CN103793572A - Method for inspecting PCB packaged bonding pads - Google Patents

Abstract

The invention provides a method for inspecting PCB packaged bonding pads. The method includes the steps of carrying out attribute setting on the PCB packaged bonding pads, and adding the two attributes PM and SM including welding assisting layers and welding resisting layers, wherein when the welding assisting layers and the welding resisting layers exist in the bonding pads, attribute values are one, and when the welding assisting layers and the welding resisting layers do not exist in the bonding pads, the attribute values are zero; inspecting the bonding pads in a PCB, carrying out logic XOR operation on the two attributes, reporting errors when the logic XOR operation result of the PM and the SM is zero to explain that the attribute welding assisting layers or the attribute welding resisting layers of the bonding pads have faults, and then carrying out inspection and modification. Compared with the prior art, the method for inspecting the PCB packaged bonding pads has the advantages that the accuracy of the bonding pads is guaranteed, welding and manufacturing of the PCB are prevented from being influenced by the fact that certain attributes are missed due to manual reasons, the welding quality and the design efficiency of the PCB are accordingly improved, and the method is high in practicability and easy to popularize.

Description

A kind of inspection method of PCB encapsulation welding tray

Technical field

The present invention relates to a kind of automatic electronic technical field, specifically a kind of inspection method of PCB encapsulation welding tray.

Background technology

Along with the complexity of PCB design is increasing, device on pcb board is more and more, while doing pad, sometimes miss unavoidably some attributes, in PCB, check out by artificial being difficult to, therefore the inspection of encapsulation storehouse pad has been helped in the urgent need to platform software, even if use assistant software in prior art, still can not well improve PCB welding quality and design efficiency, based on this, now provide a kind of inspection method of PCB encapsulation welding tray of the problem that can easily find PCB encapsulation welding tray design existence.

Summary of the invention

Technical assignment of the present invention is to solve the deficiencies in the prior art, provides a kind of artificial origin of avoiding to miss some attributes and affects the inspection method of the welding of PCB and the PCB encapsulation welding tray of manufacture.

Technical scheme of the present invention realizes in the following manner, the inspection method of this kind of PCB encapsulation welding tray, and its specific implementation process is: 1) each pad of PCB encapsulation is carried out to setup of attribute, increase and help layer and two attribute PM of solder mask and SM;

2) PM=1 in the time that pad existence helps layer, otherwise PM=0;

3) SM=1 in the time that pad exists solder mask, otherwise SM=0;

4) two attributes are carried out to logic XOR, calculate the value of PM ⊕ SM;

5) in the time of PM ⊕ SM=0, report an error, now pad attribute helps layer or solder mask to have omission, then checks and revises;

6) reexamine, reach requirement until work as PM ⊕ SM=1.

The beneficial effect that the present invention compared with prior art produced is:

The inspection method of a kind of PCB encapsulation welding tray of the present invention is by the inspection to PCB encapsulation welding tray, guarantee the accuracy of pad, avoid artificial origin to miss some attributes and affect welding and the manufacture of PCB, thereby improve PCB welding quality and design efficiency, practical, be easy to promote.

Accompanying drawing explanation

Accompanying drawing 1 is checking process process flow diagram of the present invention.

Embodiment

Below in conjunction with accompanying drawing, the inspection method of a kind of PCB encapsulation welding tray of the present invention is described in detail below.

As shown in Figure 1, the inspection method of this kind of PCB encapsulation welding tray, its specific implementation process is:

1) each pad of PCB encapsulation is carried out to setup of attribute, increase and help layer Pastemask and two attribute PM of solder mask Soldermask and SM;

2) PM=1 in the time that pad existence helps layer Pastemask, otherwise PM=0;

3) SM=1 in the time that pad exists solder mask Soldermask, otherwise SM=0;

4) two attributes are carried out to logic XOR, calculate the value of PM ⊕ SM;

5) in the time of PM ⊕ SM=0, report an error, now pad attribute helps layer or solder mask to have omission, then checks and revises;

6) reexamine, reach requirement until work as PM ⊕ SM=1.

PCB encapsulation welding tray inspection method of the present invention, is conducive to find the problem that exists in the design of PCB encapsulation welding tray improve the quality of PCB welding, improves PCB design efficiency.

The foregoing is only embodiments of the invention, within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.

Claims (1)

1. an inspection method for PCB encapsulation welding tray, is characterized in that its implementation procedure is:

1) each pad of PCB encapsulation is carried out to setup of attribute, increase and help layer and two attribute PM of solder mask and SM;

2) PM=1 in the time that pad existence helps layer, otherwise PM=0;

3) SM=1 in the time that pad exists solder mask, otherwise SM=0;

4) two attributes are carried out to logic XOR, calculate the value of PM ⊕ SM;

5) in the time of PM ⊕ SM=0, report an error, now pad attribute helps layer or solder mask to have omission, then checks and revises;

6) reexamine, reach requirement until work as PM ⊕ SM=1.

Images