CN103801787B - A kind of Soldering lug machine device and weld tabs method thereof - Google Patents
A kind of Soldering lug machine device and weld tabs method thereof Download PDFInfo
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- CN103801787B CN103801787B CN201410071076.3A CN201410071076A CN103801787B CN 103801787 B CN103801787 B CN 103801787B CN 201410071076 A CN201410071076 A CN 201410071076A CN 103801787 B CN103801787 B CN 103801787B
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Abstract
The invention discloses a kind of novel weld tabs machine and weld tabs method thereof, its device comprises head (2), ejection cap (4) and track welding platform (1), ejection cap (4) below is provided with for promoting the mobile ejection pin (6) of ejection cap (4), ejection cap (4) upper surface is provided with ejector (5), track welding platform (1) is located at ejection cap (4) upper right side, ejection cap (4) top is also provided with the head (2) for pick-up chip and welding chip, its method comprises welding chip, absorption chip, detection chip and discharge chip. The present invention solves traditional welding inefficiency, and the phenomenon of the easy collision orbit welding bench of head and the easy collision orbit welding bench in suction nozzle bottom surface is easy to operate, cost-saving.
Description
Technical field
The present invention relates to a kind of Soldering lug machine device solder technology, particularly a kind of Soldering lug machine device and weld tabs method thereof.
Background technology
In the process of welding, easily there are a lot of problems in existing Soldering lug machine, owing to there is a distance between track welding platform and ejection cap, head need to be carried out welding operation to track welding platform by absorption chip from ejection cap. But head, in the time that absorption chip arrives track welding platform, usually easily collides track welding platform, and head or suction nozzle are caused to damage, and the serious direct machine that affects can not be carried out welding job, the maintenance of need to stopping. The production of product is brought to very large impact, also indirectly improved the production cost of product simultaneously, reduced the production efficiency of product.
Number of patent application: CN2013104110297.4 discloses a kind of microphone miaow head automatic welding device and method, this invention involving vibrations dish feeding module, image capture module, soldering operation module, lead-in wire feeding module and electrical control cabinet, microphone solder pad, lead-in wire automatic peeling and the function of cutting off, lower weldering, automatic sorting miaow head, automatic conveying go between are automatically adjusted in automatic identification that this contrive equipment is integrated, efficiently solve welding microphone efficiency not high, cannot realize the problem of automation material loading and blanking. But what this invention solved is the problem of material loading blanking, the easy collision orbit welding bench of head solving with the application, and the not high problem of welding efficiency is far from each other.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of Soldering lug machine device and weld tabs method thereof are provided, solve traditional welding inefficiency, the phenomenon of the easy collision orbit welding bench of head and the easy collision orbit welding bench in suction nozzle bottom surface, easy to operate, cost-saving.
The object of the invention is to be achieved through the following technical solutions: a kind of Soldering lug machine device, it comprises head, ejection cap and track welding platform, head moves back and forth between ejection cap and track welding platform, ejection cap below is provided with the ejection pin moving for promoting ejection cap, ejection cap upper surface is provided with ejector, and described head comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip.
Lateral separation between described track welding platform and ejection cap is 26.5mm, and the fore-and-aft distance between the peak of head and ejection cap is 28.5mm.
One side of described ejection cap is also provided with detecting sensor.
S1: head moves to track welding platform top, and the chip on track welding bench is welded;
S2: head is drawn the chip having welded by suction nozzle, and carry and draw chip on head and move to together above ejection cap;
S3: the chip that the detecting sensor butt welding of ejection cap side connects detects;
S4: head is placed on the chip after detecting on ejection cap, ejection pin promotes on ejection cap position to move, ejector by the chip ejection after placing to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
The invention has the beneficial effects as follows: head is provided with suction nozzle and plumb joint simultaneously, can weld and absorption chip, performance is strong, easy to operate, reciprocal distance when head welding chip between track welding bench and ejection cap is short, efficiency is high, saves production cost, and can not cause the phenomenon of head collision orbit welding bench or head suction nozzle bottom surface collision orbit welding bench.
Brief description of the drawings
Fig. 1 is structural representation of the present invention;
In figure, 1-track welding platform, 2-head, 3-chip, 4-ejection cap, 5-ejector, 6-ejection pin.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, a kind of Soldering lug machine device, it comprises head 2, ejection cap 4 and track welding platform 1, head 2 moves back and forth between ejection cap 4 and track welding platform 1, ejection cap 4 belows are provided with the ejection pin 6 moving for promoting ejection cap 4, ejection cap 4 upper surfaces are provided with ejector 5, and described head 2 comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip.
Lateral separation between described track welding platform 1 and ejection cap 4 is 26.5mm, and the fore-and-aft distance between the peak of head 2 and ejection cap 4 is 28.5mm.
One side of described ejection cap 4 is also provided with detecting sensor.
A weld tabs method for Soldering lug machine device, it includes following steps:
S1: head 2 moves to track welding platform 1 top, and the chip 3 on track welding bench 1 is welded;
S2: head 2 is drawn the chip 3 having welded by suction nozzle, and carry and draw chip 3 on head 2 and move to together above ejection cap 4;
S3: the chip 3 that the detecting sensor butt welding of ejection cap 4 sides connects detects;
S4: head 2 by detect after chip 3 be placed on ejection cap 4, ejection pin 6 promotes to move on ejection cap 4 positions, ejector 5 by place after chip 3 ejections to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
Concrete, head is carrying out in the process of welding chip, and traditional head welding 20 rows' displacements are: lateral separation=636mm+30mm*20=1236mm; Vertical range=30mm*20+5mm*20=700mm; Total distance=lateral separation+vertical range=1236mm+700mm=1936mm.
Apparatus of the present invention welding 20 rows' displacement is: lateral separation=636mm+26.5mm*20=1166mm; Vertical range=28.5mm*20+3.5*20=640mm; Total distance=lateral separation+vertical range=1166mm+640mm=1806mm; Therefore, apparatus of the present invention reduce 130mm than traditional welder head displacement.
Concrete, on average weld a chip, the distance that head moves is 1936mm/20=97mm.
Concrete, the speed of machine head is 686mm/ms, the head required time of chip of welding is 170ms, and the few mobile 130mm of head, machine is saved 185ms. Therefore, head welding 20 row's chips are than chip of the many welding of traditional Soldering lug machine, and its efficiency improves 5%.
Claims (2)
1. a Soldering lug machine device, it is characterized in that: it comprises head (2), ejection cap (4) and track welding platform (1), head (2) moves back and forth between ejection cap (4) and track welding platform (1), ejection cap (4) below is provided with for promoting the mobile ejection pin (6) of ejection cap (4), ejection cap (4) upper surface is provided with ejector (5), and described head (2) comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip;
Lateral separation between described track welding platform (1) and ejection cap (4) is 26.5mm, and the fore-and-aft distance between the peak of head (2) and ejection cap (4) is 28.5mm; Head (2) welding 20 row's chips are than chip of the many welding of traditional Soldering lug machine, and its efficiency improves 5%;
One side of described ejection cap (4) is also provided with detecting sensor.
2. a weld tabs method for Soldering lug machine device, is characterized in that: it includes following steps:
S1: head (2) moves to track welding platform (1) top, and the chip (3) on track welding bench (1) is welded;
S2: head (2) is drawn the chip (3) having welded by suction nozzle, and carry and draw chip (3) on head (2) and move to together ejection cap (4) top;
S3: the chip (3) that the detecting sensor butt welding of ejection cap (4) side connects detects;
S4: it is upper that the chip (3) after detecting is placed on ejection cap (4) by head (2), and ejection pin (6) promotes to move on ejection cap (4) position, ejector (5) by chip (3) ejection after placing to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071076.3A CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071076.3A CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103801787A CN103801787A (en) | 2014-05-21 |
| CN103801787B true CN103801787B (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410071076.3A Expired - Fee Related CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
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| Country | Link |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203725947U (en) * | 2014-02-28 | 2014-07-23 | 成都先进功率半导体股份有限公司 | Novel chip welding machine device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3581684B2 (en) * | 2001-12-04 | 2004-10-27 | Ｎｅｃマシナリー株式会社 | Die bonder |
| JP2004273805A (en) * | 2003-03-10 | 2004-09-30 | Hikari:Kk | Chip mounting apparatus, chip mounting method, ic module manufacturing method, and computer program for controlling chip mounting apparatus |
| EP1612843A1 (en) * | 2004-07-02 | 2006-01-04 | Unaxis International Trading Ltd | Method and apparatus for mounting semiconductors |
| JP4397429B1 (en) * | 2009-03-05 | 2010-01-13 | 株式会社新川 | Semiconductor die pickup apparatus and pickup method |
| CN201936864U (en) * | 2010-12-20 | 2011-08-17 | 乐山-菲尼克斯半导体有限公司 | Elastic thimble used in field of semi-conductor capsulation |
| JP5277266B2 (en) * | 2011-02-18 | 2013-08-28 | 株式会社日立ハイテクインスツルメンツ | Die bonder and semiconductor manufacturing method |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203725947U (en) * | 2014-02-28 | 2014-07-23 | 成都先进功率半导体股份有限公司 | Novel chip welding machine device |
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| CN103801787A (en) | 2014-05-21 |
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