CN103787665B - 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 - Google Patents
联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 Download PDFInfo
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- CN103787665B CN103787665B CN201210423153.8A CN201210423153A CN103787665B CN 103787665 B CN103787665 B CN 103787665B CN 201210423153 A CN201210423153 A CN 201210423153A CN 103787665 B CN103787665 B CN 103787665B
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- organic ceramic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 104
- 229910010293 ceramic material Inorganic materials 0.000 title claims abstract description 55
- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 82
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 63
- 239000000843 powder Substances 0.000 claims abstract description 53
- 239000007822 coupling agent Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 27
- 239000005011 phenolic resin Substances 0.000 claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 27
- 239000010425 asbestos Substances 0.000 claims abstract description 26
- 229910052895 riebeckite Inorganic materials 0.000 claims abstract description 26
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 24
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 50
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011259 mixed solution Substances 0.000 claims description 10
- ZHSXANMFVCDUJW-UHFFFAOYSA-N prop-1-ene trimethoxysilane Chemical group CO[SiH](OC)OC.C=CC ZHSXANMFVCDUJW-UHFFFAOYSA-N 0.000 claims description 9
- 229910017083 AlN Inorganic materials 0.000 claims description 8
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052573 porcelain Inorganic materials 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229960001866 silicon dioxide Drugs 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052788 barium Inorganic materials 0.000 abstract 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 15
- 239000002994 raw material Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical class CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
| 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | |
| 强度 | 20 | 17 | 18 | 22 | 15 |
| 导热系数(W/M.K) | 12 | 10 | 10 | 15 | 8 |
| 室温热膨胀系数(PPM/℃) | 0.06 | 0.08 | 0.08 | 0.05 | 0.1 |
| 300℃热膨胀系数(PPM/℃) | 9 | 11 | 10 | 8 | 12 |
| 耐电压性能(V) | 1万 | 1万 | 1万 | 1万 | 1万 |
| 耐高温(℃) | 300 | 300 | 300 | 300 | 300 |
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210423153.8A CN103787665B (zh) | 2012-10-30 | 2012-10-30 | 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210423153.8A CN103787665B (zh) | 2012-10-30 | 2012-10-30 | 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103787665A CN103787665A (zh) | 2014-05-14 |
| CN103787665B true CN103787665B (zh) | 2015-07-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210423153.8A Active CN103787665B (zh) | 2012-10-30 | 2012-10-30 | 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103787665B (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105565786A (zh) * | 2015-12-16 | 2016-05-11 | 广东昭信照明科技有限公司 | 一种低温复合高导热陶瓷材料及其制备方法 |
| CN106007481A (zh) * | 2016-05-12 | 2016-10-12 | 廊坊市高瓷新材料科技有限公司 | 联接剂、有机陶瓷基板组合物、有机陶瓷基板及覆铜板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02303185A (ja) * | 1989-05-18 | 1990-12-17 | Matsushita Electric Works Ltd | 多層印刷配線板の製造方法 |
| CN101747854B (zh) * | 2008-12-04 | 2012-11-21 | 比亚迪股份有限公司 | 胶粘剂组合物以及覆盖膜和柔性线路板 |
| CN102448251B (zh) * | 2011-09-29 | 2014-04-02 | 秦会斌 | 一种多层单面铝基线路板及其制造方法 |
-
2012
- 2012-10-30 CN CN201210423153.8A patent/CN103787665B/zh active Active
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| Publication number | Publication date |
|---|---|
| CN103787665A (zh) | 2014-05-14 |
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