CN103803481A - Sensor - Google Patents
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- CN103803481A CN103803481A CN201410045658.4A CN201410045658A CN103803481A CN 103803481 A CN103803481 A CN 103803481A CN 201410045658 A CN201410045658 A CN 201410045658A CN 103803481 A CN103803481 A CN 103803481A
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- sensing element
- post wall
- sensor
- column walls
- layer
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Abstract
The invention discloses a sensor. The sensor comprises a base plate, a sensing element arranged on the base plate, at least two layers of column walls, a sensing element structural layer covering the periphery of the outermost column wall and at least two sealing covers. The column walls are arranged on the base plate around the sensing element and are formed by deposition and etching, and the connected column walls are bonded through packing colloid. The innermost sealing cover is clamped between the packing colloid between the two column walls of the innermost layer, and the outer layer sealing cover is arranged on the column walls. The sensor comprises a plurality of layers of column walls, the sensor can be effectively prevented from being damaged caused by hitting, external impact resisting capacity is greatly enhanced, the column walls are connected through the packing colloid, air holes are formed in the packing colloid between the column walls, the connection is firmer, a certain buffer space is formed due to the air holes, therefore, the impact resisting capacity is further enhanced, and damage is not easy. The sensing element is further provided with a sealing layer, supporting points are added, and the sensing element is further protected.
Description
Technical field
The present invention relates to a kind of sensor, especially a kind of micro electronmechanical sensor.
Background technology
Sensor (English name: transducer/sensor) is a kind of checkout gear, can experience measured information, and the information that detection can be experienced, be for conversion into according to certain rules the information output of the signal of telecommunication or other desired forms, to meet the requirement such as transmission, processing, storage, demonstration, record and control of information.
Sensor has been widely used in industry and life, and such as pressure gauge, accelerometer and gyroscope etc. all belong to the one of sensor.With regard to its principle classification, can be divided into condenser type, resistance-type and thermal-induction type etc. a variety of.
Along with the develop rapidly of micro electronmechanical manufacturing technology, a lot of sensors all adopt micro electronmechanical manufacture, greatly to dwindle its volume.But, how the micro electronmechanical sensor of this class is carried out to packaging protection simultaneously, just become problem in the urgent need to address.Just be difficult to resist if protection is too fragile the impact that the reasons such as external environment cause, thereby greatly shortened the service life of this class sensor, if but protection is too thick and heavy, may affect again its sensitivity, or its volume also can increase.
Summary of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of volume little, the high micro electronmechanical sensor of protection intensity.
The technical solution adopted in the present invention is: a kind of sensor, comprising:
Substrate;
Sensing element, is arranged on described substrate;
At least two-layer post wall, is arranged on described substrate around sensing element, and described post wall forms by deposition and etching, is connected and bonds by packing colloid between post wall;
Sensing element structure layer, covers and is arranged at outermost layer post wall periphery;
At least two cappings, innermost layer capping is arranged between innermost layer two post wall packing colloids, and outer capping is located on post wall.
Further, in the packing colloid between described post wall, be provided with air pocket.
Further, described sensing element upper surface is coated with one deck sealant.
Further, described sealant is made up of insulation lightweight material.
Further, the thickness of described post wall is greater than the thickness of sensing element.
Further, described post wall is silica, copper or polymer.
Further, described post wall is two-layer, is combined with capping in the upper end that packing colloid extends to outer post wall.
The invention has the beneficial effects as follows: this kind of sensor include multicolumn wall, can effectively prevent that sensor from damaging because of shock, the impact capacity in the anti-external world strengthens greatly, and between post wall, connect by packing colloid and post wall between packing colloid in be provided with air pocket, connect more firmly, owing to being provided with air pocket, formed certain cushion space, therefore impact resistance further increases, not fragile.Sensing element is also provided with sealant, has increased the strong point, can further protect sensing element.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, below with preferred embodiment of the present invention and coordinate accompanying drawing to be described in detail as follows.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Fig. 1 is sectional structure schematic diagram of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples, the present invention is further described.
The sectional structure schematic diagram of the present embodiment as shown in Figure 1,
A kind of sensor, comprising:
Described substrate 1 can be the multiple material such as silicon, GaAs, and these materials are are researched and developed widely and used.Manufacturing integration circuit in advance on substrate 1, realizes sensing function jointly with sensing element, and sensing element structure layer 31 connects by the integrated circuit of substrate 1 inside.
In packing colloid 32 between described post wall 21,22, be provided with air pocket 11, air pocket 11 is equivalent to arrange a buffering area, increases the buffering of impacting.
Described sensing element 4 upper surfaces are coated with one deck sealant 5, and sealant 5 extends to innermost layer post wall 22.Described sealant 5 is made up of the lightweight material of insulation.
The thickness of described post wall 21,22 is greater than the thickness of sensing element 4.
Described post wall 21,22 is silica, copper or polymer.
Described post wall is preferably two-layer, and packing colloid 32 extends to upper end and capping 10 combinations of outer post wall 21.
It should be noted that, although this kind of sensor has multicolumn wall, but one deck post wall of comparing can not occupy more space, because, the volume of post wall is very little, two-layer post wall does not have the variation on too obvious volume than one deck post wall, but the impact resistance of two-layer post wall but increases greatly, therefore has positive meaning.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a sensor, is characterized in that, comprising:
Substrate;
Sensing element, is arranged on described substrate;
At least two-layer post wall, is arranged on described substrate around sensing element, and described post wall forms by deposition and etching, is connected and bonds by packing colloid between post wall;
Sensing element structure layer, covers and is arranged at outermost layer post wall periphery;
At least two cappings, innermost layer capping is arranged between innermost layer two post wall packing colloids, and outer capping is located on post wall.
2. sensor according to claim 1, is characterized in that being provided with air pocket in the packing colloid between described post wall.
3. sensor according to claim 1, is characterized in that described sensing element upper surface is coated with one deck sealant.
4. sensor according to claim 3, the sealant described in it is characterized in that is made up of insulation lightweight material.
5. according to the sensor described in claim 1-3 any one, it is characterized in that the thickness of described post wall is greater than the thickness of sensing element.
6. according to the sensor described in claim 1-3 any one, it is characterized in that described post wall is silica, copper or polymer.
7. according to the sensor described in claim 1-3 any one, it is characterized in that described post wall is two-layer, be combined with capping in the upper end that packing colloid extends to outer post wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410045658.4A CN103803481A (en) | 2014-02-09 | 2014-02-09 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410045658.4A CN103803481A (en) | 2014-02-09 | 2014-02-09 | Sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103803481A true CN103803481A (en) | 2014-05-21 |
Family
ID=50700934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410045658.4A Pending CN103803481A (en) | 2014-02-09 | 2014-02-09 | Sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103803481A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106256758A (en) * | 2015-06-18 | 2016-12-28 | 立景光电股份有限公司 | Micro electromechanical system packaging structure and preparation method thereof |
-
2014
- 2014-02-09 CN CN201410045658.4A patent/CN103803481A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106256758A (en) * | 2015-06-18 | 2016-12-28 | 立景光电股份有限公司 | Micro electromechanical system packaging structure and preparation method thereof |
| CN106256758B (en) * | 2015-06-18 | 2018-06-08 | 立景光电股份有限公司 | Micro electromechanical system packaging structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140521 |
|
| WD01 | Invention patent application deemed withdrawn after publication |