CN103794541A - Carrying platform for wafer-level ball mounter - Google Patents
Carrying platform for wafer-level ball mounter Download PDFInfo
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- CN103794541A CN103794541A CN201410018328.6A CN201410018328A CN103794541A CN 103794541 A CN103794541 A CN 103794541A CN 201410018328 A CN201410018328 A CN 201410018328A CN 103794541 A CN103794541 A CN 103794541A
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- outer ring
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- 230000001360 synchronised effect Effects 0.000 claims description 25
- 230000005540 biological transmission Effects 0.000 claims description 22
- 235000012431 wafers Nutrition 0.000 abstract description 65
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000007246 mechanism Effects 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A carrying platform for a wafer-level ball mounter comprises a bottom X-axis movement system, a bottom Y-axis movement system, a bottom Z-axis movement system, an outer-circle Z-axis movement mechanism, an inner-circle Z-axis movement mechanism, wafer supporting columns, an outer carrying platform circle and an inner carrying platform circle. Vacuum absorption holes are formed in the outer carrying platform circle, the inner carrying platform circle and the wafer supporting columns respectively. According to the carrying platform for the wafer-level ball mounter, a high-precision lead screw is adopted for driving, and therefore the carrying platform has high precision and high stability; the smallest ball diameter phi of the wafer-level ball mounter can be 0.1mm. According to the carrying platform, a inner and outer circle carrying platform structure and a wafer supporting column structure are adopted, automatic wafer feeding and discharging can be performed through mechanical arms, the automation degree of equipment is improved to the maximum extent, the production efficiency is improved, and the stability of products is improved. By replacing a jig, the carrying platform can correspond to wafers being six inches, eight inches and twelve inches, and is high in applicability.
Description
Technical field
The present invention relates to a kind of semiconductor production equipment, relate in particular to a kind of carrying platform for wafer scale ball attachment machine.
Background technology
Along with the develop rapidly of semicon industry, semi-conductor industry is also in growth at a high speed.In semiconductor later process, WLP (wafer level package wafer-level packaging) packaged type has become the market mainstream, and the advantages such as WLP encapsulation is little with its high density, volume, good heat dissipation, electrical property excellence are being widely applied aspect large scale integrated circuit.A core process of WLP encapsulation technology is planted ball exactly.On future market, planting ball main flow is that wafer scale is planted ball, and wafer scale is planted the lift-launch mode of the wafer carrying platform in ball equipment and is directly connected to the success rate of planting ball; The carrying platform of wafer current level ball attachment machine carries mode mainly places wafer on carrying platform with manual mode, and mechanism adopts XYZ tri-axis mechanisms more, and for pursuing precision, some equipment XY axle adopts linear electric motors to drive.Mainly there are following defects in these carrying platform platforms:
Although 1 X, Y-axis adopt linear electric motors to drive, the overall positioning precision of carrying platform does not have too large raising, causes the significant wastage of cost.
2, Z axis adopts single screw to add lead mode and drive, and causes mechanism unstable, and precision is lower.Existing carrying platform positioning precision is lower, cannot be applied in φ 0.3mm sphere diameter and plant below in ball equipment, plants ball weak effect, does not meet current semicon industry and plants the ball development trend of path tin ball increasingly.
3, existing carrying platform is most of adopts the artificial wafer of placing to carrying platform, and automaticity is low, and production efficiency is low.
Summary of the invention
Object of the present invention, exactly in order to solve the problem in above-mentioned actual production, provides a kind of carrying platform for wafer scale ball attachment machine.
In order to achieve the above object, the present invention has adopted following technical scheme: a kind of carrying platform for wafer scale ball attachment machine, comprises bottom X-axis kinematic system, bottom Y-axis kinematic system and bottom Z axis kinematic system; Also comprise outer ring Z axis motion, inner ring Z axis motion, wafer support post, carrying platform outer ring and carrying platform inner ring, outer ring Z axis motion, inner ring Z axis motion and wafer support post are arranged on respectively in Z axis kinematic system, carrying platform outer ring is arranged on the Z axis motion of outer ring, carrying platform inner ring is arranged on inner ring Z axis motion, and wafer support post is arranged on carrying platform inner ring below and can protrudes upward through carrying platform inner ring; Described bottom X-axis kinematic system, bottom Y-axis kinematic system, bottom Z axis kinematic system, outer ring Z axis motion and inner ring Z axis motion adopt respectively driven by servomotor and precision lead screw transmission, on carrying platform outer ring, carrying platform inner ring and wafer support post, are respectively equipped with vacuum suction hole.
Described bottom Z axis kinematic system comprises bottom Z axis servomotor and four bottom Z-axis transmission leading screws, four bottom Z-axis transmission leading screws are separately positioned on four jiaos of tops of bottom Y-axis kinematic system, and four bottom Z-axis transmission leading screws are connected with bottom Z axis servomotor Synchronous Transmission by bottom synchronous cog belt.
Described outer ring Z axis motion comprises outer ring Z axis servomotor and four outer ring Z axis leading screws, four outer ring Z axis leading screws are separately positioned on four jiaos of belows of carrying platform outer ring, and four outer ring Z axis leading screws are connected with outer ring Z axis servomotor Synchronous Transmission by outer ring synchronous cog belt.
Described inner ring Z axis motion comprises inner ring Z axis servomotor and four inner ring Z axis leading screws, four inner ring Z axis leading screws are separately positioned on the below of carrying platform inner ring, and four inner ring Z axis leading screws are connected with inner ring Z axis servomotor Synchronous Transmission by inner ring synchronous cog belt.
Described carrying platform inner ring is rounded, and carrying platform outer ring is square-outside and round-inside shape, and its inner circle and carrying platform inner ring are suitable, can do the relative motion that interts between carrying platform inner ring and carrying platform outer ring.
Also comprise DD motor and θ rotation platform, DD motor is arranged in the Z axis kinematic system of bottom, and θ rotation platform is connected with DD motor driven and is connected with carrying platform inner ring, can drive carrying platform inner ring to do θ rotation.
The mobile accuracy of described precision lead screw is 1 micron, and the positioning precision of described carrying platform is 10 microns.
Described wafer support post is three, and three wafer support post deciles are on φ 60 calibration circumference.
Compared with prior art, the present invention has following advantage and disadvantage:
1, the XY axle of the high-accuracy carrying platform of the present invention adopts high-accuracy lead screw transmission, with respect to adopting linear electric motors to drive, has reached the high accuracy of carrying platform, has also effectively reduced cost.
2, the high-accuracy carrying platform of the present invention has high-precision and high-stability, applies this high-accuracy carrying platform, and wafer scale is planted ball equipment minimum and planted ball sphere diameter and can reach φ 0.1mm.
3, the high-accuracy carrying platform of the present invention adopts the two Z axis of carrying platform Internal and external cycle and wafer support rod structure, robotic arm is carried out the automatic loading/unloading of wafer, the automaticity that has improved to greatest extent equipment, has improved production efficiency, and has improved the stability of product.
4, the high-accuracy carrying platform of the present invention is by changing tool, can corresponding 6 inches, 8 inches and 12 inches of wafers, there is the applicability of height.
Accompanying drawing explanation
Fig. 1 is the perspective view of the present invention for the carrying platform of wafer scale ball attachment machine;
Fig. 2 is the present invention for the structural representation of facing of the carrying platform of wafer scale ball attachment machine;
Fig. 3 is the side-looking structural representation of the present invention for the carrying platform of wafer scale ball attachment machine.
Embodiment
Referring to Fig. 1, Fig. 2, Fig. 3, carrying platform for wafer scale ball attachment machine of the present invention, comprises bottom X-axis kinematic system, bottom Y-axis kinematic system, bottom Z axis kinematic system, outer ring Z axis motion, inner ring Z axis motion, wafer support post, carrying platform outer ring and carrying platform inner ring.Above-mentioned bottom X-axis kinematic system, bottom Y-axis kinematic system, bottom Z axis kinematic system, outer ring Z axis motion and inner ring Z axis motion adopt respectively driven by servomotor and precision lead screw transmission, on carrying platform outer ring 11, carrying platform inner ring 16 and wafer support post 18, are respectively equipped with vacuum suction hole.In figure, 12 are depicted as the vacuum suction hole being arranged on carrying platform outer ring 11.
Bottom X-axis kinematic system comprises X-axis drive motors 1 and X-axis turn-screw 2; Bottom Y-axis kinematic system is erected in the X-axis kinematic system of bottom, comprises Y-axis drive motors 3 and Y-axis turn-screw 4; Bottom Z axis kinematic system is erected in the Y-axis kinematic system of bottom, comprise bottom Z axis servomotor 5 and four bottom Z-axis transmission leading screws 7, four bottom Z-axis transmission leading screws 7 are separately positioned on four jiaos of tops of bottom Y-axis kinematic system, and four bottom Z-axis transmission leading screws are connected with bottom Z axis servomotor Synchronous Transmission by bottom synchronous cog belt 6.
Outer ring Z axis motion, inner ring Z axis motion and wafer support post are arranged on respectively in Z axis kinematic system, wherein Z axis motion in outer ring comprises outer ring Z axis servomotor 8 and four outer ring Z axis leading screws 10, four outer ring Z axis leading screws 10 are separately positioned on four jiaos of belows of carrying platform outer ring, and four outer ring Z axis leading screws are connected with outer ring Z axis servomotor Synchronous Transmission by outer ring synchronous cog belt 9.Inner ring Z axis motion comprises inner ring Z axis servomotor 13 and four inner ring Z axis leading screws 15, four inner ring Z axis leading screws are separately positioned on the below of carrying platform inner ring, and four inner ring Z axis leading screws are connected with inner ring Z axis servomotor Synchronous Transmission by inner ring synchronous cog belt 14.Wafer support post 18 is three, and this wafer support post is arranged on carrying platform inner ring below and can protrudes upward through carrying platform inner ring, and three wafer support post deciles are arranged on φ 60 calibration circumference.
Carrying platform outer ring 11 is arranged on the Z axis motion of outer ring, carrying platform inner ring 16 is arranged on inner ring Z axis motion, carrying platform inner ring 16 is rounded, carrying platform outer ring 11 is square-outside and round-inside shape, its inner circle and carrying platform inner ring are suitable, can do the relative motion that interts between carrying platform inner ring and carrying platform outer ring.
Also comprise DD motor 17 and θ rotation platform (not marking), DD motor is arranged in the Z axis kinematic system of bottom, and θ rotation platform is connected with DD motor driven and is connected with carrying platform inner ring, can drive carrying platform inner ring to do θ rotation.
The mobile accuracy of the precision lead screw in the present invention is 1 micron, and the positioning precision of carrying platform is 10 microns.
Operation principle of the present invention is can accompanying drawings as follows:
The high-accuracy carrying platform of the present invention is by the driving of bottom X-axis kinematic system and bottom Y-axis kinematic system, realize each work bit position switch and carrying platform in the location of X, Y-direction; Drive carrying platform to carry out the large stroke motion of Z axis by bottom Z axis kinematic system, evade to realize Z axis working face location and necessary position; The Z axis lifting of little stroke can be realized in carrying platform outer ring under the effect of outer ring Z axis motion, and has Incision Machine's, realizes support and absorption to half tone; Carrying platform inner ring can be realized the Z axis lifting of θ rotation and little stroke under the effect of θ rotation platform and inner ring Z axis motion, below carrying platform inner ring, there are 3 wafer support posts, when carrying platform inner ring drops to while evading position, can make 3 wafer support posts give prominence on carrying platform inner ring working face, at this moment can wafer be placed on 3 wafer support posts by wafer manipulator, wafer support post vacuum is opened and is held wafer, then carrying platform inner ring working face rises, 3 wafer support posts are closed vacuum, and workbench adsorbs wafer; Then carry out wafer in the contraposition of each station and the switching of each station by bottom X-axis kinematic system, bottom Y-axis kinematic system, bottom Z axis kinematic system and θ rotation platform.
Action example while applying to wafer scale ball attachment machine is as follows: first, under the driving of bottom X-axis kinematic system, bottom Y-axis kinematic system, carrying platform moves to material level; Under the effect of 11 outer ring, carrying platform outer ring Z axis servomotor 8, outer ring synchronous cog belt 9 and outer ring Z axis leading screw 10, decline in evading position; Carrying platform inner ring 16, under the drive of inner ring Z axis servomotor 13, inner ring synchronous cog belt 14 and inner ring Z axis leading screw 15, also drops to and evades position, makes three wafer support posts 18 expose the lift-launch face of carrying platform; Now carrying platform is in wafer material loading ready position, and manipulator takes out the wafer in wafer cassette, is placed on 3 wafer support posts 18, and the vacuum system of wafer support post 18 is opened, and adsorbs wafer; Then carrying platform inner ring rises and holds wafer under the effect of inner ring Z axis servomotor 13, inner ring synchronous cog belt 14 and inner ring Z axis leading screw 15, and the vacuum of wafer support post 18 is closed simultaneously, and the vacuum system of carrying platform inner ring is opened, and adsorbs wafer; Carrying platform outer ring also rises to service position simultaneously.
After carrying platform material loading is ready, by CCD (charge coupled device, charge coupled cell, a kind of image handling components) location, under the driving of X-axis drive motors 1 and Y-axis drive motors 3, move to printing position; Under the effect of 11 outer ring, carrying platform outer ring Z axis servomotor 8, outer ring synchronous cog belt 9 and outer ring Z axis leading screw 10, rise to half tone Support Position and support half tone, the vacuum system of carrying platform outer ring 11 is opened simultaneously, adsorbs half tone by half tone vacuum suction hole 12; Carrying platform inner ring 16 rises to printing position under the effect of inner ring Z axis servomotor 13, inner ring synchronous cog belt 14 and inner ring Z axis leading screw 15, prepares printing.
After finishing printing, after carrying platform outer ring 11 and carrying platform inner ring 16 drop to and evade position, by CCD (charge coupled device, charge coupled cell, a kind of image handling components) behind location, under the driving of X-axis drive motors 1 and Y-axis drive motors 3, move to and plant ball position; Under the effect of 11 outer ring, carrying platform outer ring Z axis servomotor 8, outer ring synchronous cog belt 9 and outer ring Z axis leading screw 10, rise to half tone Support Position and support half tone, the vacuum system of carrying platform outer ring 11 is opened simultaneously, adsorbs half tone by half tone vacuum suction hole 12; Carrying platform inner ring 16 rises to and plants ball position under the effect of inner ring Z axis servomotor 13, inner ring synchronous cog belt 14 and inner ring Z axis leading screw 15, starts to plant ball.
After planting ball, carrying platform, under the driving of X-axis drive motors 1 and Y-axis drive motors 3, moves to wafer blanking position; Carrying platform outer ring 11 and inner ring 16 drop to evades position; Wafer support post 18 is opened vacuum system, supports and adsorb the wafer of having planted ball, waits for that manipulator carries out the blanking of wafer.
Claims (8)
1. for a carrying platform for wafer scale ball attachment machine, comprise bottom X-axis kinematic system, bottom Y-axis kinematic system and bottom Z axis kinematic system; It is characterized in that, also comprise outer ring Z axis motion, inner ring Z axis motion, wafer support post, carrying platform outer ring and carrying platform inner ring, outer ring Z axis motion, inner ring Z axis motion and wafer support post are arranged on respectively in Z axis kinematic system, carrying platform outer ring is arranged on the Z axis motion of outer ring, carrying platform inner ring is arranged on inner ring Z axis motion, and wafer support post is arranged on carrying platform inner ring below and can protrudes upward through carrying platform inner ring; Described bottom X-axis kinematic system, bottom Y-axis kinematic system, bottom Z axis kinematic system, outer ring Z axis motion and inner ring Z axis motion adopt respectively driven by servomotor and precision lead screw transmission, on carrying platform outer ring, carrying platform inner ring and wafer support post, are respectively equipped with vacuum suction hole.
2. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, it is characterized in that: described bottom Z axis kinematic system comprises bottom Z axis servomotor and four bottom Z-axis transmission leading screws, four bottom Z-axis transmission leading screws are separately positioned on four jiaos of tops of bottom Y-axis kinematic system, and four bottom Z-axis transmission leading screws are connected with bottom Z axis servomotor Synchronous Transmission by bottom synchronous cog belt.
3. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, it is characterized in that: described outer ring Z axis motion comprises outer ring Z axis servomotor and four outer ring Z axis leading screws, four outer ring Z axis leading screws are separately positioned on four jiaos of belows of carrying platform outer ring, and four outer ring Z axis leading screws are connected with outer ring Z axis servomotor Synchronous Transmission by outer ring synchronous cog belt.
4. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, it is characterized in that: described inner ring Z axis motion comprises inner ring Z axis servomotor and four inner ring Z axis leading screws, four inner ring Z axis leading screws are separately positioned on the below of carrying platform inner ring, and four inner ring Z axis leading screws are connected with inner ring Z axis servomotor Synchronous Transmission by inner ring synchronous cog belt.
5. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, it is characterized in that: described carrying platform inner ring is rounded, carrying platform outer ring is square-outside and round-inside shape, its inner circle and carrying platform inner ring are suitable, can do the relative motion that interts between carrying platform inner ring and carrying platform outer ring.
6. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, it is characterized in that: also comprise DD motor and θ rotation platform, DD motor is arranged in the Z axis kinematic system of bottom, θ rotation platform is connected with DD motor driven and is connected with carrying platform inner ring, can drive carrying platform inner ring to do θ rotation.
7. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, is characterized in that: the mobile accuracy of described precision lead screw is 1 micron, and the positioning precision of described carrying platform is 10 microns.
8. the carrying platform for wafer scale ball attachment machine as claimed in claim 1, is characterized in that: described wafer support post is three, and three wafer support post deciles are on φ 60 calibration circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410018328.6A CN103794541A (en) | 2014-01-15 | 2014-01-15 | Carrying platform for wafer-level ball mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410018328.6A CN103794541A (en) | 2014-01-15 | 2014-01-15 | Carrying platform for wafer-level ball mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103794541A true CN103794541A (en) | 2014-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410018328.6A Pending CN103794541A (en) | 2014-01-15 | 2014-01-15 | Carrying platform for wafer-level ball mounter |
Country Status (1)
| Country | Link |
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| CN (1) | CN103794541A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107322687A (en) * | 2017-08-09 | 2017-11-07 | 东莞市三创智能卡技术有限公司 | Automatic trimming detection integrated machine equipment is expected in a kind of INLAY cards |
| CN109273399A (en) * | 2018-09-28 | 2019-01-25 | 上海理工大学 | A kind of smooth fixed device of 12 inch wafers |
| CN109285807A (en) * | 2018-09-28 | 2019-01-29 | 上海微松工业自动化有限公司 | A kind of smooth fixed equipment of wafer |
| CN109300809A (en) * | 2018-09-28 | 2019-02-01 | 上海理工大学 | A kind of wafer plant ball package system |
| CN115802643A (en) * | 2023-02-10 | 2023-03-14 | 深圳市立可自动化设备有限公司 | Ball planting machine's platform of carrying on |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102849A (en) * | 1989-09-14 | 1991-04-30 | Fujitsu Ltd | Wafer adapter and exposure device |
| JP2008091948A (en) * | 2007-12-14 | 2008-04-17 | Athlete Fa Kk | Stage, and method of transferring substrate using the same |
| JP2009170688A (en) * | 2008-01-17 | 2009-07-30 | Athlete Fa Kk | Stage and ball mounting device using it |
| CN101996907A (en) * | 2010-09-09 | 2011-03-30 | 上海微松工业自动化有限公司 | Bumping device for pressing wafer-level elastomer into microsphere |
| CN203690277U (en) * | 2014-01-15 | 2014-07-02 | 上海微松工业自动化有限公司 | Embarkation platform for wafer-level ball mounter |
-
2014
- 2014-01-15 CN CN201410018328.6A patent/CN103794541A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102849A (en) * | 1989-09-14 | 1991-04-30 | Fujitsu Ltd | Wafer adapter and exposure device |
| JP2008091948A (en) * | 2007-12-14 | 2008-04-17 | Athlete Fa Kk | Stage, and method of transferring substrate using the same |
| JP2009170688A (en) * | 2008-01-17 | 2009-07-30 | Athlete Fa Kk | Stage and ball mounting device using it |
| CN101996907A (en) * | 2010-09-09 | 2011-03-30 | 上海微松工业自动化有限公司 | Bumping device for pressing wafer-level elastomer into microsphere |
| CN203690277U (en) * | 2014-01-15 | 2014-07-02 | 上海微松工业自动化有限公司 | Embarkation platform for wafer-level ball mounter |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107322687A (en) * | 2017-08-09 | 2017-11-07 | 东莞市三创智能卡技术有限公司 | Automatic trimming detection integrated machine equipment is expected in a kind of INLAY cards |
| CN107322687B (en) * | 2017-08-09 | 2020-02-11 | 东莞市三创智能卡技术有限公司 | Automatic trimming and detecting integrated machine equipment for INLAY card middle material |
| CN109273399A (en) * | 2018-09-28 | 2019-01-25 | 上海理工大学 | A kind of smooth fixed device of 12 inch wafers |
| CN109285807A (en) * | 2018-09-28 | 2019-01-29 | 上海微松工业自动化有限公司 | A kind of smooth fixed equipment of wafer |
| CN109300809A (en) * | 2018-09-28 | 2019-02-01 | 上海理工大学 | A kind of wafer plant ball package system |
| CN109300809B (en) * | 2018-09-28 | 2021-10-26 | 上海微松工业自动化有限公司 | Wafer ball mounting packaging system |
| CN109285807B (en) * | 2018-09-28 | 2023-01-20 | 上海微松工业自动化有限公司 | Wafer flattening and fixing equipment |
| CN109273399B (en) * | 2018-09-28 | 2023-02-10 | 上海微松工业自动化有限公司 | Leveling and fixing device for 12-inch wafer |
| CN115802643A (en) * | 2023-02-10 | 2023-03-14 | 深圳市立可自动化设备有限公司 | Ball planting machine's platform of carrying on |
| CN115802643B (en) * | 2023-02-10 | 2023-04-21 | 深圳市立可自动化设备有限公司 | Carry-on platform of ball planter |
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Application publication date: 20140514 |
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