield rate analysis integration | |
| CN102053093A (en) | Method for detecting surface defects of chip cut from wafer surface | |
| CN102522350B (en) | Method and device for detecting failed production machine platforms | |
| CN104062305B (en) | A kind of analysis method of integrated circuit defect | |
| CN109285791B (en) | Design layout-based rapid online defect diagnosis, classification and sampling method and system | |
| CN101470426A (en) | Fault detection method and system | |
| CN103367103B (en) | Production of semiconductor products method and system | |
| CN103676868A (en) | Automatic monitoring and intelligent analyzing system used in FPC manufacturing critical process | |
| CN101852741A (en) | Method for defect diagnosis and management | |
| CN104201130A (en) | Optical detection method for defect classification | |
| CN113888480A (en) | MES-based quality tracing method and system | |
| CN114140684A (en) | Method, device and equipment for detecting coal blockage and coal leakage and storage medium | |
| CN103646888A (en) | A wafer acceptance testing system and method | |
| CN102637617B (en) | Wafer quality detecting system and wafer quality detection method | |
| CN110763979A (en) | LED wafer point measurement automatic system based on MES system | |
| CN103646886A (en) | A wafer working method for monitoring defect conditions of multi-cavity devices | |
| JP2008033902A (en) | Alarm device | |
| CN100375258C (en) | Method for detecting again fault | |
| CN105759748B (en) | A kind of dynamic monitoring system and monitoring method of semiconductor production board hardware performance | |
| CN115265635B (en) | Industrial machine vision detection management system based on data analysis | |
| CN112567627A (en) | Photovoltaic solar cell testing system for a pipeline solar cell production plant and method for optimizing a solar cell pipeline production using a photovoltaic solar cell testing system of this type | |
| CN104078381A (en) | Method for setting specification limit of measurement machine monitoring chart | |
| KR100823573B1 (en) | Semiconductor test system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |